CN112602377A - 发光装置、发光模块、电子设备及发光装置的制造方法 - Google Patents

发光装置、发光模块、电子设备及发光装置的制造方法 Download PDF

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Publication number
CN112602377A
CN112602377A CN201980055691.6A CN201980055691A CN112602377A CN 112602377 A CN112602377 A CN 112602377A CN 201980055691 A CN201980055691 A CN 201980055691A CN 112602377 A CN112602377 A CN 112602377A
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CN
China
Prior art keywords
insulating layer
light
layer
emitting device
inorganic insulating
Prior art date
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Pending
Application number
CN201980055691.6A
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English (en)
Chinese (zh)
Inventor
安达广树
谷中顺平
佐藤将孝
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of CN112602377A publication Critical patent/CN112602377A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN201980055691.6A 2018-08-24 2019-08-08 发光装置、发光模块、电子设备及发光装置的制造方法 Pending CN112602377A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018-156888 2018-08-24
JP2018156888 2018-08-24
PCT/IB2019/056747 WO2020039293A1 (ja) 2018-08-24 2019-08-08 発光装置、発光モジュール、電子機器、及び発光装置の作製方法

Publications (1)

Publication Number Publication Date
CN112602377A true CN112602377A (zh) 2021-04-02

Family

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CN201980055691.6A Pending CN112602377A (zh) 2018-08-24 2019-08-08 发光装置、发光模块、电子设备及发光装置的制造方法

Country Status (5)

Country Link
US (1) US12414443B2 (enExample)
JP (1) JP7464524B2 (enExample)
KR (1) KR102862477B1 (enExample)
CN (1) CN112602377A (enExample)
WO (1) WO2020039293A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114256400B (zh) * 2020-09-24 2023-05-12 重庆康佳光电技术研究院有限公司 微型发光芯片组件及其制作方法、微型发光芯片转移方法
KR102877626B1 (ko) 2021-07-29 2025-10-28 엘지디스플레이 주식회사 표시패널

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101369638A (zh) * 2002-04-23 2009-02-18 株式会社半导体能源研究所 发光器件及其制造方法
CN102169964A (zh) * 2010-01-20 2011-08-31 株式会社半导体能源研究所 发光装置、柔性发光装置、电子设备、照明装置、以及发光装置和柔性发光装置的制造方法
US20150255739A1 (en) * 2014-03-07 2015-09-10 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US20180151837A1 (en) * 2016-11-29 2018-05-31 Japan Display Inc. Display device
TW201824216A (zh) * 2016-08-17 2018-07-01 半導體能源研究所股份有限公司 顯示裝置、顯示模組、電子裝置及顯示裝置的製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI328837B (en) 2003-02-28 2010-08-11 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
KR102079188B1 (ko) 2012-05-09 2020-02-19 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치 및 전자 기기
KR102141209B1 (ko) 2014-03-07 2020-08-05 삼성디스플레이 주식회사 디스플레이 장치 및 이의 제조 방법
JP6761276B2 (ja) 2015-05-28 2020-09-23 株式会社半導体エネルギー研究所 表示装置の作製方法、および電子機器の作製方法
KR102632066B1 (ko) 2015-07-30 2024-02-02 가부시키가이샤 한도오따이 에네루기 켄큐쇼 발광 장치의 제작 방법, 발광 장치, 모듈, 및 전자 기기
KR102400022B1 (ko) 2015-12-30 2022-05-19 엘지디스플레이 주식회사 측부 구부림 구조를 갖는 플렉서블 유기발광 다이오드 표시장치
KR102592956B1 (ko) * 2016-08-29 2023-10-24 삼성디스플레이 주식회사 디스플레이 장치
KR102392993B1 (ko) * 2017-09-28 2022-04-29 엘지디스플레이 주식회사 유기 발광 표시 장치
KR102638296B1 (ko) * 2018-03-19 2024-02-20 삼성디스플레이 주식회사 유기발광표시장치
JP7108478B2 (ja) * 2018-06-21 2022-07-28 株式会社ジャパンディスプレイ 表示装置
KR102554461B1 (ko) * 2018-07-26 2023-07-10 엘지디스플레이 주식회사 스트레쳐블 표시 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101369638A (zh) * 2002-04-23 2009-02-18 株式会社半导体能源研究所 发光器件及其制造方法
CN102169964A (zh) * 2010-01-20 2011-08-31 株式会社半导体能源研究所 发光装置、柔性发光装置、电子设备、照明装置、以及发光装置和柔性发光装置的制造方法
US20150255739A1 (en) * 2014-03-07 2015-09-10 Samsung Display Co., Ltd. Display device and method of manufacturing the same
TW201824216A (zh) * 2016-08-17 2018-07-01 半導體能源研究所股份有限公司 顯示裝置、顯示模組、電子裝置及顯示裝置的製造方法
US20180151837A1 (en) * 2016-11-29 2018-05-31 Japan Display Inc. Display device

Also Published As

Publication number Publication date
JPWO2020039293A1 (ja) 2021-09-24
KR20210046703A (ko) 2021-04-28
KR102862477B1 (ko) 2025-09-23
US20210167329A1 (en) 2021-06-03
WO2020039293A1 (ja) 2020-02-27
JP7464524B2 (ja) 2024-04-09
US12414443B2 (en) 2025-09-09

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