CN112521134A - 一种带断屑槽的陶瓷刀具及其制备方法 - Google Patents

一种带断屑槽的陶瓷刀具及其制备方法 Download PDF

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CN112521134A
CN112521134A CN202011553124.4A CN202011553124A CN112521134A CN 112521134 A CN112521134 A CN 112521134A CN 202011553124 A CN202011553124 A CN 202011553124A CN 112521134 A CN112521134 A CN 112521134A
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chip breaker
ceramic
width
sintering
chip
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伍尚华
许跃锐
伍海东
林立甫
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Guangdong University of Technology
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Abstract

本发明属于陶瓷材料成型技术领域，尤其涉及一种带断屑槽的陶瓷刀具及其制备方法。本申请提供了一种带断屑槽的陶瓷刀具制备方法，通过光固化制备带断屑槽的陶瓷刀具，断屑槽能降低车削加工时刀具所受的切削力和切削温度，对切屑起到导向和折断作用，使刀具磨损量减小且提高工件的表面加工质量。用于解决现有陶瓷切削刀具使用寿命短、加工质量低的技术问题。

Description

一种带断屑槽的陶瓷刀具及其制备方法
技术领域
本发明属于陶瓷材料成型技术领域，尤其涉及一种带断屑槽的陶瓷刀具及其制备方法。
背景技术
陶瓷材料具有低密度、高硬度、高强度、化学稳定性好和高温性能优良等优点，已被广泛应用于化工、机械、电子、航空航天等领域。目前传统的陶瓷成型工艺(如干压成型、流延成型、热压成型、凝胶注模成型等)，可以成型大部分结构简单的陶瓷产品。但是由于陶瓷材料的韧性低，陶瓷构件的可加工性差，导致常规的陶瓷制造工艺在制造精密型、复杂型的特种陶瓷时，往往需要借助模具，工艺配备复杂、制作时间长、制作成本极高且周期长，这使得它们渐渐无法满足日益增长的特种陶瓷产品研发和市场使用需要，严重阻碍了陶瓷材料在工程领域的推广和应用。
现今传统商用的陶瓷刀具大都是通过热压成型方法来制备的，使用该方法制备的陶瓷刀具无法成型带断屑槽和复杂花纹的刀具，这大大影响了刀具的断屑性能，导致刀具寿命缩短，工件表面的加工质量降低。
发明内容
有鉴于此，本发明提供了一种带断屑槽的陶瓷刀具及其制备方法，用于解决用于解决现有陶瓷切削刀具使用寿命短、加工质量低的技术问题。
本申请第一方面提供了一种氧化锆增韧氧化铝陶瓷切削刀具的制备方法，包括步骤：
步骤1，将陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料；
步骤2，将第一陶瓷浆料进行光固化成型，得到带断屑槽的陶瓷刀具胚体；
步骤3，将所述带断屑槽的陶瓷刀具胚体排胶、烧结，得到所述带断屑槽的陶瓷刀具；
所述断屑槽所述断屑槽宽度为0.5-3mm；
所述断屑槽深度为0.2-1mm；
所述刃口高度为0.01-0.5mm；
所述棱带宽度为0.05-0.6mm。
优选的，所述断屑槽为带直线圆弧形断屑槽，所述断屑槽宽度为2.4mm，深度为0.4mm，刃口高度为0.1mm，棱带宽度为0.2mm。
优选的，所述断屑槽为带直线圆弧形断屑槽，所述断屑槽宽度为1.5mm，深度为0.2mm，刃口高度为0.3mm，棱带宽度为0.15mm。
优选的，所述断屑槽宽度为2.0mm，深度为0.3mm，刃口高度为0.2mm，棱带宽度为0.2mm。
优选的，所述陶瓷粉体为氧化铝、氮化硅、Sialon、氮化硼、TiCN,TiC,TiN,ZrO2,WC中的任意一种或多种。
优选的，所述光敏树脂为乙氧化季戊四醇四丙烯酸酯、环己烷、脂肪族聚氨酯丙烯酸酯、乙酸乙酯、1，6-乙二醇二丙烯酸酯、正辛醇、异丙醇、聚乙二醇和乙酸甲酯中的一种或多种。
优选的，所述光引发剂选自2-羟基-2-甲基-1-苯基-1-丙酮、苯基双(2,4,6-三甲基苯甲酰基)氧化膦、(2,4,6-三甲基苯甲酰基)二苯基氧化膦和2-异丙基硫杂蒽酮中的一种或多种。
优选的，所述光固化具体为在三维绘图软件中设计断屑槽宽度为0.5-3mm，深度为0.2-1mm，刃口高度为0.01-0.5mm，棱带宽度为0.05-0.6mm，然后导出成stl格式文件，将所述第一陶瓷浆料进行光固化成型得到陶瓷刀具坯体。
优选的，所述烧结方法具体为:无压烧结、热压烧结、气压烧结、微波烧结、热等静压烧结中的一种或多种。
本申请第二方面提供了一种带断屑槽的陶瓷刀具。
与现有技术相比，本申请具有以下有益效果。
1、与现有机械加工制备带断屑槽的陶瓷刀具相比，光固化成型可制备带断屑槽和复杂花纹的的陶瓷刀具。
2、本申请通过光固化制备的带断屑槽和复杂花纹的的陶瓷刀具，可提高刀具切削加工时的使用寿命，同时减少了切削加工工件的表面粗糙度，提高了质量。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍。
图1为本申请实施例1制备的带断屑槽的陶瓷刀具尺寸示意图。
具体实施方式
本申请提供了一种带断屑槽的陶瓷刀具及其制备方法，用于解决用于解决现有陶瓷切削刀具使用寿命短、加工质量低的技术问题。
下面将对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
实施例1
本申请实施例1提供了第一种带断屑槽的陶瓷刀具的制备方法，具体包括步骤：
步骤1，将氧化铝陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料；
步骤2，在三维绘图软件中设计断屑槽宽度为2.4mm，深度为0.4mm，刃口高度为0.1mm，棱带宽度为0.2mm，参数示意图如下图1所示，然后导出成stl格式文件，用光固化浆料在光固化设备上成型出氧化铝陶瓷刀具坯体。
步骤3，将氧化铝陶瓷刀具坯体置于脱脂炉中，设置升温程序使其升温至600℃并保温3h脱脂排胶。
步骤4，无压烧结：排胶后的氧化铝陶瓷刀具置于马弗炉中，以10℃/min的速率升温至1600℃并保温2h，随后以3℃/min的速率降温至800℃，得到氧化铝陶瓷样品。
实施例2
本申请实施例2提供了第二种带断屑槽的陶瓷刀具的制备方法，具体包括步骤：
步骤1，将氧化铝陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料；
步骤2，在三维绘图软件中设计断屑槽宽度为1.5mm，深度为0.2mm，刃口高度为0.3mm，棱带宽度为0.15mm，然后导出成stl格式文件，用光固化浆料在光固化设备上成型出氧化铝陶瓷刀具坯体。
步骤3，将氧化铝陶瓷刀具胚体置于脱脂炉中，设置升温程序使其升温至800℃并保温2h脱脂排胶。
步骤4，无压烧结：将脱脂后的氧化铝陶瓷刀具置于马弗炉中，以10℃/min的速率升温至1650℃并保温2h，随后以5℃/min的速率降温至900℃，得到氧化铝陶瓷样品，
实施例3
本申请实施例3提供了第二种带断屑槽的陶瓷刀具的制备方法，具体包括步骤：
步骤1，将氧化铝陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料；
步骤2，在三维绘图软件中设计断屑槽宽度为2mm，深度为0.3mm，刃口高度为0.2mm，棱带宽度为0.2mm，然后导出成stl格式文件，用光固化浆料在光固化设备上成型出氧化铝陶瓷刀具坯体。
步骤3，将氧化铝陶瓷刀具胚体置于脱脂炉中，设置升温程序使其升温至800℃并保温2h脱脂排胶。
步骤4，无压烧结：将脱脂后的氧化铝陶瓷刀具置于马弗炉中，以10℃/min的速率升温至1650℃并保温2h，随后以5℃/min的速率降温至900℃，得到氧化铝陶瓷样品，
实施例4
本申请实施例4提供了第四种带断屑槽的陶瓷刀具的制备方法。
与实施例1、2或3不同的是，本实施例将氧化铝陶瓷刀具胚体置于热等静压烧结炉中，以15℃/min的速率升温至1500℃并通氩气在80MPa的压力下保温2h，随后以10℃/min的速率降温至常温，得到氧化铝陶瓷刀具。
实施例5
本申请实施例5提供了第五种带断屑槽的陶瓷刀具的制备方法。
与实施例1、2、3或4不同的是，本实施例中步骤1为将氮化硅陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料；
实施例6
与实施例1、2、3或4不同的是，本实施例中步骤1为将赛隆(Sialon)陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料。
实施例7
与实施例1、2、3或4不同的是，本实施例中步骤1为将氮化硼陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料。
实施例8
与实施例1、2、3或4不同的是，本实施例中步骤1为将TiCN陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料。
实施例9
与实施例1、2、3或4不同的是，本实施例中步骤1为将TiC陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料。
实施例10
与实施例1、2、3或4不同的是，本实施例中步骤1为将TiN陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料。
实施例11
与实施例1、2、3或4不同的是，本实施例中步骤1为将ZrO2陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料。
实施例11
与实施例1、2、3或4不同的是，本实施例中步骤1为将WC陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料。
实施例12
本申请是对实施例1-11制备的陶瓷刀具进行切削性能测试，其中，实施例1制备的氧化铝陶瓷刀具进行车削45#钢实验，发现其带断屑槽的一面比不带断屑槽一面的寿命高30％，车削工件表面粗糙度降低了22％；实施例2制备的氧化铝陶瓷刀具进行车削40Cr合金钢实验，发现其带断屑槽的一面比不带断屑槽一面的寿命高40％，车削工件表面粗糙度降低了30％；实施例3制备的氧化铝陶瓷刀具进行车削灰铸铁实验，发现其带断屑槽的一面比不带花纹一面的寿命高30％，车削工件表面粗糙度减小了20％。
从实施例1-12可以理解的是，通过光固化可制备带断屑槽的陶瓷刀具，断屑槽能降低车削加工时刀具所受的切削力和切削温度，对切屑起到导向和折断作用，使刀具磨损量减小且提高工件的表面加工质量；且设置合理的断屑槽的断屑槽宽度、断屑槽深度、刃口高度、棱带宽度会大大提高断屑槽的性能，陶瓷刀具断屑槽宽度为1.5mm，深度为0.2mm，刃口高度为0.3mm，棱带宽度为0.15mm时，该陶瓷刀具的使用寿命长、加工质量高。
以上所述仅是本申请的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，如将陶瓷粉体选自其他硬质陶瓷材料以及热压烧结、气压烧结、微波烧结等陶瓷烧结方法烧结刀具胚体，这些改进和润饰也应视为本申请的保护范围。

Claims (10)

1.一种带断屑槽的陶瓷刀具制备方法，其特征在于，包括以下步骤：
步骤1，将陶瓷粉体、光敏树脂、光引发剂球磨混合得到第一陶瓷浆料；
步骤2，将第一陶瓷浆料进行光固化成型，得到带断屑槽的陶瓷刀具胚体；
步骤3，将所述带断屑槽的陶瓷刀具胚体排胶、烧结，得到所述带断屑槽的陶瓷刀具；
所述断屑槽所述断屑槽宽度为0.5-3mm；
所述断屑槽深度为0.2-1mm；
所述刃口高度为0.01-0.5mm；
所述棱带宽度为0.05-0.6mm。
2.根据权利要求1所述的制备方法，其特征在于，所述断屑槽为带直线圆弧形断屑槽，所述断屑槽宽度为2.4mm，深度为0.4mm，刃口高度为0.1mm，棱带宽度为0.2mm。
3.根据权利要求1所述的制备方法，其特征在于，所述断屑槽为带直线圆弧形断屑槽，所述断屑槽宽度为1.5mm，深度为0.2mm，刃口高度为0.3mm，棱带宽度为0.15mm。
4.根据权利要求1所述的制备方法，其特征在于，所述断屑槽宽度为2.0mm，深度为0.3mm，刃口高度为0.2mm，棱带宽度为0.2mm。
5.根据权利要求1所述的制备方法，其特征在于，所述陶瓷粉体为氧化铝、氮化硅、Sialon、氮化硼、TiCN、TiC、TiN,、ZrO2、WC中的任意一种或多种。
6.根据权利要求1所述的制备方法，其特征在于，所述光敏树脂为乙氧化季戊四醇四丙烯酸酯、环己烷、脂肪族聚氨酯丙烯酸酯、乙酸乙酯、1，6-乙二醇二丙烯酸酯、正辛醇、异丙醇、聚乙二醇和乙酸甲酯中的一种或多种。
7.根据权利要求1所述的制备方法，其特征在于，所述光引发剂选自2-羟基-2-甲基-1-苯基-1-丙酮、苯基双(2,4,6-三甲基苯甲酰基)氧化膦、(2,4,6-三甲基苯甲酰基)二苯基氧化膦和2-异丙基硫杂蒽酮中的一种或多种。
8.根据权利要求1所述的制备方法，其特征在于，所述光固化具体为在三维绘图软件中设计断屑槽宽度为0.5-3mm，深度为0.2-1mm，刃口高度为0.01-0.5mm，棱带宽度为0.05-0.6mm，然后导出成stl格式文件，将所述第一陶瓷浆料进行光固化成型得到陶瓷刀具坯体。
9.根据权利要求1所述的制备方法，其特征在于，所述烧结方法为无压烧结、热压烧结、气压烧结、微波烧结或热等静压烧结。
10.一种陶瓷刀具，其特征在于，根据权利要求1-9任一项所述的制备方法制备得到。
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