CN112525395A - Film stress measuring device and measuring method - Google Patents
Film stress measuring device and measuring method Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/24—Measuring force or stress, in general by measuring variations of optical properties of material when it is stressed, e.g. by photoelastic stress analysis using infrared, visible light, ultraviolet
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Abstract
The application discloses rete stress measuring device and measuring method, rete stress measuring device is used for measuring the rete to be measured the stress of release in the reliability test, includes: the carrier is used for attaching the film layer to be measured, and a plurality of measuring point positions are arranged on the film layer to be measured in a first direction and a second direction crossed with the first direction; a carrier for supporting the carrier; the detection device is perpendicular to the bearing platform and is used for measuring each measurement point position on the film layer to be measured before and after reliability test; and the analysis control system is electrically connected with the detection device and used for analyzing the measurement result obtained by the detection device to obtain the curvature radius of the film layer to be tested before and after the reliability test and the stress released in the reliability test so as to realize the measurement of the stress released by the film layer to be tested in the reliability test.
Description
Technical Field
The application relates to the technical field of display, in particular to a film stress measuring device and a measuring method.
Background
The display device is prone to black spot phenomenon caused by failure of the display device packaging layer, and the display device is reflected to be prone to gourd screen at the hole digging position in the hole digging screen display device. The reason is that because the inorganic film layer in the packaging layer is easy to be damaged under the stress action, and the module material of the display panel can release certain stress in the high-temperature reliability test environment, when the film material with residual stress is attached on the display panel, acting force is generated on the panel in the stress relaxation process, the damage process of the inorganic film layer in the packaging layer is aggravated, the packaging failure is caused, and the display black spot is generated. Therefore, how to effectively measure the stress of the film layer in the reliability test is realized, and the method has important significance for reducing the probability of package failure and calabash screen problems of the display device in the follow-up process.
Disclosure of Invention
The embodiment of the application provides a film stress measuring device and a film stress measuring method, which can realize the measurement of the stress released by a film to be measured in the reliability test.
The embodiment of the application provides a film stress measuring device for measure the stress that awaits measuring the rete and release in the reliability test, include:
the carrier is used for attaching the film layer to be measured, and a plurality of measuring point positions are arranged on the film layer to be measured in a first direction and a second direction crossed with the first direction;
a carrier for supporting the carrier;
the detection device is perpendicular to the bearing platform and is used for measuring each measurement point position on the film layer to be measured before and after reliability test;
and the analysis control system is electrically connected to the detection device and used for analyzing the measurement result obtained by the detection device to obtain the curvature radius of the film layer to be tested before and after the reliability test and the stress released in the reliability test.
In some embodiments, the carrier comprises at least one of a wafer, a glass.
In some embodiments, the detection device comprises one of a camera of a charge coupled device, a laser device.
In some embodiments, the measurement sites include a first measurement site, a second measurement site, a third measurement site, a fourth measurement site, and a fifth measurement site; in a top view, the first measurement point, the second measurement point, and the third measurement point are located on a first straight line extending along the first direction, and the fourth measurement point, the fifth measurement point, and at least one of the first measurement point, the second measurement point, and the third measurement point are located on a second straight line extending along the second direction.
In some embodiments, in a top view, the second measurement point is located at a center of the film layer to be measured, the first measurement point, the third measurement point, the fourth measurement point, and the fifth measurement point are located around the film layer to be measured, the first measurement point, the second measurement point, and the third measurement point are located on the first straight line, and the fourth measurement point, the fifth measurement point, and the second measurement point are located on the second straight line.
The application also provides a measuring method for realizing the measurement of the release stress of the film layer to be measured in the reliability test by using the film layer stress measuring device, which comprises the following steps:
step S10: providing the film stress measuring device, wherein the film to be measured is attached to the surface of the carrier, and a plurality of measuring points are arranged on the film to be measured in a first direction and a second direction which is crossed with the first direction;
step S20: measuring each measuring point position on the film layer to be measured by using the detection device to obtain the vertical distance between the detection device and the measuring point position before and after the reliability test;
step S30: and the analysis control system obtains the curvature radius of the film layer to be tested before and after the reliability test and the stress released in the reliability test according to the result measured by the detection device.
In some embodiments, the film to be tested includes one of a polarizer and a support film.
In some embodiments, the thickness of the film layer to be tested is greater than 1 micron and less than the thickness of the carrier.
In some embodiments, the thickness of the film layer to be tested is greater than or equal to 50 micrometers and less than or equal to 3900 micrometers.
In some embodiments, the stress released by the film layer to be tested in the reliability test is:
wherein E issIs the Young's modulus, T, of the supportsIs the thickness of the support, TfIs the thickness, V, of the film to be measuredsIs the Poisson's ratio, R, of the film layer to be measured0Before reliability test, the curvature radius of the film layer to be tested, and R is the curvature radius of the film layer to be tested after reliability test.
The film stress measuring device and the measuring method provided by the embodiment of the application are used for measuring the stress released by a film to be measured in the reliability test, and comprise the following steps: the carrier is used for attaching the film layer to be measured, and a plurality of measuring point positions are arranged on the film layer to be measured in a first direction and a second direction crossed with the first direction; a carrier for supporting the carrier; the detection device is perpendicular to the bearing platform and is used for measuring each measurement point position on the film layer to be measured before and after reliability test; and the analysis control system is electrically connected with the detection device and used for analyzing the measurement result obtained by the detection device to obtain the curvature radius of the film layer to be tested before and after the reliability test and the stress released in the reliability test so as to realize the evaluation of the stress released in the reliability test of the film layer to be tested.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1A to 1B are schematic diagrams of a film stress measuring device according to an embodiment of the present disclosure;
fig. 2A to fig. 2C are schematic structural diagrams of measurement point locations of a film layer to be measured according to an embodiment of the present application;
fig. 3 is a flowchart of a film stress measurement method according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
Specifically, please refer to fig. 1A to 1B, which are schematic diagrams of a film stress measuring device according to an embodiment of the present disclosure; as shown in fig. 2A to 2C, which are schematic structural diagrams of measurement points of a film layer to be measured according to an embodiment of the present application. The embodiment of the application provides a film stress measuring device for measure the stress sigma that awaits measuring rete 100 releases in the reliability test, include:
the carrier 201 is used for attaching the film layer 100 to be measured, and a plurality of measurement points 101 are arranged on the film layer 100 to be measured in a first direction x and a second direction y intersecting with the first direction x;
a stage 202 for supporting the carrier 201;
the detection device 203 is arranged perpendicular to the carrier 202, and is used for measuring each measurement point 101 on the film layer 100 to be measured before and after reliability test;
and the analysis control system is electrically connected to the detection device 203 and is used for analyzing the measurement result obtained by the detection device 203 to obtain the curvature radii R0 and R of the film layer 100 to be tested before and after the reliability test and the stress sigma released in the reliability test, so as to measure the stress sigma released in the reliability test of the film layer 100 to be tested.
Specifically, the existing display panel is mostly provided with sensors in a hole digging design to achieve functions of shooting and the like of the display panel, or four corners of the display panel are designed to be circular arcs (namely, the display panel is designed to be in an R-corner form) to improve design aesthetic feeling, but in a reliability test, stress released by each film layer in the display panel can cause uneven stress on a hole digging area and the R-corner of the display panel, so that warping and microcracks occur at uneven stress positions of the display panel, and a calabash screen problem can also occur on the display panel seriously. Adopt rete stress measuring device can be right each rete in the display panel (promptly the rete 100 that awaits measuring) the stress sigma of releasing in the reliability test measures, then according to measuring stress sigma analysis stress sigma's direction of action with the R angle, dig the relation between the position of hole region, the analysis goes out the rete 100 that awaits measuring is in release in the reliability test stress sigma makes display panel is in the R angle, dig the effort size when hole region department takes place warpage or microcrack, thereby the evaluation film 100 that awaits measuring releases stress sigma to the influence of display panel encapsulation failure and to the influence that the calabash screen problem appears in the display panel. Later, the accessible is in adjust laminating technological parameter, adjustment in display panel's the processing procedure modes such as the stress contraction direction of rete 100 that awaits measuring reduce rete 100 that awaits measuring releases in the reliability test stress sigma is to display panel's influence avoids the concentrated effect or the independent effect messenger of each rete in the display panel produces micro crack or micro crack aggravation and warpage scheduling problem, thereby reduces display panel appears the probability of calabash screen problem.
With continued reference to fig. 1A to 1B and fig. 2A to 2C, the carrier 201 includes at least one of a wafer and a glass. The film layer to be tested 100 includes one of a polarizer, a support film, and the like. Under the overlooking view angle, the shape of the carrier 201 is not limited to the shapes of rectangle, circle, ellipse, polygon, combination of polygon and arc and the like, the shape of the film layer 100 to be measured is the same as that of the carrier 201, so that the film layer stress measuring device is utilized to realize the measurement of the stress sigma released in the reliability test of the film layer 100 to be measured in different shapes.
Further, the film thickness of the film layer 100 to be measured is greater than 1 micron and less than the thickness of the carrier 201; furthermore, the difference between the thickness of the carrier 201 and the thickness of the film layer 100 to be tested is greater than 100 micrometers; further, the thickness of the film layer 100 to be tested is greater than or equal to 50 micrometers and less than or equal to 3900 micrometers.
Further, the carrier 201 is a wafer, and the film layer 100 to be tested is a polarizer; the thickness of the carrier 201 is equal to 4000 micrometers, and the thickness of the film layer 100 to be tested is 80 micrometers, 85 micrometers, 90 micrometers, 93 micrometers, 97 micrometers, 95 micrometers, 100 micrometers, 102 micrometers, 105 micrometers, 118 micrometers, 124 micrometers, 150 micrometers, 200 micrometers, and the like.
With reference to fig. 2A to 2C, since the analysis control system obtains the curvature radii R0 and R of the film 100 to be tested before and after the reliability test and the stress σ released in the reliability test according to the measurement result of the detection device 203, the selection of the position of the measurement point 101 may affect the calculation accuracy of the stress σ released in the reliability test of the film 100 to be tested. In order to improve the measurement accuracy of the stress σ released by the film layer 100 to be measured in the reliability test, the plurality of measurement points 101 of the film layer 100 to be measured may be disposed at the center and around the film layer 100 to be measured.
Specifically, referring to fig. 2A to 2C, the measurement points 101 include a first measurement point 1011, a second measurement point 1012, a third measurement point 1013, a fourth measurement point 1014, and a fifth measurement point 1015; in a top view, the first measurement point 1011, the second measurement point 1012, and the third measurement point 1013 are located on a first straight line L1 extending along the first direction x, and at least one of the fourth measurement point 1014, the fifth measurement point 1015, the first measurement point 1011, the second measurement point 1012, and the third measurement point 1013 is located on a second straight line L2 extending along the second direction y.
Further, in a top view, the second measurement point 1012 is located at the center of the film layer 100 to be measured, the first measurement point 1011, the third measurement point 1013, the fourth measurement point 1014, and the fifth measurement point 1015 are located around the film layer 100 to be measured, the first measurement point 1011, the second measurement point 1012, and the third measurement point 1013 are located on the first straight line L1, and the fourth measurement point 1014, the fifth measurement point 1015, and the second measurement point 1012 are located on the second straight line L2, as shown in fig. 2A.
In the film layer to be measured 100 shown in fig. 2A, the film layer to be measured 100 is polygonal (here, rectangular), the first measurement point 1011, the third measurement point 1013, the fourth measurement point 1014, and the fifth measurement point 1015 are respectively located at an intersection of any two sides of the film layer to be measured 100, and since the intersection of any two sides is easily warped when stressed, the measurement point 101 is disposed at the intersection of any two sides of the film layer to be measured 100 and at the center of the film layer to be measured 100, so that the measurement accuracy of the stress σ released by the film layer to be measured 100 in the reliability test can be improved. In addition, in a top view, the film layer 100 to be tested may also be configured in other shapes, such as triangle, hexagon, and other polygons, which will not be described herein again.
Similar to it, when looking down the visual angle, rete 100 that awaits measuring is circular, oval, also can be through with measuring point location 101 sets up the center department and the department all around of rete 100 that awaits measuring sets up department all around measuring point location 101 can be for equidistant setting to guarantee right rete 100 that awaits measuring releases in the reliability test stress sigma's measurement accuracy.
Since the detection device 203 needs to measure each measurement point 101, the measurement points 101 are only arranged at the center and the periphery of the film layer 100 to be measured, so that the measurement time can be saved under the condition of ensuring certain measurement accuracy. When higher measurement accuracy is required, more measurement points 101 may be added to the film layer 100 to be measured, as shown in fig. 2B to 2C.
In a top view, the first measurement point 1011, the second measurement point 1012, and the third measurement point 1013 are located on a first straight line L1; the first measurement location 1011, the fourth measurement location 1014, and the fifth measurement location 1015 are located on a second straight line L2; the second point of measurement 1012, the fourth point of measurement 1014, and the fifth point of measurement 1015 are located on a second sub-line L21 that is parallel to the second line L2; the third measurement site 1013, the fourth measurement site 1014, and the fifth measurement site 1015 are located on a second sub-straight line L22 parallel to the second straight line L2; the plurality of fourth measurement sites 1014 are located on a first sub-straight line L11 parallel to the first straight line L1, and the plurality of fifth measurement sites 1015 are located on a first sub-straight line L12 parallel to the first straight line L1, as shown in fig. 2B, so that the detection device 203 obtains a measurement result by measuring each measurement site 101, and the analysis control system obtains the stress σ released by the film layer 100 to be measured in a reliability test according to the measurement result, thereby improving the measurement accuracy.
In addition, when a plurality of measurement points 101 are arranged, the measurement points 101 located on different straight lines may share part of the measurement points, so as to save measurement time while ensuring measurement accuracy, as shown in fig. 2C. It can be understood that the measurement point 101 may also be set in other setting manners, and the setting manner of the measurement point 101 shown in fig. 2A to fig. 2C is only an exemplary illustration, and a person skilled in the art may adjust the setting position of the measurement point 101 according to actual requirements, which is not described herein again.
With reference to fig. 1A to fig. 1B and fig. 2B, the detection device 203 detects a vertical distance between each measurement point 101 and the detection device 203, and the analysis control system obtains a relative position relationship of the measurement points 101 located on the same straight line in the corresponding top view in a vertical plane, so as to determine a curvature radius of the measurement points 101 located on the same straight line in the corresponding top view in the vertical plane, and obtain the stress σ released by the film layer 100 to be tested in the reliability test according to the curvature radius.
Specifically, taking the first measurement point 1011, the second measurement point 1012, and the third measurement point 1013 located on the first straight line L1 in a top view as an example, the detection device 203 measures vertical distances D1, D2, and D3 between the first measurement point 1011, the second measurement point 1012, and the third measurement point 1013 with respect to the detection device 203, and marks distances D1, D2, and D3 as a P1 point, a P2 point, and a P3 point, respectively, in a front view perpendicular to the top view, so that a triangle including the P1 point, the P2 point, and the P3 point is obtained, midperpendings of two sides of the triangle (the P1P2 side and the P1P3 side) are respectively made, an intersection point is marked as O, and a circle C3 passing through the P1 point, the P2 point, and the P2 6 point can be obtained with the intersection point O as an OP1, or OP2 or OP3 as a radius. The radii of curvature corresponding to the first measurement point 1011, the second measurement point 1012 and the third measurement point 1013 (including the radius of curvature R0 before the reliability test and the radius of curvature R after the reliability test) are the radii of the circle C (OP1, OP2 or OP 3). The stress sigma is then obtained by the analysis and control system according to the following formula. Namely:
wherein E issIs a Young's modulus of the carrierAmount, TsIs the thickness of the support, TfIs the thickness, V, of the film to be measuredsIs the Poisson's ratio, R, of the film layer to be measured0Before reliability test, the curvature radius of the film layer to be tested, and R is the curvature radius of the film layer to be tested after reliability test.
It is understood that the curvature radius R, R0 of the film layer 100 to be tested before and after the reliability test may also be obtained by other methods or software, for example, CAD software is used to calculate the difference between the measurement results of the measurement points 101 corresponding to two ends of the same straight line in the measurement results of the detection device 203 and the measurement results of the remaining measurement points 101, so as to obtain the curvature radius R, R0 of the film layer 100 to be tested before and after the reliability test. In addition, those skilled in the art can also use other methods to perform the calculation, which will not be described herein.
With continued reference to fig. 1A, the detecting device 203 includes one of a camera and a laser device of a charge coupled device. The analysis control system may be further configured to control the detection device 203 to displace, so that the detection device 203 may move to a next measurement point after completing measurement of one measurement point.
In some embodiments, the film stress measuring apparatus includes a 3D automatic measuring apparatus, so that the stress σ released by the film 100 to be tested in the reliability test can be measured by using the existing equipment.
Please refer to fig. 3, which is a flowchart illustrating a method for measuring film stress according to an embodiment of the present disclosure; the application also provides a measuring method for realizing the measurement of the release stress of the film layer to be measured in the reliability test by using the film layer stress measuring device, which comprises the following steps:
step S10: providing the film stress measuring device, wherein the film to be measured is attached to the surface of the carrier, and a plurality of measuring points are arranged on the film to be measured in a first direction and a second direction which is crossed with the first direction;
step S20: measuring each measuring point position on the film layer to be measured by using the detection device to obtain the vertical distance between the detection device and the measuring point position before and after the reliability test;
step S30: and the analysis control system obtains the curvature radius of the film layer to be tested before and after the reliability test and the stress released in the reliability test according to the result measured by the detection device.
The film layer to be tested comprises one of a polarizer and a support film.
The thickness of the film layer to be detected is more than 1 micron and less than that of the carrier; further, the thickness of the film layer to be tested is greater than or equal to 50 micrometers and less than or equal to 3900 micrometers.
The stress released by the film layer to be tested in the reliability test is as follows:
wherein E issIs the Young's modulus, T, of the supportsIs the thickness of the support, TfIs the thickness, V, of the film to be measuredsIs the Poisson's ratio, R, of the film layer to be measured0Before reliability test, the curvature radius of the film layer to be tested, and R is the curvature radius of the film layer to be tested after reliability test.
Because the sensor is placed to the design of digging the hole that adopts more in current display panel, so that display panel realizes the function of making a video recording, or adopts R angle design in display panel to improve the design aesthetic feeling, consequently, after reliability test, the stress that each rete in the display panel released can be right display panel produces the influence, and the uneven condition of atress can appear in display panel's the regional and the R angle department of digging the hole, leads to display panel to appear warpage and microcrack, and serious still leads to the encapsulation inefficacy, makes display panel appears the calabash screen problem. The measuring method can measure the stress released by the film layer in the reliability test, and is beneficial to evaluating the influence of the stress released by each film layer material on the packaging failure of the display panel.
Specifically, use the rete that awaits measuring is the polaroid as an example, display panel includes the encapsulated layer, display panel attaches the polaroid on the encapsulated layer and carries out reliability testing back, the polaroid has some effect in the stress of release in reliability testing R angle or digs the hole region, if display panel itself has warpage and microcrack (certain processing procedure before the attached polaroid leads to, like high temperature, cutting etc. easily appears near R angle and the hole region), then the stress that the polaroid released can aggravate the diffusion of warpage and microcrack, easily leads to display panel encapsulation inefficacy calabash screen problem to appear. If the measuring device and the measuring method are adopted to measure the stress released by the polaroid in the reliability test in advance, and the action direction of the stress and the magnitude of the stress acting on the R angle or the hole digging area are analyzed according to the stress, the influence of the stress released by the polaroid on the display panel can be reduced by adjusting the laminating process parameters or the contraction direction of the stress of the polaroid and the like during the subsequent attaching of the polaroid, so that the problem that the display panel has a calabash screen is avoided.
The film stress measuring device and the measuring method provided by the embodiment of the application are used for measuring the stress released by a film to be measured in the reliability test, and comprise the following steps: the carrier is used for attaching the film layer to be measured, and a plurality of measuring point positions are arranged on the film layer to be measured in a first direction and a second direction crossed with the first direction; a carrier for supporting the carrier; the detection device is perpendicular to the bearing platform and is used for measuring each measurement point position on the film layer to be measured before and after reliability test; and the analysis control system is electrically connected with the detection device and used for analyzing the measurement result obtained by the detection device to obtain the curvature radius of the film layer to be tested before and after the reliability test and the stress released in the reliability test so as to realize the measurement of the stress released by the film layer to be tested in the reliability test.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The film stress measuring device and the film stress measuring method provided by the embodiment of the application are described in detail, a specific example is applied in the description to explain the principle and the implementation of the application, and the description of the embodiment is only used for helping to understand the technical scheme and the core idea of the application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. The utility model provides a film stress measuring device for measure the stress that the rete that awaits measuring released in the reliability test, include:
the carrier is used for attaching the film layer to be measured, and a plurality of measuring point positions are arranged on the film layer to be measured in a first direction and a second direction crossed with the first direction;
a carrier for supporting the carrier;
the detection device is perpendicular to the bearing platform and is used for measuring each measurement point position on the film layer to be measured before and after reliability test;
and the analysis control system is electrically connected to the detection device and used for analyzing the measurement result obtained by the detection device to obtain the curvature radius of the film layer to be tested before and after the reliability test and the stress released in the reliability test.
2. The film stress measuring device of claim 1, wherein the carrier comprises at least one of a wafer and a glass.
3. The film stress measuring apparatus of claim 1, wherein the detecting means comprises one of a camera of a charge coupled device and a laser device.
4. The film stress measuring device of claim 1, wherein the measurement points comprise a first measurement point, a second measurement point, a third measurement point, a fourth measurement point, and a fifth measurement point; in a top view, the first measurement point, the second measurement point, and the third measurement point are located on a first straight line extending along the first direction, and the fourth measurement point, the fifth measurement point, and at least one of the first measurement point, the second measurement point, and the third measurement point are located on a second straight line extending along the second direction.
5. The film stress measuring device of claim 4, wherein, in a top view, the second measuring point is located at a center of the film to be measured, the first measuring point, the third measuring point, the fourth measuring point and the fifth measuring point are located at the periphery of the film to be measured, the first measuring point, the second measuring point and the third measuring point are located on the first straight line, and the fourth measuring point, the fifth measuring point and the second measuring point are located on the second straight line.
6. A method for measuring the release stress of a film to be measured in a reliability test by using the film stress measuring device as claimed in any one of claims 1 to 5, comprising the following steps:
step S10: providing the film stress measuring device, wherein the film to be measured is attached to the surface of the carrier, and a plurality of measuring points are arranged on the film to be measured in a first direction and a second direction which is crossed with the first direction;
step S20: measuring each measuring point position on the film layer to be measured by using the detection device to obtain the vertical distance between the detection device and the measuring point position before and after the reliability test;
step S30: and the analysis control system obtains the curvature radius of the film layer to be tested before and after the reliability test and the stress released in the reliability test according to the result measured by the detection device.
7. The measurement method according to claim 6, wherein the film to be measured includes one of a polarizer and a support film.
8. The measurement method according to claim 6, wherein the thickness of the film layer to be measured is greater than 1 micron and less than the thickness of the carrier.
9. The measurement method according to claim 8, wherein the thickness of the film layer to be measured is greater than or equal to 50 micrometers and less than or equal to 3900 micrometers.
10. The method according to claim 6, wherein the film to be tested releases stress during the reliability test as follows:
wherein E issIs the Young's modulus, T, of the supportsIs the thickness of the support, TfIs the thickness, V, of the film to be measuredsIs the Poisson's ratio, R, of the film layer to be measured0Before reliability test, the curvature radius of the film layer to be tested, and R is the curvature radius of the film layer to be tested after reliability test.
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