CN112490225A - Light-emitting device and manufacturing method thereof - Google Patents
Light-emitting device and manufacturing method thereof Download PDFInfo
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- CN112490225A CN112490225A CN202011371302.1A CN202011371302A CN112490225A CN 112490225 A CN112490225 A CN 112490225A CN 202011371302 A CN202011371302 A CN 202011371302A CN 112490225 A CN112490225 A CN 112490225A
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- conversion layer
- emitting device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Microelectronics & Electronic Packaging (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The invention discloses a light-emitting device and a manufacturing method thereof, wherein the light-emitting device comprises a light-emitting element, a substrate, a light conversion layer, a light reflection layer, a light transmission layer and a dam; the upper surface of the base body is provided with at least one groove, the light conversion layer is laid in the groove, and the light-emitting element is embedded in the light conversion layer and fixedly connected with the base body; the box dam is arranged on the upper surface of the light conversion layer, and the inner side and the outer side of the box dam are respectively an inner area and an outer area; the light reflection layer is arranged on the outer zone and covers the upper surface of the light conversion layer; the light transmission layer is disposed in the inner region and covers an upper surface of the light conversion layer. In this illuminator, the size of the box dam that sets up can be adjusted to reach the mesh of controlling the plain noodles size, the size area of recess is greater than the size area of box dam simultaneously, and the light emitting component who locates in the recess like this can not be limited by the restriction of fixed plain noodles size, can set up more quantity light emitting component, thereby satisfies the demand of different plain noodles sizes.
Description
Technical Field
The invention belongs to the technical field of light emitting diodes, and particularly relates to a light emitting device and a manufacturing method thereof.
Background
The high-density integrated package means that a plurality of light-emitting elements are packaged on a substrate with high heat conductivity coefficient and are connected in a series/parallel coexistence mode, heat dissipation is performed through the substrate, and thermal resistance is reduced, so that high-power package, namely COB package, is realized.
Patent CN 204497269U discloses a light emitting device of integrated encapsulation, its light emitting component module is located the bottom of anti-light cup, and it has one deck light transmission layer to cover at the upper surface of light emitting component module, and the upper surface on light transmission layer covers there is the one deck fluorescence piece, and this light emitting device can realize powerful white light and light-emitting homogeneity height, but the size of its play plain noodles is not adjustable, and the light emitting component that can hold is small in quantity, has certain limitation.
Disclosure of Invention
In order to overcome the above disadvantages of the prior art, an object of the present invention is to provide a light emitting device, which aims to solve the problems of the prior art that the size of the light emitting surface is not adjustable and the number of light emitting elements that can be accommodated is small.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a light emitting device includes a light emitting element, a substrate, a light conversion layer, a light reflection layer, a light transmission layer, and a dam;
the upper surface of the base body is provided with at least one groove, the light conversion layer is laid in the groove, and the light emitting element is embedded in the light conversion layer and fixedly connected with the base body;
the enclosure dam is arranged on the upper surface of the light conversion layer, and the inner side and the outer side of the enclosure dam are respectively an inner area and an outer area;
the light reflection layer is arranged on the outer zone and covers the upper surface of the light conversion layer of the outer zone;
the light transmission layer is disposed in the inner region and covers an upper surface of the light conversion layer of the inner region.
Preferably, the shape of the groove comprises one of a circle, a square and a polygon.
Preferably, the light-emitting element includes at least one of a face-up, a flip, and a vertical chip.
Preferably, the light emitting elements are embedded in the grooves in an array manner of series connection or parallel connection or coexistence of series connection and parallel connection.
Preferably, the diameter dimension of the dam is smaller than the diameter dimension or the width dimension of the groove, and the upper surface of the dam is higher than the upper surface of the substrate.
Preferably, the light transmission layer is made of transparent adhesive.
Preferably, an upper surface of the light conversion layer is lower than an upper surface of the base, an upper surface of the light reflection layer and an upper surface of the base are on the same horizontal plane, and an upper surface of the light transmission layer is lower than an upper surface of the dam.
The invention also comprises a manufacturing method of the light-emitting device, which comprises the following steps:
s1: fixing a plurality of light-emitting elements in the grooves of the substrate by taking the upper surface of the substrate as the front surface, wherein the plurality of light-emitting elements are electrically connected through the substrate;
s2: paving a layer of fluorescent glue on the side surface and the upper surface of the light-emitting element to form the light conversion layer;
s3: laying a circle of box dam glue on the upper surface of the light conversion layer by taking the center of the groove as a center to form a box dam, wherein an inner area and an outer area are respectively arranged on the inner side and the outer side of the box dam;
s4: laying a layer of light reflection glue on the outer area to cover the upper surface of the light conversion layer of the outer area to form the light reflection layer;
s5: and paving a layer of transparent adhesive on the inner area to cover the upper surface of the light conversion layer of the inner area to form the light transmission layer.
Preferably, in step S1: the light emitting elements are fixed in the grooves in an array mode of series connection or parallel connection or coexistence of series connection and parallel connection.
Preferably, in step S3: the diameter dimension of the box dam is smaller than the diameter dimension or the width dimension of the groove.
Compared with the prior art, the invention has the beneficial effects that:
according to the light-emitting device and the manufacturing method thereof, the size of the arranged dam can be adjusted, so that the purpose of controlling the size of the light-emitting surface is achieved, meanwhile, the size area of the groove is larger than that of the dam, so that the light-emitting elements arranged in the groove are not limited by the fixed size of the light-emitting surface, a larger number of light-emitting elements can be arranged, and the requirements of different light-emitting surface sizes are met.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a structural sectional view of a light emitting device in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a manufacturing process S1 of the light-emitting device in the embodiment of the invention;
fig. 3 is a schematic structural diagram of a manufacturing process S5 of the light-emitting device in the embodiment of the invention;
fig. 4 is a flowchart of a manufacturing process of a light emitting device in an embodiment of the present invention.
Description of reference numerals:
1-light emitting element, 2-substrate, 3-groove, 4-light conversion layer, 5-light reflection layer, 6-light transmission layer and 7-box dam.
Detailed Description
So that the manner in which the above recited objects, features and advantages of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to the embodiments thereof which are illustrated in the appended drawings. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present invention, and the described embodiments are merely a subset of the embodiments of the present invention, rather than a complete embodiment. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1 to 4, an embodiment of the present invention provides a light emitting device,
the LED light source comprises a light emitting element 1, a substrate 2, a light conversion layer 4, a light reflection layer 5, a light transmission layer 6 and a box dam 7;
a groove 3 is formed in the upper surface of the base body 2, the groove 3 is circular, the light conversion layer 4 is laid in the groove 3, and the light emitting element 1 is embedded in the light conversion layer 4 and fixedly connected with the base body 2;
the dam 7 is arranged on the upper surface of the light conversion layer 4, the shape of the dam 7 is circular, the diameter size of the dam 7 is smaller than that of the groove 3, the upper surface of the dam 7 is higher than that of the substrate 2, and the inner side and the outer side of the dam 7 are respectively an inner area and an outer area;
the light reflection layer 5 is arranged on the outer zone and covers the upper surface of the light conversion layer 4 of the outer zone;
the light transmission layer 6 is provided in the inner region and covers the upper surface of the light conversion layer 4 of the inner region;
the upper surface of the light conversion layer 4 is lower than the upper surface of the substrate 2, the upper surface of the light reflection layer 5 and the upper surface of the substrate 2 are on the same horizontal plane, and the upper surface of the light transmission layer 6 is lower than the upper surface of the dam 7;
the light transmission layer 6 is made of transparent adhesive, the light reflection layer 5 is made of light reflection adhesive, and the light conversion layer 4 is made of fluorescent adhesive. Further, the shape of the groove comprises one of a circle, a square and a polygon, wherein the polygon is a regular polygon and a non-regular polygon. The regular polygon may be a regular triangle, a regular pentagon or a regular hexagon, or even another regular polygon with a larger number of sides. The non-regular polygon may be a regular pentagon, the sides of which are not equal, or a regular hexagon, the sides of which are not equal.
Further, the light-emitting element includes at least one of a face-up, a flip, and a vertical chip. The flip chip does not need a bonding wire, the normally-installed chip and the vertical chip need the bonding wire, and different types of chips can be selected according to different product requirements.
Furthermore, the light-emitting elements are embedded in the grooves in an array mode of series connection or parallel connection or coexistence of series connection and parallel connection.
The invention also discloses a manufacturing method of the light-emitting device, which comprises the following steps:
s1: fixing a plurality of light-emitting elements in the grooves of the substrate by taking the upper surface of the substrate as the front surface, wherein the plurality of light-emitting elements are electrically connected through the substrate;
s2: paving a layer of fluorescent glue on the side surface and the upper surface of the light-emitting element to form the light conversion layer;
s3: laying a circle of box dam glue on the upper surface of the light conversion layer by taking the center of the groove as a center to form a box dam, wherein the inner side and the outer side of the box dam are respectively an inner area and an outer area, and the diameter size of the box dam is smaller than the diameter size or the width size of the groove;
s4: laying a layer of light reflection glue on the outer area to cover the upper surface of the light conversion layer of the outer area to form the light reflection layer;
s5: and paving a layer of transparent adhesive on the inner area to cover the upper surface of the light conversion layer of the inner area to form the light transmission layer.
Further, in step S1: the light emitting elements are fixed in the grooves in an array mode of series connection or parallel connection or coexistence of series connection and parallel connection.
In summary, compared with the prior art, the method has the following advantages:
1. in the invention, light of the light-emitting element is converted by the light conversion layer, the outer area of the dam is provided with the light emitting layer, most of the light-emitting element paved below the light emitting layer is reflected for many times and is refracted and emitted from the light transmission layer above the light conversion layer, most of the light-emitting element paved inside the dam is directly refracted and emitted from the light transmission layer after being converted by the light conversion layer, so that the size of the light-emitting surface is not limited by the area of the arrangement area of the light-emitting element, and a smaller light-emitting surface can accommodate more chips; meanwhile, the light emitting elements paved below the light emitting layer emit light through emission and refraction, and the light emitting brightness is improved.
2. In the invention, the size of the arranged dam can be adjusted, thereby achieving the purpose of controlling the size of the light emitting surface.
3. In the invention, the size area of the groove is larger than that of the box dam, so that the light-emitting elements arranged in the groove are not limited by the size of the fixed light-emitting surface, and more light-emitting elements can be arranged, thereby meeting the requirements of different light-emitting surface sizes.
4. In the invention, the light conversion layer in the light emitting device is protected by the light transmission layer, so that the light emitting device can work in a more severe environment.
5. In the manufacturing method of the invention, enough light-emitting elements can be preset, and then the box dams with different sizes are paved according to the use conditions, so that the process smoothness is ensured without increasing the process complexity.
It should be noted that other contents of the light emitting device and the manufacturing method disclosed in the present invention can be referred to in the prior art, and are not described herein again.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, so that any modification, equivalent change and modification made to the above embodiment according to the technical spirit of the present invention are within the scope of the technical solution of the present invention.
Claims (10)
1. A light-emitting device is characterized by comprising a light-emitting element, a substrate, a light conversion layer, a light reflection layer, a light transmission layer and a dam;
the upper surface of the base body is provided with at least one groove, the light conversion layer is laid in the groove, and the light emitting element is embedded in the light conversion layer and fixedly connected with the base body;
the enclosure dam is arranged on the upper surface of the light conversion layer, and the inner side and the outer side of the enclosure dam are respectively an inner area and an outer area;
the light reflection layer is arranged on the outer zone and covers the upper surface of the light conversion layer of the outer zone;
the light transmission layer is disposed in the inner region and covers an upper surface of the light conversion layer of the inner region.
2. The light-emitting device according to claim 1, wherein the shape of the groove comprises one of a circle, a square, and a polygon.
3. The light-emitting device according to claim 1, wherein the light-emitting element comprises at least one of a face-up, a flip, and a vertical chip.
4. The light-emitting device according to claim 1, wherein the light-emitting elements are embedded in the grooves in an array that is connected in series or in parallel or in both series and parallel.
5. The light-emitting device according to claim 1, wherein a diameter dimension of the dam is smaller than a diameter dimension or a width dimension of the groove, and an upper surface of the dam is higher than an upper surface of the base.
6. The light-emitting device according to claim 1, wherein the light-transmitting layer is made of a transparent adhesive.
7. The light-emitting device according to claim 1, wherein an upper surface of the light conversion layer is lower than an upper surface of the base, an upper surface of the light reflection layer and an upper surface of the base are on the same horizontal plane, and an upper surface of the light transmission layer is lower than an upper surface of the dam.
8. A method of manufacturing a light emitting device according to claim 1, comprising the steps of:
s1: fixing a plurality of light-emitting elements in the grooves of the substrate by taking the upper surface of the substrate as the front surface, wherein the plurality of light-emitting elements are electrically connected through the substrate;
s2: paving a layer of fluorescent glue on the side surface and the upper surface of the light-emitting element to form the light conversion layer;
s3: laying a circle of box dam glue on the upper surface of the light conversion layer by taking the center of the groove as a center to form a box dam, wherein an inner area and an outer area are respectively arranged on the inner side and the outer side of the box dam;
s4: laying a layer of light reflection glue on the outer area to cover the upper surface of the light conversion layer of the outer area to form the light reflection layer;
s5: and paving a layer of transparent adhesive on the inner area to cover the upper surface of the light conversion layer of the inner area to form the light transmission layer.
9. The method for manufacturing a light-emitting device according to claim 8, wherein in step S1: the light emitting elements are fixed in the grooves in an array mode of series connection or parallel connection or coexistence of series connection and parallel connection.
10. The method for manufacturing a light-emitting device according to claim 8, wherein in step S3: the diameter dimension of the box dam is smaller than the diameter dimension or the width dimension of the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011371302.1A CN112490225A (en) | 2020-11-30 | 2020-11-30 | Light-emitting device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011371302.1A CN112490225A (en) | 2020-11-30 | 2020-11-30 | Light-emitting device and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112490225A true CN112490225A (en) | 2021-03-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011371302.1A Pending CN112490225A (en) | 2020-11-30 | 2020-11-30 | Light-emitting device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112490225A (en) |
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2020
- 2020-11-30 CN CN202011371302.1A patent/CN112490225A/en active Pending
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