CN112570365A - Intelligent automatic silicon wafer cleaning system - Google Patents
Intelligent automatic silicon wafer cleaning system Download PDFInfo
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- CN112570365A CN112570365A CN202110224808.8A CN202110224808A CN112570365A CN 112570365 A CN112570365 A CN 112570365A CN 202110224808 A CN202110224808 A CN 202110224808A CN 112570365 A CN112570365 A CN 112570365A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 136
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 56
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 56
- 239000010703 silicon Substances 0.000 title claims abstract description 56
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 4
- 238000005086 pumping Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 42
- 238000000034 method Methods 0.000 abstract description 7
- 239000012459 cleaning agent Substances 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000007873 sieving Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses an intelligent automatic silicon wafer cleaning system, which comprises a cleaning assembly, a cleaning assembly and a control assembly, wherein the cleaning assembly comprises a cleaning box, a cleaning frame and a driving part, the cleaning frame is rotatably connected in the cleaning box, and the driving part is arranged in the cleaning box; the feeding assembly comprises a feeding pipe arranged on one side of the cleaning box, a feeding belt arranged in the feeding pipe and an auxiliary feeding plate arranged at the front end of the feeding belt; and the unloading assembly is arranged on one side, far away from the feeding assembly, of the cleaning assembly, the silicon wafers are completely and can be singly poured into the cleaning frame by utilizing the feeding assembly, and each silicon wafer can be fully adhered with the cleaning agent due to the fact that intervals exist in the pouring process, so that the later-stage cleaning effect is better.
Description
Technical Field
The invention relates to the technical field of silicon wafer cleaning, in particular to an intelligent automatic silicon wafer cleaning system.
Background
After the silicon wafer is cut, silicon material scraps, cutting fluid and other dirt exist on the surface of the silicon wafer, and the silicon wafer needs to be cleaned so as to keep the surface of the silicon wafer clean. Generally, a silicon wafer is cleaned by a silicon wafer cleaning machine. Before cleaning the silicon wafer, the silicon wafer needs to be placed in a flower basket through a wafer inserting machine.
Conventionally, the sheet inserting machine is provided separately from the cleaning machine. The inserting machine is provided with an inserting sheet output track, and the cleaning machine is provided with a feeding support and a movable feeding mechanism arranged on the feeding support. Traditionally, the inserted sheet output track of the inserted sheet machine is inconsistent with the structure of a feeding mechanism of a cleaning machine, and the butt joint structure of the inserted sheet machine and the cleaning machine is complex.
Disclosure of Invention
The purpose of the present invention is to present some aspects of embodiments of the invention in a simplified form as well as to present some preferred embodiments. In the present specification and in the abstract and title of the present application, some simplifications or omissions may be made to avoid obscuring the purpose of the specification, abstract and title, and such simplifications or omissions are not intended to limit the scope of the invention.
The present invention has been made in view of the above-mentioned problems of the conventional silicon wafer cleaning techniques.
Therefore, the invention aims to provide an intelligent automatic silicon wafer cleaning system.
In order to solve the technical problems, the invention provides the following technical scheme: an intelligent automatic silicon wafer cleaning system comprises a cleaning assembly, a cleaning assembly and a control assembly, wherein the cleaning assembly comprises a cleaning box, a cleaning frame rotationally connected in the cleaning box and a driving part arranged in the cleaning box; the feeding assembly comprises a feeding pipe arranged on one side of the cleaning box, a feeding belt arranged in the feeding pipe and an auxiliary feeding plate arranged at the front end of the feeding belt; and the unloading assembly is arranged on one side, away from the feeding assembly, of the cleaning assembly.
As a preferred scheme of the intelligent automatic silicon wafer cleaning system, the system comprises the following components: the driving part comprises a rotating shaft which is rotatably connected to the lower end of the cleaning frame, a driving groove which is formed in the rotating shaft and an eccentric groove which is formed in the groove wall of the driving groove, wherein a driving shaft is rotatably connected in the driving groove, a balancing weight is arranged on the driving shaft, and two ends of the driving shaft extend outwards.
As a preferred scheme of the intelligent automatic silicon wafer cleaning system, the system comprises the following components: the cleaning device is characterized in that a support frame is arranged in the cleaning box, support blocks are connected in the support frame in a sliding mode in the vertical direction, two ends of the driving shaft are rotatably connected with the support blocks, guide rods are connected between the upper ends and the lower ends of the support blocks and the support frame in a sliding mode, elastic pieces are arranged outside the guide rods, and a driving motor is arranged on one of the support blocks.
As a preferred scheme of the intelligent automatic silicon wafer cleaning system, the system comprises the following components: the two ends of the cleaning frame are provided with brackets, the brackets are internally connected with a shaking rod in a sliding way along the vertical direction, the lower end of the shaking rod is provided with a conical block, the two ends of the driving shaft are both provided with a lug boss which is abutted against the conical block,
the upper end of the shaking rod is rotatably connected with the two ends of the cleaning frame.
As a preferred scheme of the intelligent automatic silicon wafer cleaning system, the system comprises the following components: a feeding tray is arranged at the lower end of the opening of the feeding pipe, plate feeding grooves which are perpendicular to each other are arranged on the feeding tray, external gears are arranged outside the feeding tray, a connecting plate is arranged on the feeding pipeline, internal gears which are meshed with the external gears are arranged in the connecting plate,
the side wall of the cleaning frame is provided with an opening, the opening is rotatably connected with a switch board, a rotating plane of the switch board is vertically arranged, and a discharging unloading board is obliquely arranged in the cleaning box.
As a preferred scheme of the intelligent automatic silicon wafer cleaning system, the system comprises the following components: the unloading assembly comprises a grabbing plate rotatably connected in the cleaning box, a bearing roller arranged outside the cleaning box and a frame arranged outside the cleaning box, a first connecting rod is rotatably connected on the frame, one end of the first connecting rod is hinged with the grabbing plate, a driving piece is connected between the other end of the first connecting rod and the bearing roller,
wherein, a clamping groove is arranged outside the bearing roller.
As a preferred scheme of the intelligent automatic silicon wafer cleaning system, the system comprises the following components: the driving piece comprises a short frame, a rotating disc rotationally connected with the short frame, an extension bar arranged on the rotating disc and a long strip groove arranged on the side wall of the bearing roller and matched with the extension bar,
the round surface of the rotating disc is perpendicular to the length direction of the extension rod, a connecting rod extends outwards from the rotating disc and is perpendicular to the length direction of the extension rod, one end of the connecting rod is hinged to a second connecting rod, and the first connecting rod is hinged to the second connecting rod.
As a preferred scheme of the intelligent automatic silicon wafer cleaning system, the system comprises the following components: the equidistance is seted up between draw-in groove and the draw-in groove, the spout has been seted up to the grabhook upper end, sliding connection has the slider in the spout, the slider is articulated with the shelf.
As a preferred scheme of the intelligent automatic silicon wafer cleaning system, the system comprises the following components: an adsorption cavity is formed in the bearing roller, and a vacuum suction hole is formed in the clamping groove.
As a preferred scheme of the intelligent automatic silicon wafer cleaning system, the system comprises the following components: the bearing roller is connected with an air suction pipe, and a vacuumizing fan is arranged at the rear end of the air suction pipe.
The invention has the beneficial effects that: utilize the material loading subassembly with the silicon chip complete and can pour into in the washing frame in proper order to because there is the interval to pour into, and then can make every silicon chip all adhere full cleaning agent, make later stage cleaning effect better.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise. Wherein:
FIG. 1 is a schematic diagram of the overall structure of the intelligent automatic silicon wafer cleaning system of the present invention.
FIG. 2 is a schematic structural diagram of a discharge plate assembly of the intelligent automatic silicon wafer cleaning system of the invention.
FIG. 3 is a schematic structural diagram of a driving member of the intelligent automatic silicon wafer cleaning system of the present invention.
FIG. 4 is an exploded view of the driving component of the intelligent automatic silicon wafer cleaning system according to the present invention.
FIG. 5 is a schematic diagram of an auxiliary feeding plate structure of the intelligent automatic silicon wafer cleaning system of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways than those specifically described and will be readily apparent to those of ordinary skill in the art without departing from the spirit of the present invention, and therefore the present invention is not limited to the specific embodiments disclosed below.
Furthermore, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one implementation of the invention. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
Furthermore, the present invention is described in detail with reference to the drawings, and in the detailed description of the embodiments of the present invention, the cross-sectional view illustrating the structure of the device is not enlarged partially according to the general scale for convenience of illustration, and the drawings are only exemplary and should not be construed as limiting the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
Example 1
Referring to fig. 1-5, an intelligent automatic silicon wafer cleaning system comprises a cleaning assembly 100, a loading assembly 300 and an unloading assembly 400, wherein the cleaning assembly 100 comprises a cleaning box 101, a cleaning frame 102 rotatably connected in the cleaning box 101 and a driving part 200 arranged in the cleaning box 101; the feeding assembly 300 comprises a feeding pipe 301 arranged on one side of the cleaning box 101, a feeding belt arranged in the feeding pipe 301, and an auxiliary feeding plate 302 arranged at the front end of the feeding belt; wherein, the unloading assembly 400 is arranged at the side of the cleaning assembly 100 far away from the loading assembly 300.
Specifically, the main structure of the present invention includes a cleaning assembly 100, in this embodiment, the cleaning assembly 100 is used as a main device of the whole system, and includes a cleaning box 101, the cleaning box 101 is box-shaped and is disposed on the ground, then a cleaning frame 102 is further disposed inside the cleaning box 101, the cleaning frame 102 can continuously sieve, meanwhile, a cleaning agent is poured into the cleaning box 101 by an operator, under the sieving of the cleaning frame 102, the silicon wafer in the cleaning frame 102 is cleaned by the cleaning agent, and then a driving component 200 for driving the cleaning frame 102 to sieve is further disposed inside the cleaning box 101.
Further, the main body of the invention further comprises a feeding assembly 300, in this embodiment, the feeding assembly 300 comprises a feeding box arranged on one side of the cleaning box 101, the feeding box is arranged at a position close to the cleaning box 101, the whole volume of the feeding box is smaller than that of the cleaning box 101, then an upward extending feeding pipe 301 is arranged on one side of the feeding box, a feeding belt is further fixed inside the feeding pipe 301, the feeding belt extends outwards and can be abutted to an inlet after extending, an auxiliary feeding plate 302 is fixed at the front end of the feeding belt, and a plurality of grooves are further formed in the surface of the feeding belt and used for bearing silicon wafers.
Meanwhile, the main body of the invention also comprises a disassembling component 400, and the disassembling component 400 can be used for taking out the cleaned silicon wafer from the cleaning frame 102 and then drying the silicon wafer.
Example 2
Referring to fig. 1-5, this embodiment differs from the first embodiment in that: the driving part 200 comprises a rotating shaft 201 connected to the lower end of the cleaning frame 102, a driving groove 202 arranged in the rotating shaft 201 and an eccentric groove arranged on the groove wall of the driving groove 202, wherein a driving shaft 203 is connected in the driving groove 202 in a rotating manner, a balancing weight 204 is arranged on the driving shaft 203, two ends of the driving shaft 203 extend outwards, a supporting frame 205 is arranged in the cleaning box 101, a supporting block 206 is connected in the supporting frame 205 in a sliding manner along the vertical direction, two ends of the driving shaft 203 are connected with the supporting block 206 in a rotating manner, a guide rod 207 is connected between the upper end and the lower end of the supporting block 206 and the supporting frame 205 in a sliding manner, an elastic part 208 is arranged outside the guide rod 207, wherein a driving motor is arranged on one supporting block 206, a bearing plate is arranged at the lower end of the cleaning frame 102, brackets 303 are arranged at two ends, the convex part 306 is abutted against the conical block 305, the upper end of the shaking rod 304 is rotationally connected with two ends of the cleaning frame 102, the lower end of the opening of the feeding pipe 301 is provided with a feeding disc 307, the feeding disc 307 is provided with a plate feeding groove 308 which is arranged vertically, an external gear 309 is arranged outside the feeding disc 307, an internal gear 309a which is meshed with the external gear 309 is arranged inside the auxiliary feeding plate 302, wherein, the side wall of the cleaning frame 102 close to the unloading assembly 400 is provided with an opening, the shape of the opening is inverted 'door' -shaped, the opening can lead the silicon chip in the cleaning frame 102 to fall out outwards, then a switch board is connected on the opening in a rotating way, the rotating plane of the switch board is vertically arranged, and magnets are arranged at the two ends of the switch board and the inner side of the opening, so that the opening can be closed by the switch board in a closed state, the opening can be exposed after the switch board is opened, so that the silicon wafer falls out, and the discharging unloading board is obliquely arranged in the cleaning box 101.
Specifically, in this embodiment, the driving member 200 includes a rotating shaft 201 connected to the lower end of the cleaning frame 102, the rotating shaft 201 extends outward along a horizontal direction, a driving groove 202 is formed in the rotating shaft 201 along a length direction of the rotating shaft 201, a driving shaft 203 is further rotatably connected in the driving groove 202, two ends of the driving shaft 203 extend outward, round holes matched with the driving shaft 203 are formed in two ends of the rotating shaft 201, an inner diameter of the driving groove 202 is larger than an outer diameter of the driving shaft 203, a weight 204 is fixed on a peripheral wall of the driving shaft 203, the weight 204 is in a shape of a long strip and a cross section is in a shape of a sector, and the weight is larger than a weight of the driving shaft 203, and after the driving shaft 203 rotates, eccentric swing is generated due to the weight 204, so as to implement a sifting action.
Further, a support frame 205 is fixed in the cleaning box 101, the support frame 205 is provided with two support frames 205, which correspond to two ends of the driving shaft 203 respectively, a support block 206 is connected in the support frame 205 in a sliding manner along the vertical direction, a jack matched with the driving shaft 203 is formed in the support block 206, so as to support the rotation of the driving shaft 203, guide rods 207 are connected to the upper end and the lower end of the support block 206, the guide rods 207 are fixedly connected with the support frame 205, a sliding groove matched with the guide rods 207 is formed in one end, close to the guide rods 207, of the support block 206, so that the support block 206 can slide on the guide rods 207, and an elastic part 208 is further fixed outside the guide rods 207.
Then, a driving motor is provided on one of the supporting blocks 206 for driving the driving shaft 203 to rotate.
Then, a receiving plate is arranged at the lower end of the cleaning frame 102, the receiving plate is arranged at the lower end of the cleaning frame 102 and extends outwards to be communicated with the side wall of the cleaning box 101, an opening is also formed in the side wall of the cleaning box 101, the receiving plate extends outwards from the opening and is used for receiving the cleaning frame 102 and the driving component 200 after a silicon wafer falls out, a bracket 303 is arranged at the upper end of the receiving plate, a shaking rod 304 is connected inside the bracket 303 in a sliding mode along the vertical direction, a conical block 305 is arranged at the lower end of the shaking rod 304, the lower end of the shaking rod 304 extends downwards, then a protruding portion 306 is further arranged on the driving shaft 203, the conical block 305 abuts against the protruding portion 306, two protruding portions 306 are arranged at two ends of the driving shaft 203 respectively, and the two protruding portions 306 are arranged in the radial direction of the driving shaft 203.
Further, the upper end of the shaking rod 304 is rotatably connected with two ends of the cleaning frame 102, the rotation is in a ball hinge mode, 360-degree rotation can be achieved, a feeding tray 307 is arranged at the lower end of the opening of the feeding pipe 301, plate feeding grooves 308 which are perpendicular to each other are formed in the feeding tray 307, the plate feeding grooves 308 are arranged in a penetrating mode, external gears 309 are arranged outside the feeding tray 307, internal gears 309a meshed with the external gears 309 are arranged in the auxiliary feeding plate 302, the internal gears 309a are driven by a motor to rotate simultaneously, the silicon wafers can be placed in the cleaning frame 102 uniformly in a timing and quantitative mode, openings are formed in the side wall of the cleaning frame 102, switch plates are rotatably connected to the openings, the rotating planes of the switch plates are vertically arranged, and discharging plates are obliquely arranged in the cleaning box 101.
The rest of the structure is the same as in example 1.
The operation process is as follows: after the operator puts the silicon chip into cleaning frame 102, the starter motor, the motor drives the rotation of drive shaft 203, then drive shaft 203 can realize the action of sieving under the effect of balancing weight 204, then at the pivoted in-process, because bellying 306 and the continuous butt of shaking pole 304 will wash frame 102 from top to bottom and sieve, realize more abundant washing operation.
Example 3
Referring to fig. 1-5, this embodiment differs from the above embodiments in that: the plate unloading assembly 400 comprises a grabbing plate 401 rotatably connected in the cleaning box 101, a receiving roller 402 arranged outside the cleaning box 101 and a rack 403 arranged outside the cleaning box 101, wherein a first connecting rod 404 is rotatably connected on the rack 403, one end of the first connecting rod 404 is hinged with the grabbing plate 401, a driving member 405 is connected between the other end of the first connecting rod 404 and the receiving roller 402, a clamping groove 408 is arranged outside the receiving roller 402, the driving member 405 comprises a short rack 409, a rotating disc 405a rotatably connected on the short rack 409, an extension rod 405b arranged on the rotating disc 405a and a long groove 405c arranged on the side wall of the receiving roller 402 and matched with the extension rod 405b, wherein the circular surface of the rotating disc 405a is vertically arranged with the length direction of the extension rod 405b, a connecting rod 405d extends outwards from the rotating disc 405a, the connecting rod 405d is perpendicular to the length direction of the extension rod 405b, one end of the connecting rod 405d is hinged with a second connecting rod 405, the first connecting rod 404 is hinged to the second connecting rod 405e, the clamping groove 408 and the clamping groove 408 are arranged at equal intervals, the upper end of the grabbing plate 401 is provided with a sliding groove 406, the sliding groove 406 is connected with a sliding block 407 in a sliding mode, the sliding block 407 is hinged to the frame 403, an adsorption cavity is formed in the bearing roller 402, the clamping groove 408 is provided with a vacuum suction hole, the bearing roller 402 is connected with an air suction pipe, and then the rear end of the air suction pipe is further connected with a vacuum pumping fan.
Specifically, in this embodiment, the plate unloading assembly 400 includes a grabbing plate 401 rotatably connected outside the cleaning tank 101, the grabbing plate 401 is in an inverted door shape, a receiving roller 402 is further rotatably connected to a position outside the cleaning tank 101, a clamping groove 408 is provided outside the receiving roller 402, a lower surface of the grabbing plate 401 abuts against a surface of the receiving roller 402 after rotating 90 °, a rack 403 is further provided outside the cleaning tank 101, wherein the rack 403 includes two parts, one part is used for receiving the roller 402, the other part is used for carrying the grabbing plate 401, a first connecting rod 404 is rotatably connected to the rack 403, a rotating plane of the first connecting rod 404 is vertically arranged, then one end is hinged to a side wall of the grabbing plate 401, and the other end is provided with a driving member 405.
In this embodiment, the driving member 405 includes a short frame 409, a rotating disc 405a is rotatably connected to the short frame 409, a rotating plane of the rotating disc 405a is vertically disposed, an extending rod 405b is fixed to the rotating disc 405a, the extending rod 405b extends in a radial direction of the rotating disc 405a, a plurality of long grooves 405c are formed in the side wall of the receiving roller 402 at equal intervals, a transversely disposed clamping rod is disposed at one end of the extending rod 405b, which is far away from the rotating disc 405a, and the clamping rod is screwed into the long groove 405c after rotating and then stirs the receiving roller 402, so that the receiving roller 402 rotates by an angle, and a next clamping groove 408 is aligned with the rotating grip 401.
Preferably, the circular surface of the rotating disk 405a is provided perpendicular to the longitudinal position of the extension rod 405b, and when the circular surface of the rotating disk 405a rotates to the receiving roller 402 position, the receiving roller 402 is provided with a plurality of arc grooves so as not to interfere with the receiving roller 402.
Further, a connecting rod 405d extends outwards from the rotating disc 405a, the length direction of the connecting rod 405d is perpendicular to the length direction of the extending rod 405b, a second connecting rod 405e is hinged to one end of the connecting rod 405d, and one end of the second connecting rod 405e, which is far away from the receiving roller 402, is hinged to the first connecting rod 404.
Preferably, the upper end of the gripping plate 401 is further provided with a sliding groove 406, a sliding block 407 is further connected in the sliding groove 406 in a sliding manner, and the sliding block 407 extends outwards to form a rotating shaft to be rotatably connected with the bracket 403, so that displacement deviation when the first connecting rod 404 drives the gripping plate 401 to rotate can be compensated.
Furthermore, an adsorption cavity is formed in the bearing roller 402, a vacuum suction hole communicated with the adsorption cavity is formed in each clamping groove 408, an air suction pipe is connected to the bearing roller 402, and the silicon wafer can be fixedly adsorbed by a vacuum fan after being placed on the clamping grooves 408.
The rest of the structure is the same as in example 2.
The operation process is as follows: an operator starts the rotating disc 405a, so that the rotating disc 405a drives the extension rod 405b to be screwed into the long groove 405c, then the extension rod 405b rotates and the long groove 405c is limited, the receiving roller 402 can be driven to rotate, then the connecting rod 405d drives the second connecting rod 405e to rotate, then the first connecting rod 404 is driven to rotate, the grabbing plate 401 rotates towards the direction close to the receiving roller 402, at the moment, the sucking disc on the grabbing plate 401 releases adsorption, and at the moment, the silicon wafer is adsorbed into the clamping groove 408 under the action of the vacuum sucking hole on the clamping groove 408.
It is important to note that the construction and arrangement of the present application as shown in the various exemplary embodiments is illustrative only. Although only a few embodiments have been described in detail in this disclosure, those skilled in the art who review this disclosure will readily appreciate that many modifications are possible (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters (e.g., temperatures, pressures, etc.), mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter recited in this application. For example, elements shown as integrally formed may be constructed of multiple parts or elements, the position of elements may be reversed or otherwise varied, and the nature or number of discrete elements or positions may be altered or varied. Accordingly, all such modifications are intended to be included within the scope of this invention. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. In the claims, any means-plus-function clause is intended to cover the structures described herein as performing the recited function and not only structural equivalents but also equivalent structures. Other substitutions, modifications, changes and omissions may be made in the design, operating conditions and arrangement of the exemplary embodiments without departing from the scope of the present inventions. Therefore, the present invention is not limited to a particular embodiment, but extends to various modifications that nevertheless fall within the scope of the appended claims.
Moreover, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not be described (i.e., those unrelated to the presently contemplated best mode of carrying out the invention, or those unrelated to enabling the invention).
It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, without undue experimentation.
It should be noted that the above-mentioned embodiments are only for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the claims of the present invention.
Claims (10)
1. The utility model provides an automatic silicon chip cleaning system of intelligence which characterized in that: comprises the steps of (a) preparing a mixture of a plurality of raw materials,
the cleaning assembly (100) comprises a cleaning box (101), a cleaning frame (102) rotatably connected in the cleaning box (101) and a driving part (200) arranged in the cleaning box (101);
the feeding assembly (300) comprises a feeding pipe (301) arranged on one side of the cleaning box (101), a feeding belt arranged in the feeding pipe (301) and an auxiliary feeding plate (302) arranged at the front end of the feeding belt; and the number of the first and second groups,
the unloading assembly (400), the unloading assembly (400) is arranged on one side of the cleaning assembly (100) far away from the feeding assembly (300).
2. The intelligent automated silicon wafer cleaning system of claim 1, wherein: the driving component (200) comprises a rotating shaft (201) which is rotatably connected with the lower end of the cleaning frame (102) and a driving groove (202) which is arranged in the rotating shaft (201),
the driving groove (202) is connected with a driving shaft (203) in a rotating mode, a balancing weight (204) is arranged on the driving shaft (203), and two ends of the driving shaft (203) extend outwards.
3. The intelligent automated silicon wafer cleaning system of claim 2, wherein: a supporting frame (205) is arranged in the cleaning box (101), a supporting block (206) is connected in the supporting frame (205) in a sliding manner along the vertical direction, two ends of the driving shaft (203) are rotatably connected with the supporting block (206), a guide rod (207) is connected between the upper end and the lower end of the supporting block (206) and the supporting frame (205) in a sliding manner, an elastic part (208) is arranged outside the guide rod (207),
and a driving motor is arranged on one of the supporting blocks (206).
4. The intelligent automated silicon wafer cleaning system of claim 3, wherein: supports (303) are arranged at two ends of the cleaning frame (102), a shaking rod (304) is connected in the supports (303) in a sliding manner along the vertical direction, a conical block (305) is arranged at the lower end of the shaking rod (304), bosses (306) are arranged at two ends of the driving shaft (203), the bosses (306) are abutted to the conical block (305),
the upper end of the shaking rod (304) is rotatably connected with the two ends of the cleaning frame (102).
5. The intelligent automated silicon wafer cleaning system of claim 1 or 3, wherein: a feeding tray (307) is arranged at the lower end of the opening of the feeding pipe (301), plate feeding grooves (308) which are perpendicular to each other are formed in the feeding tray (307), an external gear (309) is arranged outside the feeding tray (307), an internal gear (309 a) which is meshed with the external gear (309) is arranged in the auxiliary feeding plate (302),
the side wall of the cleaning frame (102) is provided with an opening, the opening is rotatably connected with a switch board, a rotating plane of the switch board is vertically arranged, and a discharging unloading board is obliquely arranged in the cleaning box (101).
6. The intelligent automated silicon wafer cleaning system of claim 1, wherein: the plate unloading assembly (400) comprises a grabbing plate (401) rotatably connected in the cleaning box (101), a bearing roller (402) arranged outside the cleaning box (101) and a frame (403) arranged outside the cleaning box (101), a first connecting rod (404) is rotatably connected on the frame (403), one end of the first connecting rod (404) is hinged with the grabbing plate (401), and a driving piece (405) is connected between the other end of the first connecting rod and the bearing roller (402),
wherein, a clamping groove (408) is arranged outside the bearing roller (402).
7. The intelligent automated silicon wafer cleaning system of claim 6, wherein: the driving piece (405) comprises a short frame (409), a rotating disc (405 a) rotatably connected with the short frame (409), an extension bar (405 b) arranged on the rotating disc (405 a) and a long groove (405 c) which is arranged on the side wall of the bearing roller (402) and is matched with the extension bar (405 b),
the round surface of the rotating disc (405 a) is perpendicular to the length direction of the extension rod (405 b), a connecting rod (405 d) extends out of the rotating disc (405 a), the connecting rod (405 d) is perpendicular to the length direction of the extension rod (405 b), one end of the connecting rod (405 d) is hinged to a second connecting rod (405 e), and the first connecting rod (404) is hinged to the second connecting rod (405 e).
8. The intelligent automated silicon wafer cleaning system of claim 6 or 7, wherein: the clamping grooves (408) and the clamping grooves (408) are arranged at equal intervals, the upper end of the grabbing plate (401) is provided with a sliding groove (406), the sliding groove (406) is connected with a sliding block (407) in a sliding mode, and the sliding block (407) is hinged to the frame (403).
9. The intelligent automated silicon wafer cleaning system of claim 8, wherein: an adsorption cavity is formed in the bearing roller (402), and a vacuum suction hole is formed in the clamping groove (408).
10. The intelligent automated silicon wafer cleaning system of claim 9, wherein: an air suction pipe is connected to the bearing roller (402), and a vacuum-pumping fan is arranged at the rear end of the air suction pipe.
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| CN112570365B (en) | 2021-05-07 |
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