CN112524972A - Micro-channel stacked air-cooled radiator - Google Patents
Micro-channel stacked air-cooled radiator Download PDFInfo
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- CN112524972A CN112524972A CN202011387130.7A CN202011387130A CN112524972A CN 112524972 A CN112524972 A CN 112524972A CN 202011387130 A CN202011387130 A CN 202011387130A CN 112524972 A CN112524972 A CN 112524972A
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- stacked
- air
- heat dissipation
- parallel flow
- microchannel
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/047—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag
- F28D1/0477—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being bent, e.g. in a serpentine or zig-zag the conduits being bent in a serpentine or zig-zag
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
- F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
Abstract
The invention discloses a micro-channel stacked air-cooled radiator, relates to the field of heat energy and power engineering, and aims to provide a high-efficiency air-cooled radiating system under complex working conditions. The invention utilizes the forced convection heat transfer technology to carry out air cooling heat dissipation on the cooling medium, completes the heat exchange process of the working medium and the cooling medium through the stacked micro-channel heat dissipation module, and completes the heat exchange process by leading the cooling medium heated by heat exchange to flow into the stacked micro-channel heat dissipation module under the action of the air quantity adjustable fan module and taking away the surface temperature of the stacked micro-channel heat dissipation module. The control system module calculates the real temperature of the working medium in the pipe by acquiring the real-time temperature outside the outflow end of the microchannel stacked heat dissipation module and comparing the real temperature with the optimal working temperature of the working medium, and adjusts the air quantity adjustable fan module in real time, so that the interior of the system is in the optimal air quantity for a long time, and the optimal heat dissipation effect is achieved.
Description
Technical Field
The invention relates to the field of heat energy and power engineering, in particular to a micro-channel stacked air-cooled radiator structure.
Background
As an energy exchange device, a radiator is used in various fields such as civil use, military use, food engineering, electric power engineering, and vehicle engineering, and the rationality of its structure has a great influence on energy consumption. The types of radiators can be classified into various types according to their different structures, for example, the radiators have two types of structures, i.e., a longitudinal flow type and a direct flow type, according to the difference of the fluid directions, and the radiators can be classified into a fin-and-tube radiator, a band-and-tube radiator, a plate radiator, and the like, according to the structural form of the radiator core. The heat dissipation mode applied to the current engineering mainly comprises the following steps: natural convection, forced air cooling, liquid cooling, heat pipe technology cooling, microchannel cooling etc. wherein forced air cooling technique utilizes the fan module to change atmospheric pressure according to the heat convection principle, the direction that the control air flows for the object that needs the heat exchange is air fast around flows, thereby takes away the heat on object surface and realizes the heat exchange, and its radiating effect is better than natural convection, but if want to realize abundant heat exchange, need with the help of other modules, and fully optimize heat radiation structure. Wherein the radiator cross-section can adopt the microchannel form, compares in traditional heat dissipation cross-section, and the microchannel can increase heat exchange surface area, can reduce convection heat transfer's flow resistance simultaneously to produce higher cooling efficiency.
Disclosure of Invention
The invention aims to provide a high-efficiency air-cooled heat dissipation system under complex working conditions. The above object of the present invention is achieved by the following technical solutions,
a microchannel stacked air cooled heat sink comprising: the device comprises a stack type micro-channel heat dissipation module 01, an air quantity adjustable fan module 02, a control system module 03, a temperature sensor 04 and a shell 05.
The stacked microchannel heat dissipation module 01 is used for completing a heat exchange process between a working medium and a cooling medium, and the cooling medium heated by heat exchange flows into the stacked microchannel heat dissipation module 01 under the action of the air volume adjustable fan module 02 to take away the surface temperature of the stacked microchannel heat dissipation module 01 to complete the heat exchange process, namely, cooling. The control system module 03 collects real-time temperature outside the outflow end pipe of the microchannel stacked heat dissipation module 01, calculates real temperature of working medium in the microchannel stacked heat dissipation module 01 through the CPU, compares the real temperature with optimal working temperature of the working medium, and adjusts the air volume adjustable fan module 02 in real time, so that the inside of the system is in optimal air volume for a long time, and the optimal heat dissipation effect is achieved.
The stacked microchannel heat dissipation module 01 is provided with a plurality of groups of same parallel flow type heat radiators 0102, and the middle heat dissipation section of the parallel flow type heat radiators 0102 is designed by microchannels, so that the heat dissipation area is increased, and the heat dissipation effect is improved; each group of parallel flow radiators 0102 are stacked along the air inlet and outlet direction, so that the number of radiators in a limited space is increased, and the space utilization rate is improved. The number of the parallel-flow radiators 0102 can be selected according to actual requirements, and the circulation length of the working medium in the stacked microchannel heat dissipation module 01, namely the air-cooling heat exchange length, is controlled by controlling the number of the parallel-flow radiators 0102 in the stacked microchannel heat dissipation module 01, so that the cooling efficiency is improved.
The air inlet end of the stacked micro-channel heat dissipation module 01 is connected with the air quantity adjustable fan module 02 through the air diffuser 0101, the gap at the joint is sealed by the sealing material 0103, and the gap between the parallel flow type radiators 0102 in the stacked micro-channel heat dissipation module 01 is sealed by the sealing material 0103 to form a closed air-cooled heat dissipation system, so that the utilization rate of a cooling medium is improved; also can adopt the 01 air inlet end of pile-up microchannel heat dissipation module to be connected with adjustable fan module 02 through air diffuser 0101 to seal 0103 junction clearance with the sealing material, sealed through outside sealed casing 05 again, form closed air-cooled cooling system, improve the cooling medium utilization ratio. When the sealing requirement is high, the two sealing modes can be combined, namely, the air inlet end of the stacked micro-channel heat dissipation module 01 is connected with the adjustable fan module 02 through the air diffuser 0101, the gap at the joint is sealed by the sealing material 0103, the gap between the parallel flow type heat radiators 0102 in the stacked micro-channel heat dissipation module 01 is sealed by the sealing material 0103, and then the gap is sealed by the external sealing shell 05, so that a better closed air-cooled heat dissipation system is formed, and the utilization rate of the cooling medium is improved.
The control of the flow and the temperature of a single or multiple working media under complex working conditions. The pipeline connection among a plurality of groups of parallel flow type radiators 0102 in the stacked microchannel heat dissipation module 01 can adopt a series connection, parallel connection or series-parallel connection mixed connection mode for the plurality of groups of parallel flow type radiators 0102 according to the relation among the groups of parallel flow type radiators 0102, so that the circulation length and the liquid resistance of a working medium in the parallel flow type radiators 0102 are changed, and the heat dissipation efficiency is improved.
The air quantity of the air quantity adjustable fan module 02 can be divided into three basic modes of an air quantity adjustable blower 0201 and an air quantity adjustable suction fan 0202 according to different application occasions, the air quantity adjustable blower 0201 and the air quantity adjustable suction fan 0202 are combined, the air quantity adjustable blower 0201 or the air quantity adjustable suction fan 0202 mode is adopted in medium and low temperature occasions according to different temperature control requirements, and the temperature is controlled by adopting the air quantity adjustable combined mode blower 0201 and the air quantity adjustable suction fan 0202 combined mode in high temperature occasions.
The control system module 03 collects real-time temperature outside the output end pipe of the microchannel stacked heat dissipation module 01 through the temperature sensor 04, calculates real temperature of working media through a CPU inside the control system module 03, and then compares the real temperature with the optimal working temperature of each working medium, so that the air quantity of the air quantity adjustable fan module 02 is adjusted to control the temperature of the working media in the stacked microchannel heat dissipation module 01.
The invention has the beneficial effects that:
the invention utilizes a forced convection heat transfer technology to carry out air cooling heat dissipation on a cooling medium, wherein the stacked micro-channel heat dissipation module 01 is used for completing the heat exchange process of a working medium and the cooling medium. Compare in traditional forced air cooling heat dissipation and have following advantage:
1. the parallel flow type radiators 0102 are installed in a stacked structure, so that the number of radiators in a limited space is increased, and the space utilization rate is improved;
2. the number of the parallel-flow radiators 0102 is controlled to control the circulation length of the working medium in the radiating module, namely the air-cooling heat exchange length, so that the cooling efficiency is changed;
3. parallel-flow radiators 0102 in the stacked microchannel heat dissipation module 01 can be connected in series, parallel and series-parallel according to actual needs, so that the circulation length and liquid resistance of a working medium in the parallel-flow radiators 0102 are changed, and the control of the flow and temperature of the working medium under complex working conditions is facilitated;
4. the whole radiating system adopts a closed structure, and the utilization rate of a cooling medium in the system is improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention.
FIG. 1 is an overall view of the present invention
FIG. 2 is a main body structure of a micro-channel stacked air-cooled heat sink
FIG. 3 is an isometric view of a stacked microchannel module
FIG. 4 is a schematic view of the layout of a stack-up microchannel module
FIG. 5 is a flow chart of the control of the blower module 02 with adjustable air volume
In the figure: 01. a stacked microchannel heat dissipation module; 02. the air quantity adjustable fan module; 03. a control system module; 04. a temperature sensor; 05. a housing;
0101. a diffuser; 0102. 0103, sealing material;
0201. an air volume adjustable blower; 0202. an air volume adjustable suction fan;
010201, a serial combination of a single working medium parallel flow radiator;
010202, multiple groups of parallel combination forms of a single working medium parallel flow type radiator;
010203, a typical parallel flow type radiator series-parallel combination form of multiple working media;
010204, a typical parallel flow type radiator series-parallel combination form of multiple working media;
010205, a typical parallel flow radiator series-parallel combination form of multiple working media;
010206, the parallel flow type radiator is in a flow dividing combination mode according to the working medium flow.
Detailed Description
The details of the present invention and its embodiments are further described below with reference to the accompanying drawings.
As shown in fig. 1, the present invention relates to a microchannel stacked air-cooled heat sink structure, the main body of which includes a stacked microchannel heat sink module 01, an air volume adjustable fan module 02, a control system module 03, a temperature sensor 04, and a housing 05, wherein the stacked microchannel module 01 is used for completing a heat exchange process between a working medium and a cooling medium, and the cooling medium heated by heat exchange flows into the stacked microchannel module 01 under the action of the air volume adjustable fan module 02 to take away the surface temperature of the stacked microchannel module 01 to complete the heat exchange process, i.e., complete the cooling process. The control system module 03 calculates the real temperature of the working medium in the microchannel stacked heat dissipation module 01 by acquiring the real-time temperature outside the outflow end pipe of the microchannel stacked heat dissipation module 01 and comparing the real temperature with the optimal working temperature of the working medium, and adjusts the air volume adjustable fan module 02 in real time, so that the inside of the system is in the optimal air volume for a long time, and the optimal heat dissipation effect is achieved.
As shown in fig. 2, the stacked microchannel heat dissipation module 01 of the present invention is provided with a plurality of groups of same parallel flow type heat sinks 0102, and the middle heat dissipation section of the parallel flow type heat sinks 0102 is designed with microchannels, thereby increasing the heat dissipation area and improving the heat dissipation effect; each group of parallel flow radiators 0102 are stacked along the air inlet and outlet direction, so that the number of radiators in a limited space is increased, and the space utilization rate is improved. The number of the parallel-flow radiators 0102 can be selected according to actual requirements, and the circulation length of the working medium in the stacked microchannel heat dissipation module 01, namely the air-cooling heat exchange length, is controlled by controlling the number of the parallel-flow radiators 0102 in the stacked microchannel heat dissipation module 01, so that the cooling efficiency is improved.
As shown in fig. 2, the sealing method of the microchannel stacked air-cooled heat sink is as follows: the air inlet end of the stacked micro-channel heat dissipation module 01 is connected with the air quantity adjustable fan module 02 through the air diffuser 0101, the gap at the joint is sealed by the sealing material 0103, and the gap between the parallel flow type radiators 0102 in the stacked micro-channel heat dissipation module 01 is sealed by the sealing material 0103 to form a closed air-cooled heat dissipation system, so that the utilization rate of a cooling medium is improved; the air inlet end of the stacked micro-channel heat dissipation module 01 can also be connected with the adjustable fan module 02 through the air diffuser 0101, the gap at the connection position of the 0103 is sealed by a sealing material, and then the sealed air cooling heat dissipation system is formed through the external sealing shell 06, so that the utilization rate of a cooling medium is improved.
As shown in fig. 4, when only one working medium exists in the stacked microchannel module 01 of the present invention, a plurality of sets of parallel flow type radiators 0102 in the stacked microchannel heat dissipation module 01 are connected to form a series 010201 through a pipeline, that is, the parallel flow type radiators 0102 in the plurality of sets of stacked microchannel heat dissipation modules 01 are connected in sequence through a pipeline to form a series connection of the parallel flow type radiators 0102, and the temperature of the working medium at the outflow end of the stacked microchannel heat dissipation module 01 is controlled by controlling the air volume of the air volume adjustable fan module 02;
also can connect a plurality of parallel flow formula radiators 0102 of group through the pipeline in the stack formula microchannel heat dissipation module 01 for parallel type 010202, be about to working medium reposition of redundant personnel in proper order with parallel flow formula radiator 0102 inflow end connection, each group of parallel flow formula radiator 0102 outflow end carries out the confluence connection to through the amount of wind of the adjustable fan module of control amount of wind, and then outflow end working medium temperature in the control stack formula microchannel heat dissipation module 0102 casing.
As shown in fig. 4, when working media with different optimal working temperatures exist in the stacked microchannel heat dissipation module 01, a plurality of sets of parallel-flow radiators 0102 in the stacked microchannel heat dissipation module 01 are connected to form a series-parallel type 010205 through a pipeline, that is, a part of parallel-flow radiators 0102 in the stacked microchannel heat dissipation module 01 are connected individually in series, and a part of parallel-flow radiators 0102 are connected individually in parallel, and the radiator components in the two combined modes are sequentially sorted according to the optimal working temperatures of the working media in the radiator pipes, and the temperature of the working media at the outflow end of each unit in the stacked microchannel heat dissipation module 01 is controlled by controlling the air volume of the air volume adjustable fan module 02.
As shown in fig. 4, in the stacked microchannel heat dissipation module 01, the pipeline connection between a plurality of groups of parallel flow radiators 0102 can also be connected 010206 according to the flow rate of the working medium, that is, according to the flow rate of the parallel flow radiators 0102, the working medium is shunted and is sequentially connected with the inflow ends of the parallel flow radiators 0102, and the outflow ends of the shells of the groups of parallel flow radiators 0102 are connected to the pipeline in a confluence manner, so as to change the circulation length and the liquid resistance of the working medium in the parallel flow radiators 0102, and simultaneously, according to the heat dissipation temperature requirement, a plurality of groups of parallel flow radiators 0102 with the above connection mode can be added, and each component is connected in series, thereby better controlling the temperature of the working medium.
As shown in fig. 1, the blower module 02 with adjustable air volume can be divided into three basic modes of combining an air volume adjustable blower 0201, an air volume adjustable suction fan 0201 and the air volume adjustable blower 0201 with adjustable air volume according to different application occasions, wherein the air volume adjustable blower 0201 or the air volume adjustable suction fan 0202 mode is adopted in medium and low temperature occasions according to different temperature control requirements, and the temperature is controlled by adopting the air volume adjustable combined mode blower 0201 and the air volume adjustable suction fan 0202 combined mode in high temperature occasions. When the air-cooled route is too long, can adopt multiunit stack mode, the air-out end of radiator carries out the series connection as the air inlet end of next group's radiator promptly, carries out the amount of wind excessively, guarantees the inside wind pressure of microchannel heap air-cooled radiator, promotes the cooling effect.
As shown in fig. 5, the control system module 03 collects real-time temperature outside the output end of the stack-type microchannel heat dissipation module 01 through the temperature sensor 04, calculates real temperature of the working medium through the CPU inside the control system module 03, and compares the real temperature with the optimal working temperature of each working medium, thereby adjusting the air volume of the air volume adjustable fan module 02 to control the temperature of the working medium in the stack-type microchannel heat dissipation module 01.
The above description is only a preferred example of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like of the present invention shall be included in the protection scope of the present invention.
Claims (10)
1. A stack-type air-cooled heat sink with micro-channels is characterized in that the heat sink mainly comprises: a stack type micro-channel heat dissipation module (01) and an air quantity adjustable fan module (02);
the stacked micro-channel heat dissipation module (01) is provided with a plurality of groups of same parallel flow type heat radiators (0102), and the middle heat dissipation section of each parallel flow type heat radiator (0102) is designed by a micro-channel; each group of parallel flow radiators (0102) are placed in a stacking mode along the air inlet and outlet direction, the number of the parallel flow radiators (0102) can be selected according to the actual circulation length required, and the circulation length of the working medium in the stacked micro-channel heat dissipation module (01) is controlled by controlling the number of the parallel flow radiators (0102) in the stacked micro-channel heat dissipation module (01).
2. The microchannel stacked air-cooled radiator of claim 1, wherein the air inlet end of the stacked microchannel heat dissipation module (01) is connected with the air volume adjustable fan module (02) through the diffuser (0101), the gap at the joint is sealed by a sealing material (0103), and the gap between the parallel flow type radiators (0102) in the stacked microchannel heat dissipation module (01) is sealed by the sealing material (0103).
3. The microchannel stacked air-cooled radiator of claim 1, wherein the air inlet end of the stacked microchannel radiating module (01) is connected with the adjustable fan module (02) through a radiator (0101), the gap at the joint of the two modules is sealed by a sealing material (0103), and then the gap is sealed by an external sealing shell (05), or the gap between parallel flow type radiators (0102) in the stacked microchannel radiating module (01) is sealed by the sealing material (0103) and then the gap is sealed by the external sealing shell (05).
4. The microchannel stacked air-cooled radiator of claim 1, wherein the pipeline connection between the sets of parallel flow radiators (0102) in the stacked microchannel heat dissipation module (01) can adopt a series, parallel or series-parallel mixed connection mode for the sets of parallel flow radiators (0102) according to the relationship between the sets of parallel flow radiators (0102), thereby changing the circulation length and the liquid resistance of the working medium in the parallel flow radiators (0102); or the flow dividing connection mode is carried out according to the relation between the flow of the working medium and the flow of the parallel flow type radiator (0102), so that the flow length and the liquid resistance of the working medium in the parallel flow type radiator (0102) are changed.
5. The microchannel stacked air-cooled radiator of claim 4, wherein the parallel flow radiators (0102) in the plurality of sets of stacked microchannel radiating modules (01) are connected sequentially through a pipeline to form a serial connection form of the parallel flow radiators (0102).
6. The microchannel stacked air-cooled radiator as claimed in claim 4, wherein the sets of parallel flow radiators (0102) are connected in parallel (010202) by piping, that is, the working medium is divided and connected to the inflow ends of the parallel flow radiators (0102) in sequence, and the outflow ends of the sets of parallel flow radiators (0102) are connected in confluence.
7. The microchannel stacked air-cooled radiator of claim 4, wherein a part of parallel flow radiators (0102) in the stacked microchannel heat dissipation module (01) are connected in series and then connected in parallel and mounted in sequence according to the optimal working temperature of the working medium in the radiator pipe.
8. The microchannel stacked air-cooled radiator of claim 4, wherein the stacked microchannel heat dissipation module (01) shunts the working medium according to the flowing amount of the parallel flow type radiator (0102), and is sequentially connected with the inflow end of the parallel flow type radiator (0102), and the outflow ends of the shells of the parallel flow type radiators (0102) of each group are confluent and connected to the pipeline, so as to change the flowing length and the liquid resistance of the working medium in the parallel flow type radiator (0102), and simultaneously, according to the heat dissipation temperature requirement, a plurality of groups of parallel flow type radiator groups (0102) of the connection mode can be added, and each group of units are installed in series.
9. The microchannel stacked air-cooled radiator according to claim 1, wherein the air volume of the air volume adjustable fan module (02) can be divided into three basic modes of an air volume adjustable blower (0201), an air volume adjustable suction fan (0202) and a combination of the air volume adjustable blower (0201) and the air volume adjustable suction fan (0202) according to different application occasions; the air quantity adjustable blower (0201) is arranged at the outlet of the air inlet, and the air quantity adjustable suction fan (0202) is arranged at the outlet of the air inlet; according to different temperature control requirements, an air volume adjustable blower (0201) mode or an air volume adjustable suction fan (0202) mode is adopted in medium and low temperature occasions, and an air volume adjustable combined mode blower (0201) and the air volume adjustable suction fan (0202) combined mode is adopted in high temperature occasions for temperature control.
10. The microchannel stacked air-cooled radiator of claim 1, further comprising a control system module (03) and a temperature sensor (04), wherein the control system module (03) collects real-time temperature outside an output end pipe of the microchannel stacked heat dissipation module (01) through the temperature sensor (04), and calculates real temperature of the working medium through a CPU inside the control system module (03), and then compares the real temperature with optimal working temperature of each working medium, so as to adjust air volume of the air volume adjustable fan module (02) to control the temperature of the working medium in the stacked microchannel heat dissipation module (01).
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| CN202011387130.7A CN112524972A (en) | 2020-12-01 | 2020-12-01 | Micro-channel stacked air-cooled radiator |
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| CN202011387130.7A CN112524972A (en) | 2020-12-01 | 2020-12-01 | Micro-channel stacked air-cooled radiator |
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| CN1704699A (en) * | 2004-06-02 | 2005-12-07 | 陈苏红 | Automobile air-conditioner multilayer parallel cascade type evaporator |
| CN101177120A (en) * | 2007-12-01 | 2008-05-14 | 陈基镛 | Multiple medium modularization integration cooling units for automobile |
| CN207395537U (en) * | 2017-10-13 | 2018-05-22 | 纳百川控股有限公司 | Mouth organ passage parallel flow heat exchanger |
| CN109256604A (en) * | 2018-08-31 | 2019-01-22 | 西华大学 | A kind of air-cooled filter device of battery for electric automobile |
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Application publication date: 20210319 |