CN108074833A - A kind of testing film and for assessing the gauge of thin-film package performance and test method - Google Patents
A kind of testing film and for assessing the gauge of thin-film package performance and test method Download PDFInfo
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- CN108074833A CN108074833A CN201711368776.9A CN201711368776A CN108074833A CN 108074833 A CN108074833 A CN 108074833A CN 201711368776 A CN201711368776 A CN 201711368776A CN 108074833 A CN108074833 A CN 108074833A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/32—Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Abstract
The invention discloses a kind of testing film and for assessing the gauge of thin-film package performance and test method, wherein testing film includes substrate, conductive layer, active metal layer and the encapsulated layer being equipped with successively from top to bottom on substrate, wherein layer packed layer in active metal all covers, and conductive layer is included not by active metal layer and at least one pin of encapsulated layer covering；Gauge includes pedestal and upper cover, further includes loading component, the groove one with testing film shape adaptation；Seal member, several test probe, opening and connection components.Testing film and gauge of the present invention, its is simple in structure, convenient test, its test instrumentations such as current source, voltmeter use that can arrange in pairs or groups, its test method can realize the variation of prolonged monitoring variation of testing film film layer micro resistance under certain temperature, damp condition, it can determine whether the ability of testing film barrier aqueous vapor, can be used in the encapsulation performance of accurate evaluation testing film film layer, accuracy is high.
Description
Technical field
The present invention relates to a kind of packaging and testing technical field, more particularly to a kind of testing film and for assess film envelope
Fill the gauge and test method of performance.
Background technology
Existing organic electronic device such as organic luminescent device (OLED), charge coupling device (CCD), thin film transistor (TFT)
(TFT), the electronic devices such as Organic Thin Film Transistors (TFT) and solar cell, due to its own frivolous, energy saving and self-luminous
The advantages that, it is had broad application prospects in display and solid-state lighting field, outstanding characteristic will influence next-generation display electricity
The exploitation of sub- product is the future that flexible electronic is shown.
But the service life of above-mentioned organic electronic device is but highly susceptible to the influence of the steam and oxygen in air, it is empty
Steam and oxygen in gas have organic electronic device fatal harm, and reason is to have steam and oxygen to organic each thin
Film layer has a variety of reactions and influence, so as to influence integral device normal work.Therefore, it is existing mainly by organic light
Electrical part can carry out effective Feng Installed, to stop that steam in air and oxygen touch each organic function layer, so as to come significantly
Improve the service life of organic electronic device.
Therefore, can all be tested after existing organic electronic device encapsulation, to meet the requirement of encapsulation performance.Often at present
The means of testing of use includes air tightness test, direct observational method and the test of gas Liquid penetrant testing method, specifically：
1. air tightness test：
It is sealed in using by the mixture of helium and drying nitrogen in encapsulation, and is detected from encapsulation and leaked out using mass spectrograph
Helium, send one's regards to topic and be that the air tightness test is only applicable to encapsulation of the test with cavity, and be not suitable for such as photoelectricity
Sub- device, MEMS or any other thin film microelectronics etc. do not include the device of cavity；
2. direct observational method：
The optical properties of observation electronic component are carried out by microscope, such as can be right under the microscope in OLED
Deteriorate pattern to be observed to assess the aging of OLED；This direct observational method simply can only provide pass according to artificial experience
In the qualitative information of packaging, can not accurate quantitative study, and judge encapsulation performance, less efficient, precision is poor；
3. gas Liquid penetrant testing method：
This method is that gas permeation sensor is integrated in encapsulation packaging, and measurement device, which includes being present in encapsulation, to be used for
The one layer of corrosion-susceptible material and permeation sensor of resistance measurement, but with corrosion-susceptible material because into encapsulation oxygen and
Steam and when deteriorating, resistance can dramatically increase, but it passes through the change that permeation sensor monitors resistance in corrosion-susceptible material
Change precision is limited, and detection sensitivity is not enough to detection gas with 10-4g/m2/ day or lower level infiltration, so as to carry
High measurement accuracy, and operated by way of being encapsulated in permeation sensor also complex.
The content of the invention
It is an object of the invention to the existing organic electronic device packaging and testing in the presence of the prior art is overcome to use
Air tightness test adaptability is poor, direct observational method efficiency and precision are relatively low, gas Liquid penetrant testing method is complicated for operation and precision
Not high above-mentioned deficiency provides a kind of testing film, and also provides a kind of gauge for being used to assess thin-film package performance simultaneously
And test method.
In order to realize foregoing invention purpose, the present invention provides following technical schemes：
The present invention provides a kind of testing films, including substrate, are equipped with conductive layer, work on the substrate successively from top to bottom
Metal layer and encapsulated layer are sprinkled, wherein active metal layer is all covered by the encapsulated layer, the conductive layer is included not by institute
State active metal layer and at least one pin of encapsulated layer covering.
A kind of testing film of the present invention, by setting gradually conductive layer, active metal from top to bottom on substrate
Layer and encapsulated layer, wherein conductive layer, which extend, to be had not by active metal layer and at least one pin of encapsulated layer covering, is packaged
After the active metal layer of layer covering, with the redox chemistry reaction through steam in the air of encapsulated layer or oxygen generation, lead to
The information (such as electric current, voltage) of test pin is crossed, the variation of active metal layer resistance can be measured indirectly, so as to judge this
Testing film encapsulated layer obstructs the ability of steam and oxygen.
The testing film is simple in structure, convenient test, can adapt in spite of the films test for having cavity package, and
Obtain the relevant information of conductive layer in real time by test instrumentation, the artificial judgment that compares precision is higher, which does not have to envelope
Permeation sensor is filled, come external test instrumentation, simplified test method by the way of at least one pin or electrode.
Preferably, the active metal layer is arranged on the centre position of substrate, remaining position is then used to set each of conductive layer
A pin.
Preferably, the conductive layer includes several the described pins being connected to around the layer of active metal, all described to draw
Foot is located at outside the region that the encapsulated layer is covered.
Preferably, the active layer of the metal is square shape, and the conductive layer includes being located at active metal layer corner
Four pins.
It is further preferred that the conductive layer is ITO conductive layer, including the conductive layer sheet covered by active metal layer
The pin of body and four plates being connected with conductive layer body surrounding.
It is further preferred that the area of the encapsulated layer is more than the area 10-20% of active metal layer.
It is further preferred that the shape of the substrate is square shape, four pins of conductive layer are located at the corner of substrate, base
It is respectively conductive layer body, active metal layer and encapsulated layer among plate.
The present invention also provides a kind of for assessing the gauge of thin-film package performance, including pedestal and upper cover, further include：
Loading component, positioned at the pedestal, including the groove one with testing film shape adaptation；
Seal member, for when pedestal and upper cover fastening when, can seal not by the testing film active metal layer
With the Conductive layer portions structure of encapsulated layer covering；
Several test probes, for when pedestal and upper cover fastening, all pins of test probe and the conductive layer
It contacts with each other respectively；
Opening, arranged on the upper cover, when pedestal and upper cover fastening, the corresponding active metal layer position of opening；
Connection component is electrically connected with the test probe, and for external test instrumentation.
It is of the present invention a kind of for assessing the gauge of thin-film package performance, including pedestal and upper cover, the wherein pedestal
For the loading component being equipped with for putting testing film, seal member is used for the Conductive layer portions for being covered non-encapsulated layer
(mainly including pin portions) sealing avoids steam from entering influence test result, several test probes are then thin for connecting test
Film and circuit connecting section, convenient for the logical upper cover gab infiltration encapsulated layer of extraneous test instrumentation monitoring in real time with testing film
After the redox chemistry reaction that active metal layer occurs, by testing the variation of active metal layer resistance, so as to judge
The testing film encapsulated layer obstructs the ability of steam and oxygen.The structure of the gauge is simple, convenient test, and can arrange in pairs or groups electric current
The test instrumentations such as source, voltmeter use, can be used for for a long time, accurate measurement certain temperature (0~200 DEG C), humidity (0~
The variation of testing film film layer micro resistance under the conditions of 100%RH), it is accurate for assessing the encapsulation performance of testing film film layer
Exactness is high.
It is further preferred that the loading component further includes at least one groove two being connected with the groove one, it should
Groove one is for the external shape fits with testing film, and groove two is used to easily pick and place testing film from gauge.
It is further preferred that the seal member includes the ring-shaped interior sealing item and annular arranged on the upper interior surface
Shape external seal strip, wherein the region between the interior sealing item and external seal strip is used for when pedestal and upper cover fastening, Neng Goumi
Envelope is not by active metal layer on the testing film and the Conductive layer portions structure of encapsulated layer covering.The interior sealing item and external seal
Item can select silica gel strip, for obstructing extraneous steam or oxygen enters circuit part between interior sealing item and external seal strip
(i.e. the pin of conductive layer and test probe) prevents that the circuit part exposed beyond the region from suffering erosion or short circuit.
It is further preferred that all test probes are arranged on the interior sealing item and external seal strip of the upper interior surface
Between region.
Preferably, including four test probes, each probe of testing is gold plated copper pin, when upper cover and pedestal mutually fasten
When, four probes are corresponded and contacted with four pins on testing film, which, can as cathode
Changed by measuring cathode resistor, and then assess the encapsulation performance of active metal layer.
It is further preferred that the connection component includes the pcb board being connected with each other with all test probes, Yi Jiwei
In the patch cord connectors on pcb board.
It is further preferred that the upper cover is rotatably connected by upset pin on pedestal.
The present invention also provides a kind of for assessing the test method of the gauge of thin-film package performance, including following test step
Suddenly：
Step 1: make the testing film for needing to test；
Step 2: the testing film is positioned in the loading component of gauge；
Step 3: by the gauge connecting test instrument；
Step 4: the testing film resistance conductive layer changing value tested by the test instrumentation, to the survey
The encapsulation performance of examination film makes assessment；
The order of wherein described step 2 and step 3 can be exchanged with each other or be carried out at the same time.
It is of the present invention a kind of for assessing the test method of the gauge of thin-film package performance, it is thin by making test
Then testing film is placed in gauge by film, gauge and test instrumentation are connected with each other, by being tested described in test instrumentation
The testing film resistance conductive layer value variation arrived, i.e. active metal layer are subject to steam in air or oxygen to permeate and aoxidize
The situation of reduction reaction, the test method can realize prolonged monitoring certain temperature (0~200 DEG C), humidity (0~
The variation of the variation of testing film film layer micro resistance under the conditions of 100%RH) can determine whether the ability of testing film barrier aqueous vapor, energy
The encapsulation performance of accurate evaluation testing film film layer is enough in, accuracy is high.
Compared with prior art, beneficial effects of the present invention：
1. a kind of testing film of the present invention, by setting gradually conductive layer, active gold from top to bottom on substrate
Belong to layer and encapsulated layer, wherein conductive layer, which extends, has not by active metal layer and at least one pin of encapsulated layer covering, is sealed
The active metal layer of layer covering is filled, after the redox chemistry reaction through steam in the air of encapsulated layer or oxygen generation,
By the information (such as electric current, voltage) of test pin, the variation of active metal layer resistance can be measured indirectly, so as to judge
The testing film encapsulated layer obstructs the ability of steam and oxygen；The testing film is simple in structure, convenient test, can adapt to no matter
Whether there is the films test of cavity package, and obtain the relevant information of conductive layer in real time by test instrumentation, compared to relatively manually
Judge that precision is higher, which does not have to encapsulation permeation sensor, come external by the way of at least one pin or electrode
Test instrumentation, simplified test method；
2. it is of the present invention a kind of for assessing the gauge of thin-film package performance, including pedestal and upper cover, the wherein bottom
For the loading component that seat is equipped with for putting testing film, seal member is used for the Conductive layer portions for being covered non-encapsulated layer
(mainly including pin portions) sealing avoids steam from entering influence test result, several test probes are then thin for connecting test
Film and circuit connecting section, convenient for the logical upper cover gab infiltration encapsulated layer of extraneous test instrumentation monitoring in real time with testing film
After the redox chemistry reaction that active metal layer occurs, by testing the variation of active metal layer resistance, so as to judge
The testing film encapsulated layer obstructs the ability of steam and oxygen；The structure of the gauge is simple, convenient test, and can arrange in pairs or groups electric current
The test instrumentations such as source, voltmeter use, can be used for for a long time, accurate measurement certain temperature (0~200 DEG C), humidity (0~
The variation of testing film film layer micro resistance under the conditions of 100%RH), it is accurate for assessing the encapsulation performance of testing film film layer
Exactness is high；
3. it is of the present invention a kind of for assessing the test method of the gauge of thin-film package performance, it is thin by making test
Then testing film is placed in gauge by film, gauge and test instrumentation are connected with each other, by being tested described in test instrumentation
The testing film resistance conductive layer value variation arrived, i.e. active metal layer are subject to steam in air or oxygen to permeate and aoxidize
The situation of reduction reaction, to assess by the encapsulation performance quality and reliability of the testing film；The test method is simple to operation,
It can realize prolonged monitoring testing film film layer under the conditions of certain temperature (0~200 DEG C), humidity (0~100%RH)
The variation of the variation of micro resistance can determine whether the ability of testing film barrier aqueous vapor, can be used in accurate evaluation testing film film layer
Encapsulation performance, accuracy is high.
Description of the drawings
Fig. 1 is the structure diagram of testing film in the embodiment of the present invention 1；
Fig. 2 is the sectional view of testing film in the embodiment of the present invention 1；
Fig. 3 is a kind of structure diagram for the gauge for being used to assess thin-film package performance in the embodiment of the present invention 2；
Fig. 4 is the schematic diagram that gauge is adapted in opening with testing film in Fig. 3；
Fig. 5 is upper cover partial enlargement structural representation in Fig. 4.
It is marked in figure：
1st, testing film, 11, substrate, 12, conductive layer, 13, active metal layer, 14, encapsulated layer, 15, pin, 2, pedestal,
3rd, loading component, 31, groove one, 32, groove two, 4, upper cover, 5, seal member, 51, interior sealing item, 52, external seal strip, 6, survey
Sound out pin, 7, opening, 8, connection component, 81, pcb board, 82, patch cord connectors, 9, upset pin.
Specific embodiment
With reference to test example and specific embodiment, the present invention is described in further detail.But this should not be understood
Following embodiment is only limitted to for the scope of the above-mentioned theme of the present invention, it is all that this is belonged to based on the technology that present invention is realized
The scope of invention.
Embodiment 1
As shown in Figs. 1-2, be the present embodiment a kind of testing film 1, including substrate 11, on the substrate 11 from it is lower to
On be equipped with conductive layer 12, active metal layer 13 and encapsulated layer 14 successively, wherein active metal layer 13 is by the encapsulated layer 14
All coverings, the conductive layer 12 include at least one pin 15 not covered by active metal layer 13 and encapsulated layer 14.
Wherein above-mentioned active metal layer 13 is arranged on the centre position of substrate 11, remaining position is then used to set conductive layer 12
Each pin 15.The conductive layer 12 includes several pins 15 being connected to around active metal layer 13, all pins 15
Outside the region covered in the encapsulated layer 14.Specifically, the active layer of metal can select square shape or toroidal or remaining
Shape, when conductive layer 12 selects square shape, which includes 12 body of conductive layer and four pins 15, when conductive layer 12
During layer 13 of upper surface covering active metal, active metal layer 13 covers 12 body of conductive layer, and four pins 15 then distinguish position
In active metal layer 13 4 jiaos.
Conductive layer 12 described in the present embodiment is ITO conductive layer 12, and it is right that active metal layer 13 could alternatively be remaining
The sensitive material of redox reaction can occur for steam or oxygen in air.The area of above-mentioned encapsulated layer 14 is more than active
The area 10-20% of metal layer 13, the leakproofness of increase active metal layer 13.In addition, according to the convenience of test, substrate 11
Shape is adopted as square shape, and four pins 15 of conductive layer 12 are located at the corner of substrate 11, are respectively conductive layer among substrate 11
12 bodies, active metal layer 13 and encapsulated layer 14.
By using a kind of testing film 1 described in the present embodiment, led by setting gradually from top to bottom on the substrate 11
Electric layer 12, active metal layer 13 and encapsulated layer 14, wherein conductive layer 12, which extend, to be had not by active metal layer 13 and encapsulated layer 14
At least one pin 15 of covering is packaged the active metal layer 13 of the covering of layer 14, steam in the air with penetrating encapsulated layer 14
Or it after the redox chemistry reaction of oxygen generation, by the information (such as electric current, voltage) of test pin 15, can measure indirectly
The variation of active metal 13 resistance of layer, so as to judge the ability of 1 encapsulated layer 14 of testing film barrier steam and oxygen.
Testing film 1 described in the present embodiment is simple in structure, convenient test, can adapt in spite of there is cavity package
Films test, and the relevant information of conductive layer 12 is obtained by test instrumentation in real time, the artificial judgment that compares precision is higher, should
Testing film 1 does not have to encapsulation permeation sensor, come external test instrumentation, letter by the way of at least one pin 15 or electrode
The test method of change.
Embodiment 2
As in Figure 3-5, a kind of gauge for being used to assess thin-film package performance is present embodiments provided, including 2 He of pedestal
Upper cover 4, further includes：
Loading component 3, positioned at the pedestal 2, including the groove 1 with 1 shape adaptation of testing film；
Seal member 5, for that when pedestal 2 and the fastening of upper cover 4, can seal not by active gold on the testing film 1
Belong to 12 part-structure of conductive layer that layer 13 and encapsulated layer 14 cover；
Several test probes 6, for when pedestal 2 and the fastening of upper cover 4, the institute of test probe 6 and the conductive layer 12
There is pin 15 to contact with each other respectively；
Opening 7, arranged on the upper cover 4, when pedestal 2 and the fastening of upper cover 4, the opening 7 corresponds to the active metal layer
13 positions；
Connection component 8 is electrically connected with the test probe 6, and for external test instrumentation.
Wherein, the shape of the groove 1 of above-mentioned loading component 3 is for the external shape fits with testing film 1, in loading
At least one groove 2 32 including being connected with groove 1, preferably two grooves two being oppositely arranged are further included in component 3
32,2 32 depth of further groove is more than the thickness of testing film 1, for easily picking and placeing testing film 1 from gauge.Into one
Step, groove 1 and groove which includes and can be and 2 integrally formed structure of pedestal or load
Object component 3 includes several chuck bodies being detachably connected on pedestal 2, and fluted one 31 He is set in each chuck body
Groove 2 32 wherein the shape of each groove 1 can be different, can be adapted to different shape test to be measured respectively
Film 1.
Above-mentioned seal member 5 includes being arranged on the ring-shaped interior sealing item 51 of 4 inner surface of upper cover and ring-shaped external seal strip
52, the wherein region between interior sealing item 51 and external seal strip 52 is used for when pedestal 2 and upper cover 4 fasten, can seal not by
12 part-structure of conductive layer that active metal layer 13 and encapsulated layer 14 cover on testing film 1.The interior sealing item 51 and external seal
Item 52 can select silica gel strip, for obstructing extraneous steam or oxygen enters circuit between interior sealing item 51 and external seal strip 52
The pin 15 of part, i.e. conductive layer 12 and test probe 6, prevent that the circuit part exposed beyond the region from being invaded to play
Erosion or short circuit.
Above-mentioned all test probes 6 are arranged on the area between the interior sealing item 51 of 4 inner surface of upper cover and external seal strip 52
Domain.Further, if testing film 1 includes four pins 15, then 4 inner surface of upper cover then includes four test probes 6,
Each test probe 6 is gold plated copper pin, and when upper cover 4 and the mutually fastening of pedestal 2, four probes are with being located on testing film 1
Four pins 15 correspond and can contact with each other, four pins 15 be used as cathode, can by measure cathode electricity
Resistive, and then assess the encapsulation performance of active metal layer 13.
Above-mentioned connection component 8 includes the pcb board 81 being connected with each other with all test probes 6 and positioned at pcb board
Patch cord connectors 82 on 81, external test instrumentation such as voltage source, ammeter, voltmeter connection patch cord connectors 82, with reality
The installation of existing gauge.
In addition, for the ease of using, the upper cover 4 of the gauge is rotatably connected by upset pin 9 on pedestal 2, in order to will be upper
What lid 4 was stablized is fastened on pedestal 2, and the hook fastened with upper cover 4 is additionally provided on pedestal 2.The upper cover 4 and the material of pedestal 2 can
To select engineering plastic structure part, PEEK materials are such as used.
It is a kind of for assessing the gauge of thin-film package performance described in the present embodiment, including pedestal 2 and upper cover 4, wherein should
For putting testing film 1, seal member 5 is used to lead what non-encapsulated layer 14 was covered the loading component 3 that pedestal 2 is equipped with
12 part of electric layer (mainly including 15 part of pin) sealing avoids steam from entering influence test result, several test probes 6 are then
For connecting testing film 1 and circuit connecting section, convenient for the logical 7 infiltration envelope of the opening of upper cover 4 of extraneous test instrumentation monitoring in real time
After the redox chemistry reaction for filling layer 14 and occurring with the active metal of testing film 1 layer 13, by testing active metal layer
The variation of 13 resistance, so as to judge the ability of 1 encapsulated layer 14 of testing film barrier steam and oxygen.
The structure of the gauge is simple, convenient test, and the test instrumentations such as current source, voltmeter that can arrange in pairs or groups use, can be with
For for a long time, accurately measuring 1 film of testing film under the conditions of certain temperature (0~200 DEG C), humidity (0~100%RH)
The variation of layer micro resistance, for assessing the encapsulation performance of 1 film layer of testing film, accuracy is high.
Embodiment 3
The present embodiment additionally provides a kind of test method for the gauge for being used to assess thin-film package performance, including following test
Step：
Step 1: make the testing film 1 for needing to test；
Step 2: the testing film 1 is positioned in the loading component 3 of gauge；
Step 3: by the gauge connecting test instrument；
Step 4: 1 conductive layer of testing film, 12 increased resistance value tested by the test instrumentation, to described
The encapsulation performance of testing film 1 makes assessment.
Used by the present embodiment testing film 1 as described in example 1 above, institute in used gauge such as embodiment 2
It states.Above-mentioned step two and the order of step 3 can be exchanged with each other or be carried out at the same time.
It is a kind of for assessing the test method of the gauge of thin-film package performance described in the present embodiment, it is thin by making test
Then testing film 1 is placed in gauge by film 1, gauge and test instrumentation are connected with each other, and passes through test described in test instrumentation
Obtained 1 conductive layer of testing film, 12 resistance change, i.e. active metal layer 13 be subject to steam in air or oxygen infiltration and
There is a situation where redox reaction, to assess by the encapsulation performance quality and reliability of the testing film 1.
The test method is simple, can be under the conditions of certain temperature (0~200 DEG C), humidity (0~100%RH) for a long time
Use, test method is used for the encapsulation performance of 1 film layer of accurate evaluation testing film, and accuracy is high.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of testing film, including substrate (11), which is characterized in that be equipped with conduction on the substrate (11) successively from top to bottom
Layer (12), active metal layer (13) and encapsulated layer (14), wherein active metal layer (13) is whole by the encapsulated layer (14)
Covering, the conductive layer (12) are included not by active metal layer (13) and at least one pin of encapsulated layer (14) covering
(15)。
2. a kind of testing film according to claim 1, which is characterized in that the active metal layer (13) is arranged on substrate
(11) centre position.
3. a kind of testing film according to claim 1, which is characterized in that the conductive layer (12) includes being connected to active
Several described pins (15) around metal layer (13), all pins (15) are located at what the encapsulated layer (14) was covered
Outside region.
4. a kind of testing film according to claim 3, which is characterized in that the active layer of metal is square shape, described
Conductive layer (12) includes being located at four pins (15) of active metal layer (13) corner.
5. it is a kind of for assessing the gauge of thin-film package performance, including pedestal (2) and upper cover (4), which is characterized in that further include：
Loading component (3), positioned at the pedestal (2), including the groove one (31) with testing film (1) shape adaptation；
Seal member (5) when being fastened for working as pedestal (2) and upper cover (4), can be sealed not by living on the testing film (1)
Sprinkle metal layer (13) and conductive layer (12) part-structure of encapsulated layer (14) covering；
Several test probes (6), when being fastened for working as pedestal (2) and upper cover (4), test probe (6) and the conductive layer
(12) all pins (15) contact with each other respectively；
It is open (7), arranged on the upper cover (4), when pedestal (2) and upper cover (4) fastening, the opening (7) is corresponding described active
Metal layer (13) position；
Connection component (8) is electrically connected with the test probe (6), and for external test instrumentation.
A kind of 6. gauge for being used to assess thin-film package performance according to claim 5, which is characterized in that the moving load part
Part (3) further includes at least one groove two (32) being connected with the groove one (31).
A kind of 7. gauge for being used to assess thin-film package performance according to claim 5, which is characterized in that the sealing
Part (5) includes being arranged on the ring-shaped interior sealing item (51) of the upper cover (4) inner surface and ring-shaped external seal strip (52), wherein institute
The region between interior sealing item (51) and external seal strip (52) is stated to be used to, when pedestal (2) and upper cover (4) fastening, to seal not
By active metal layer (13) on the testing film (1) and conductive layer (12) part-structure of encapsulated layer (14) covering.
A kind of 8. gauge for being used to assess thin-film package performance according to claim 7, which is characterized in that all surveys
It sounds out pin (6) and is arranged on the region between the interior sealing item (51) of the upper cover (4) inner surface and external seal strip (52).
9. a kind of gauge for being used to assess thin-film package performance according to claim 5, which is characterized in that the circuit connects
Relay part (8) includes the pcb board (81) being connected with each other with all test probes (6) and the plug wire on pcb board (81) connects
Connect device (82).
10. a kind of test method for the gauge for being used to assess thin-film package performance, which is characterized in that including following testing procedure：
Step 1: make the testing film (1) for needing to test；
Step 2: the testing film (1) is positioned in the loading component (3) of gauge；
Step 3: by the gauge connecting test instrument；
Step 4: testing film (1) conductive layer (12) increased resistance value tested by the test instrumentation, to described
The encapsulation performance of testing film (1) makes assessment；
The order of wherein described step 2 and step 3 can be exchanged with each other or be carried out at the same time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711368776.9A CN108074833B (en) | 2017-12-18 | 2017-12-18 | Test film, jig for evaluating film packaging performance and test method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711368776.9A CN108074833B (en) | 2017-12-18 | 2017-12-18 | Test film, jig for evaluating film packaging performance and test method |
Publications (2)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109696390A (en) * | 2019-01-28 | 2019-04-30 | 中山大学 | The device of electric-resistivity method testing film gas permeation rate and its production, test method |
| CN110470583A (en) * | 2019-08-26 | 2019-11-19 | 武汉华星光电半导体显示技术有限公司 | The method of testing film encapsulation performance |
| CN112525395A (en) * | 2020-11-16 | 2021-03-19 | 武汉华星光电半导体显示技术有限公司 | Film stress measuring device and measuring method |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465622A (en) * | 2014-12-08 | 2015-03-25 | 京东方科技集团股份有限公司 | Method and packaging structure for detecting water and oxygen penetration rate of back plate |
| US20160178473A1 (en) * | 2014-12-03 | 2016-06-23 | International Business Machines Corporation | Measuring moisture leakage through liquid-carrying hardware |
| CN105807200A (en) * | 2016-05-13 | 2016-07-27 | 南京工业大学 | Universal testing device for solar cell and electroluminescent device |
| CN105973548A (en) * | 2016-05-07 | 2016-09-28 | 上海大学 | Water vapor transmittance testing clamp based on active metal electrical method |
| CN106018243A (en) * | 2016-08-02 | 2016-10-12 | 方圆环球光电技术盐城有限公司 | Method for testing and designing vapor/air permeability of transparent encapsulation coating and structure |
| CN106124384A (en) * | 2016-07-29 | 2016-11-16 | 方圆环球光电技术盐城有限公司 | The steam of hyaline membrane/measuring gas permebility system and method for testing |
| CN106153519A (en) * | 2016-07-29 | 2016-11-23 | 方圆环球光电技术盐城有限公司 | The steam of a kind of film/measuring gas permebility System and method for |
| CN106290106A (en) * | 2016-07-29 | 2017-01-04 | 方圆环球光电技术盐城有限公司 | The steam of encapsulation coating and structure/measuring gas permebility System and method for |
| CN107449704A (en) * | 2017-05-22 | 2017-12-08 | 茆胜 | The method of testing of film water vapor transmittance |
-
2017
- 2017-12-18 CN CN201711368776.9A patent/CN108074833B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160178473A1 (en) * | 2014-12-03 | 2016-06-23 | International Business Machines Corporation | Measuring moisture leakage through liquid-carrying hardware |
| CN104465622A (en) * | 2014-12-08 | 2015-03-25 | 京东方科技集团股份有限公司 | Method and packaging structure for detecting water and oxygen penetration rate of back plate |
| CN105973548A (en) * | 2016-05-07 | 2016-09-28 | 上海大学 | Water vapor transmittance testing clamp based on active metal electrical method |
| CN105807200A (en) * | 2016-05-13 | 2016-07-27 | 南京工业大学 | Universal testing device for solar cell and electroluminescent device |
| CN106124384A (en) * | 2016-07-29 | 2016-11-16 | 方圆环球光电技术盐城有限公司 | The steam of hyaline membrane/measuring gas permebility system and method for testing |
| CN106153519A (en) * | 2016-07-29 | 2016-11-23 | 方圆环球光电技术盐城有限公司 | The steam of a kind of film/measuring gas permebility System and method for |
| CN106290106A (en) * | 2016-07-29 | 2017-01-04 | 方圆环球光电技术盐城有限公司 | The steam of encapsulation coating and structure/measuring gas permebility System and method for |
| CN106018243A (en) * | 2016-08-02 | 2016-10-12 | 方圆环球光电技术盐城有限公司 | Method for testing and designing vapor/air permeability of transparent encapsulation coating and structure |
| CN107449704A (en) * | 2017-05-22 | 2017-12-08 | 茆胜 | The method of testing of film water vapor transmittance |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109696390A (en) * | 2019-01-28 | 2019-04-30 | 中山大学 | The device of electric-resistivity method testing film gas permeation rate and its production, test method |
| CN109696390B (en) * | 2019-01-28 | 2024-06-21 | 中山大学 | Device for testing gas permeability of film by resistance method and manufacturing and testing methods thereof |
| CN110470583A (en) * | 2019-08-26 | 2019-11-19 | 武汉华星光电半导体显示技术有限公司 | The method of testing film encapsulation performance |
| CN112525395A (en) * | 2020-11-16 | 2021-03-19 | 武汉华星光电半导体显示技术有限公司 | Film stress measuring device and measuring method |
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