CN219163347U

CN219163347U - Semiconductor wafer strorage device that can go up and down voluntarily

Info

Publication number: CN219163347U
Application number: CN202223507882.XU
Authority: CN
Inventors: 洪永斌; 保贵; 魏娇娇; 黄勇富
Original assignee: Sichuan Yingzhixing Electronic Technology Co ltd
Current assignee: Sichuan Yingzhixing Electronic Technology Co ltd
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-06-09
Anticipated expiration: 2032-12-28

Abstract

The utility model relates to the field of semiconductor manufacturing, in particular to an automatically lifting semiconductor wafer storage device which comprises an outer shell, a conductive accommodating cavity, a shell plate, a lifting plate, a base, a lifting guide rail and a lifting support sliding rail, wherein a front side plate and a rear side plate of the outer shell are movable rotating plates, the bottom of the outer shell and the shell plate are arranged together through a detachable plug-in structure, the shell plate is fixed on the lifting plate, the front side and the rear side of the lifting plate are fixed above the base through the lifting guide rail, and the lifting support sliding rail is parallel to the lifting guide rail and is fixed between the lifting plate and the base. In the lifting process, the semiconductor wafer of the highest layer is always at the height position of the grabbing of the manipulator, and the manipulator can accurately grab the semiconductor wafers with different storage heights under the condition of not changing the program. When encountering automatic assembly line, the automatic lifting height cooperates with the grabbing position of the manipulator, and the automatic and quick assembly function cannot be realized.

Description

Semiconductor wafer strorage device that can go up and down voluntarily

Technical Field

The utility model relates to the field of semiconductor manufacturing, in particular to a semiconductor wafer storage device capable of automatically lifting.

Background

The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because of its circular shape, and various circuit element structures can be manufactured on the silicon wafer to form an IC product having a specific electrical function.

The storage boxes which are constant in temperature and can fix the wafers exist at present, have the functions of enabling the wafers to be stacked in an aligned mode and preventing the wafers from being damaged by mutual friction, and have the function of preventing the circuit from being damaged by mutual friction.

For example, patent number 202023142822.3 discloses a semiconductor wafer storage box, which comprises an inner shell, wherein the inner shell is in a cube shape, the upper end of the inner shell is open, the lower end of the inner shell is closed, a plurality of round storage grids are arranged in the inner shell, the storage grids are vertically arranged side by side, the upper ends of the storage grids are cut along the round edges to form a straight edge, and notches communicated with the storage grids are arranged on two sides of the inner shell so as to completely place wafers in the storage grids; the outer shell is a cylinder and is inserted from an opening at the upper end of the inner shell so as to sleeve the outer shell on the periphery of the inner shell, and the outer wall at the lower end of the outer shell is provided with external threads and is connected with a sealing cover through the external threads. By storing the wafers, the utility model can reduce the abrasion between the wafers and prevent dust from entering the box body, thereby reducing the production cost.

Also disclosed in an embodiment of the utility model, for example, in patent number 201921105016.3, is a semiconductor storage device comprising: the capacitor is arranged in the cavity and used for storing the semiconductor device and collecting charges which can interfere with the semiconductor device in the environment; and the lead-out structure is connected with the conductive accommodating cavity and used for leading out the charges collected on the conductive accommodating cavity. According to the embodiment of the specification, the conductive accommodating cavity for accommodating the semiconductor device is utilized to collect charges interfering with the semiconductor device in the environment, and the lead-out structure connected with the conductive accommodating cavity is utilized to lead out the charges collected by the conductive accommodating cavity, so that the charges remained on the surface of the semiconductor device in the semiconductor accommodating device can be eliminated, the damage of the semiconductor device caused by excessive accumulation of the environmental charges on the semiconductor device is reduced, the influence of the charges on the subsequent process of the semiconductor device is reduced, and the performance of the semiconductor device is improved.

At present, the workshop production is basically automated, and particularly, the manipulator is used, so that the manipulator is a mature automatic handling instrument, and is a control object frequently encountered in the field of semiconductor automatic control. The manipulator can perform a plurality of works such as carrying, assembling, cutting, spray dyeing and the like, and has very wide application. However, reasonable matching is crucial, the existing semiconductor wafer storage boxes are all of a fixed height, and when an automatic assembly line is met, the existing semiconductor wafer storage boxes cannot be lifted to match with the grabbing positions of the manipulators, so that the automatic and rapid assembly function cannot be realized.

Disclosure of Invention

In order to solve the technical problems, the utility model aims to provide the semiconductor wafer storage device capable of automatically lifting, which can adjust the height position of each semiconductor wafer, so that the semiconductor wafer storage device can move up and down by being matched with the grabbing manipulator, and the storage box can be taken down and carried at will, so that the use is convenient.

In order to achieve the above object, the technical scheme of the present utility model is as follows:

the semiconductor wafer storage device capable of automatically lifting comprises an outer shell and a conductive accommodating cavity, wherein the conductive accommodating cavity is arranged in the outer shell and is cylindrical, the outer shell is cylindrical or rectangular, a movable switch door is arranged at the top of the outer shell, and a plurality of conductive brackets are arranged in the conductive accommodating cavity in parallel; wherein, a containing area is formed between two adjacent conductive brackets, and the containing area is used for storing the semiconductor wafer;

still include casing board, lifter plate, base and lift guide rail to and lift support slide rail, the preceding curb plate and the posterior lateral plate of shell body are movable rotating plate, are in the same place through removable grafting structure installation between the bottom of shell body and casing board, and the casing board is fixed on the lifter plate, and the front and back side at the lifter plate is fixed in the base top through the lift guide rail, and lift support slide rail is on a parallel with the lift guide rail, fixes between lifter plate and base to the lift guide rail is servo motor drive, is used for driving the distance formula of the high interval of holding area of casing board realization.

Preferably, a conductive connector and a conductive protrusion are further arranged in the outer shell, the conductive connector is connected with the conductive bracket, the conductive protrusion is connected with the conductive connector, and the conductive protrusion penetrates through the outer shell to conduct out charges of the mobile phone on the conductive accommodating cavity.

Preferably, the detachable plug structure comprises: the bottom of the outer shell is provided with a bolt fixed on a shell plate, and the shell plate is provided with a socket for inserting the bolt. The shell body is detachable, the semiconductor chip is convenient to carry and transport, and the semiconductor chip can be directly participated in production under the condition that the semiconductor is not taken and carried by the shell body and is fast to assemble, so that the semiconductor chip is convenient to use.

Preferably, the left ends of the front side plate and the rear side plate are connected with the left side plate of the outer shell by a movable spanner, the right ends of the front side plate and the rear side plate are connected with the right side plate of the outer shell by a movable spanner,

the front side plate is connected with the bottom plate of the outer shell through a hinge, and the rear side plate is connected with the bottom plate of the outer shell through a hinge.

Preferably, the movable switch door is a double door type, and is turned towards the left side and the right side of the outer shell to be opened, and the conductive accommodating cavity is completely exposed after the movable switch door is opened. After the outer shell is placed on the shell plate, the outer shell is opened quickly, so that the conductive accommodating cavity inside the outer shell is exposed, and the semiconductor wafer can be directly exposed for grabbing by a manipulator during production.

Preferably, the conductive support has a notch, wherein the semiconductor wafer stored on the conductive support is suspended at the notch position for extracting the semiconductor wafer from the conductive accommodating cavity.

Preferably, the lifting guide rail is a ball screw group, the lifting support slide rail is a linear slide rail, four groups of lifting support slide rails are arranged, and the lifting support slide rails are fixed between the lifting plate and the base at equal intervals.

The beneficial effect that above design compares with prior art is: the design of shell body and electrically conductive holding chamber is used for depositing the semiconductor wafer, be convenient for store and transport the semiconductor wafer, can also utilize the electrically conductive holding chamber of depositing the semiconductor device, the electric charge that interferes the semiconductor device in the collecting environment, and utilize the derivation structure of being connected with electrically conductive holding chamber to derive the electric charge that the electric charge was collected in the electrically conductive holding chamber, can eliminate the electric charge that remains on the semiconductor device surface of depositing in the semiconductor strorage device, reduce the damage of the semiconductor device that the environmental charge caused when accumulating too much on the semiconductor device, and reduce the influence of electric charge to the follow-up technology of semiconductor device, improve the semiconductor device performance, make strorage device have the function of avoiding mutual friction circuit damage.

The design of movable switch door can open the shell body fast, and the front and back lateral wall of shell body also can overturn fast and open, exposes the electrically conductive support of the semiconductor wafer of inside deposit, makes things convenient for the manipulator to snatch the semiconductor wafer, and the semiconductor wafer of one deck stack, and at the in-process of going up and down, the semiconductor wafer of the highest one deck is in the high position that the manipulator snatched all the time, under the condition that does not change the procedure, the semiconductor wafer of different storage heights of snatch that the manipulator can be accurate. When encountering automatic assembly line, the automatic lifting height cooperates with the grabbing position of the manipulator, and the automatic and quick assembly function cannot be realized.

Drawings

FIG. 1 is a schematic diagram of a front view of the present utility model;

FIG. 2 is a schematic top view of the present utility model;

FIG. 3 is a schematic top view of the outer housing of the present utility model in an open position;

fig. 4 is a schematic left-hand view of the outer housing and the housing plate removably mounted together.

Detailed Description

In order that the manner in which the utility model is attained, as well as the features and advantages thereof, will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof.

The semiconductor wafer storage device capable of automatically lifting as shown in fig. 1-4 comprises an outer shell 1 and a conductive accommodating cavity 2, wherein the conductive accommodating cavity 2 is installed inside the outer shell 1 and is cylindrical, the outer shell 1 is cylindrical or rectangular, a movable switch door 10 is arranged at the top of the outer shell 1, the movable switch door 10 is a double-door type, is opened to the left side and the right side, is turned over to the left side and the right side of the outer shell 1 and is opened, and the conductive accommodating cavity 2 is completely exposed after opening. The left ends of the front side plate 11 and the rear side plate 12 are connected with the left side plate of the outer shell 1 by a movable spanner, the right ends of the front side plate 11 and the rear side plate 12 are connected with the right side plate of the outer shell 1 by a movable spanner, the front side plate 11 is connected with the bottom plate of the outer shell 1 by a hinge, and the rear side plate 12 is connected with the bottom plate of the outer shell 1 by a hinge.

A plurality of conductive brackets are arranged in parallel in the conductive capacity placing cavity 2; the semiconductor wafer 3 is placed on the conductive support, and the semiconductor wafer 3 is placed in the conductive support, wherein a containing area is formed between two adjacent conductive supports, the containing area is used for storing the semiconductor wafer 3, the conductive support is provided with a notch, and the semiconductor wafer 3 stored on the conductive support is suspended at the position of the notch so as to be extracted from the conductive containing cavity 2. The mobile phone comprises a shell body 1, a conductive support, a conductive bulge and a conductive accommodating cavity, wherein the conductive support is connected with the conductive bulge, the conductive bulge is arranged in the shell body 1, and the conductive bulge penetrates through the shell body to conduct charges of the mobile phone on the conductive accommodating cavity.

The lifting device further comprises a shell plate 4, a lifting plate 5, a base 6 and a lifting guide rail 7, and lifting support sliding rails 8, wherein a front side plate 11 and a rear side plate 12 of the shell 1 are movable rotating plates, the front side plate and the rear side plate are installed together between the bottom of the shell 1 and the shell plate 4 through a detachable plug-in structure 9, and the detachable plug-in structure 9 comprises, but is not limited to, a plug pin fixed on the shell plate 4 is arranged at the bottom of the shell 1, and a socket for plugging the plug pin is arranged on the shell plate 4. The shell plate 4 is fixed on the lifting plate 5, the front side and the rear side of the lifting plate 5 are fixed above the base 6 through lifting guide rails 7, lifting support sliding rails 8 are parallel to the lifting guide rails 7, the lifting support sliding rails 7 are fixed between the lifting plate 5 and the base 6, the lifting guide rails 7 are ball screw groups, the lifting support sliding rails 8 are linear sliding rails and are provided with four groups, and the lifting support sliding rails are fixed between the lifting plate 5 and the base 6 at equal intervals. When the ball screw group drives the lifting plate 5 to move up and down, the lifting plate 5 moves up and down along the path of the lifting support sliding rail 8, and the lifting support sliding rail 8 plays a supporting role, so that the lifting plate 5 moves up and down under the condition of keeping balance.

And the lifting guide rail 7 is driven by a servo motor and is used for driving the shell plate 4 to realize a distance type moving mode equal to the height interval of the accommodating area. The ball screw group realizes servo drive, and when the design procedure, the height of each movement of the ball screw group is the notch height of one conductive bracket, and each uppermost semiconductor wafer 3 is kept at the same height all the time, and at the height position, the manipulator moves each time to grasp one semiconductor wafer 3, and after grasping, the notch of the conductive bracket is followed, and the semiconductor wafer 3 at the uppermost layer is horizontal.

The device can be directly placed beside a processing position, the outer shell 1 can be taken down by utilizing a manipulator to grasp, after the outer shell 1 is used for mounting the semiconductor wafer 3 in other places, the device is directly placed on the shell plate 4 and is clamped, the movable door at the top of the outer shell 1 is opened after clamping, the plate buckle is opened, the front side plate 11 and the rear side plate 12 are opened, the conductive support is completely exposed, the notch is also exposed, and the manipulator is convenient to grasp the semiconductor wafer 3 from the notch position and is matched with automatic processing.

The above description is made in detail on the semiconductor wafer storage device capable of automatically lifting. The description of the specific embodiments is only intended to aid in understanding the method of the utility model and its core concept, and it should be understood that it will be apparent to those skilled in the art that various changes and modifications can be made herein without departing from the principles of the utility model, and such changes and modifications will fall within the scope of the appended claims.

Claims

1. An automatic lifting semiconductor wafer storage device comprises an outer shell and a conductive accommodating cavity,

the conductive capacity placing cavity is arranged in the outer shell body and is cylindrical, the outer shell body is cylindrical or rectangular, the top of the outer shell body is provided with a movable switch door,

a plurality of conductive brackets are arranged in the conductive accommodating cavity in parallel; wherein, a containing area is formed between two adjacent conductive brackets, and the containing area is used for storing the semiconductor wafer;

the method is characterized in that: still include casing board, lifter plate, base and lift guide rail to and lift support slide rail, the preceding curb plate and the posterior lateral plate of shell body are movable rotating plate, are in the same place through removable grafting structure installation between the bottom of shell body and casing board, and the casing board is fixed on the lifter plate, and the front and back side at the lifter plate is fixed in the base top through the lift guide rail, and lift support slide rail is on a parallel with the lift guide rail, fixes between lifter plate and base to the lift guide rail is servo motor drive, is used for driving the distance formula of the high interval of holding area of casing board realization.

2. An automatically liftable semiconductor wafer storage device of claim 1, wherein: the shell is also internally provided with a conductive connector and a conductive bulge, the conductive connector is connected with a conductive bracket, the conductive bulge is connected with the conductive connector, and the conductive bulge penetrates through the shell body to lead out the charge of the mobile phone on the conductive accommodating cavity.

3. An automatically liftable semiconductor wafer storage device of claim 1, wherein: the detachable plug structure comprises:

the bottom of the outer shell is provided with a bolt fixed on the shell plate,

the shell plate is provided with a socket for inserting the bolt.

4. An automatically liftable semiconductor wafer storage device of claim 1, wherein: the left ends of the front side plate and the rear side plate are connected with the left side plate of the outer shell by a movable spanner, the right ends of the front side plate and the rear side plate are connected with the right side plate of the outer shell by a movable spanner,

5. An automatically liftable semiconductor wafer storage device of claim 1, wherein: the movable switch door is a double door type, and is turned towards the left side and the right side of the outer shell body to be opened, and the conductive accommodating cavity is completely exposed after the movable switch door is opened.

6. An automatically liftable semiconductor wafer storage device of claim 2, wherein: the conductive support is provided with a notch, wherein the semiconductor wafer stored on the conductive support is suspended at the position of the notch so as to be extracted from the conductive accommodating cavity.

7. An automatically liftable semiconductor wafer storage device of claim 1, wherein: the lifting guide rail is a ball screw group, the lifting support slide rail is a linear slide rail and is provided with four groups, and the lifting guide rail is fixed between the lifting plate and the base at equal intervals.