CN112600525A - Surface acoustic wave filter, method for manufacturing the same, and electronic device - Google Patents
Surface acoustic wave filter, method for manufacturing the same, and electronic device Download PDFInfo
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- CN112600525A CN112600525A CN202011499463.9A CN202011499463A CN112600525A CN 112600525 A CN112600525 A CN 112600525A CN 202011499463 A CN202011499463 A CN 202011499463A CN 112600525 A CN112600525 A CN 112600525A
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims description 28
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- 238000007789 sealing Methods 0.000 claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 14
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- 239000000919 ceramic Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
The invention discloses a surface acoustic wave filter, a manufacturing method thereof and electronic equipment. Wherein the SAW filter comprises: the surface of the base plate is provided with a positioning groove; the chip is arranged on the surface of the substrate, provided with the positioning groove, and covers the positioning groove, and the chip is electrically connected to the substrate; and the sealing rubber ring is arranged around the periphery of the chip so as to seal and fix the chip on the surface of the substrate. The technical scheme of the invention can reduce the manufacturing cost of the surface acoustic wave filter.
Description
Technical Field
The present invention relates to the field of surface acoustic wave filter technology, and in particular, to a surface acoustic wave filter, a method for manufacturing the same, and an electronic device.
Background
In the related art, the packaging process of the surface acoustic wave filter is relatively fixed, and generally, a flip-chip process is adopted to interconnect a chip and a substrate, then a vacuum film laminating machine is used to seal the whole product to form a closed cavity, and finally plastic packaging is carried out on the whole product through plastic packaging equipment to enhance the mechanical strength of the product. In the process operation, the product is sealed by vacuum film covering, so that the investment cost is high, and the manufacturing cost of the product is high.
Disclosure of Invention
The invention mainly aims to provide a surface acoustic wave filter, a manufacturing method thereof and electronic equipment, aiming at reducing the manufacturing cost of the surface acoustic wave filter.
In order to achieve the above object, the present invention provides a saw filter, including: the surface of the base plate is provided with a positioning groove; the chip is arranged on the surface of the substrate, provided with the positioning groove, and covers the positioning groove, and the chip is electrically connected to the substrate; and the sealing rubber ring is arranged around the periphery of the chip so as to seal and fix the chip on the surface of the substrate.
In an alternative embodiment, the adhesive strength of the sealing rubber ring ranges from 10Pa · s to 20Pa · s.
In an alternative embodiment, the substrate is a ceramic substrate.
In an optional embodiment, a connection solder ball is disposed on a surface of the chip facing the positioning slot, a metal trace is disposed in the substrate, at least a portion of the metal trace is exposed out of the bottom wall of the positioning slot, and the connection solder ball is electrically abutted to the exposed portion of the metal trace.
In an optional embodiment, when the connection solder balls are gold balls, the depth range of the positioning grooves is 10um-20 um; or when the connecting solder ball is a solder ball, the depth range of the positioning groove is 50um-90 um.
In an optional embodiment, the saw filter further includes a fixing adhesive layer, and the fixing adhesive layer is disposed on a surface of the substrate facing the chip and covers the chip and the sealing rubber ring.
In an alternative embodiment, the adhesive strength of the fixing adhesive layer ranges from 12Pa · s to 20Pa · s.
The invention also provides a manufacturing method of the sound surface filter, which comprises the following steps:
providing a substrate provided with a positioning groove, a chip and sealant;
attaching the chip to the surface of the substrate provided with the positioning groove, so that the positioning groove is covered by the chip, and the chip is electrically connected to the substrate;
and sealing glue is dispensed at the periphery of the chip so as to seal and fix the chip on the surface of the substrate.
In an optional embodiment, a connection solder ball is disposed on the surface of the chip, a metal trace is disposed in the substrate, and at least a portion of the metal trace is exposed out of the bottom wall of the positioning groove;
attaching the chip to the surface of the substrate, where the positioning groove is formed, so that the chip covers the positioning groove and is electrically connected to the substrate, the method includes:
and enabling the surface of the chip provided with the connecting solder balls to face the positioning groove, and attaching the chip to the surface of the substrate so that the chip covers the positioning groove and the connecting solder balls are electrically abutted against the exposed part of the metal wire.
In an optional embodiment, after the step of applying a sealant to the peripheral edge of the chip to seal and fix the chip to the surface of the substrate, the method further includes:
and fixing glue on the surface of the substrate facing the chip, so that the chip and the sealant are coated by the fixing glue.
The invention also proposes an electronic device comprising a surface acoustic wave filter comprising: the surface of the base plate is provided with a positioning groove; the chip is arranged on the surface of the substrate, provided with the positioning groove, and covers the positioning groove, and the chip is electrically connected to the substrate; and the sealing rubber ring is arranged around the periphery of the chip so as to seal and fix the chip on the surface of the substrate.
According to the technical scheme, the positioning groove is formed in the surface of the substrate, the chip is arranged on the surface, provided with the positioning groove, of the substrate, the positioning groove is covered, the chip is electrically connected with the substrate, meanwhile, the sealing rubber ring is arranged on the periphery of the chip, the chip is fixed on the surface of the substrate in a sealing mode, and therefore a closed cavity can be formed in a surrounding mode. Because the substrate provided with the positioning groove is adopted, and the sealing rubber ring is adopted to seal and fix the chip to form the sealed cavity, compared with the method that the chip is sealed by the vacuum film to form the sealed cavity, the vacuum film coating machine is not needed, the manufacturing cost is greatly reduced, and the manufacturing cost of the surface acoustic wave filter is effectively reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of an SAW filter according to an embodiment of the present invention;
FIG. 2 is a flowchart illustrating steps of a method for manufacturing a SAW filter according to an embodiment of the present invention;
FIG. 3 is a flowchart illustrating steps of a method for manufacturing an SAW filter according to another embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of fig. 3 after step S21;
fig. 5 is a schematic cross-sectional structure diagram related to step S30 in fig. 3.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
20 | Chip and method for manufacturing the same |
| 10 | |
21 | Connecting |
| 11 | Locating |
30 | |
| 12 | |
40 | Fixed glue line |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
At present, the surface acoustic wave filter 100 on the market generally adopts a flip-chip process to mount the chip 20 on the surface of the substrate 10, then adopts a vacuum film to seal the whole product, and finally strengthens the mechanical strength of the product through plastic package.
The present invention provides a saw filter 100, which aims to reduce the manufacturing cost of the saw filter 100.
Referring to fig. 1, in an embodiment of the saw filter 100 of the present invention, the saw filter 100 includes: a substrate 10, wherein a positioning groove 11 is arranged on the surface of the substrate 10; the chip 20 is arranged on the surface of the substrate 10 provided with the positioning groove 11, and covers the positioning groove 11, and the chip 20 is electrically connected to the substrate 10; and a sealing rubber ring 30, wherein the sealing rubber ring 30 is arranged around the periphery of the chip 20 to seal and fix the chip 20 on the surface of the substrate 10.
Specifically, the substrate 10 is a circuit board, a positioning groove 11 is formed in one surface of the substrate, the size of the positioning groove 11 is smaller than that of the chip 20, the chip 20 is attached to the surface of the substrate 10, where the positioning groove 11 is formed, and covers the positioning groove 11, so that a closed cavity is formed. The chip 20 is electrically connected to the substrate 10 after being mounted, and the electrical connection mode may be contact electrical conduction, or may be electrical conduction achieved by wire bonding, which is within the protection scope of the present invention. The sealing rubber ring 30 is substantially in a ring shape, and has the same size as the peripheral edge of the chip 20, and the sealing rubber ring 30 is disposed around the peripheral edge of the chip 20, so that the chip 20 can be hermetically fixed on the surface of the substrate 10, and thus the chip 20 and the substrate 10 can enclose a sealed cavity. The sealing rubber ring 30 is adopted to seal and fix the chip 20, so that the operation is simpler and the manufacturing cost is lower.
It should be noted that the chip 20 is generally a square chip 20, and the shape of the positioning groove 11 may be a square groove and is matched with the shape of the chip 20, so that the size of the chip 20 required when the size of the cavity is fixed is relatively small, which is beneficial to reducing the overall size of the saw filter and the miniaturization development thereof.
It can be understood that, according to the technical solution of the present invention, the positioning groove 11 is formed on the surface of the substrate 10, the chip 20 is disposed on the surface of the substrate 10 where the positioning groove 11 is formed, and covers the positioning groove 11, the chip 20 is electrically connected to the substrate 10, and the sealing rubber ring 30 is disposed on the periphery of the chip 20 to seal and fix the chip 20 on the surface of the substrate 10, so that a closed cavity can be formed. Because the substrate 10 provided with the positioning grooves 11 is adopted and the sealing rubber ring 30 is adopted to seal and fix the chip 20 to form the sealed cavity, compared with the method of sealing the chip 20 by vacuum coating to form the sealed cavity, a vacuum coating machine is not needed, the manufacturing cost is greatly reduced, and the manufacturing cost of the surface acoustic wave filter is effectively reduced.
Alternatively, the adhesive strength of the seal gasket 30 ranges from 10Pa · s to 20Pa · s. The function of the sealing rubber ring 30 is to seal and fix the chip 20 on the surface of the substrate 10, which is a preliminary fixing for the chip 20, and the adhesiveness of the sealing rubber ring 30 does not need to be too large, and certainly is not too small, otherwise the sealing effect is not good, so the adhesiveness is selected to be suitable, and in alternative embodiments, the adhesiveness of the sealing rubber ring 30 is in the range of 10Pa · s, 12Pa · s, 14Pa · s, 16Pa · s, 18Pa · s or 20Pa · s.
Since the positioning groove 11 needs to be formed on the surface of the substrate 10, the substrate 10 may be selected as the ceramic substrate 10, which facilitates the formation operation of the positioning groove 11. The Ceramic material of the Ceramic substrate 10 may be a High Temperature co-fired Ceramic (HTCC), the High Temperature co-fired Ceramic is prepared by printing High melting point metal heating resistance slurry of tungsten, molybdenum, manganese, etc. on 92-96% alumina tape-casting Ceramic green body according to the requirement of heating circuit design, and 4-8% sintering aid is laminated in multiple layers and co-fired at 1500-1600 ℃. The ceramic substrate 10 made of the high-temperature co-fired ceramic has the advantages of high structural strength, high thermal conductivity, low thermal expansion coefficient, low dielectric constant and low dielectric loss, good chemical stability, high wiring density and the like.
Referring to fig. 1 again, in an embodiment of the invention, the surface of the chip 20 facing the positioning slot 11 is provided with a connection solder ball 21, the substrate 10 is provided with a metal trace 12 therein, at least a portion of the metal trace 12 is exposed out of the bottom wall of the positioning slot 11, and the connection solder ball 21 is electrically abutted against the exposed portion of the metal trace 12. Here, the electrical conduction between the solder balls 21 and the metal traces 12 is adopted, which is simple and effective to operate compared with the wire bonding method, and is also beneficial to reducing the overall size of the saw filter 100.
It is understood that the depth of the positioning groove 11 is designed to ensure the electrical conduction between the solder ball 21 and the metal trace 12. The solder balls 21 are usually gold balls and solder balls, which have different sizes, and the depth of the positioning groove 11 can be designed according to the size of the solder balls 21.
In an alternative embodiment, when the solder balls 21 are gold balls, the depth of the positioning groove 11 ranges from 10um to 20um, for example, the depth of the positioning groove 11 is 10um, 12um, 14um, 16um, 18um or 20 um.
In an alternative embodiment, when the solder balls 21 are solder balls, the depth of the positioning groove 11 ranges from 50um to 90um, for example, the depth of the positioning groove 11 is 50um, 55um, 60um, 65um, 70um, 75um, 80um, 85um or 90 um.
Further, referring to fig. 1 again, the saw filter 100 further includes a fixing adhesive layer 40, and the fixing adhesive layer 40 is disposed on a surface of the substrate 10 facing the chip 20 and covers the chip 20 and the sealing rubber ring 30.
Here, the fixing adhesive layer 40 covers the entire chip 20 and the sealing rubber 30, and serves to reinforce the fixing of the chip 20, thereby reinforcing the mechanical strength of the entire acoustic surface filter 100.
Since the plastic package is adopted in the surface acoustic wave filter 100 on the market at present to enhance the mechanical strength of the product, however, in the operation process, the lamination phenomenon is easily generated at the joint of the film coating material and the plastic package material, which leads to the failure of the product and poor reliability. The chip 20 is sealed and fixed by the sealing rubber ring 30, and then the mechanical strength of the product is enhanced by the fixing rubber layer 40, the chip 20 can be well fixed by the fixing rubber layer 40, the fixing rubber layer 40 and the sealing rubber ring 30 are both made of rubber, the fixing rubber layer 40 and the sealing rubber ring 30 can be well combined, the layering phenomenon cannot occur, the problem of combination of a laminating material and a plastic packaging material can be effectively solved, and the stability and the reliability of the surface acoustic wave filter are guaranteed. And adopt fixed glue film 40 to strengthen fixedly, compare in the plastic envelope and strengthen fixedly, its cost of manufacture further reduces to reduce the cost of manufacture of sound surface filter more effectively.
Note that, the thickness of the fixing adhesive layer 40 is not limited, and only the chip 20 and the sealing rubber ring 30 need to be completely covered.
Certainly, in other embodiments, the plastic package can also be used to enhance the mechanical strength of the whole structure, the plastic package material and the sealant material are not layered, and the reliability of the product is good.
Since the fixing adhesive layer 40 further reinforces the chip 20 to reinforce the mechanical product of the integral acoustic surface filter 100, the adhesive strength of the fixing adhesive layer 40 is required to be relatively high to ensure a relatively good reinforcing performance. Alternatively, the tackiness of the fixing glue layer 40 ranges from 12Pa · s to 20Pa · s, such as the tackiness of the fixing glue layer 40 is 12Pa · s, 14Pa · s, 16Pa · s, 18a · s, or 20Pa · s.
The present invention further provides a method for manufacturing the surface acoustic wave filter 100, which is used for manufacturing the surface acoustic wave filter 100 as described above.
Referring to fig. 2, 4 and 5, in an embodiment of the method for manufacturing the saw filter 100 of the present invention, the method includes the following steps:
step S10, providing the substrate 10 with the positioning groove 11, the chip 20 and the sealant;
step S20, attaching the chip 20 to the surface of the substrate 10 having the positioning groove 11, so that the chip 20 covers the positioning groove 11 and the chip 20 is electrically connected to the substrate 10;
step S30, dispensing a sealant around the chip 20 to fix the chip 20 to the surface of the substrate 10.
Specifically, the substrate 10 is generally a ceramic substrate 10, the positioning groove 11 is formed on the surface of the ceramic substrate 10, and the positioning groove 11 is optionally a square groove, whose shape is matched with the shape of the chip 20 and whose size is smaller than the size of the chip 20. Firstly, a flip-chip process is used to attach the chip 20 to the surface of the substrate 10 having the positioning groove 11, and the chip 20 covers the positioning groove 11, and the chip 20 is electrically connected to the substrate 10, wherein the electrical connection mode can be selected from contact electrical connection or wire bonding conduction. And then, a circle of sealant is dispensed at the periphery of the chip 20 by using a dispenser, and the chip 20 can be hermetically fixed on the surface of the substrate 10 after the sealant is cured, so that a sealed cavity can be formed by the chip 20 and the substrate 10. The operation is simple, the traditional film covering process is replaced, vacuum film covering machine equipment is not needed, and the operation cost is low.
Referring to fig. 3 and 4, in an embodiment of the invention, the surface of the chip 20 is provided with connection solder balls 21, the substrate 10 is provided with metal traces 12, and the metal traces 12 are at least partially exposed out of the bottom wall of the positioning slot 11.
Step S20, attaching the chip 20 to the surface of the substrate 10 having the positioning groove 11, so that the chip 20 covers the positioning groove 11 and the chip 20 is electrically connected to the substrate 10, includes:
step S21, the surface of the chip 20 with the solder balls 21 faces the positioning slot 11, and the chip 20 is attached to the surface of the substrate 10, so that the positioning slot 11 is covered by the chip 20, and the solder balls 21 electrically abut against the exposed portion of the metal trace 12.
Here, the electrical conduction between the solder balls 21 and the metal traces 12 is adopted, which is simple and effective to operate compared with the wire bonding method, and is also beneficial to reducing the overall size of the saw filter 100.
Further, referring to fig. 1 and 2, step S30, after the step of dispensing a sealant around the chip 20 to hermetically fix the chip 20 to the surface of the substrate 10, the method further includes:
step S40, dispensing a fixing adhesive on the surface of the substrate 10 facing the chip 20, so that the fixing adhesive covers the chip 20 and the sealing adhesive.
Specifically, a dispenser is used to perform spot-fixing glue on the surface of the substrate 10 facing the chip 20, so that the fixing glue can completely cover the chip 20 and the sealant to further reinforce the chip 20, thereby enhancing the mechanical strength of the whole surface acoustic wave filter 100, wherein the viscosity of the fixing glue is required to be higher than that of the sealant to better reinforce the chip.
It can be understood that the adhesive dispensing operation is used to replace a plastic package process to enhance the mechanical strength of the surface acoustic wave filter 100, so that the problem that the joint of the film coating material and the plastic package material is easy to delaminate can be effectively avoided, the process flow is simplified, and the manufacturing cost of the surface acoustic wave filter is further reduced.
It should be noted that, in other embodiments, since the chip 20 is sealed and fixed by the dispensing operation to form a sealed cavity, a plastic package process may be subsequently used to enhance the mechanical strength of the entire surface acoustic wave filter 100, and the problem that the joint of the film coating material and the plastic package material is easily delaminated may be effectively avoided.
The invention also proposes an electronic device comprising a surface acoustic filter as described above, the specific structure of which is referred to the previous embodiments. Since the electronic device adopts all technical solutions of all the foregoing embodiments, at least all the beneficial effects brought by the technical solutions of the foregoing embodiments are achieved, and no further description is given here.
The electronic device includes, but is not limited to, intermediate products such as a radio frequency front end and a filtering and amplifying module, and terminal products such as a mobile phone, WIFI and an unmanned aerial vehicle.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (11)
1. A surface acoustic filter, comprising:
the surface of the base plate is provided with a positioning groove;
the chip is arranged on the surface of the substrate, provided with the positioning groove, and covers the positioning groove, and the chip is electrically connected to the substrate; and
and the sealing rubber ring is arranged around the periphery of the chip so as to seal and fix the chip on the surface of the substrate.
2. The acoustic surface filter according to claim 1, wherein the adhesive strength of the sealing rubber is in a range of 10 Pa-s to 20 Pa-s.
3. The SAW filter of claim 1, wherein the substrate is a ceramic substrate.
4. The SAW filter of claim 1, wherein connection solder balls are disposed on the surface of the chip facing the positioning grooves, metal traces are disposed in the substrate, the metal traces are at least partially exposed from the bottom walls of the positioning grooves, and the connection solder balls are electrically abutted to the exposed portions of the metal traces.
5. The SAW filter of claim 4, wherein when the solder balls are gold balls, the depth of the detents ranges from 10um to 20 um; or,
when the connecting solder ball is a solder ball, the depth range of the positioning groove is 50um-90 um.
6. The SAW filter of any of claims 1-5, further comprising a fixing glue layer disposed on a surface of the substrate facing the chip and covering the chip and the sealing rubber ring.
7. The acoustic surface filter according to claim 6, wherein the adhesive strength of the fixing adhesive layer is in a range of 12 Pa-s to 20 Pa-s.
8. A method for manufacturing a surface acoustic wave filter is characterized by comprising the following steps:
providing a substrate provided with a positioning groove, a chip and sealant;
attaching the chip to the surface of the substrate provided with the positioning groove, so that the positioning groove is covered by the chip, and the chip is electrically connected to the substrate;
and sealing glue is dispensed at the periphery of the chip so as to seal and fix the chip on the surface of the substrate.
9. The method for manufacturing an acoustic surface filter according to claim 8, wherein the surface of the chip is provided with connecting solder balls, the substrate is provided with metal traces, and the metal traces are at least partially exposed out of the bottom wall of the positioning groove;
attaching the chip to the surface of the substrate, where the positioning groove is formed, so that the chip covers the positioning groove and is electrically connected to the substrate, the method includes:
and enabling the surface of the chip provided with the connecting solder balls to face the positioning groove, and attaching the chip to the surface of the substrate so that the chip covers the positioning groove and the connecting solder balls are electrically abutted against the exposed part of the metal wire.
10. The method of claim 8 or 9, further comprising, after the step of applying a sealant around the chip to hermetically fix the chip to the surface of the substrate:
and fixing glue on the surface of the substrate facing the chip, so that the chip and the sealant are coated by the fixing glue.
11. An electronic device, characterized in that the electronic device comprises a surface acoustic wave filter according to any of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011499463.9A CN112600525A (en) | 2020-12-17 | 2020-12-17 | Surface acoustic wave filter, method for manufacturing the same, and electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011499463.9A CN112600525A (en) | 2020-12-17 | 2020-12-17 | Surface acoustic wave filter, method for manufacturing the same, and electronic device |
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| CN112600525A true CN112600525A (en) | 2021-04-02 |
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| CN202011499463.9A Pending CN112600525A (en) | 2020-12-17 | 2020-12-17 | Surface acoustic wave filter, method for manufacturing the same, and electronic device |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120236513A1 (en) * | 2009-10-09 | 2012-09-20 | Eads Deutschland Gmbh | Hermetically Sealed Radio-Frequency Front End |
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