CN112582316B - Processing device and method - Google Patents
Processing device and method Download PDFInfo
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- CN112582316B CN112582316B CN201910933331.3A CN201910933331A CN112582316B CN 112582316 B CN112582316 B CN 112582316B CN 201910933331 A CN201910933331 A CN 201910933331A CN 112582316 B CN112582316 B CN 112582316B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67373—Closed carriers characterised by locking systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Abstract
The invention relates to a processing device and a method, wherein the processing device comprises: the first loading mechanism, the assembly part and more than one covering parts. And placing the wafer into the first carrying mechanism or taking out the processed wafer according to the actual processing procedure. At this point, a robot or other automated device may be used to move some or all of the covering elements at the access opening of the first carrier mechanism, which, as the covering elements are moved, exposes a window for the robot or other automated device to extend into the first carrier mechanism. A robot or other automation equipment can drive the wafer to enter the first carrying mechanism through the window for placing or take the wafer out of the first carrying mechanism through the window. After the operation of the wafer is completed, the moved covering part is reset, namely, the operation opening is completely sealed by the covering part again. The processing device improves the finished product effect of the wafer.
Description
Technical Field
The present invention relates to the field of wafer processing technologies, and in particular, to a processing apparatus and a processing method.
Background
Conventionally, a wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and various circuit elements can be manufactured on the silicon wafer, so that an integrated circuit product with a specific electrical function is obtained. Therefore, there are very strict requirements for processing wafers. That is, it is necessary to process the wafer in an environment having high cleanliness (under conditions of sterility, no impurities, etc.). However, after the wafer is placed in the processing equipment in the conventional processing method, the external air can still contact with the wafer, and at this time, moisture or microparticle impurities can be attached to the wafer, thereby affecting the finished product effect of the wafer.
Disclosure of Invention
Accordingly, there is a need for a processing apparatus and method that can improve the yield of wafers.
The technical scheme is as follows:
a processing apparatus, comprising: first year thing mechanism, assembly part and more than one cover, first year thing mechanism is used for placing the wafer, first year thing mechanism offers the operation mouth that is used for getting to put the wafer, the assembly part is installed first year operation mouth department of thing mechanism, more than one cover the equal movably cover of piece and establish on the assembly part, just cover the piece and can cover the operation mouth, still be equipped with shockproof piece on the cover.
When the processing device is used, wafers are placed in the first carrying mechanism or processed wafers are taken out according to actual processing procedures. Movement of the carrier mechanism with the covering exposes a window for a robot or other automated device to extend into the first carrier mechanism. The robot or other automation equipment can drive the wafer to enter the first carrying mechanism through the window for placing or take the wafer out of the first carrying mechanism through the window. In the process, the mechanical arm is firstly contacted with the shockproof part and further drives the covering part to move, so that the vibration generated when the mechanical arm drives the covering part to move can be effectively avoided, and the stable taking and placing of the wafer by the processing device are ensured. After the operation of the wafer is finished, the moved covering part is reset, namely, the operation opening is completely sealed by the covering part again. Above-mentioned processing device utilizes the covering piece to cover the operation mouth, has avoided external moisture or impurity particle to get into first year thing mechanism through the operation mouth to guarantee that the wafer is in the environment of high cleanliness in first year thing mechanism, improved the finished product effect of wafer.
A processing apparatus comprising: the second carries thing mechanism and blocking mechanism, the second carries thing mechanism and is used for placing the wafer, the second carries thing mechanism and offers the mouth of putting of getting that is used for getting to put the wafer, blocking mechanism movably installs the second carries thing mechanism is last, just blocking mechanism is used for hiding get and put the mouth.
When the processing device is used, the wafer is placed in the second carrying mechanism or the processed wafer is taken out according to the actual processing procedure. At this time, the movement of the blocking mechanism may be achieved manually or by means of automatic control. With the movement of the blocking mechanism, the blocking mechanism can release the blocking of the taking and placing opening, and at the moment, the wafer can be placed in the second carrying mechanism (or the wafer can be taken out from the second carrying mechanism) through the taking and placing opening. After the operation of the wafer is finished, the moved blocking mechanism is reset to move, namely, the taking and placing opening is completely sealed by the blocking mechanism again. The processing device utilizes the blocking mechanism to cover the pick-and-place opening, and avoids external moisture or impurity particles from entering the second object carrying mechanism through the pick-and-place opening, so that the wafer is ensured to be in a high-cleanliness environment in the second object carrying mechanism, and the finished product effect of the wafer is improved.
A processing method comprises the following steps: moving a covering member for covering the operation opening until a window for the wafer to pass through is formed at the operation opening; the wafer enters the first carrying mechanism through the window for storage, or the wafer is taken out of the first carrying mechanism through the window; and after the wafer is taken and placed in the first carrying mechanism, the covering part is moved again until the covering part covers the whole operation opening.
When the processing method is used for processing, the area of the opening for passing through the wafer is determined according to the size, the thickness or the shape of the wafer, the wafer enters the first carrying mechanism through the opening to be stored, or the wafer is taken out of the first carrying mechanism through the opening, so that the accidental friction between the wafer and the shielding part in the conveying (or moving) process is ensured. And after the wafer is taken and placed in the first carrying mechanism, moving the covering part again until the covering part covers the whole operation opening. The processing method ensures that the wafer can be in a high-cleanliness environment during processing or storage, and improves the finished product effect of the wafer.
The technical solution is further explained below:
the processing device further comprises more than two partition plates, the first carrying mechanism comprises a storage box and a carrying mechanism, the storage box is used for placing wafers, the storage box is placed on the carrying mechanism, the carrying mechanism is provided with an operation opening corresponding to a box opening of the storage box, the operation opening is more than two, the partition plates are arranged in the storage box at intervals in the height direction, the partition plates are used for placing the wafers, and the partition plates are adjacent to each other, and the interval between the partition plates is larger than the thickness of the wafers.
The processing device further comprises more than two shockproof pieces, the number of the covering pieces is more than two, the covering pieces are stacked along the axial direction of the assembly piece, the shockproof pieces are arranged on the covering pieces in a one-to-one correspondence mode, and the two adjacent covering pieces absorb shock through the shockproof pieces.
The shockproof part is attached to one surface of the covering part, a first adjusting part and a second adjusting part are arranged on the covering part, and the first adjusting part and the second adjusting part are located on two sides of the shockproof part.
The processing device further comprises an air injection mechanism, a first nozzle and a second nozzle are arranged on the air injection mechanism, a first air inlet hole and a second air inlet hole are formed in the bottom of the storage box, the first nozzle is communicated with the first air inlet hole, and the second nozzle is communicated with the second air inlet hole.
The processing device further comprises a taking base, a lifting piece and a taking piece, wherein the lifting piece is movably mounted on the taking base, and the end part of the lifting piece is in plug-in fit with the first positioning part and/or the second positioning part.
The processing device further comprises a synchronous seat, a positioning driving piece, a lifting driving piece and a taking driving piece, wherein the positioning driving piece is installed on the taking base, the synchronous seat is installed at the output end of the positioning driving piece, the lifting driving piece is installed with the taking driving piece on the synchronous seat, the lifting driving piece is connected with the lifting piece, and the taking driving piece is connected with the taking piece.
The processing device further comprises an assembly frame, wherein the assembly frame is arranged on the carrying mechanism, a frame opening of the assembly frame corresponds to the operation opening, and the opening area of the frame opening is larger than that of the operation opening.
Drawings
Fig. 1 is a schematic structural diagram of a processing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a processing apparatus according to another embodiment of the present invention;
FIG. 3 is a schematic structural view of a storage compartment according to an embodiment of the present invention;
FIG. 4 is a schematic structural view of a covering member according to an embodiment of the present invention;
FIG. 5 is a schematic view of an internal structure of a storage case according to an embodiment of the present invention;
FIG. 6 is a schematic structural view of a lifting member and a pick-up member according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a processing apparatus according to another embodiment of the present invention;
fig. 8 is a flowchart of a processing method according to an embodiment of the invention.
Description of the reference numerals:
100. the device comprises a first carrying mechanism, 110, an operation port, 120, a partition plate, 130, a storage box, 131, a first air inlet hole, 132, a second air inlet hole, 140, a carrying mechanism, 150, an assembly frame, 160, an air injection mechanism, 161, a first nozzle, 162, a second nozzle, 200, an assembly part, 300, a covering part, 310, a shockproof part, 311, a first positioning part, 312, a second positioning part, 400, a wafer, 500, a taking base, 510, a synchronous seat, 520, a positioning driving part, 530, a lifting driving part, 540, a taking driving part, 600, a lifting part, 700, a taking part, 800, a second carrying mechanism, 810, a taking and placing port, 900 and a blocking mechanism.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The terms "first" and "second" used herein do not denote any particular order or quantity, but rather are used to distinguish one element from another.
In one embodiment, as shown in fig. 1 or 2, a processing device includes: the first object carrying mechanism 100 is used for placing a wafer 400, the first object carrying mechanism 100 is provided with an operation opening 110 used for taking and placing the wafer 400, the assembly part 200 is arranged at the operation opening 110 of the first object carrying mechanism 100, more than one of the covering parts 300 are movably sleeved on the assembly part 200, the covering parts 300 are used for covering the operation opening 110, and the covering parts 300 are further provided with shockproof parts 310.
When the processing apparatus is used, the wafer 400 is placed in the first stage loading mechanism 100 or the processed wafer 400 is taken out as necessary according to the actual processing step. At this time, a robot or other automated equipment may be used to move some or all of the covering members 300 at the access opening 110 of the first loading mechanism 100, and as the covering members 300 are moved, a window for the robot or other automated equipment to extend into the first loading mechanism 100 is exposed. A robot or other automated equipment may move the wafer 400 through the window into the first carrier mechanism 100 for placement or remove the wafer 400 from the first carrier mechanism 100 through the window. In this process, the covering member 300 can effectively avoid the vibration generated when the robot drives the covering member 300 to move under the action of the vertical traction force of the shockproof member 310, i.e. the stable taking and placing of the wafer 400 by the processing device is ensured. After the operation for the wafer 400 is completed, the moved cover 300 is reset, i.e., the operation opening 110 is completely sealed by the cover 300. The processing device utilizes the covering piece 300 to cover the operation opening 110, so that external moisture or impurity particles are prevented from entering the first loading mechanism 100 through the operation opening 110, the wafer 400 is ensured to be in a high-cleanliness environment in the first loading mechanism 100, and the finished product effect of the wafer 400 is improved.
In one embodiment, the fitting 200 is a fitting post or a fitting rod. Specifically, the assembly 200 is vertically mounted on the first loading mechanism 100, that is, more than one covering member 300 is sleeved on the assembly 200 along the axial direction of the assembly 200. One side of the cover 300 is provided with a piercing opening for mating with the fitting 200. More specifically, the number of the fitting 200 may be one or two.
In one embodiment, when the number of the assembly 200 is one, after the cover 300 is sleeved on the assembly 200, the cover 300 can be rotated along the assembly 200, that is, when the cover 300 is moved, a window for passing the wafer 400 (a window through which the wafer 400 enters the first loading mechanism 100 from the outside or a window through which the wafer 400 is taken out from the first loading mechanism 100 to the outside) can be formed by lifting the cover 300, or all or part of the cover 300 can be rotated along the assembly 200, and a window for passing the wafer 400 is formed at the handling port 110 at this time, which makes the adjustment of the cover 300 more convenient.
In one embodiment, when the number of the assembling members 200 is two, two assembling members 200 are mounted on the first loading mechanism 100, and the two assembling members 200 are respectively located at two corresponding sides of the operation opening 110, and two ends of the covering member 300 are respectively provided with a first assembling opening and a second assembling opening matched with the assembling members 200. Specifically, the covering member 300 is moved in the axial direction (the covering member 300 moves in the axial direction of the fitting member 200) by the two fitting members 200, and at the same time, the covering member 300 can be prevented from being displaced in the horizontal direction (the radial direction of the fitting member 200), and the sealing property of the covering member 300 with respect to the first loading mechanism 100 is ensured.
In one embodiment, the covering member 300 is a plate or a sheet. When the number of the covering members 300 is one, the size of the covering members 300 is determined according to the size of the opening of the operation opening 110, that is, it is ensured that one covering member 300 can completely cover the operation opening 110. When it is necessary to store or take out the wafer 400, directly moving the cover 300 (moving the cover 300 in the axial direction of the assembly 200 or rotating the cover 300 in the radial direction of the assembly 200) can form a window for the wafer 400 to pass through (a window through which the wafer 400 enters the first carrier mechanism 100 from the outside or a window through which the wafer 400 is taken out from the first carrier mechanism 100 to the outside). Finally, after the wafer 400 is taken out or stored, the covering member 300 is reset to seal the first loading mechanism 100.
In one embodiment, the number of the covers 300 is two or more. Considering that a plurality of wafers 400 are stacked inside the first carrier mechanism 100, in this embodiment, when the wafers 400 need to be stored or taken out, the wafer 400 is placed in the first carrier mechanism 100 (corresponding to the height of the wafer 400 inside the first carrier mechanism). Then, the cover 300 (the cover 300 on the first loading mechanism 100 and the wafer 400) at the same height as the target wafer 400 is adjusted by the robot. Such an embodiment can reduce the moving distance of the covering member 300, and can prevent an excessively large window from being formed at the operation opening 110, and prevent moisture or foreign particles from entering the first loading mechanism 100 through the window.
As shown in fig. 1-3, in one embodiment, the processing device further includes two or more baffles 120. First thing mechanism 100 of carrying includes storage tank 130 and carrying mechanism 140, storage tank 130 is used for placing wafer 400, storage tank 130 places on carrying mechanism 140, carrying mechanism 140 set up with the case mouth of storage tank 130 is corresponding operation mouth 110, more than two baffle 120 is followed storage tank 130's direction of height interval sets up inside storage tank 130, baffle 120 is used for placing wafer 400, and adjacent two interval between the baffle 120 is greater than the thickness of wafer 400. Further, for example: when the robot performs a pick-and-place operation on the wafer 400 mounted on the partition 120, after the robot contacts the surface of the wafer 400, the robot has a lifting process (i.e., moves along the height direction of the storage box 130), so that the space between two adjacent partitions 120 is greater than the thickness of the wafer 400, on one hand, a lifting space can be provided for the robot, and on the other hand, the wafer 400 can be prevented from being damaged by friction with the partitions 120 when lifted by the robot.
When the processing apparatus is used, the wafer 400 is placed in the storage box 130 or the wafer 400 is taken out as required by the processing procedure. At this time, a robot or other automated equipment is used to move part or all of the covering members 300 located at the operation ports 110 of the loading mechanism 140 (to move up and down in the axial direction of the assembly 200 or to rotate in the axial direction along the assembly 200). After the covering member 300 is moved, the covered operation opening 110 exposes a window for a robot or other automation equipment to extend into the storage box 130, and the robot or other automation equipment can drive the wafer 400 into the storage box 130 through the window for placing or taking out the wafer 400 from the storage box 130. After the operation for the wafer 400 is completed, the moved cover 300 is reset, i.e., the operation opening 110 is completely sealed by the cover 300. The processing device utilizes the covering piece 300 to cover the operation opening 110, so that external moisture or impurity particles are prevented from entering the storage box 130 through the operation opening 110, the wafer 400 is ensured to be in a high-cleanliness environment in the storage box 130, and the finished product effect of the wafer 400 is improved.
Specifically, the wafer 400 is placed or stored in the storage box 130, and the storage box 130 is mounted in the mounting mechanism 140. The carrying mechanism 140 is a table or a base. Considering that the processing procedure of the wafer 400 is complicated, at this time, the carrying mechanism 140 can fix the storage box 130 at a preset height position, and the box opening of the storage box 130 and the chamber of the processing equipment are located at the same height, so that the robot is more convenient to transfer and carry. . More specifically, the side of the storage box 130, at which the box opening is opened, is attached to the operation opening 110 of the carrying mechanism 140, i.e. a gap is prevented from being formed between the box opening and the operation opening 110.
As shown in fig. 1 and 4, in one embodiment, the processing apparatus further includes two or more shock absorbing members 310. The number of the covering members 300 is two or more. The covering member 300 may be an aluminum covering member, a titanium covering member, or another covering member 300 made of light metal. The shock absorbing member 310 is a rubber shock absorbing member, a plastic shock absorbing member, or a shock absorbing member made of other flexible materials. In this embodiment, the covering member 300 is an aluminum covering member, and the shock absorbing member 310 is a perfluoro engineering plastic shock absorbing member. Further, according to the placement positions of the plurality of partition boards 120 inside the storage box 130, in the present embodiment, 25 covering members are adopted, that is, the window of the storage box 130 is covered by the 25 covering members, and after the window is covered by the 25 covering members, each of the covering members can correspond to the space between two adjacent partition boards one by one. The embodiment facilitates the robot to pick and place the wafer at a specific position inside the storage box, and the size of the window to be moved is reduced to the maximum extent, that is, the risk that external moisture or impurity particles enter the first loading mechanism 100 is reduced. The cover members 300 are stacked in the axial direction of the assembly member 200, the shock-absorbing members 310 are mounted on the cover members 300 in a one-to-one correspondence, and the shock-absorbing members 310 absorb shock between adjacent two cover members 300. Specifically, the shock absorbing member 310 is a cushion pad or an elastic layer. The shock absorbing member 310 is installed at the bottom of the covering member 300. That is, when two or more of the covering members 300 are stacked, the covering member 300 located above is stacked with the covering member 300 located below via the shock absorbing member 310, so that a shock absorbing effect between two adjacent covering members 300 is achieved, and foreign particles generated by mutual collision or impact between two adjacent covering members 300 are also prevented. Further, the shockproof piece 310 generates a certain elastic deformation under the action of the gravity of the covering members 300, and at this time, the shockproof piece 310 can compensate and fill the gap formed by two adjacent covering members 300, so that the sealing performance of the covering members 300 on the first loading mechanism 100 (the operation opening 110) is improved.
As shown in fig. 1, 4 and 6, in one embodiment, the shockproof member 310 is attached to one surface of the covering member 300, the covering member 300 is provided with a first positioning portion 311 and a second positioning portion 312, and the first positioning portion 311 and the second positioning portion 312 are located at two sides of the shockproof member 310. The processing apparatus further includes a pick-up base 500, a lifting member 600, and a pick-up member 700. The lifting member 600 and the taking member 700 are movably mounted on the taking base 500, and the end of the lifting member 600 is inserted and matched with the first positioning portion 311 and/or the second positioning portion 312. Specifically, the first positioning portion 311 and the second positioning portion 312 are concave portions or arc-shaped portions. The lifting member 600 is a rod or a column. In this embodiment, the lifting member 600 includes a first mounting plate and two rods, and the two rods are spaced apart from each other on the first mounting plate. When moving the covering member 300, the two rod bodies are inserted into the first positioning portion 311 and the second positioning portion 312 respectively, and meanwhile, the first positioning portion 311 and the second positioning portion 312 are both arc-shaped portions or concave portions, so that the rod bodies can be wrapped, and the rod bodies are prevented from falling off from the first positioning portion 311 or the second positioning portion 312 accidentally in the moving process.
As shown in fig. 5, in an embodiment, the processing device further includes an air injection mechanism 160, the air injection mechanism 160 is provided with a first nozzle 161 and a second nozzle 162, the bottom of the storage box 130 is provided with a first air inlet hole 131 and a second air inlet hole 132, the first nozzle 161 is communicated with the first air inlet hole 131, and the second nozzle 162 is communicated with the second air inlet hole 132. Specifically, after the storage box 130 is placed on the carrying mechanism 140, the air injection mechanism 160 can be correspondingly assembled with the storage box 130, that is, a space for installing and matching the air injection mechanism 160 and the storage box 130 is left on the carrying mechanism 140 (when the storage box 130 is placed on the carrying mechanism 140, the first nozzle 161 can be communicated with the first air inlet hole 131, and the second nozzle 162 can be communicated with the second air inlet hole 132). The nitrogen is injected into the storage box 130 through the air injection mechanism 160, so that on one hand, a dry environment can be kept in the storage box 130, and on the other hand, positive pressure is formed in the storage box 130, which helps prevent outside air from entering the storage box 130. Furthermore, in the embodiment, since the covering member 300 can cover the window of the storage box 130, the air injection mechanism 160 can use low-flow nitrogen gas, so as to ensure a dry and clean environment inside the storage box 130.
As shown in fig. 1 and 2, in one embodiment, the pick-up 700 is a plate or a sheet. In this embodiment, take piece 700 and include second mounting panel and two plate bodies, two the plate body interval sets up on the second mounting panel, and two interval between the plate body is less than the interval (indicates two corresponding baffles 120 that are located on the relative both sides of storage tank 130) between two baffles 120 in the storage tank 130 to guarantee to take piece 700 after getting into storage tank 130, take piece 700 can not take place to contradict with baffle 120 when going on finely tuning to rise or descend.
In one embodiment, the processing tool further comprises a synchronization base 510, a positioning actuator 520, a lifting actuator 530, and a picking actuator 540. Position adjusting driving piece 520 is installed on the base 500 of taking, install in step seat 510 the output of position adjusting driving piece 520, lift driving piece 530 with the driving piece 540 of taking is all installed on step seat 510, lift driving piece 530 with it links to each other to lift a 600, the driving piece 540 of taking with it links to each other to take 700. Specifically, the positioning driving element 520, the lifting driving element 530 and the taking driving element 540 are motors, air cylinders or oil cylinders. In the present embodiment, the positioning driving element 520 drives the synchronizing base 510 to move or rotate, so that the lifting element 600 and the picking element 700 on the synchronizing base 510 can move synchronously to the operation area corresponding to the first loading mechanism 100, and then the lifting driving element 530 drives the lifting element 600 to insert into the first positioning portion 311 and the second positioning portion 312 of the covering element 300 and perform the lifting operation, so as to form a window for the picking element 700 to pass through. The wafer 400 is picked or placed by the picking member 700 driven by the picking driving member 540 through the window and into the first loading mechanism 100. After the wafer 400 is placed or taken, the taking driving member 540 drives the taking member 700 to move again and leave the first object carrying mechanism 100 through the window. After the picking member 700 completely leaves the first loading mechanism 100, the lifting driving member 530 drives the lifting member 600 to move until the covering member 300 is reset, and at this time, the picking and placing operations for the wafer 400 are completed.
In one embodiment, the processing apparatus does not need any driving mechanism added to the first loading mechanism 100, thereby avoiding the effect of vibration on the first loading mechanism 100 due to the operation of the driving mechanism, i.e., avoiding the effect of the operation of the driving mechanism on the processing of the wafer 400. In addition, the shock-proof member 310 is additionally disposed in the processing apparatus, so that on one hand, the sealing performance of the covering member 300 with respect to the operation opening 110 can be improved, and on the other hand, when the lifting member 600 lifts the covering member 300, a certain shock is generated due to the lifting driving member 530, and at this time, the covering member 300 can effectively absorb the shock caused by the lifting driving member 530, so as to ensure the stability of the wafer 400 during the moving process.
As shown in fig. 1 and 2, in one embodiment, the first carrier mechanism 100 further includes a mounting frame 150. The assembly member 200 is mounted on the assembly frame 150, the assembly frame 150 is mounted on the carrying mechanism 140, a frame opening of the assembly frame 150 corresponds to the operation opening 110, and an opening area of the frame opening is larger than that of the operation opening 110. Specifically, the opening area of the frame opening is larger than the opening area of the operation opening 110, so that the operation opening 110 can be prevented from being blocked after the assembly member 200 is mounted on the assembly frame 150. More specifically, the assembly frame 150 is assembled by a plurality of mounting rods or mounting plates, and when the assembly member 200 or the covering member 300 needs to be replaced, the corresponding part of the assembly frame 150 is directly disassembled, so that the assembly member 200 or the covering member 300 which needs to be replaced can be taken out, and the operation is very convenient.
In one embodiment, as shown in fig. 7, a processing device includes: a second loading mechanism 800 and a blocking mechanism 900. The second carrying mechanism 800 is used for placing the wafer 400, the second carrying mechanism 800 is provided with a pick-and-place opening 810 for picking and placing the wafer 400, the blocking mechanism 900 is movably arranged on the second carrying mechanism 800, and the blocking mechanism 900 is used for covering the pick-and-place opening 810.
When the processing apparatus is used, the wafer 400 is placed in the second stage loading mechanism 800 or the processed wafer 400 is taken out as necessary according to the actual processing step. In this case, the movement control of the blocking mechanism 900 may be performed manually or by means of automatic control. As the blocking mechanism 900 moves, the blocking mechanism 900 releases the shielding of the pick-and-place port 810, and at this time, the placement of the wafer 400 in the second stage loading mechanism 800 (or the removal of the wafer 400 from the second stage loading mechanism 800) can be achieved through the pick-and-place port 810. After the operation on the wafer 400 is completed, the moved blocking mechanism 900 is reset, that is, the pick-and-place opening 810 is completely sealed by the blocking mechanism 900 again. Above-mentioned processing apparatus utilizes blocking mechanism 900 to cover getting and putting mouth 810, has avoided external moisture or impurity particle to get into the second through getting and putting mouth 810 and has carried thing mechanism 800 to guarantee that wafer 400 is in the environment of high cleanliness in the second carries thing mechanism 800, improved wafer 400's finished product effect.
In one embodiment, the second carrier mechanism 800 is a box or a storage bin. The blocking mechanism 900 is a door panel or a curtain panel. Specifically, in this embodiment, the blocking mechanism 900 is a door panel, a slide rail is disposed on the processing device, and the door panel can move relative to the pick-and-place port 810 of the second object loading mechanism 800 through the slide rail, that is, the door panel can block and open the pick-and-place port 810.
In one embodiment, as shown in fig. 8, a method of processing includes the steps of:
s100, moving the covering member 300 for covering the operation opening 110 until a window for the wafer 400 to pass through is formed at the operation opening 110;
s200, the wafer 400 enters the first loading mechanism 100 through the window for storage, or the wafer 400 is taken out from the first loading mechanism 100 through the opening;
s300, after the wafer 400 is completely taken into and placed in the first loading mechanism 100, the covering member 300 is moved again until the covering member 300 covers the entire operation opening 110.
In the processing method, during processing, the area of the window for passing through the wafer 400 is determined according to the size, thickness or shape of the wafer 400, and the wafer 400 enters the first carrying mechanism 100 through the window for storage or the wafer 400 is taken out from the first carrying mechanism 100 through the window, so that accidental friction between the wafer 400 and the covering member 300 during transportation (or movement) is ensured. After the wafer 400 is completely picked up and placed in the first loading mechanism 100, the covering member 300 is moved again until the covering member 300 covers the entire operation opening 110. The processing method enables the wafer 400 to be in a high-cleanliness environment during processing or storage, and improves the finished product effect of the wafer 400.
All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A processing apparatus, comprising: the wafer assembling device comprises a first carrying mechanism, an assembling part and more than two covering parts, wherein the first carrying mechanism is used for placing a wafer, the first carrying mechanism is provided with an operation port used for taking and placing the wafer, the assembling part is arranged at the operation port of the first carrying mechanism, the more than two covering parts are movably sleeved on the assembling part and used for covering the operation port, and the covering parts are also provided with shockproof parts; still including taking the base, lifting, taking the piece, cover the piece and follow the axial of assembly part stacks, shockproof one-to-one is installed cover on the piece, and adjacent two cover and pass through between the piece shockproof piece carries out the shock attenuation, shockproof piece is all installed cover the bottom of piece, and its lower surface flushes with the lower surface that covers the piece, cover and seted up first positioning portion and second positioning portion on the piece, just first positioning portion with the second positioning portion is in shockproof both sides, lift with it all movably installs to take the piece on the base of taking, just lift the tip of piece with the cooperation of pegging graft of first positioning portion and/or second positioning portion.
2. The processing device according to claim 1, further comprising two or more partition plates, wherein the first loading mechanism comprises a storage box and a carrying mechanism, the storage box is used for placing a wafer, the storage box is placed on the carrying mechanism, the carrying mechanism is provided with the operation opening corresponding to the box opening of the storage box, the two or more partition plates are arranged inside the storage box at intervals along the height direction of the storage box, the partition plates are used for placing a wafer, and the interval between every two adjacent partition plates is greater than the thickness of the wafer.
3. The processing device of claim 2, further comprising an air injection mechanism, wherein the air injection mechanism is provided with a first nozzle and a second nozzle, the bottom of the storage box is provided with a first air inlet hole and a second air inlet hole, the first nozzle is communicated with the first air inlet hole, and the second nozzle is communicated with the second air inlet hole.
4. The processing apparatus according to claim 2, wherein the first loading mechanism further comprises an assembly frame, the assembly member is mounted on the assembly frame, the assembly frame is mounted on the loading mechanism, a frame opening of the assembly frame corresponds to the operation opening, and an opening area of the frame opening is larger than an opening area of the operation opening.
5. The machining processing apparatus according to claim 1, wherein the first positioning portion and the second positioning portion are concave portions or arc-shaped portions.
6. The processing apparatus according to claim 5, wherein the lifting member comprises a first mounting plate and two rods spaced apart from each other on the first mounting plate, and the two rods are inserted into the first and second positioning portions when the covering member is moved.
7. The converting apparatus of claim 2, wherein said pick-up member includes a second mounting plate and two plates spaced apart from each other on said second mounting plate, and wherein the spacing between said two plates is less than the spacing between said two partitions in said storage compartment.
8. The processing device according to claim 7, further comprising a synchronization seat, a positioning driving member, a lifting driving member and a taking driving member, wherein the positioning driving member is mounted on the taking base, the synchronization seat is mounted at an output end of the positioning driving member, the lifting driving member and the taking driving member are mounted on the synchronization seat, the lifting driving member is connected with the lifting member, and the taking driving member is connected with the taking member.
9. The machining device of claim 8, wherein the positioning drive, the lifting drive and the retrieving drive are motors, cylinders or cylinders.
10. A processing method using the processing apparatus according to any one of claims 1 to 9, comprising the steps of:
moving a covering member for covering the operation opening until a window for the wafer to pass through is formed at the operation opening;
the wafer enters the first carrying mechanism through the window for storage, or the wafer is taken out of the first carrying mechanism through the window;
and after the wafer is taken and placed in the first carrying mechanism, moving the covering part again until the covering part covers the whole operation opening.
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| CN1830733A (en) * | 2005-03-10 | 2006-09-13 | 爱普生拓优科梦株式会社 | Packing material for wafer |
| JP4535937B2 (en) * | 2005-05-27 | 2010-09-01 | 大日本印刷株式会社 | Substrate housing |
| JP2007165821A (en) * | 2005-11-15 | 2007-06-28 | Nsk Ltd | Carrier device and exposure device |
| TW201004853A (en) * | 2008-07-25 | 2010-02-01 | Inotera Memories Inc | Method for carrying wafer cassette and carrying system thereof |
| JP6556148B2 (en) * | 2014-09-05 | 2019-08-07 | ローツェ株式会社 | Load port and load port atmosphere replacement method |
| TWI545067B (en) * | 2015-01-26 | 2016-08-11 | 茂迪股份有限公司 | Loading body of wafer cassette |
| CN211017012U (en) * | 2019-09-29 | 2020-07-14 | 长鑫存储技术有限公司 | Processing device |
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| JP2007173265A (en) * | 2005-12-19 | 2007-07-05 | Dainippon Printing Co Ltd | Shock resistant clean vessel |
| TW201523776A (en) * | 2013-09-04 | 2015-06-16 | Tokyo Electron Ltd | Loading port apparatus and substrate processing apparatus |
| CN108091599A (en) * | 2017-12-12 | 2018-05-29 | 成都强思科技有限公司 | A kind of fixed equipment of Automated library system chip |
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