CN216831662U - Silicon wafer quarter splitting device - Google Patents
Silicon wafer quarter splitting device Download PDFInfo
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- CN216831662U CN216831662U CN202220069545.8U CN202220069545U CN216831662U CN 216831662 U CN216831662 U CN 216831662U CN 202220069545 U CN202220069545 U CN 202220069545U CN 216831662 U CN216831662 U CN 216831662U
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Abstract
The utility model relates to a silicon wafer quarter splitting device, which comprises a splitting mechanism, wherein the splitting mechanism comprises a bottom plate, a fixing frame and a splitting assembly; the bottom plate is horizontally arranged, and the fixing frame is fixedly arranged at the upper end of the bottom plate; the splinter assembly comprises a fixed suction plate, a movable frame, a movable suction plate and a suction plate driving piece, wherein the fixed suction plate is horizontally arranged at the upper end of the fixed frame; the movable frame is movably arranged on one side of the fixed frame, the movable frame can slide towards the direction close to or far away from the fixed frame, the movable suction plate is arranged on the upper end of the movable frame, one side, close to the fixed frame, of the movable suction plate is rotatably connected with the movable frame, the suction plate driving piece is connected with the other side of the movable suction plate to drive the movable suction plate to rotate, the fixed suction plate and the movable suction plate are consistent in installation height, the movable frame moves towards one side far away from the fixed frame in the splitting process, two broken quarter splits are rapidly separated, interference is avoided, the completeness of the splits is effectively guaranteed, and the phenomenon that the splits are broken due to the interference of the column splits is avoided.
Description
Technical Field
The utility model relates to a silicon chip processing equipment technical field, concretely relates to silicon chip quarter lobe of a leaf device.
Background
Solar power generation is a new renewable clean energy, more and more attention is paid to the utilization of photovoltaic power generation by the nation, and in order to improve the efficiency of a battery, a method that laser beams scribe and crack a battery piece in equal parts at a certain depth and then perform series welding is generally adopted to improve the power generation power of a component.
In the prior art, a production process of firstly splitting a complete silicon wafer into two half splits and then splitting the half split into a quarter split is generally adopted, and at present, in the splitting process, especially the quarter splitting process, because the structural design of a splitting device is unreasonable, the splitting device is easy to decrystallize, the splitting rate is high, the blanking is irregular, the cost is wasted, and the manufacturing period is prolonged.
SUMMERY OF THE UTILITY MODEL
Based on the above expression, the utility model provides a silicon chip quarter lobe of a leaf device to solve among the prior art because lobe of a leaf device structural design takes off the crystallization easily when unreasonable resulting in the lobe of a leaf, the fragmentation rate is high, the unloading technical problem irregularly.
The utility model provides an above-mentioned technical problem's technical scheme as follows: a quarter-splitting device for a silicon wafer comprises a splitting mechanism, wherein the splitting mechanism comprises a bottom plate, a fixing frame and a splitting assembly;
the bottom plate is horizontally arranged, and the fixing frame is fixedly arranged at the upper end of the bottom plate;
the splinter assembly comprises a fixed suction plate, a movable frame, a movable suction plate and a suction plate driving piece, wherein the fixed suction plate is horizontally arranged at the upper end of the fixed frame; the adjustable shelf is movably installed in one side of mount, the adjustable shelf can slide to the direction of being close to or keeping away from the mount, the activity suction disc install in the upper end of adjustable shelf, the activity suction disc is close to one side of mount with the rotatable connection of adjustable shelf, the suction disc driving piece with the opposite side of activity suction disc is connected, in order to drive the activity suction disc rotates, the slip direction of adjustable shelf with the axis of rotation place direction of activity suction disc sets up perpendicularly, fixed suction disc with the mounting height of activity suction disc is unanimous.
Compared with the prior art, the technical scheme of the application has the following beneficial technical effects:
the application provides a quarter lobe device holds half of a half lobe respectively through fixed suction disc and activity suction disc, then drives through the suction disc driving piece the activity suction disc rotates and realizes the lobe of a leaf process, and at the lobe of a leaf in-process, the adjustable shelf is to keeping away from one side motion of mount, makes two cracked quarter lobes separate rapidly, avoids interfering, has effectively guaranteed the completeness of lobe of a leaf, stops to interfere the phenomenon that leads to the lobe of a leaf because of the column lobe.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
Furthermore, a guide rail is arranged on the bottom plate, a sliding block matched with the guide rail to slide is arranged at the lower end of the movable frame, and a displacement driving piece used for driving the movable frame to slide is arranged on the bottom plate.
After the scheme is adopted, the movement of the movable frame can be driven through the displacement driving piece during splitting
Furthermore, the two ends of one side of the movable suction plate, which is far away from the fixed suction plate, are provided with limit grooves, and the two ends of the movable frame are connected with limit stoppers matched with the limit grooves.
Furthermore, the number of the lobe assemblies is two, the fixed suction plates corresponding to the two lobe assemblies are respectively arranged on two sides of the upper end of the fixed frame, and the two movable frames are symmetrically arranged on two sides of the fixed frame.
Through the two symmetrically arranged splinter assemblies, the splinter operation can be simultaneously carried out on two half splinters, the splinter efficiency is greatly increased, and the process period is shortened.
Further, still include frame, feeding mechanism, go up unloading mechanism and material receiving box, work platform has in the frame, work platform is last to set up material loading station, lobe of a leaf station and unloading station along the even interval of process, feeding mechanism including set up in the conveyer belt of material loading station and the conveying driving piece that is used for driving the conveyer belt work, lobe of a leaf mechanism set up in the lobe of a leaf station, material receiving box set up in the unloading station, go up unloading mechanism be used for with the half lobe of a leaf that the conveyer belt carried is sent to along the process lobe of a leaf station lobe of a leaf and send the quarter lobe of a leaf after the lobe of a leaf to unloading station unloading is received and is stored up.
Furthermore, the feeding and discharging device comprises a cross beam, a sliding cantilever and two sucker assemblies, wherein the cross beam is fixedly arranged above the lobe mechanism, a rotating shaft of the movable suction plate is arranged in parallel with the cross beam, the sliding cantilever is slidably arranged on the cross beam, the two sucker assemblies are arranged below the sliding cantilever at intervals, and the interval between the two sucker assemblies is consistent with the interval between two adjacent stations on the working platform; the sliding cantilever is provided with a first working state and a second working state on the sliding stroke, when the sliding cantilever is in the first working state, the two sucker components are respectively arranged corresponding to the feeding station and the splitting station, and when the sliding cantilever is in the second working state, the two sucker components are respectively arranged corresponding to the splitting station and the discharging station.
Furthermore, each sucking disc subassembly includes lift seat, lift driving piece and two sucking disc units, the liftable install of lift seat in on the slip cantilever, the lift driving piece is used for the drive the lift seat goes up and down, two the lobe of a leaf subassembly sets up in two on the motion trail of sucking disc unit.
Furthermore, each sucker unit comprises two suction nozzle groups arranged at intervals, and the two suction nozzle groups of the same sucker unit are used for correspondingly sucking two quarter splinters on one half splinter.
Furthermore, the feeding mechanism further comprises a sliding seat, a lifting support platform, a sliding driving cylinder, two lifting material blocking parts and a thick positioning part, the thick positioning part is positioned on two sides of the conveying belt and can vertically move relative to the conveying belt on a horizontal plane, the two lifting material blocking parts are arranged at intervals along the conveying belt, the lifting material blocking parts rise or fall to block or release half of the splinters on the conveying belt, the distance between the two lifting material blocking parts is consistent with the distance between the splinter assemblies, the sliding seat is slidably mounted at the lower end of the conveying surface of the conveying belt along the direction of the conveying belt, the lifting support platform is liftably mounted on the sliding seat, the sliding driving cylinder is used for driving the sliding seat to slide, the stroke starting point of the sliding seat corresponds to the two half of the splinters blocked by the two lifting material blocking parts, the stroke end point of the sliding seat is arranged corresponding to the lobe splitting mechanism.
Furthermore, an outer cover is installed on the periphery of the working platform, a safety door capable of being opened and closed is arranged at the front end of the outer cover, and the conveyor belt extends from the rear end of the outer cover to enter the feeding station.
Drawings
Fig. 1 is a schematic external structural diagram of a silicon wafer quarter-splitting apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural view of the safety door hidden in fig. 1;
FIG. 3 is a schematic view of the distribution of stations on the work platform of FIG. 2;
FIG. 4 is a schematic diagram showing the position distribution of the feeding mechanism, the feeding and discharging mechanism, the splitting mechanism and the material receiving box on the working platform according to the embodiment of the present application;
FIG. 5 is a schematic structural view of the feeding and discharging mechanism in FIG. 4;
FIG. 6 is a schematic structural view of the breaking mechanism of FIG. 4;
FIG. 7 is a schematic structural view of the feeding mechanism in FIG. 4;
fig. 8 is a side view of fig. 7.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Embodiments of the present application are set forth in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
It will be understood that spatial relationship terms, such as "under", "below", "beneath", "below", "over", "above", and the like, may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements or features described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" can encompass both an orientation of above and below. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations) and the spatial descriptors used herein interpreted accordingly.
It will be understood that when an element is referred to as being "connected" to another element, it can be directly connected to the other element or be connected to the other element through intervening elements. The "connection" in the following embodiments is understood as "electrical connection", "communication connection", or the like if the connected circuits, modules, units, or the like have electrical signals or data transmission therebetween.
As used herein, the singular forms "a", "an" and "the" may include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises/comprising," "includes" or "including," etc., specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.
As shown in fig. 1 to 8, an embodiment of the present application provides a silicon wafer quarter splitting apparatus, which includes a rack 10, a feeding mechanism 20, a loading and unloading mechanism 30, a splitting mechanism 40, and a receiving box 50.
The frame 10 serves as a supporting main body of the device and is provided with a working platform 11, and a feeding station A, a splitting station B and a discharging station C are arranged on the working platform 11 at intervals along the working procedure. The feeding mechanism 20 comprises a conveyor belt 21 arranged at the feeding station A and a conveying driving part 22 used for driving the conveyor belt 21 to work, the splitting mechanism 40 is arranged at the splitting station B, the material receiving box 50 is arranged at the discharging station C, and the feeding and discharging mechanism 30 is used for conveying the half split 60 conveyed by the conveyor belt to the splitting station B along the working procedure and conveying the quarter split 61 after the split to the discharging station C for discharging and storing.
The splinter mechanism 40 comprises a bottom plate 41, a fixing frame 42 and a splinter assembly 43; the bottom plate 41 is horizontally arranged on the working platform 11, and the fixed frame 41 is fixedly arranged at the upper end of the bottom plate 41; the lobe assembly 43 includes a fixed suction plate 431, a movable frame 432, a movable suction plate 433, and a suction plate driving member 434.
The fixed suction plate 431 is horizontally installed at the upper end of the fixed frame 41, and it can be understood that the upper end of the fixed suction plate 431 can suck the silicon wafer to be split.
The movable frame 432 is movably installed on one side of the fixed frame, the movable frame can slide in the direction close to or far away from the fixed frame, preferably, a guide rail 411 is arranged on the bottom plate 41, a sliding block 412 matched with the guide rail 411 and sliding is arranged at the lower end of the movable frame 432, and a displacement driving piece 413 used for driving the movable frame 432 to slide is installed on the bottom plate 41.
Preferably, the two ends of one side of the movable suction plate 433, which is far away from the fixed suction plate 431, are provided with limiting grooves, the two ends of the movable frame 432 are connected with limiting stoppers 435 matched with the limiting grooves, and the limiting stoppers 435 can effectively limit the rotation angle of the movable suction plate 433.
In order to effectively increase the splinter efficiency, the number of the splinter assemblies 43 is two, the fixed suction plates 431 corresponding to the two splinter assemblies 43 are respectively installed at two sides of the upper end of the fixed frame 42, the two movable frames 432 are symmetrically arranged at two sides of the fixed frame 42, and the splinter operation can be simultaneously performed on two half splinters 60 through the two symmetrically arranged splinter assemblies 43, so that the splinter efficiency is greatly increased, and the process period is shortened.
In this embodiment, the suction plate driving member 434 is an air cylinder disposed on the movable frame 432, and the displacement driving member 413 is an air cylinder horizontally mounted on the bottom plate 41.
In order to correspond to the two sets of lobe assemblies 43, the feeding mechanism 20 further comprises a sliding seat 23, a lifting support platform 24, a sliding driving cylinder 25, two lifting material blocking members 26 and a rough positioning member 27.
The two ascending and descending material blocking pieces 26 are arranged at intervals along the conveyor belt 21, the coarse positioning piece 27 is positioned on two sides of the conveyor belt 21 and can move vertically on the horizontal plane relative to the conveyor belt 21 to centrally position the half-split pieces on the conveyor belt 21, in the embodiment, the coarse positioning piece is two pairs of ascending and descending material blocking columns, each pair of the two pairs of the ascending and descending material blocking pieces are symmetrically arranged on two sides of the conveyor belt 21, the distance between the two ascending and descending material blocking pieces 21 is consistent with that between the two split piece assemblies 43, the ascending and descending material blocking pieces 26 ascend or descend to block or release the half-split pieces 60 on the conveyor belt 21, the sliding seat 23 is slidably arranged at the lower end of the conveying surface of the conveyor belt 21 along the direction of the conveyor belt 21, the ascending and descending support platform 24 is installed on the sliding seat 23 in a liftable manner, the sliding drive cylinder 25 is used for driving the sliding seat 23 to slide, and the starting point stroke of the sliding seat 23 corresponds to the two half-split pieces 60 blocked by the two ascending and descending material blocking pieces 26 The stroke end of the sliding seat 23 is arranged corresponding to the splinter mechanism 40.
When the two lifting material blocking parts 26 lift to block the two half splinters 60, the distance between the two half splinters 60 is consistent with the distance between the splinter assemblies 43, so that the loading and positioning of the loading and unloading mechanism 30 are facilitated, then the lifting support platform 24 lifts up to lift the two half splinters 60, the sliding table 23 moves from the stroke starting point to the stroke end point, at the moment, the two splinter assemblies 43 are arranged corresponding to the two half splinters 60 to be splinted, and the loading and unloading mechanism 30 only needs to convey the two half splinters 60 to be splinter along the space between the two half splinters 60, so that the conveying action is simplified, the conveying period is shortened, and the splinter efficiency is improved.
Specifically, unloader 30 includes crossbeam 31, slip cantilever 32 and two sucking disc subassemblies 33, crossbeam 31 fixed set up in the top of lobe of a leaf mechanism 40, the axis of rotation of activity suction disc 433 with crossbeam 31 parallel arrangement, slip cantilever 32 slidable install in on the crossbeam 31, two sucking disc subassemblies 33 interval install in the below of slip cantilever 32, and the interval of two sucking disc subassemblies 33 is unanimous with the interval of two adjacent stations on the work platform 11.
In this embodiment, the sliding cantilever 32 has a first working state and a second working state on its sliding stroke, when it is in the first working state, the two sucker assemblies 33 are respectively arranged corresponding to the feeding station a and the splitting station B, and when it is in the second working state, the two sucker assemblies 33 are respectively arranged corresponding to the splitting station B and the blanking station C.
When the device moves from the first working state to the second working state, one sucker assembly 33 sucks and conveys the half splinter 60 on the feeding station A to the splinter mechanism 40 for splinting, and sucks and conveys the quarter splinter 61 of the splinter on the splinter mechanism 40 to the material receiving box 50.
Specifically, each sucker component 33 includes a lifting seat 331, a lifting driving member 332 and two sucker units 333, the lifting seat 331 is installed on the sliding cantilever 32 in a lifting manner, the lifting driving member 332 is used for driving the lifting seat 331 to lift, and the splinter components 43 are arranged on the motion tracks of the two sucker units 333.
In order to ensure that each quarter chip 61 can be sucked smoothly, each suction cup unit 333 includes two suction nozzle sets arranged at intervals, and the two suction nozzle sets of the same suction cup unit 333 are used for sucking two quarter chips 61 on one half chip 60 correspondingly.
In this application, install dustcoat 12 around work platform 11, the front end of dustcoat 12 is provided with emergency exit 13 that can open and shut, and after the magazine is full of material, equipment automatic shutdown, the magazine is changed from emergency exit 13 rear open type space directly to the operator, takes out the quarter lobe piece of the storage in the material collecting box 50, and emergency exit 13 closes the safety that can protect the operator at equipment during operation, conveyer belt 21 follows the rear end of dustcoat 12 extends and gets into material loading station A.
The application comprises the following specific using processes:
firstly, the silicon wafer after the initial splitting is split into two half splits, the two half splits are arranged at the upper end of a conveyor belt 21 at intervals, in the conveying process, two lifting material blocking parts 26 lift at intervals to block the two half splits 60, then a lifting support table 24 lifts to lift the two half splits 60, a sliding table 23 moves from the stroke starting point to the stroke end point, at the moment, two split assemblies 43 are arranged corresponding to the two half splits 60 to be split, at the moment, a sliding cantilever 32 is in a first working position, a sucker assembly 33 in a feeding station A sucks the two half splits 60, a sucker assembly 33 in a splitting station B position sucks up four quarter splits 61 after the splitting, then the sliding cantilever 32 moves from the first working state to a second working state, the sucker assembly 33 in the original feeding station A position moves to a splitting station B, placing two half splinters 60 on the splinter assembly 43, moving the sucker assembly 33 at the original splinter station B to the blanking station C, placing four quarter splinters 61 in the material receiving box 50, and then displacing and resetting the sliding cantilever 32 to a first working state; during splitting, the half-split 60 respectively sucked by the fixed suction plate 431 and the movable suction plate 433 on the splitting assembly 43 is normal, then the suction plate driving member 434 drives the movable suction plate 433 to rotate to realize splitting, meanwhile, the displacement driving member 413 drives the movable frame 432 to move towards the side far away from the fixed frame 41 to allow enough space for the split to flow out so as to avoid interference, then the movable frame 432 moves towards the side close to the fixed frame 41 to enable the two quarter-split 61 to be close, and thus, a quarter-split period of a silicon wafer is realized.
The application provides a quarter lobe device holds half of a half lobe respectively through fixed suction disc and activity suction disc, then drives through the suction disc driving piece the activity suction disc rotates and realizes the lobe of a leaf process, and at the lobe of a leaf in-process, the adjustable shelf is to keeping away from one side motion of mount, makes two cracked quarter lobes separate rapidly, avoids interfering, has effectively guaranteed the completeness of lobe of a leaf, stops to interfere the phenomenon that leads to the lobe of a leaf because of the column lobe.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (10)
1. The quarter-splitting device for the silicon wafer is characterized by comprising a splitting mechanism, wherein the splitting mechanism comprises a bottom plate, a fixing frame and a splitting assembly;
the bottom plate is horizontally arranged, and the fixing frame is fixedly arranged at the upper end of the bottom plate;
the splinter assembly comprises a fixed suction plate, a movable frame, a movable suction plate and a suction plate driving piece, wherein the fixed suction plate is horizontally arranged at the upper end of the fixed frame; the adjustable shelf is movable install in one side of mount, the adjustable shelf can be to being close to or keeping away from the direction of mount slides, the activity suction disc install in the upper end of adjustable shelf, the activity suction disc is close to one side of mount with the rotatable connection of adjustable shelf, the suction disc driving piece with the opposite side of activity suction disc is connected, in order to drive the activity suction disc rotates, the slip direction of adjustable shelf with the axis of rotation place direction of activity suction disc sets up perpendicularly, fixed suction disc with the mounting height of activity suction disc is unanimous.
2. The silicon wafer quarter-splitting device according to claim 1, wherein a guide rail is disposed on the bottom plate, a sliding block which is matched with the guide rail to slide is disposed at the lower end of the movable frame, and a displacement driving member for driving the movable frame to slide is mounted on the bottom plate.
3. The silicon wafer quarter-splitting device according to claim 1, wherein the two ends of the side of the movable suction plate away from the fixed suction plate are provided with limiting grooves, and the two ends of the movable frame are connected with limiting stoppers matched with the limiting grooves.
4. The silicon wafer quarter-splitting device according to claim 1, wherein the number of the splitting assemblies is two, the fixed suction plates corresponding to the two splitting assemblies are respectively installed on two sides of the upper end of the fixed frame, and the two movable frames are symmetrically arranged on two sides of the fixed frame.
5. The silicon wafer quarter-splitting device as claimed in claim 4, further comprising a frame, a feeding mechanism, a loading and unloading mechanism and a material receiving box, wherein the frame is provided with a working platform, the working platform is provided with a loading station, a splitting station and a discharging station at regular intervals along the working procedure, the feeding mechanism comprises a conveyor belt arranged at the loading station and a conveying driving member for driving the conveyor belt to work, the splitting mechanism is arranged at the splitting station, the material receiving box is arranged at the discharging station, and the loading and unloading mechanism is used for conveying half of the split pieces conveyed by the conveyor belt to the splitting station along the working procedure and conveying the split quarter-pieces to the discharging station for unloading and storage.
6. The silicon wafer quarter-splitting device of claim 5, wherein the loading and unloading device comprises a beam, a sliding cantilever and two sucker assemblies, the beam is fixedly arranged above the splitting mechanism, the rotating shaft of the movable suction plate is arranged in parallel with the beam, the sliding cantilever is slidably arranged on the beam, the two sucker assemblies are arranged below the sliding cantilever at intervals, and the interval between the two sucker assemblies is consistent with the interval between two adjacent stations on the working platform; the sliding cantilever is provided with a first working state and a second working state on the sliding stroke, when the sliding cantilever is in the first working state, the two sucker components are respectively arranged corresponding to the feeding station and the splitting station, and when the sliding cantilever is in the second working state, the two sucker components are respectively arranged corresponding to the splitting station and the discharging station.
7. The silicon wafer quarter-splitting device of claim 6, wherein each of the sucker assemblies comprises a lifting seat, a lifting driving member and two sucker units, the lifting seat is liftably mounted on the sliding cantilever, the lifting driving member is used for driving the lifting seat to lift, and the two sucker units are arranged on the motion tracks of the two sucker units.
8. The silicon wafer quarter-splitting device as claimed in claim 7, wherein each suction cup unit comprises two suction nozzle groups arranged at intervals, and the two suction nozzle groups of the same suction cup unit are used for correspondingly sucking two quarter-splits on one half-split.
9. The silicon wafer quarter-cracking device of claim 5, wherein the feeding mechanism further comprises a sliding seat, a lifting support platform, a sliding driving cylinder, two lifting material-blocking members and a coarse positioning member, the coarse positioning member is located on two sides of the conveyor belt and can vertically move on the horizontal plane relative to the conveyor belt, the two lifting material-blocking members are arranged at intervals along the conveyor belt, the lifting material-blocking members rise or fall to block or release half of the cracks on the conveyor belt, the interval between the two lifting material-blocking members is consistent with the interval between the crack assemblies, the sliding seat further comprises a sliding seat, a lifting support platform, a sliding driving cylinder, two lifting material-blocking members and a coarse positioning member along the conveyor belt, the coarse positioning member is located on two sides of the conveyor belt and can vertically move on the horizontal plane relative to the conveyor belt, the lifting support table is arranged on the sliding seat in a lifting mode, the sliding driving cylinder is used for driving the sliding seat to slide, the stroke starting point of the sliding seat corresponds to two half splinters blocked by the two lifting material blocking parts, and the stroke end point of the sliding seat corresponds to the splinter mechanism.
10. The silicon wafer quarter-splitting device as claimed in claim 5, wherein a housing is mounted around the working platform, a safety door capable of opening and closing is arranged at the front end of the housing, and the conveyor belt extends from the rear end of the housing into the loading station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220069545.8U CN216831662U (en) | 2022-01-11 | 2022-01-11 | Silicon wafer quarter splitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220069545.8U CN216831662U (en) | 2022-01-11 | 2022-01-11 | Silicon wafer quarter splitting device |
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| Publication Number | Publication Date |
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| CN216831662U true CN216831662U (en) | 2022-06-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202220069545.8U Active CN216831662U (en) | 2022-01-11 | 2022-01-11 | Silicon wafer quarter splitting device |
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| CN (1) | CN216831662U (en) |
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