CN112582312B - Automatic packaging system of AUTO-MGP - Google Patents
Automatic packaging system of AUTO-MGP Download PDFInfo
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- CN112582312B CN112582312B CN202011591333.8A CN202011591333A CN112582312B CN 112582312 B CN112582312 B CN 112582312B CN 202011591333 A CN202011591333 A CN 202011591333A CN 112582312 B CN112582312 B CN 112582312B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 24
- 238000004140 cleaning Methods 0.000 claims abstract description 84
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000000463 material Substances 0.000 claims abstract description 39
- 238000007599 discharging Methods 0.000 claims abstract description 26
- 238000004080 punching Methods 0.000 claims abstract description 26
- 239000002699 waste material Substances 0.000 claims abstract description 20
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000000428 dust Substances 0.000 claims description 12
- 238000011084 recovery Methods 0.000 claims description 12
- 238000005303 weighing Methods 0.000 claims description 10
- 238000007664 blowing Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims 6
- 238000010168 coupling process Methods 0.000 claims 6
- 238000005859 coupling reaction Methods 0.000 claims 6
- 230000007246 mechanism Effects 0.000 description 13
- 238000013461 design Methods 0.000 description 10
- 238000011010 flushing procedure Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000004100 electronic packaging Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention discloses an AUTO-MGP automatic packaging system which comprises a chip arranging unit, a resin feeding unit, a feeding and discharging manipulator, a die cleaning unit, a plastic package die, a press unit, a punching channel and a material receiving unit, wherein the chip arranging unit is used for arranging a chip on a chip; the sheet arranging unit sends the heating mobile station to the mechanical gripper through the driving guide rail, the resin feeding unit is connected with the plastic package mold and the press unit through the driving guide rail, the mechanical gripper of the feeding and discharging manipulator and the mold cleaning unit grips and puts the product into the plastic package mold and the press unit, the plastic package mold and the press unit grip and put the product into the punching channel and the material receiving unit through the mechanical gripper of the feeding and discharging manipulator and the mold cleaning unit, and the punching channel and the material receiving unit are used for separating and receiving the waste materials and the product. According to the packaging system, all parts of units of the packaging system are integrated, and through the flexible application of the driving device and the manipulator, all units of the equipment are coordinated and smooth, the occupied space is low, the movement stroke is short, and the working efficiency is greatly improved.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to an AUTO-MGP automatic packaging system.
Background
The rapid development of the semiconductor industry pushes the progress and innovation of the electronic packaging technology in China, the semiconductor manufacturing industry in China develops rapidly and slowly enters a mature stage, and the fire explosion of ultra-high-speed computers, digital audio-visual devices, mobile communication devices and portable electronic machines directly drives the high demand of the chip electronic packaging technology, so that the development of electronic packaging is promoted, and the intelligence of the manufacturing industry is higher and higher. However, the automation degree in the field of semiconductor packaging is still very low, most of work is still completed by manual cooperation, the labor intensity of workers is high, the efficiency is low, and the precision is not high. At present, a full-automatic packaging system is also available in the market, a plurality of relatively independent presses are used for packaging, one press is only matched with one group of mould boxes, and although automatic production is realized, the operation among a plurality of modules is carried out through a manipulator, the stroke of the manipulator is too long, the working efficiency is seriously influenced, and although manpower can be saved, the working efficiency is relatively low in cost. The manual press can package more than 4 groups of mold boxes at one time, but the whole process is manually operated, the production environment is relatively poor due to high mold temperature and large resin dust, and the production line is nervous in manpower.
Disclosure of Invention
The invention solves the technical problems that in the prior art, full-automatic packaging is realized, one press can only be matched with one group of mould boxes, the mechanical hand has long stroke, low efficiency and high cost; in manual production, more than four groups can be packaged at one time, but the whole process is manual, the working environment is poor, and the health of workers is influenced. Through the mutual cooperation of each unit by using the rotary presenting mechanism and the cooperation of the guide rail and the mechanical arm, the working stroke of the mechanical arm is short, and the full-automatic high-efficiency production of the multi-mode box is completed.
The technical scheme adopted by the invention is as follows: an AUTO-MGP automatic packaging system comprises a chip arranging unit, a resin feeding unit, a feeding and discharging manipulator, a die cleaning unit, a plastic packaging die, a press unit, a punching channel and a material receiving unit; the sheet arranging unit is used for conveying the heating moving table to a grabbing position of a mechanical gripper on the upper discharging mechanical arm and the mold cleaning unit through the driving guide rail, the resin feeding unit is connected with the plastic package mold and the press unit through the driving guide rail, the mechanical gripper of the upper discharging mechanical arm and the mold cleaning unit grabs and puts a product on the heating moving table in the sheet arranging unit into the plastic package mold of the plastic package mold and the plastic package mold of the press unit, the plastic package mold and the press unit grabs and puts the product onto a material receiving moving platform in the punching channel and the material receiving unit through the mechanical gripper of the upper discharging mechanical arm and the mold cleaning unit, and the punching channel and the material receiving unit are used for separating and receiving the waste materials and the product.
As a further improvement of the invention, the feeding and discharging manipulator and the die cleaning unit comprise a grabbing unit and a die cleaning unit, and the die cleaning unit is positioned on one side of the grabbing unit; the grabbing unit comprises a mechanical gripper, the mechanical gripper is positioned on a fixed plate, the fixed plate is fixedly connected to a driving structure, the driving structure is movably connected to a linear guide rail, one end of the driving structure is fixedly connected to a fixed structure, and the linear guide rail is positioned at two ends of the fixed plate; the die cleaning unit comprises a die cleaning roller brush and a shell, two ends of a central shaft of the die cleaning roller brush are fixedly connected to the shell, one end of the central shaft is connected with a conveying belt, the conveying belt is driven by a motor, a blowing structure is arranged on one side of the shell, the other side of the shell is connected with a pipeline, one end of the pipeline is connected with the shell, the other end of the pipeline is connected with a negative pressure fan, a dust collecting box is further connected to the middle of the pipeline, and the dust collecting box is fixedly connected to the shell.
As a further improvement of the invention, at least one pair of the die cleaning roller brushes is arranged, the pair of the die cleaning roller brushes is paired up and down, the bottom ends of the shells at the two sides of the die cleaning roller brushes are fixedly connected with movable shafts, the movable shafts are movably connected with the cleaning brushes, the middle ends of the cleaning brushes are fixedly connected with telescopic rods, and the telescopic rods are fixedly connected at the middle ends of the shells of the die cleaning roller brushes.
As a further improvement of the invention, the flow channel punching and material receiving unit comprises a frame, a guide rail, a flow channel punching upper die and a flow channel punching lower die; the feeding device is characterized in that an upper die and a guide rail are fixedly connected to the frame, a sliding block is connected to the guide rail in a sliding mode, a lower die of the flushing channel is fixedly connected to the sliding block, a lower die cleaning part is fixedly connected to the upper die of the flushing channel, a waste collecting barrel is fixedly connected to the bottom of the lower die of the flushing channel, a collecting manipulator is fixedly connected to the upper end of the frame, and a material box assembly is fixedly connected to the side end of the collecting manipulator.
As a further improvement of the invention, the resin feeding unit comprises a bottom plate, wherein a conveying device, a feeding device, a weighing device, a supplying device and a waste recovery device are fixedly connected to the surface of the bottom plate; the driven wheel of the conveying device is fixedly connected to one side of the bottom plate, the other side of the bottom plate is fixedly connected with the waste recovery device, and the feeding device, the weighing device and the supply device are connected through the conveying device and are sequentially arranged in the direction of the waste recovery device.
As a further improvement of the invention, the plastic package mold and the press unit comprise a press, at least four upright posts are fixedly connected to the press, a driving structure is fixedly connected to the upright posts through a fixing structure, a top cover is fixedly connected to the upper ends of the upright posts, an upper mold is arranged at the bottom of the top cover, a lower mold is fixedly connected to the press, and the upper mold and the lower mold are matched for use.
The invention has the following beneficial effects: according to the packaging system, all parts of units of the packaging system are integrated, and through the flexible application of the driving device and the manipulator, all units of the equipment are coordinated and smooth, the occupied space is low, the movement stroke is short, and the working efficiency is greatly improved. Compared with the existing product, the invention has the advantages of lower cost, higher benefit and better application prospect.
Drawings
FIG. 1 is a schematic view of the present invention.
FIG. 2 is a schematic view of a resin feeding unit according to the present invention.
FIG. 3 is a schematic view of the runner and the material receiving unit according to the present invention.
FIG. 4 is a schematic view of the loading and unloading robot and the mold cleaning unit according to the present invention.
Fig. 5 is a schematic view of the mold cleaning unit of the present invention.
Fig. 6 is a schematic view of the die cleaning roller brush of the present invention.
Fig. 7 is a schematic view of a plastic mold and a press unit according to the present invention.
Shown in the figure: 1. a sheet arranging unit; 2. a resin feeding unit; 3. a loading and unloading manipulator and a die cleaning unit; 4. a plastic package mold and a press unit; 5. a runner and a receiving unit; 201. a feeding device; 202. a conveying device; 203. a weighing device; 204. a waste recovery device; 205. a supply device; 206. a base plate; 301. cleaning a mold roller brush; 302. a mechanical gripper; 303. a drive structure; 304. a fixed structure; 305. a pipeline; 306. a dust collecting box; 307. a blowing structure; 308. a conveyor belt; 309. a linear guide rail; 310. a housing; 3102. Cleaning a brush; 3103. a movable shaft; 3104. a telescopic rod; 401. an upper die; 402. a lower die; 403. a column; 404. a press; 405. a top cover; 501. a frame; 502. punching an upper die of the runner; 503. flushing a runner lower die; 504. a waste collection barrel; 505. a guide rail; 506. a magazine assembly; 507. a collecting manipulator; 508. the lower die cleaning piece.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
As shown in fig. 1, the sheet arranging unit 1 is located at the upper left of the system, the resin feeding unit 2 is located below the sheet arranging unit 1, the plastic package mold and press unit 4 is located at the right of the resin feeding unit 2, the feeding and discharging manipulator and the mold cleaning unit 3 are connected above the plastic package mold and press unit 4, the feeding and discharging manipulator and the mold cleaning unit 3 are located at the right side of the feeding and discharging manipulator and the mold cleaning unit 3, and the punching channel and the material receiving unit 5 are located at the upper right of the system. The piece arranging unit 1 moves the heated lead frame to a grabbing position of a mechanical gripper 302 in the feeding and discharging manipulator and the die cleaning unit 3 to cooperate with the feeding and discharging manipulator and the die cleaning unit 3; the resin feeding unit 2 can directly move the resin to the feeding position and feed the resin into the plastic package mold of the plastic package mold and the plastic package mold of the press unit 4, and the resin feeding unit cooperates with the plastic package mold and the press unit 4; all products are grabbed and put into the plastic package mold and the plastic package mold of the press unit 4 by the mechanical gripper 302 of the loading and unloading manipulator and mold cleaning unit 3, and the mechanical gripper cooperates with the plastic package mold and the press unit 4; the plastic package mold and press unit 4 grips and puts the plastic packaged product onto a material receiving moving platform in the punching channel and material receiving unit 5 through a mechanical gripper 302 of the feeding and discharging manipulator and mold cleaning unit 3, and cooperates with the punching channel and the material receiving unit 5.
Further, the feeding and discharging manipulator and the die cleaning unit comprise a grabbing unit and a die cleaning unit, and the die cleaning unit is positioned on one side of the grabbing unit; the grabbing unit comprises a mechanical gripper, the mechanical gripper is positioned on a fixed plate, the fixed plate is fixedly connected to a driving structure, the driving structure is movably connected to a linear guide rail, one end of the driving structure is fixedly connected to a fixed structure, and the linear guide rail is positioned at two ends of the fixed plate; the die cleaning unit comprises a die cleaning roller brush and a shell, two ends of a central shaft of the die cleaning roller brush are fixedly connected to the shell, one end of the central shaft is connected with a conveying belt, the conveying belt is driven by a motor, a blowing structure is arranged on one side of the shell, the other side of the shell is connected with a pipeline, one end of the pipeline is connected with the shell, the other end of the pipeline is connected with a negative pressure fan, a dust collecting box is further connected to the middle of the pipeline, and the dust collecting box is fixedly connected to the shell.
By adopting the technical scheme, the grabbing unit and the die cleaning unit are tightly combined, so that the space occupation is greatly reduced, the linkage between the grabbing unit and the die cleaning unit is increased, the stroke of a mechanical gripper is simplified and shortened, and the working efficiency is greatly improved; at least eight material belts are grabbed at one time through the multiple groups of mechanical grabbers, so that grabbing and conveying efficiency is greatly improved; and the whole process uses an automatic design, so that the labor intensity of operators is reduced, and the omission and insufficient cleaning of the cleaning process of the operators are reduced.
Further, the die cleaning roller brush is at least provided with a pair of die cleaning roller brushes, the pair of die cleaning roller brushes are paired up and down, the bottom ends of the shells on the two sides of the die cleaning roller brush are fixedly connected with movable shafts, the movable shafts are movably connected with the die cleaning brush, the middle end of the die cleaning brush is fixedly connected with a telescopic rod, and the telescopic rod is fixedly connected to the middle end of the shell of the die cleaning roller brush.
Through adopting above-mentioned technical scheme, can clean upper and lower die cavity simultaneously, more comprehensive clear upper and lower particle on the die cavity, the telescopic link passes through hydraulic pressure or pneumatic control cleaning brush, purposefully carries out the particulate matter to the cleaning roller brush and strikes off, both sides all are equipped with cleaning brush, can change cleaning roller brush direction of rotation, select the cleaning brush of adaptation, two-way clearance, then cooperate negative-pressure air fan to pass through the pipeline and inhale integrated box, cleaning brush passes through the loose axle and is connected with the shell of cleaning roller brush, the shell of cleaning roller brush is installed in the casing middle-end.
Furthermore, the flow channel punching and material receiving unit comprises a rack, a guide rail, a flow channel punching upper die and a flow channel punching lower die; the feeding device is characterized in that an upper die and a guide rail are fixedly connected to the frame, a sliding block is connected to the guide rail in a sliding mode, a lower die of the flushing channel is fixedly connected to the sliding block, a lower die cleaning part is fixedly connected to the upper die of the flushing channel, a waste collecting barrel is fixedly connected to the bottom of the lower die of the flushing channel, a collecting manipulator is fixedly connected to the upper end of the frame, and a material box assembly is fixedly connected to the side end of the collecting manipulator.
Through adopting above-mentioned technical scheme, in falling into the storage bucket of bottom down with the waste material, can clear up the lower mould to clean debris and siphon away, the collection manipulator can take out the product and put into the magazine automatically, accomplishes the last step of system.
Further, the resin feeding unit comprises a bottom plate, and the surface of the bottom plate is fixedly connected with a conveying device, a feeding device, a weighing device, a supplying device and a waste recovery device; the driven wheel of the conveying device is fixedly connected to one side of the bottom plate, the other side of the bottom plate is fixedly connected with the waste recovery device, and the feeding device, the weighing device and the supply device are connected through the conveying device and are sequentially arranged in the direction of the waste recovery device.
By adopting the technical scheme, the weighing device classifies the products, screens qualified products out and then enters the supply pipe, so that the qualified rate of the products is improved while the working efficiency is improved; the waste recovery device can recycle the unqualified products, thereby reducing waste, saving cost and improving the economic benefit of enterprises; the dust absorption pipe is removed the pollutant on product surface, improves the accuracy of the judgement to product quality, further improves the qualification rate.
Further, the plastic package mold and the press unit comprise a press, at least four stand columns are fixedly connected to the press, the stand columns are fixedly connected with a driving structure through fixing structures, a top cover is fixedly connected to the upper ends of the stand columns, an upper mold is arranged at the bottom of the top cover, a lower mold is fixedly connected to the press, and the upper mold and the lower mold are matched for use.
By adopting the technical scheme, the feeding and discharging manipulator and the die cleaning unit are positioned and installed by the stand column, so that the feeding and discharging manipulator and the die cleaning unit are tightly combined with the plastic package die and the press unit, and the mechanical gripper fully automatically works, so that the plastic package conveying efficiency is increased, and the precision is improved; the right side of the press part adopts an open design. And the left resin feeding unit also adopts a one-key movable design, namely when the die needs to be disassembled or maintained, the left side and the right side of the press are both in an open state, so that the maintenance and the replacement are convenient.
The specific working method comprises the following steps: 1. a sheet arranging part: the lead frame loaded in the material box is pushed to the feeding guide rail by the lead frame pushing device through the material box feeding device. The material is transferred to the grabbing position through a roller and a belt on the feeding guide rail. And then the lead frame grabbing mechanical arm is used for grabbing and placing the lead frame grabbing mechanical arm on a preheating table for heating, the mechanical arm has a rotating function, the direction of the lead frame is ensured to be consistent with the design direction of the plastic package mold, and one of the two lead frames in the same mold box needs to rotate 180 degrees. The preheating table is in a movable design, and more than 8 products can be heated at one time according to the design of the die. The preheating table is arranged at a piece position and a material discharging integrated mechanical hand grabbing position, and the heated lead frame is moved to the grabbing positions of the material discharging mechanical hand and the mechanical hand in the die cleaning unit.
2. Resin feeding unit: on the resin passed through vibration dish feed arrangement and conveyed weighing device, weighing device weighed the resin weight and detected, unqualified resin will be discharged in the waste recovery device through NG passageway. The qualified resin will be delivered to the robot. The manipulator is provided with a material storage station, and the resin quantity required by one-time encapsulation can be stored. And then the manipulator sequentially puts the resin on the resin frame putting detection mechanism. The position of the resin on the resin shelf is kept consistent with the position of the mold design. The resin frame putting detection mechanism adopts a movable design and is provided with a resin feeding position and a resin putting position. After the resin feeding is finished, the resin can be directly moved to a feeding position and fed into a plastic package mold and a plastic package mold of a press unit. Meanwhile, the mechanism has the function of detecting whether resin is put in place or not, and if the resin does not smoothly enter the plastic package mold, the system alarms and stops. Because the resin itself produces more dust, consequently, be equipped with dust extraction in resin feeding mechanism to guarantee the cleanness and the smoothness nature of whole material loading process.
3. Go up unloading manipulator and clear mould unit: the whole feeding and discharging mechanical arm and the mold cleaning unit are in movable design and driven by a servo motor. And after the lead frame in the preheating table in the sheet arranging unit moves to the mechanical gripper gripping position, the mechanical gripper grips all the products and puts the products into the plastic package mold. In the moving process, the die cleaning unit cleans the die, and impurities such as scraps, dust and the like are avoided in the die before the lead frame enters the die. The feeding and discharging integrated mechanical arm unit is provided with a lead frame detecting mechanism and a positioning detecting mechanism and an auxiliary positioning mechanism, so that the lead frame can accurately enter a die.
4. Plastic packaging mold and press unit: when the plastic package mold is in a mold opening state, the lead frame is fed into the plastic package mold and the plastic package mold of the press unit by the feeding and discharging mechanical arm and the mechanical gripper in the mold cleaning unit, and at the moment, the resin frame feeding detection mechanism in the resin feeding unit can feed resin into the plastic package mold. At this time, the plastic package mold can be closed under the driving of the press and the injection control mechanism, namely, the product plastic package is carried out. And the plastic packaging process comprises die assembly pressure detection and position detection.
After the plastic packaging is finished, the plastic packaged product is grabbed by the feeding and discharging mechanical arm and the mechanical hand in the die cleaning unit again and is placed on the material receiving moving platform in the material punching channel and the material receiving unit. At the moment, the material receiving moving platform mechanism and the preheating table grabbing position in the sheet arranging unit are at the same position. The material receiving moving platform mechanism in the material punching channel and the material receiving unit and the preheating table in the sheet arranging unit are respectively controlled by two servo motors. And sequentially carrying out feeding and discharging according to the action time sequence.
5. A flow channel punching and material receiving unit: the material receiving mobile platform is in a mobile design and is provided with a material receiving position, a collecting manipulator grabbing position and a servo motor drive. And conveying the plastic-packaged products from the receiving position to a collecting manipulator grabbing position by a receiving moving platform. And the collecting manipulator puts the products into a runner punching die one by one from the die boxes to perform runner punching. The upper die cutting and the lower die cutting of the flow channel die are driven by a cylinder. The lower die of the runner punching die is designed in a movable mode, so that a manipulator is convenient to store and take products, and the products with the runners removed are finally picked by the storage manipulator and put into a product storage mechanism and finally taken into a material box.
According to the packaging system, all parts of units of the packaging system are integrated, and through the flexible application of the driving device and the manipulator, all units of the equipment are coordinated and smooth, the occupied space is low, the movement stroke is short, and the working efficiency is greatly improved.
It should be understood by those skilled in the art that the protection scheme of the present invention is not limited to the above-mentioned embodiments, and various permutations, combinations and modifications can be made on the above-mentioned embodiments without departing from the spirit of the present invention, and the modifications are within the scope of the present invention.
Claims (5)
1. An AUTO-MGP automatic packaging system is characterized in that:
comprises a sheet arranging unit (1), a resin feeding unit (2), a feeding and discharging manipulator and die cleaning unit (3), a plastic package die and press unit (4) and a punching channel and material receiving unit (5); the sheet arranging unit (1) conveys the heating mobile platform to a grabbing position of a mechanical gripper (302) on the upper blanking manipulator and mold cleaning unit (3) through a driving guide rail, the resin feeding unit (2) is connected with a plastic package mold and a press unit (4) through the driving guide rail, the mechanical gripper (302) of the upper blanking manipulator and mold cleaning unit (3) grabs and puts a product on the heating mobile platform in the sheet arranging unit (1) into the plastic package mold of the plastic package mold and press unit (4), the plastic package mold and press unit (4) grabs and puts the product onto a material receiving mobile platform of the upper blanking runner and material receiving unit (5) through the mechanical gripper (302) of the upper blanking manipulator and mold cleaning unit (3), and the blanking runner and material receiving unit (5) is used for separating and receiving waste materials and the product;
the feeding and discharging manipulator and die cleaning unit (3) comprises a grabbing unit and a die cleaning unit, and the die cleaning unit is positioned on one side of the grabbing unit; the grabbing unit comprises a mechanical grabbing hand (302), the mechanical grabbing hand (302) is positioned on a fixing plate, the fixing plate is fixedly connected to a driving structure (303), the driving structure (303) is movably connected to a linear guide rail (309), one end of the driving structure (303) is fixedly connected to a fixing structure (304), and the linear guide rail (309) is positioned at two ends of the fixing plate; the die cleaning unit comprises a die cleaning roller brush (301) and a shell (310), two ends of a central shaft of the die cleaning roller brush (301) are fixedly connected to the shell (310), one end of the central shaft is connected with a conveyor belt (308), the conveyor belt (308) is driven by a motor, one side of the shell (310) is provided with an air blowing structure (307), the other side of the shell is connected with a pipeline (305), one end of the pipeline (305) is connected with the shell (310), the other end of the pipeline is connected with a negative pressure fan, the middle of the pipeline (305) is also connected with a dust collection box (306), and the dust collection box (306) is fixedly connected to the shell (310);
the mold cleaning roller brush is characterized in that movable shafts (3103) are fixedly connected to the bottom ends of shells on two sides of the mold cleaning roller brush (301), the movable shafts (3103) are movably connected with cleaning brushes (3102), telescopic rods (3104) are fixedly connected to the middle ends of the cleaning brushes (3102), and the telescopic rods (3104) are fixedly connected to the middle ends of the shells of the mold cleaning roller brush (301).
2. The AUTO-MGP automatic packaging system of claim 1, wherein:
at least one pair of die cleaning roller brushes (301) is arranged, and the pair of die cleaning roller brushes (301) are paired up and down.
3. The AUTO-MGP automatic packaging system of claim 1, wherein:
the flow channel punching and receiving unit (5) comprises a rack (501), a guide rail (505), a flow channel punching upper die (502) and a flow channel punching lower die (503); towards the runner on mould (502) and guide rail (505) rigid coupling on frame (501), sliding connection has the slider on guide rail (505), towards runner lower mould (503) rigid coupling on the slider, towards the runner on mould (502) rigid coupling have lower mould to clean piece (508), towards runner lower mould (503) bottom rigid coupling have garbage collection bucket (504), frame (501) upper end rigid coupling has collection manipulator (507), and its side still rigid coupling has magazine subassembly (506).
4. The AUTO-MGP automatic packaging system according to any of claims 1 to 3, wherein:
the resin feeding unit (2) comprises a bottom plate (206), wherein the surface of the bottom plate (206) is fixedly connected with a conveying device (202), a feeding device (201), a weighing device (203), a supplying device (205) and a waste recovery device (204); the driven wheel of the conveying device (202) is fixedly connected to one side of a bottom plate (206), the other side of the bottom plate (206) is fixedly connected with a waste recovery device (204), and the feeding device (201), the weighing device (203) and the supply device (205) are connected through the conveying device (202) and are sequentially arranged towards the waste recovery device (204).
5. The AUTO-MGP automatic packaging system of claim 1, wherein:
the plastic package mold and press unit (4) comprises a press (404), at least four upright posts (403) are fixedly connected to the press (404), the upright posts are fixedly connected to driving structures (303) through fixing structures (304), top covers (405) are fixedly connected to the upper ends of the upright posts (403), an upper mold (401) is arranged at the bottom of the top covers (405), a lower mold (402) is fixedly connected to the press (404), and the upper mold (401) and the lower mold (402) are matched for use.
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| CN113937036B (en) * | 2021-10-15 | 2022-05-31 | 安徽耐科装备科技股份有限公司 | Feeding detection device and automatic packaging system |
| CN115123814A (en) * | 2022-07-19 | 2022-09-30 | 富金森(南通)科技有限公司 | Semiconductor material receiving device |
| CN115744257A (en) * | 2022-11-28 | 2023-03-07 | 卓尔半导体设备(苏州)有限公司 | Automatic feeding and discharging system of plastic packaging press |
| CN115724146A (en) * | 2022-11-30 | 2023-03-03 | 安徽飞悦芯科智能设备制造有限公司 | Linear motor feeding device for plastic packaging equipment |
| CN116153810B (en) * | 2022-12-26 | 2023-12-15 | 安徽飞悦芯科智能设备制造有限公司 | Anti-mixing method for full-automatic chip plastic packaging system |
| CN116013813B (en) * | 2023-01-06 | 2023-10-10 | 苏州赛肯智能科技有限公司 | Full-automatic packaging system |
| CN117276115B (en) * | 2023-03-27 | 2024-03-19 | 苏州赛肯智能科技有限公司 | Combined automatic packaging system |
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