CN112521881A - High-thermal-conductivity graphene heat dissipation film for 5G communication equipment and preparation method thereof - Google Patents

High-thermal-conductivity graphene heat dissipation film for 5G communication equipment and preparation method thereof Download PDF

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CN112521881A
CN112521881A CN202011323787.7A CN202011323787A CN112521881A CN 112521881 A CN112521881 A CN 112521881A CN 202011323787 A CN202011323787 A CN 202011323787A CN 112521881 A CN112521881 A CN 112521881A
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graphene
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communication equipment
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朱全红
施立毛
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Dongguan Hongyi Thermal Conductmty Material Co ltd
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Dongguan Hongyi Thermal Conductmty Material Co ltd
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Abstract

The invention belongs to the technical field of heat dissipation materials, and particularly relates to a high-thermal-conductivity graphene heat dissipation film for 5G communication equipment. In addition, the invention also relates to a preparation method of the high-thermal-conductivity graphene heat dissipation film of the 5G communication equipment. Compared with the prior art, the invention realizes high-efficiency multidirectional heat dissipation effect and meets the requirements of 5G communication equipment.

Description

High-thermal-conductivity graphene heat dissipation film for 5G communication equipment and preparation method thereof
Technical Field
The invention belongs to the technical field of heat dissipation materials, and particularly relates to a high-heat-conductivity graphene heat dissipation film for 5G communication equipment and a preparation method thereof.
Background
The global smart phone is in the 5G era, and along with the pursuit of the smart phone on light, thin and small design, the volumes of an integrated circuit chip and electronic components in the smart phone are continuously reduced, and the power density is rapidly increased; the frequency of a mobile phone CPU is rapidly increasing, and meanwhile, the packaging density is also increasing, the body is becoming thinner and thinner, and the power density thereof is rapidly increasing, but due to the gradual increase of the mobile phone hardware configuration, the upgrade of the multi-core high performance of the CPU, and the increase of the communication speed, the heat dissipation problem has become a problem that needs to be solved urgently in 5G communication equipment. Once the heat dissipation problem is not well treated, the intelligent mobile phone is stuck, the running program is slow, and the mainboard is burned out or even explosion danger is caused. At present, the heat dissipation material widely applied to 4G communication equipment is difficult to meet the requirements of 5G communication equipment.
Disclosure of Invention
One of the objects of the present invention is: aiming at the defects of the prior art, the high-heat-conductivity graphene heat dissipation film for the 5G communication equipment is provided, the efficient multidirectional heat dissipation effect is achieved, and the requirements of the 5G communication equipment are met.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a high heat conduction graphite alkene heat dissipation membrane for 5G communications facilities, includes by last protection rete, graphite alkene layer, metal foil layer, almag layer, ultra-thin heat conduction silica gel layer and from the type rete that sets gradually under to, graphite alkene layer with almag layer respectively through the mode of coating formed in the surface of metal foil layer.
The improved high-thermal-conductivity graphene heat dissipation film for 5G communication equipment further comprises coarsened layers, wherein the coarsened layers are arranged on two surfaces of the metal foil layer, one coarsened layer is connected with the graphene layer, and the other coarsened layer is connected with the aluminum magnesium alloy layer.
The edge of the protective film layer exceeds the edge of the graphene layer, the edge of the ultrathin heat-conducting silica gel layer exceeds the edge of the aluminum magnesium alloy layer, and the edges of the graphene layer, the metal foil layer and the aluminum magnesium alloy layer are flush.
As an improvement of the high-thermal-conductivity graphene heat dissipation film for the 5G communication equipment, the release film layer is divided into a plurality of small release films by dotted line-shaped breakpoints.
As an improvement of the high-thermal-conductivity graphene heat dissipation film for the 5G communication equipment, the number of the small release films is 2-4.
As an improvement of the high-thermal-conductivity graphene heat dissipation film for the 5G communication equipment, the thickness of the graphene layer is 10-100 microns, the thickness of the metal foil layer is 0.1-0.3 mm, and the thickness of the aluminum-magnesium alloy layer is 5-500 microns.
As an improvement of the high-thermal-conductivity graphene heat dissipation film for the 5G communication equipment, the thickness of the ultrathin thermal-conductivity silica gel layer is 5-50 microns, and the thermal conductivity is 5-17W/(m.K).
As an improvement of the high-thermal-conductivity graphene heat dissipation film for the 5G communication equipment, the protective film layer and the release film layer are both PET film layers, and the thicknesses of the protective film layer and the release film layer are respectively 0.01-0.1 mm.
The second purpose of the invention is: the preparation method of the high-thermal-conductivity graphene heat dissipation film for the 5G communication equipment comprises the following steps:
dissolving graphite powder, a dispersing agent and a defoaming agent in water, shearing, homogenizing for the first time to obtain a graphene dispersion liquid, mixing the graphene dispersion liquid with resin and a film-forming agent, homogenizing for the second time to obtain a graphene slurry, coating the graphene slurry on one surface of a metal foil layer, and drying to obtain a graphene layer;
mixing aluminum magnesium alloy powder and resin to obtain aluminum magnesium alloy slurry, coating the aluminum magnesium alloy slurry on the other surface of the metal foil layer, and drying to obtain an aluminum magnesium alloy layer;
coating paste-shaped heat-conducting silica gel on the surface of the aluminum-magnesium alloy layer, then attaching a protective film on the surface of the graphene layer, attaching a release film on the surface of the paste-shaped heat-conducting silica gel, calendering and attaching, and vulcanizing to enable the paste-shaped material of the heat-conducting silica gel to be completely thermally cured and molded to form an ultrathin heat-conducting silica gel layer, thereby finally obtaining the directly-used high-heat-conducting graphene heat dissipation film.
As an improvement of the preparation method of the high-thermal-conductivity graphene heat dissipation film for the 5G communication equipment, the vulcanization is divided into two stages, wherein the first stage is vulcanized for 8min at 135 ℃, and the second stage is vulcanized for 5min at 180 ℃.
Compared with the prior art, the beneficial effects of the invention include but are not limited to: the utility model discloses during the use, tear from the type rete, locate ultra-thin heat conduction silica gel layer subsides in treating heat dissipation communication equipment, the heat transmits the almag layer again after vertical (Z) conduction to ultra-thin heat conduction silica gel layer, the almag layer is non-oriented heat conduction, it transfers heat along multidirectional (X-Y-Z), wherein, the heat of along horizontal (X-Y) transmission then distributes outwards, the heat of along vertical (Z) transmission then distributes outwards via metal foil layer and graphite alkene layer (metal foil layer and graphite alkene layer all are that longitudinal heat transfer nature is good) in proper order, therefore, the high heat conduction graphite alkene heat dissipation membrane of the invention has realized the multidirectional radiating effect of efficient under the mutually supporting of the material layer that each heat conductivity is good, can satisfy 5G communication equipment's demand.
Drawings
FIG. 1 is a schematic diagram of the present invention.
FIG. 2 is a second schematic structural diagram of the present invention.
FIG. 3 is a schematic structural diagram of a release film layer according to the present invention.
Wherein: 1-protective film layer, 2-graphene layer, 3-metal foil layer, 4-aluminum-magnesium alloy layer, 5-ultrathin heat-conducting silica gel layer, 6-release film layer, 7-coarsened layer and 61-small release film.
Detailed Description
Embodiments of the present invention will be described in detail below. The embodiments of the invention should not be construed as limiting the invention.
1. High-thermal-conductivity graphene heat dissipation film for 5G communication equipment
The invention provides a high thermal conductivity graphene heat dissipation film for 5G communication equipment, and referring to fig. 1, the high thermal conductivity graphene heat dissipation film comprises a protection film layer 1, a graphene layer 2, a metal foil layer 3, an aluminum magnesium alloy layer 4, an ultrathin thermal conductivity silica gel layer 5 and a release film layer 6 which are sequentially arranged from top to bottom, wherein the graphene layer 2 and the aluminum magnesium alloy layer 4 are respectively formed on the surface of the metal foil layer 3 in a coating manner.
When the heat dissipation film is used, the release film layer 6 is torn, the ultrathin heat conduction silica gel layer 5 is attached to communication equipment to be dissipated, heat is conducted to the ultrathin heat conduction silica gel layer 5 along the longitudinal direction (Z) and then is transferred to the aluminum magnesium alloy layer 4, the aluminum magnesium alloy layer 4 conducts heat in a non-oriented mode and conducts heat along the multidirectional direction (X-Y-Z), the heat transferred along the transverse direction (X-Y) is dissipated outwards, and the heat transferred along the longitudinal direction (Z) is dissipated outwards sequentially through the metal foil layer 3 and the graphene layer 2 (the metal foil layer 3 and the graphene layer 2 are good in longitudinal heat conductivity), so that the high-heat-conductivity graphene heat dissipation film achieves an efficient multidirectional heat dissipation effect under the mutual matching of material layers with good heat conductivity, and can meet the requirements of 5G communication equipment.
Referring to fig. 2, in some embodiments, the high thermal conductivity graphene heat dissipation film for 5G communication equipment of the present invention further includes roughened layers 7, the roughened layers 7 are disposed on both surfaces of the metal foil layer 3, one roughened layer 7 is connected to the graphene layer 2, and the other roughened layer 7 is connected to the al-mg alloy layer 4. The arrangement of the coarsening layer 7 enables the graphene layer 2 and the aluminum magnesium alloy layer 4 to be combined with the metal foil layer 3 more tightly, and the structural reliability of the high-thermal-conductivity graphene heat dissipation film is improved.
In some embodiments, the edge of the protective film layer 1 exceeds the edge of the graphene layer 2, the edge of the ultra-thin heat conductive silica gel layer 5 exceeds the edge of the aluminum magnesium alloy layer 4, and the edges of the graphene layer 2, the metal foil layer 3, and the aluminum magnesium alloy layer 4 are flush. After the rolling, the protective film layer 1 is attached to the ultrathin heat-conducting silica gel layer 5, the graphene layer 2 and the aluminum magnesium alloy layer 4 are coated in the protective film layer, and the graphene layer 2 and the aluminum magnesium alloy layer 4 are prevented from being layered and falling off.
Referring to fig. 3, in some embodiments, the release film layer 6 is divided into several small release films 61 by dotted line-shaped break points. Preferably, the number of the small release films 61 is 2-4. From type rete 6 by broken line form breakpoint division polylith little from type membrane 61, when pasting, can peel off one of them piece earlier and leave type membrane 61, accurate location accuracy back, again correspond and paste, then peel off other in proper order and leave type membrane 61 and paste, conveniently prepare the location, avoid being pasted the deformation of part.
In some embodiments, the thickness of the graphene layer 2 is 10 to 100 μm, the thickness of the metal foil layer 3 is 0.1 to 0.3mm, and the thickness of the aluminum-magnesium alloy layer 4 is 5 to 500 μm.
In some embodiments, the ultra-thin thermal conductive silicone adhesive layer 5 has a thickness of 5 to 50 μm and a thermal conductivity of 5 to 17W/(mK).
In some embodiments, the protective film layer 1 and the release film layer 6 are both PET film layers, and the thicknesses of the protective film layer 1 and the release film layer 6 are 0.01-0.1 mm, respectively.
2. Preparation method
The second aspect of the present invention provides a preparation method of a high thermal conductivity graphene heat dissipation film for 5G communication equipment, including the following steps:
dissolving graphite powder, a dispersing agent and a defoaming agent in water, shearing, homogenizing for the first time to obtain a graphene dispersion liquid, mixing the graphene dispersion liquid with resin and a film forming agent, homogenizing for the second time to obtain a graphene slurry, coating the graphene slurry on one surface of a metal foil layer, and drying to obtain a graphene layer;
mixing the aluminum magnesium alloy powder with resin to obtain aluminum magnesium alloy slurry, coating the aluminum magnesium alloy slurry on the other surface of the metal foil layer, and drying to obtain an aluminum magnesium alloy layer;
coating paste-shaped heat-conducting silica gel on the surface of the aluminum-magnesium alloy layer, then attaching a protective film on the surface of the graphene layer, attaching a release film on the surface of the paste-shaped heat-conducting silica gel, calendering and attaching, and vulcanizing to enable the paste-shaped material of the heat-conducting silica gel to be completely thermoset and molded to form an ultrathin heat-conducting silica gel layer, thereby finally obtaining the directly-used high-heat-conducting graphene heat dissipation film.
In some embodiments, the vulcanization is in two stages, the first stage vulcanization at 135 ℃ for 8min and the second stage vulcanization at 180 ℃ for 5 min.
In some embodiments, a roughened layer is formed on the surface of the metal foil layer, and the graphene paste and the aluminum magnesium alloy paste are coated.
In some embodiments, breakpoint processing is performed on the release film layer of the finally prepared high thermal conductivity graphene heat dissipation film, so as to obtain a plurality of small release films divided by dotted-line-shaped breakpoints.
In the above embodiment, the dispersant is selected from: any one or more of acrylic block copolymer, polyvinyl alcohol and polymethacrylic acid; the defoaming agent is selected from: any one or more of polyether defoaming agent, organic silicon defoaming agent and mineral oil defoaming agent; the resin is selected from: any one or more of polyurethane resin, acrylic resin, epoxy resin, styrene butadiene rubber and ABS resin; the film forming agent is selected from: any one or more of an alcohol ether film forming agent, an acrylic film forming agent and a polyurethane film forming agent. The feeding ratio of the raw materials in the graphene slurry is as follows: 2-200 parts of graphite powder, 10-100 parts of dispersing agent, 1-10 parts of defoaming agent, 200-600 parts of resin and 5-100 parts of film forming agent.
Embodiments of the present invention are illustrated below with reference to examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the claimed invention.
Example 1
The preparation method of the high-thermal-conductivity graphene heat dissipation film for the 5G communication equipment comprises the following steps:
1) dissolving 2kg of graphite powder, 10kg of dispersing agent and 3kg of defoaming agent in 1000L of water, shearing at the rotating speed of 600-3000 r/min for 1.5-5 h, homogenizing at the pressure of 40-100 MPa for 2-6 h to obtain graphene dispersion, mixing the graphene dispersion 1 with 200kg of resin and 5kg of film forming agent, homogenizing at the pressure of 20-120 MPa for 0.5-2 h to obtain graphene slurry, coating the graphene slurry on one surface of a copper foil with the thickness of 0.1-0.3 mm, and drying to obtain a graphene layer with the thickness of 10-100 mu m; in the embodiment, the graphite powder is expanded graphite, the dispersing agent is acrylic acid block copolymer, the defoaming agent is mineral oil defoaming agent, the resin is polyurethane resin, and the film forming agent is polyurethane film forming agent;
2) mixing 2kg of aluminum magnesium alloy powder and 1kg of resin to obtain aluminum magnesium alloy slurry, coating the aluminum magnesium alloy slurry on the other surface of the copper foil with the thickness of 0.1-0.3 mm, and drying to obtain an aluminum magnesium alloy layer with the thickness of 5-500 mu m; in this example, the resin is a polyurethane resin;
3) coating paste-shaped heat-conducting silica gel on the surface of the aluminum-magnesium alloy layer, then attaching a PET protective film on the surface of the graphene layer, attaching a PET release film on the surface of the paste-shaped heat-conducting silica gel, calendering and attaching, and then vulcanizing to enable the paste-shaped material of the heat-conducting silica gel to be completely thermoset and molded to form an ultrathin heat-conducting silica gel layer with the thickness of 5-50 microns, and finally obtaining the directly-used high-heat-conducting graphene heat-dissipating film; in this example, the vulcanization was carried out in two stages, the first stage at 135 ℃ for 8min and the second stage at 180 ℃ for 5 min.
Through testing, the thermal diffusion coefficient of the high-thermal-conductivity graphene heat dissipation film prepared in the embodiment is 839mm2And the thermal conductivity is 1354.8W/(M.k).
Example 2
The preparation method of the high-thermal-conductivity graphene heat dissipation film for the 5G communication equipment comprises the following steps:
1) dissolving 100kg of graphite powder, 90kg of dispersing agent and 5kg of defoaming agent in 1000L of water, shearing at the rotating speed of 600-3000 r/min for 1.5-5 h, homogenizing at the pressure of 40-100 MPa for 2-6 h to obtain graphene dispersion liquid 2, mixing the graphene dispersion liquid 2 with 280kg of resin and 60kg of film forming agent, homogenizing at the pressure of 20-120 MPa for 0.5-2 h to obtain graphene slurry, coating the graphene slurry on one surface of a copper foil with the thickness of 0.1-0.3 mm, and drying to obtain a graphene layer with the thickness of 10-100 mu m; in the embodiment, the graphite powder is expanded graphite, the dispersing agent is acrylic acid block copolymer, the defoaming agent is mineral oil defoaming agent, the resin is polyurethane resin, and the film forming agent is polyurethane film forming agent;
2) mixing 200kg of aluminum magnesium alloy powder and 120kg of resin to obtain aluminum magnesium alloy slurry, coating the aluminum magnesium alloy slurry on the other surface of the copper foil with the thickness of 0.1-0.3 mm, and drying to obtain an aluminum magnesium alloy layer with the thickness of 5-500 mu m; in this example, the resin is a polyurethane resin;
3) coating paste-shaped heat-conducting silica gel on the surface of the aluminum-magnesium alloy layer, then attaching a protective film on the surface of the graphene layer, attaching a release film on the surface of the paste-shaped heat-conducting silica gel, calendering and attaching, and vulcanizing to enable the paste-shaped material of the heat-conducting silica gel to be completely thermoset and molded to form an ultrathin heat-conducting silica gel layer with the thickness of 5-50 microns, and finally obtaining the directly-used high-heat-conducting graphene heat-dissipation film; in this example, the vulcanization was carried out in two stages, the first stage at 135 ℃ for 8min and the second stage at 180 ℃ for 5 min.
Through testing, the thermal diffusion coefficient of the high-thermal-conductivity graphene heat dissipation film prepared by the embodiment is 916mm2And the thermal conductivity is 1504.3W/(M.k).
Example 3
The preparation method of the high-thermal-conductivity graphene heat dissipation film for the 5G communication equipment comprises the following steps:
1) dissolving 100kg of graphite powder, 90kg of dispersing agent and 5kg of defoaming agent in 1000L of water, shearing at the rotating speed of 600-3000 r/min for 1.5-5 h, homogenizing at the pressure of 40-100 MPa for 2-6 h to obtain graphene dispersion liquid 2, mixing the graphene dispersion liquid 2 with 280kg of resin and 60kg of film forming agent, homogenizing at the pressure of 20-120 MPa for 0.5-2 h to obtain graphene slurry, coating the graphene slurry on one surface of a copper foil with the thickness of 0.1-0.3 mm, and drying to obtain a graphene layer with the thickness of 10-100 mu m; in the embodiment, the graphite powder is expanded graphite, the dispersing agent is acrylic acid block copolymer, the defoaming agent is mineral oil defoaming agent, the resin is polyurethane resin, the film forming agent is polyurethane film forming agent, and two surfaces of the copper foil are provided with coarsening layers;
2) mixing 200kg of aluminum magnesium alloy powder and 120kg of resin to obtain aluminum magnesium alloy slurry, coating the aluminum magnesium alloy slurry on the other surface of the copper foil with the thickness of 0.1-0.3 mm, and drying to obtain an aluminum magnesium alloy layer with the thickness of 5-500 mu m; in this example, the resin is a polyurethane resin;
3) coating paste-shaped heat-conducting silica gel on the surface of the aluminum-magnesium alloy layer, then attaching a protective film on the surface of the graphene layer, attaching a release film on the surface of the paste-shaped heat-conducting silica gel, calendering and attaching, and vulcanizing to enable the paste-shaped material of the heat-conducting silica gel to be completely thermoset and molded to form an ultrathin heat-conducting silica gel layer with the thickness of 5-50 microns, and finally obtaining the directly-used high-heat-conducting graphene heat-dissipation film; in this example, the vulcanization was carried out in two stages, the first stage at 135 ℃ for 8min and the second stage at 180 ℃ for 5 min.
Through testing, the thermal diffusion coefficient of the high-thermal-conductivity graphene heat dissipation film prepared by the embodiment is 874mm2And the thermal conductivity is 1436.7W/(M.k).
Variations and modifications to the above-described embodiments may also occur to those skilled in the art, which fall within the scope of the invention as disclosed and taught herein. Therefore, the present invention is not limited to the above-mentioned embodiments, and any obvious improvement, replacement or modification made by those skilled in the art based on the present invention is within the protection scope of the present invention. Furthermore, although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims (10)

1. The utility model provides a high heat conduction graphite alkene heat dissipation membrane for 5G communications facilities, its characterized in that includes by last protection rete, graphite alkene layer, metal foil layer, almag layer, ultra-thin heat conduction silica gel layer and from the type rete that sets gradually under to, graphite alkene layer with almag layer is formed through the mode of coating respectively in the surface of metal foil layer.
2. The graphene heat dissipation film for 5G communication equipment according to claim 1, further comprising rough layers, wherein the rough layers are disposed on two surfaces of the metal foil layer, one of the rough layers is connected to the graphene layer, and the other rough layer is connected to the aluminum magnesium alloy layer.
3. The high thermal conductivity graphene heat dissipation film for 5G communication equipment according to claim 1, wherein an edge of the protection film layer exceeds an edge of the graphene layer, an edge of the ultra-thin thermal conductivity silica gel layer exceeds an edge of the aluminum magnesium alloy layer, and edges of the graphene layer, the metal foil layer and the aluminum magnesium alloy layer are flush.
4. The high thermal conductivity graphene heat dissipation film for 5G communication equipment as claimed in claim 1, wherein the release film layer is divided into a plurality of small release films by dotted line-shaped break points.
5. The high thermal conductivity graphene heat dissipation film for 5G communication equipment as claimed in claim 4, wherein the number of the small release films is 2-4.
6. The high-thermal-conductivity graphene heat dissipation film for 5G communication equipment as claimed in claim 1, wherein the thickness of the graphene layer is 10-100 μm, the thickness of the metal foil layer is 0.1-0.3 mm, and the thickness of the aluminum-magnesium alloy layer is 5-500 μm.
7. The graphene heat dissipation film for 5G communication equipment as claimed in claim 1, wherein the thickness of the ultra-thin heat conductive silica gel layer is 5-50 μm, and the thermal conductivity is 5-17W/(m-K).
8. The high-thermal-conductivity graphene heat dissipation film for 5G communication equipment as claimed in claim 1, wherein the protective film layer and the release film layer are both PET film layers, and the thicknesses of the protective film layer and the release film layer are 0.01-0.1 mm respectively.
9. The preparation method of the high-thermal-conductivity graphene heat dissipation film for 5G communication equipment as claimed in any one of claims 1 to 8, wherein the method comprises the following steps:
dissolving graphite powder, a dispersing agent and a defoaming agent in water, shearing, homogenizing for the first time to obtain a graphene dispersion liquid, mixing the graphene dispersion liquid with resin and a film-forming agent, homogenizing for the second time to obtain a graphene slurry, coating the graphene slurry on one surface of a metal foil layer, and drying to obtain a graphene layer;
mixing aluminum magnesium alloy powder and resin to obtain aluminum magnesium alloy slurry, coating the aluminum magnesium alloy slurry on the other surface of the metal foil layer, and drying to obtain an aluminum magnesium alloy layer;
coating paste-shaped heat-conducting silica gel on the surface of the aluminum-magnesium alloy layer, then attaching a protective film on the surface of the graphene layer, attaching a release film on the surface of the paste-shaped heat-conducting silica gel, calendering and attaching, and vulcanizing to enable the paste-shaped material of the heat-conducting silica gel to be completely thermally cured and molded to form an ultrathin heat-conducting silica gel layer, thereby finally obtaining the directly-used high-heat-conducting graphene heat dissipation film.
10. The method of claim 9, wherein the curing step is carried out in two stages, the first stage is carried out at 135 ℃ for 8min, and the second stage is carried out at 180 ℃ for 5 min.
CN202011323787.7A 2020-11-23 2020-11-23 High-thermal-conductivity graphene heat dissipation film for 5G communication equipment and preparation method thereof Pending CN112521881A (en)

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