CN112521183A - Meltallizing method of ceramic piece for dry etching process - Google Patents
Meltallizing method of ceramic piece for dry etching process Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 109
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000001312 dry etching Methods 0.000 title claims abstract description 11
- 239000007921 spray Substances 0.000 claims abstract description 40
- 238000002791 soaking Methods 0.000 claims abstract description 29
- 239000004809 Teflon Substances 0.000 claims abstract description 23
- 229920006362 Teflon® Polymers 0.000 claims abstract description 23
- 238000004140 cleaning Methods 0.000 claims abstract description 21
- 238000005488 sandblasting Methods 0.000 claims abstract description 21
- 238000007750 plasma spraying Methods 0.000 claims abstract description 17
- 238000001035 drying Methods 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000002390 adhesive tape Substances 0.000 claims abstract description 10
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 9
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 6
- 230000000873 masking effect Effects 0.000 claims description 6
- 229910052593 corundum Inorganic materials 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000000428 dust Substances 0.000 claims description 4
- 239000007788 liquid Substances 0.000 claims description 4
- 239000010431 corundum Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 239000004576 sand Substances 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- 229910001845 yogo sapphire Inorganic materials 0.000 claims description 2
- 238000005507 spraying Methods 0.000 abstract description 11
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000007751 thermal spraying Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
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- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
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- C04B41/5025—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials with ceramic materials
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
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- C04B41/5323—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete to make grain visible, e.g. for obtaining exposed aggregate concrete
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- Coating By Spraying Or Casting (AREA)
Abstract
The invention discloses a spray method of a ceramic piece for a dry etching process, which comprises the steps of firstly putting the ceramic piece to be sprayed into a soaking solution for soaking; then, cleaning the ceramic piece by pure water and drying; then, a high-temperature-resistant shielding adhesive tape and a Teflon cap are adopted to shield the ceramic piece, a non-spray surface is shielded, and a spray surface is exposed; carrying out sand blasting treatment on the spray surface, and then carrying out plasma spraying on the spray surface; then removing the high-temperature resistant shielding adhesive tape and the Teflon cap shielded on the ceramic piece, and then carrying out secondary cleaning and drying; finally, the appearance and size of the spray coating was examined. The invention can obtain the spray coating with the required thickness, improves the corrosion resistance of the ceramic piece and prolongs the service life of the ceramic piece.
Description
Technical Field
The invention relates to the technical field of TFT-LCD (thin film transistor liquid crystal display) manufacturing, in particular to a meltallizing method of a ceramic part for a dry etching process.
Background
The Dry Etch (Dry Etch) process among TFT-LCD (thin film transistor liquid crystal display) manufacturing processes refers to a process of removing metal (Mo, Ta, Al, ITO) and insulating film (Si, SiNx) formed on an LCD GLASS substrate (LCD GLASS) by plasma etching inside a vacuum chamber.
As with the upper and lower electrodes, the ceramic pieces mounted around the lower electrode also need to be replaced periodically, which serves to protect the periphery of the lower electrode and prevent plasma from penetrating to the bottom of the lower electrode and forming an arc. At the beginning, pure sintered ceramics are used, the surface is not subjected to any coating treatment, but the surface and the thickness of the ceramic piece are worn and thinned in the using process, and the ceramic piece has to be replaced periodically. However, the length of such ceramic members is usually more than 1 meter, and the thickness thereof is about 5cm, so that the production cost is high, and the frequent replacement also causes a burden on the cost. In order to reduce the cost and prolong the service life of the base material of the ceramic piece, the main solution at present is to additionally perform coating treatment on the surface of the ceramic piece. For such a coating, it is required to have strong corrosion resistance and insulation properties.
The 10.5 generation TFT-LCD is the largest-sized product in the LCD industry at present, and compared with the 8.5, 7, 6 generation products and the like, the ceramic part consumable material used for dry etching is also largest in size.
The large size of dry etching (10.5G) means higher injection energy (RF Power), and a larger amount of corrosive plasma gas is applied, so that the demand for ceramic parts is increasing.
Disclosure of Invention
The invention aims to overcome the defects and shortcomings of the prior art, and provides a spray method of a ceramic part for a dry etching process, which can obtain a spray coating with required thickness so as to improve the corrosion resistance of the ceramic part and prolong the service life of the ceramic part.
In order to achieve the purpose, the invention provides the following technical scheme:
a method for meltallizing a ceramic part for a dry etching process is characterized by comprising the following steps: the method specifically comprises the following steps:
s1, soaking and stripping: soaking the ceramic piece to be subjected to spray in a soaking solution, and removing a coating on the surface of the ceramic piece to be subjected to spray and attachments on the inner wall of an assembly hole on the ceramic piece to be subjected to spray;
s2, primary cleaning and drying: cleaning the ceramic piece to be subjected to spray soaking in the step S1 by using pure water, cleaning residual soaking liquid on the surface of the ceramic piece to be subjected to spray and in the assembly hole, and drying the ceramic piece to be subjected to spray;
s3, shielding: covering and bonding a high-temperature-resistant shielding adhesive tape on the peripheral step surface of the ceramic piece to be subjected to meltallizing after being dried in the step S2, and shielding the peripheral step surface, wherein the exposed surface is a meltallizing surface, and the other parts are non-meltallizing surfaces; meanwhile, a Teflon cap is plugged into the assembly hole on the ceramic piece to be melted and shot after being dried in the step S2, and the assembly hole is shielded;
s4, sand blasting: performing sand blasting treatment on the meltallizing surface of the ceramic piece shielded by the high-temperature-resistant shielding adhesive tape and the Teflon cap in the step S3 to enable the roughness of the meltallizing surface to reach 3-6 microns;
s5, plasma spraying: performing plasma spraying on the meltallizing surface of the ceramic piece subjected to sand blasting in the step S4 to form a meltallizing coating with the thickness of 170-230 microns on the meltallizing surface;
s6, removing shielding: removing the high-temperature resistant masking adhesive tape and the Teflon cap masked on the ceramic piece subjected to the plasma spraying in the step S5;
s7, secondary cleaning and drying: cleaning the surface of the ceramic piece after the shielding is removed in the step S6 by adopting pure water and an ultrasonic cleaning mode, removing the residual dust on the surface of the ceramic piece, and then drying the ceramic piece;
s8, checking: the fired coating on the ceramic piece dried in step S7 is subjected to appearance and dimensional inspection, and a ceramic piece having a fired coating formed on the surface other than the fired surface is finally obtained.
2. The method of claim 1, wherein the ceramic article comprises: in the step S1, the soaking solution is prepared by mixing the following raw materials in parts by mass: potassium hydroxide, deionized water and hydrogen peroxide are 3: 0.5: 0.1.
Further, in the step S1, the soaking time is 15-20 min, and the temperature of the soaking solution is 50-60 ℃.
Further, in step S3, the shape of the teflon cap is the same as the shape of the mounting hole of the ceramic piece to be melted.
Further, in the step S3, the diameter of the teflon cap is 0.1 to 0.2mm smaller than the inner diameter of the assembly hole of the ceramic piece to be melted.
Further, in the step S3, the height of the teflon cap is 0.2 to 0.3mm smaller than the depth of the mounting hole on the ceramic piece to be sprayed.
Further, in the step S4, the sand material used for sand blasting is one of silicon carbide and white corundum, the sand blasting distance of the spray gun used for sand blasting is 200-500 mm, and the pressure of the compressed air is 0.3-0.5 Mpa.
Further, in step S5, Y is selected as the powder used for plasma spraying2O3、Al2O3、YF3And YAG powder, wherein the spray distance of a plasma gun adopted by plasma spraying is 90-150 mm, the swing speed of the plasma gun is 400-2000 mm/s, the powder feeding amount is 10-30 g/min, the plasma voltage is 30-40V, and the plasma current is 700-900A.
Further, in the step S7, the frequency of ultrasonic cleaning is 30-40 KHz, the water temperature is 25-30 ℃, and the cleaning time is 3-4 min.
Compared with the prior art, the invention has the beneficial effects that:
1. compared with the common sand blasting stripping mode, the mode of soaking the ceramic piece to be subjected to the meltallizing in the soaking solution is adopted, and the coating on the ceramic piece can be smoothly removed, and meanwhile, attachments attached to the inner wall of each assembling hole on the ceramic piece can be thoroughly removed.
2. The invention adopts the high-temperature resistant masking tape to mask the peripheral step surfaces of the ceramic part, and adopts the Teflon cap to mask the assembly hole on the ceramic part, thereby effectively protecting the non-spray surface while exposing the spray surface.
3. According to the invention, the roughness of 3-6 μm is formed on the spray surface by adopting a sand blasting mode, so that the adhesive force of the spray coating can be effectively improved.
4. The invention adopts a plasma spraying mode and selects corresponding spray conditions for spray, can form a spray coating with the thickness of 170-230 mu m on the spray surface, can obviously improve the corrosion resistance of the ceramic part, and prolongs the service life of the ceramic part.
5. The method adopts pure water and cleans the surface of the ceramic piece after the shielding is removed in an ultrasonic cleaning mode, can effectively remove the residual dust on the surface of the ceramic piece, and keeps the cleanliness of the ceramic piece.
Drawings
FIG. 1 is a flow chart of the method of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a method for meltallizing a ceramic part for a dry etching process specifically includes the following steps:
s1, soaking and stripping: and (3) soaking the ceramic piece to be subjected to spray in the soaking solution, and removing the coating on the surface of the ceramic piece to be subjected to spray and the attachments on the inner wall of the assembling hole on the ceramic piece to be subjected to spray.
The ceramic piece can be applied to a dry etching process in the manufacturing process of any generation of products in the TFT-LCD of 10.5 generation, 8.5 generation, 7 generation and 6 generation.
Specifically, the conditions for soaking and peeling are as follows:
(1) the soaking solution is prepared by mixing the following raw materials in parts by mass: potassium hydroxide (KOH), deionized water and hydrogen peroxide (H)2O2)＝3∶0.5∶0.1；
(2) The soaking time is 20 min;
(3) the temperature of the soaking solution is 60 ℃.
Therefore, compared with the common mode of stripping by sand blasting, the coating on the ceramic piece can be smoothly removed, and meanwhile, the attachments attached to the inner wall of each assembly hole on the ceramic piece can be thoroughly removed.
S2, primary cleaning and drying: and (5) cleaning the ceramic piece to be subjected to spray soaked in the step (S1) by using pure water, cleaning residual soaking liquid on the surface of the ceramic piece to be subjected to spray and in the assembly hole, and drying the ceramic piece to be subjected to spray.
Therefore, residual soaking liquid on the surface of the ceramic piece to be subjected to melt injection and in the assembling hole can be thoroughly cleaned, reasonable drying degree of the ceramic piece to be subjected to melt injection can be guaranteed, and subsequent processes can be conveniently carried out.
S3, shielding: covering and bonding a high-temperature-resistant shielding adhesive tape on the peripheral step surface of the ceramic piece to be subjected to meltallizing after being dried in the step S2, and shielding the peripheral step surface, wherein the exposed surface is a meltallizing surface, and the other parts are non-meltallizing surfaces; meanwhile, the Teflon cap is plugged into the assembly hole on the ceramic piece to be melted and shot after being dried in the step S2, and the assembly hole is shielded.
Specifically, the shape of the Teflon cap is the same as that of an assembly hole in the ceramic piece to be subjected to meltallizing, the diameter of the Teflon cap is 0.1-0.2 mm smaller than the inner diameter of the assembly hole in the ceramic piece to be subjected to meltallizing, and the height of the Teflon cap is 0.2-0.3 mm smaller than the depth of the assembly hole in the ceramic piece to be subjected to meltallizing.
From this, both made things convenient for and plugged in and follow-up teflon cap of pulling out, can shield the pilot hole again, the effectual pilot hole that has protected can also guarantee can not drop from the pilot hole at the in-process of follow-up sandblast and plasma spraying.
S4, sand blasting: and D, performing sand blasting treatment on the spray surface of the ceramic piece shielded by the high-temperature-resistant shielding adhesive tape and the Teflon cap in the step S3 to enable the roughness of the spray surface to reach 4 microns.
Specifically, the conditions of the sand blasting are as follows:
(1) the sand material is white corundum;
(2) the sand blasting distance of the spray gun, namely the distance between the spray gun and the meltallizing surface is 400 mm;
(3) the pressure of the compressed air was 0.5 MPa.
Therefore, reasonable roughness can be formed on the spray surface, so that the adhesive force of the spray coating can be effectively improved without falling off.
S5, plasma spraying: the thermal spraying surface of the ceramic piece subjected to the sand blasting in step S4 was subjected to plasma spraying, and a thermal spraying coating layer having a thickness of 200 μm was formed on the thermal spraying surface.
Specifically, the plasma spraying conditions are as follows:
(1) the powder is Y2O3；
(2) The meltallizing distance of the plasma gun, namely the distance between the plasma gun and the meltallizing surface is 100 mm;
(3) the swinging speed of the plasma gun is 1800 mm/s;
(4) the powder feeding amount is 30 g/min;
(5) the plasma voltage is 30V;
(6) the plasma current was 900A.
In the process of spraying, attention needs to be paid to the uniformity of powder feeding and the appearance of a sprayed coating so as to ensure that abnormal conditions such as unmelted point, black point, foreign matter and the like do not occur. In addition, the plasma gun should be turned on to cool down the ceramic piece itself during the firing process to prevent the temperature of the ceramic piece itself from being too high.
S6, removing shielding: and (4) removing the high-temperature resistant masking tape and the Teflon cap masked on the ceramic piece after the plasma spraying in the step S5.
Specifically, the high-temperature resistant masking tape masked on the ceramic piece is torn off, and attention needs to be paid so that the part of the junction of the meltallizing coating and the high-temperature resistant masking tape cannot be damaged, so that the integrity of the meltallizing coating is ensured; in addition, the teflon cap in the corresponding assembly hole is pulled out.
S7, secondary cleaning and drying: and cleaning the surface of the ceramic piece after the shielding is removed in the step S6 by adopting pure water and an ultrasonic cleaning mode, removing the residual dust on the surface of the ceramic piece, and drying the ceramic piece.
Specifically, the conditions of secondary cleaning and drying are as follows:
(1) the frequency of ultrasonic cleaning is 40 KHz;
(2) the water temperature is 30 ℃;
(3) and the cleaning time is 3 min.
S8, checking: and (4) performing appearance and dimension inspection on the spray coating on the ceramic piece dried in the step S7 to obtain a spray coating with complete appearance and no unfilled corners, and ensuring that the thickness of the spray coating is 200 μm, thereby finally obtaining the ceramic piece with the spray coating formed on the surface except the spray surface.
Although the present description is described in terms of embodiments, not every embodiment includes only a single embodiment, and such description is for clarity only, and those skilled in the art should be able to integrate the description as a whole, and the embodiments can be appropriately combined to form other embodiments as will be understood by those skilled in the art.
Therefore, the above description is only a preferred embodiment of the present application, and is not intended to limit the scope of the present application; all changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope.
Claims (9)
1. A method for meltallizing a ceramic part for a dry etching process is characterized by comprising the following steps: the method specifically comprises the following steps:
s1, soaking and stripping: soaking the ceramic piece to be subjected to spray in a soaking solution, and removing a coating on the surface of the ceramic piece to be subjected to spray and attachments on the inner wall of an assembly hole on the ceramic piece to be subjected to spray;
s2, primary cleaning and drying: cleaning the ceramic piece to be subjected to spray soaking in the step S1 by using pure water, cleaning residual soaking liquid on the surface of the ceramic piece to be subjected to spray and in the assembly hole, and drying the ceramic piece to be subjected to spray;
s3, shielding: covering and bonding a high-temperature-resistant shielding adhesive tape on the peripheral step surface of the ceramic piece to be subjected to meltallizing after being dried in the step S2, and shielding the peripheral step surface, wherein the exposed surface is a meltallizing surface, and the other parts are non-meltallizing surfaces; meanwhile, a Teflon cap is plugged into the assembly hole on the ceramic piece to be melted and shot after being dried in the step S2, and the assembly hole is shielded;
s4, sand blasting: performing sand blasting treatment on the meltallizing surface of the ceramic piece shielded by the high-temperature-resistant shielding adhesive tape and the Teflon cap in the step S3 to enable the roughness of the meltallizing surface to reach 3-6 microns;
s5, plasma spraying: performing plasma spraying on the meltallizing surface of the ceramic piece subjected to sand blasting in the step S4 to form a meltallizing coating with the thickness of 170-230 microns on the meltallizing surface;
s6, removing shielding: removing the high-temperature resistant masking adhesive tape and the Teflon cap masked on the ceramic piece subjected to the plasma spraying in the step S5;
s7, secondary cleaning and drying: cleaning the surface of the ceramic piece after the shielding is removed in the step S6 by adopting pure water and an ultrasonic cleaning mode, removing the residual dust on the surface of the ceramic piece, and then drying the ceramic piece;
s8, checking: the fired coating on the ceramic piece dried in step S7 is subjected to appearance and dimensional inspection, and a ceramic piece having a fired coating formed on the surface other than the fired surface is finally obtained.
2. The method of claim 1, wherein the ceramic article comprises: in the step S1, the soaking solution is prepared by mixing the following raw materials in parts by mass: potassium hydroxide, deionized water and hydrogen peroxide are 3: 0.5: 0.1.
3. The method of claim 1, wherein the ceramic article comprises: in the step S1, the soaking time is 15-20 min, and the temperature of the soaking solution is 50-60 ℃.
4. The method of claim 1, wherein the ceramic article comprises: in step S3, the shape of the teflon cap is the same as the shape of the mounting hole of the ceramic piece to be fired.
5. The method of claim 1, wherein the ceramic article comprises: in the step S3, the diameter of the Teflon cap is 0.1-0.2 mm smaller than the inner diameter of the assembly hole on the ceramic piece to be subjected to meltallizing.
6. The method of claim 1, wherein the ceramic article comprises: in the step S3, the height of the Teflon cap is 0.2-0.3 mm less than the depth of an assembly hole on the ceramic piece to be subjected to meltallizing.
7. The method of claim 1, wherein the ceramic article comprises: in the step S4, the sand material used for sand blasting is one of silicon carbide and white corundum, the sand blasting distance of the spray gun used for sand blasting is 200-500 mm, and the pressure of the compressed air is 0.3-0.5 Mpa.
8. The method of claim 1, wherein the ceramic article comprises: in step S5, the powder used for plasma spraying is selected from Y2O3、Al2O3、YF3And YAG powder, wherein the spray distance of a plasma gun adopted by plasma spraying is 90-150 mm, the swing speed of the plasma gun is 400-2000 mm/s, the powder feeding amount is 10-30 g/min, the plasma voltage is 30-40V, and the plasma current is 700-900A.
9. The method of claim 1, wherein the ceramic article comprises: in the step S7, the frequency of ultrasonic cleaning is 30-40 KHz, the water temperature is 25-30 ℃, and the cleaning time is 3-4 min.
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| CN117867439A (en) * | 2024-01-25 | 2024-04-12 | 苏州众芯联电子材料有限公司 | Process for manufacturing coating on surface of product |
| CN117961781A (en) * | 2024-03-29 | 2024-05-03 | 佰安氪医疗科技(上海)有限公司 | Surface treatment process based on coating material covering |
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