CN112433586A - Semi-isolation ITX case based on porous ventilation frame and heat dissipation method thereof - Google Patents
Semi-isolation ITX case based on porous ventilation frame and heat dissipation method thereof Download PDFInfo
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- CN112433586A CN112433586A CN202011469912.5A CN202011469912A CN112433586A CN 112433586 A CN112433586 A CN 112433586A CN 202011469912 A CN202011469912 A CN 202011469912A CN 112433586 A CN112433586 A CN 112433586A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 39
- 238000009423 ventilation Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 9
- 238000002955 isolation Methods 0.000 title abstract description 7
- 238000005192 partition Methods 0.000 claims abstract description 16
- 230000001174 ascending effect Effects 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000010960 cold rolled steel Substances 0.000 claims description 3
- 241001233242 Lontra Species 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000009411 base construction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a semi-isolated ITX case based on a porous ventilation frame and a heat dissipation method thereof, and the semi-isolated ITX case comprises a case body, and an ITX main board, a CPU fan, a display card and a display card fan which are arranged in the case body, wherein the left side and the right side of the case body are provided with porous side panels, the top of the case body is provided with a top porous screen plate, a partition plate which divides the internal space of the case into a left heat dissipation area and a right heat dissipation area is arranged in the case body, the ITX main board and the CPU fan are arranged in the heat dissipation area on one side of the case body, and the display card fan. The semi-isolation ITX case based on the porous ventilation frame is reasonable in layout, the partition plate isolates the main heating modules in the case, heat superposition generated by the heating modules during heat dissipation is avoided, positive circulation of cold air suction and hot air discharge is realized, the heat dissipation capacity of the case is greatly enhanced, and the ITX case can be compatible with more high-power display cards and CPUs, so that the performance is improved, and the configuration cost is reduced.
Description
Technical Field
The invention relates to a semi-isolated ITX case based on a porous ventilation frame, which enables the ITX case to be compatible with more high-power display cards and CPUs.
Background
Because the Mini ITX case mainboard version is compact and the internal hardware functional modules are closely interconnected, the running performance, particularly the indexes such as over-frequency and memory delay, and the like are obviously superior to other classes of mainboards. However, the box space is compact, and the heat dissipation performance is obviously limited, so that a display card and a CPU with higher power cannot be installed generally.
On the other hand, if a high-power graphics card and a CPU are installed according to actual performance requirements, the height of the ITX case is obviously increased compared with that of a conventional middle tower and a conventional whole tower on the premise of ensuring the heat dissipation requirement of the inner hardware functional module, and the price of the whole machine is also high.
Disclosure of Invention
In view of this, the present invention provides a semi-isolated ITX chassis based on a porous ventilation frame and a heat dissipation method thereof, which are reasonable in layout and good in heat dissipation effect, so that the ITX chassis can be compatible with more high-power graphics cards and CPUs.
The invention is realized by adopting the following scheme: the utility model provides a semi-isolation ITX machine case based on porous ventilation frame, includes quick-witted case body and the ITX mainboard, CPU fan, display card and the display card fan of dress in quick-witted case body, quick-witted case body left and right both sides are provided with porous side board, and quick-witted case body top is provided with the porous otter board in top, and this internal baffle that becomes two left and right radiating areas with quick-witted incasement space separation of being provided with of machine case, ITX mainboard and CPU fan dress are in the radiating area of one side wherein, and display card fan dress are in the radiating area of opposite side.
Furthermore, the front end and the rear end of the partition board are respectively connected to the front side board and the rear side board of the case body through screws, and a hollow window is formed in the rear part of the partition board corresponding to the ITX main board.
Furthermore, a supporting bottom plate is arranged at the bottom of the case body, radiating holes are distributed in the supporting bottom plate, a plurality of guide rail long holes which are longitudinally arranged at intervals are respectively formed in the positions, close to the edges, of the left side and the right side of the supporting bottom plate, and the length directions of the guide rail long holes are longitudinally parallel to the supporting plate body.
Furthermore, the center distance between the long guide rail holes on the left side and the right side is 105mm, and the width of the long guide rail holes is 5 mm.
Further, the porous side panel is made of aluminum alloy; the top porous net plate, the partition plate and the supporting bottom plate are all made of STCC cold-rolled steel plates.
The other technical scheme of the invention is as follows: a heat dissipation method of a semi-isolation ITX case based on a porous ventilation frame is characterized in that airflow is sucked into a heat dissipation area where an ITX main board and a CPU fan are located through a porous side panel on the same side by the CPU fan, the temperature of the heat dissipation area is raised after the airflow participates in CPU heat dissipation to form updraft, and hot air overflows from meshes of a porous panel on the top of the upper portion; the display card and the display card fan are arranged in the side heat dissipation area, the display card fan is used for sucking air flow through the porous side panel on the same side, the air flow participates in heat dissipation of the display card and then is heated to form ascending air flow, and hot air overflows from meshes overflowing from the porous panel on the top of the upper portion.
Compared with the prior art, the invention has the following beneficial effects: the semi-isolation ITX case based on the porous ventilation frame is reasonable in layout, the partition plate isolates the main heating modules in the case, heat superposition generated by the heating modules during heat dissipation is avoided, positive circulation of cold air suction and hot air discharge is realized, the heat dissipation capacity of the case is greatly enhanced, and the ITX case can be compatible with more high-power display cards and CPUs, so that the performance is improved, and the configuration cost is reduced.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to specific embodiments and accompanying drawings.
Drawings
FIG. 1 is a perspective view of an ITX cabinet according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of the internal structure of an ITX cabinet according to an embodiment of the present invention;
FIG. 3 is a schematic view of a support base construction in an embodiment of the invention;
the reference numbers in the figures illustrate: 100-case body, 110-porous side panel, 120-top porous screen plate, 130-partition plate, 131-hollowed window, 140-supporting bottom plate, 141-radiating hole, 142-guide rail slot hole and 200-2.5 inch hard disk bracket.
Detailed Description
As shown in fig. 1 to 3, a semi-isolated ITX chassis based on a porous ventilation frame comprises a chassis body 100, and an ITX main board, a CPU fan, a graphics card and a graphics card fan (not shown in the figure) mounted in the chassis body, wherein porous side panels 110 are arranged on the left and right sides of the chassis body 100, a top porous screen 120 is arranged on the top of the chassis body, a partition 130 for dividing the internal space of the chassis into a left heat dissipation area and a right heat dissipation area is arranged in the chassis body, the ITX main board and the CPU fan are mounted in the heat dissipation area on one side of the ITX main board, and the graphics card fan are mounted in the heat dissipation area on the other; according to the ITX case, the porous side panel 110 and the top porous screen plate 120 are fixed together from top to bottom through the compression screws positioned at four corners of the case to form a porous ventilation frame structure, so that heat inside the case is radiated outwards, and the rapid discharge of hot air is accelerated, the heat radiation modes of the two heat radiation areas are that external cold air is sucked from the porous side panel 110, and then the hot air is discharged from the top porous screen plate 120, so that the positive circulation of cold air suction and hot air discharge is realized; the main heating module of baffle in with quick-witted case keeps apart, is about to keep apart CPU and display card and dispel the heat separately, avoids the module that generates heat to produce the heat stack when dispelling the heat, has strengthened the heat-sinking capability of quick-witted case greatly, makes ITX machine case can compatible more high power display cards and CPU to improve the performance, reduce the configuration cost.
In this embodiment, the front end and the rear end of the partition 130 are respectively connected to the front side plate and the rear side plate of the case body through screws, the rear portion of the partition is provided with a hollow window 131 corresponding to the ITX main board, the hollow window 131 gives way for the side part of the main board, and the part on the main board is prevented from touching the partition, so that the internal structure of the case is more compact.
In this embodiment, the bottom of the chassis body is provided with a supporting bottom plate 140, heat dissipation holes 141 are distributed on the supporting bottom plate 140, a plurality of guide rail long holes 142 arranged at intervals along the longitudinal direction are respectively arranged at the positions close to the edges of the left and right sides of the supporting bottom plate, the length direction of the guide rail long holes is longitudinally parallel to the supporting plate body, wherein the transverse direction is the left and right direction of the chassis, and the longitudinal direction is the front and back direction of the chassis; the support bottom plate is provided with heat dissipation holes, so that heat dissipation inside the case is effectively enhanced, and the guide rail slot holes can be flexibly butted with a 120mm case fan and a 2.5-inch hard disk support according to requirements; the arrangement of the space between the long holes of the guide rails on the two sides of the supporting bottom plate is matched with the center distance of the screw holes of widely used 120mm case fans and 2.5-inch hard disk supports, and the supporting bottom plate can be directly connected with and flexibly select a fixed position; the user can expand the case according to actual demand, supports case fan, hard disk extension, realizes the performance promotion.
In the embodiment, the center distance between the long guide rail holes on the left side and the right side is 105mm, and the width of the long guide rail holes is 5 mm.
In this embodiment, the porous side panel is made of aluminum alloy and is perforated by a high-speed perforating machine; the top porous screen plate, the partition plate and the support bottom plate are all made of STCC cold-rolled steel plates, and the top porous screen plate is punched by a punch press to form a porous net structure, so that hot air in the case can be conveniently discharged; the partition plate and the supporting bottom plate are processed into a required structure by using a punch press;
a heat dissipation method of a semi-isolation ITX case based on a porous ventilation frame is characterized in that airflow is sucked into a heat dissipation area where an ITX main board and a CPU fan are located through a porous side panel on the same side by the CPU fan, the temperature of the heat dissipation area is raised after the airflow participates in CPU heat dissipation to form updraft, and hot air overflows from meshes of a porous panel on the top of the upper portion; the display card and the display card fan are arranged in the side heat dissipation area, the display card fan is used for sucking air flow through the porous side panel on the same side, the air flow participates in heat dissipation of the display card and then is heated to form ascending air flow, and hot air overflows from meshes overflowing from the porous panel on the top of the upper portion; two heat dissipation areas are cold air from the side and are inhaled, and hot-air is discharged from the top, realizes cold air inhalation and hot-air discharging positive cycle, and the heat of two heat dissipation areas can not scurry the stack each other, independently dispel the heat, has strengthened the heat-sinking capability of quick-witted case greatly, makes ITX machine case can compatible more high power display cards and CPU to improve the performance, reduce the configuration cost.
Any embodiment disclosed herein above is meant to disclose, unless otherwise indicated, all numerical ranges disclosed as being preferred, and any person skilled in the art would understand that: the preferred ranges are merely those values which are obvious or representative of the technical effect which can be achieved. Since the numerical values are too numerous to be exhaustive, some of the numerical values are disclosed in the present invention to illustrate the technical solutions of the present invention, and the above-mentioned numerical values should not be construed as limiting the scope of the present invention.
If the invention discloses or relates to parts or structures which are fixedly connected to each other, the fixedly connected parts can be understood as follows, unless otherwise stated: a detachable fixed connection (for example using bolts or screws) is also understood as: non-detachable fixed connections (e.g. riveting, welding), but of course, fixed connections to each other may also be replaced by one-piece structures (e.g. manufactured integrally using a casting process) (unless it is obviously impossible to use an integral forming process).
In addition, terms used in any technical solutions disclosed in the present invention to indicate positional relationships or shapes include approximate, similar or approximate states or shapes unless otherwise stated.
Any part provided by the invention can be assembled by a plurality of independent components or can be manufactured by an integral forming process.
Finally, it should be noted that the above examples are only used to illustrate the technical solutions of the present invention and not to limit the same; although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art will understand that: modifications to the specific embodiments of the invention or equivalent substitutions for parts of the technical features may be made; without departing from the spirit of the present invention, it is intended to cover all aspects of the invention as defined by the appended claims.
Claims (6)
1. A semi-isolated ITX chassis based on a porous ventilation frame, characterized in that: including quick-witted case body and the ITX mainboard of dress in quick-witted case body, CPU fan, display card and display card fan, machine case body left and right both sides are provided with porous side board, and machine case body top is provided with the porous otter board in top, and this internal baffle that is provided with the internal space separation of quick-witted case into two left and right radiating areas that is provided with of machine case, ITX mainboard and CPU fan dress are in the radiating area of one side wherein, and display card fan dress are in the radiating area of opposite side.
2. The porous vent frame-based semi-insulating ITX chassis of claim 1, wherein: the front end and the rear end of the partition plate are respectively connected to the front side plate and the rear side plate of the case body through screws, and the rear part of the partition plate is provided with a hollowed window corresponding to the position of the ITX main plate.
3. The porous vent frame-based semi-insulating ITX chassis of claim 1, wherein: the bottom of the case body is provided with a supporting bottom plate, radiating holes are distributed in the supporting bottom plate, a plurality of guide rail long holes which are longitudinally arranged at intervals are respectively arranged at the positions, close to the edges, of the left side and the right side of the supporting bottom plate, and the length directions of the guide rail long holes are longitudinally parallel to the supporting plate body.
4. The porous vent frame-based semi-insulating ITX chassis of claim 3, wherein: the center distance of the long guide rail holes on the left side and the right side is 105mm, and the width of the long guide rail holes is 5 mm.
5. The porous vent frame-based semi-insulating ITX chassis of claim 3, wherein: the porous side panel is made of aluminum alloy; the top porous net plate, the partition plate and the supporting bottom plate are all made of STCC cold-rolled steel plates.
6. A method of dissipating heat from a porous ventilated frame based semi-isolated ITX chassis of claim 1, wherein: the ITX mainboard and the side heat dissipation area where the CPU fan is located utilize the CPU fan to suck airflow through the porous side panel on the same side, participate in the CPU heat dissipation and then heat up to form ascending airflow, and hot air overflows from meshes overflowing from the porous panel on the top of the ITX mainboard and the CPU fan; the display card and the display card fan are arranged in the side heat dissipation area, the display card fan is used for sucking air flow through the porous side panel on the same side, the air flow participates in heat dissipation of the display card and then is heated to form ascending air flow, and hot air overflows from meshes overflowing from the porous panel on the top of the upper portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011469912.5A CN112433586A (en) | 2020-12-15 | 2020-12-15 | Semi-isolation ITX case based on porous ventilation frame and heat dissipation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011469912.5A CN112433586A (en) | 2020-12-15 | 2020-12-15 | Semi-isolation ITX case based on porous ventilation frame and heat dissipation method thereof |
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| CN112433586A true CN112433586A (en) | 2021-03-02 |
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| CN202011469912.5A Pending CN112433586A (en) | 2020-12-15 | 2020-12-15 | Semi-isolation ITX case based on porous ventilation frame and heat dissipation method thereof |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2754144Y (en) * | 2004-12-10 | 2006-01-25 | 浪潮电子信息产业股份有限公司 | Isolating structure of computer casing |
| CN202975951U (en) * | 2012-11-13 | 2013-06-05 | 成都阿普奇自动化技术有限公司 | Industrial personal computer chassis |
| CN204595723U (en) * | 2015-04-16 | 2015-08-26 | 刘传磊 | A kind of Small Computer Case |
| CN105892598A (en) * | 2016-04-22 | 2016-08-24 | 嘉兴澎湃网络科技有限公司 | Integrated computer case structure |
| CN109613961A (en) * | 2018-11-20 | 2019-04-12 | 赖成凤 | A kind of computer host box convenient for radiating dustproof |
| CN209486587U (en) * | 2019-04-15 | 2019-10-11 | 彭俊杰 | A kind of ITX computer housing |
| CN210515174U (en) * | 2019-11-29 | 2020-05-12 | 广州台鼎科技有限公司 | Computer case adopting partitioned heat dissipation |
| CN211906154U (en) * | 2020-04-03 | 2020-11-10 | 彭俊杰 | ITX computer case |
-
2020
- 2020-12-15 CN CN202011469912.5A patent/CN112433586A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2754144Y (en) * | 2004-12-10 | 2006-01-25 | 浪潮电子信息产业股份有限公司 | Isolating structure of computer casing |
| CN202975951U (en) * | 2012-11-13 | 2013-06-05 | 成都阿普奇自动化技术有限公司 | Industrial personal computer chassis |
| CN204595723U (en) * | 2015-04-16 | 2015-08-26 | 刘传磊 | A kind of Small Computer Case |
| CN105892598A (en) * | 2016-04-22 | 2016-08-24 | 嘉兴澎湃网络科技有限公司 | Integrated computer case structure |
| CN109613961A (en) * | 2018-11-20 | 2019-04-12 | 赖成凤 | A kind of computer host box convenient for radiating dustproof |
| CN209486587U (en) * | 2019-04-15 | 2019-10-11 | 彭俊杰 | A kind of ITX computer housing |
| CN210515174U (en) * | 2019-11-29 | 2020-05-12 | 广州台鼎科技有限公司 | Computer case adopting partitioned heat dissipation |
| CN211906154U (en) * | 2020-04-03 | 2020-11-10 | 彭俊杰 | ITX computer case |
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