CN216700765U - Air-cooled case - Google Patents
Air-cooled case Download PDFInfo
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- CN216700765U CN216700765U CN202122956043.5U CN202122956043U CN216700765U CN 216700765 U CN216700765 U CN 216700765U CN 202122956043 U CN202122956043 U CN 202122956043U CN 216700765 U CN216700765 U CN 216700765U
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- heat dissipation
- air
- heat
- assembly
- cabinet according
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
An air-cooled chassis comprising: the box includes two relative lateral walls, is equipped with a heat abstractor in every lateral wall, and every heat abstractor includes: a support frame disposed inside the sidewall; the first heat dissipation assembly is arranged on the outer side of the supporting frame; the second heat dissipation assembly is arranged on the inner side of the support frame; the baffle is arranged on the outer side of the first heat dissipation assembly and connected to the inner side of the side wall; and two fan assemblies respectively arranged at two ends of the first heat dissipation assembly in the longitudinal direction and mounted on the front wall and the rear wall of the box body, wherein the front wall and the rear wall are perpendicular to the side walls. According to the air-cooled case, the heat dissipation assembly, the fan assembly and the baffle are arranged, the heat generated when the circuit board runs is guided out by the heat dissipation assembly, the heat is concentrated by matching with the baffle, and the heat is quickly guided out of the case by the fan assembly.
Description
Technical Field
At least one embodiment of the present invention relates to a heat dissipation device, and more particularly, to an air-cooled chassis suitable for dissipating heat from electronic equipment.
Background
Along with the requirements of miniaturization and light weight of electronic equipment are stricter and stricter, the power of an information processing case is larger and larger, and a heat dissipation device of a traditional case cannot meet the heat dissipation requirement. The conventional heat dissipation mode is heat dissipation in a mode of directly blowing a circuit board by a small fan, but the mode cannot achieve the obvious cooling effect on a high-power circuit board or a processor working for a long time with high strength; meanwhile, the case is also provided with a larger ventilation opening, so that the electromagnetic shielding performance of the case is also reduced.
SUMMERY OF THE UTILITY MODEL
Accordingly, the present invention is directed to an air-cooled enclosure that at least partially solves at least one of the above and other problems.
According to an embodiment of an aspect of the present invention, there is provided an air-cooled cabinet including:
the box includes two relative lateral walls, is equipped with a heat abstractor in every lateral wall, and every heat abstractor includes:
a support frame disposed inside the side wall;
the first heat dissipation assembly is arranged on the outer side of the supporting frame; the second heat radiation component is arranged at the inner side of the support frame;
a baffle plate arranged outside the first heat radiation component and connected to the inner side of the side wall; and
and two fan assemblies respectively arranged at two ends of the first heat dissipation assembly in the longitudinal direction and mounted on the front wall and the rear wall of the box body, wherein the front wall and the rear wall are perpendicular to the side walls.
According to the embodiment of the utility model, two ends of the baffle are respectively provided with a bending connecting part, and the two bending connecting parts are respectively fixed on the inner sides of the front wall and the rear wall.
According to an embodiment of the present invention, the first heat dissipation assembly includes a plurality of heat dissipation fins extending in the longitudinal direction and arranged in parallel, and the two fan assemblies are respectively disposed at two ends of the heat dissipation fins to discharge heat of the heat dissipation fins out of the box body.
According to an embodiment of the present invention, both ends of each of the support frames in the longitudinal direction abut against the inside of the front wall and the rear wall, respectively.
According to the embodiment of the utility model, a plurality of card slots for supporting the circuit board are arranged on the inner side of the supporting frame.
According to an embodiment of the present invention, the supporting frame is provided with a threaded hole for installing the feedthrough capacitor.
According to the embodiment of the utility model, the supporting frame, the upper outer edge and the lower edge of the front wall and the rear wall are provided with grooves, and the grooves are internally provided with electromagnetic shielding strips.
According to an embodiment of the utility model, each of said side walls is provided with a guide rail on the outside.
According to an embodiment of the present invention, each of the support frames is provided at an inner side thereof with at least one mounting groove, and at least one partition plate is mounted in the opposite mounting grooves of the two support frames to partition the interior of the support frames into at least two spaces.
According to an embodiment of the utility model, each of the front wall panels has a handle, and the two handles are respectively disposed on the outer sides of the fan assembly of the front wall.
According to the air-cooled case provided by the embodiment of the utility model, the heat dissipation assembly, the fan assembly and the baffle are arranged, the heat dissipation assembly guides out heat generated during the operation of the circuit board, the heat is concentrated by matching with the baffle, and the heat is quickly guided out of the case by the fan assembly.
Drawings
Fig. 1 is a perspective view of an air-cooled cabinet according to an embodiment of the present invention;
FIG. 2 is a perspective view of a support frame according to one embodiment of the present invention, viewed from the inside of a cabinet;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is a perspective view of a fan assembly according to one embodiment of the present invention;
FIG. 5 is a schematic perspective view of a baffle according to one embodiment of the utility model.
Description of the reference numerals
1: a side wall;
2: a second heat dissipation assembly;
3: a guide rail;
4: a baffle plate;
5: a first heat dissipation assembly;
51: heat dissipation fins;
7: a support frame;
8: a card slot;
9: a groove;
10: bending the connecting part;
11: a fan assembly;
12: a threaded hole;
13: a partition plate;
14: a handle.
Detailed Description
In order that the objects, technical solutions and advantages of the present invention will become more apparent, the present invention will be further described in detail with reference to the accompanying drawings in conjunction with the following specific embodiments.
Furthermore, in the following detailed description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the utility model. It may be evident, however, that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in schematic form in order to simplify the drawing.
According to the general inventive concept of an aspect of the present invention, there is provided an air-cooled cabinet, including: the box includes two relative lateral walls, is equipped with a heat abstractor in every lateral wall, and every heat abstractor includes: a support frame disposed inside the side wall; the first heat dissipation assembly is arranged on the outer side of the support frame; the second heat radiation component is arranged at the inner side of the support frame; a baffle plate arranged outside the first heat radiation component and connected to the inner side of the side wall; and two fan assemblies respectively arranged at two ends of the first heat dissipation assembly in the longitudinal direction and mounted on the front wall and the rear wall of the box body, wherein the front wall and the rear wall are perpendicular to the side walls.
Fig. 1 is a perspective view of an air-cooled cabinet according to an embodiment of the present invention;
the utility model provides an air-cooled chassis, as shown in fig. 1, comprising: the box includes two relative lateral walls 1, is equipped with a heat abstractor in every lateral wall, and every heat abstractor includes: a support frame 7 provided inside the side wall 1; a first heat sink 5 and a second heat sink 2, wherein the first heat sink 5 is mounted on the outer side of the support frame 7; the second heat sink assembly 2 is mounted inside the support frame 7; a baffle 4 disposed outside the first heat sink 5 and connected to the inside of the sidewall 1; and two fan units 11 respectively disposed at both ends of the first heat dissipating unit 5 in the longitudinal direction and mounted on front and rear walls of the case perpendicular to the side walls 1.
According to the air-cooled case provided by the embodiment of the utility model, the heat dissipation assembly, the fan assembly and the baffle are arranged, the heat dissipation assembly guides out heat generated during the operation of the circuit board, the heat is concentrated by matching with the baffle, and the heat is quickly guided out of the case by the fan assembly.
FIG. 5 is a schematic perspective view of a baffle according to one embodiment of the utility model.
In an embodiment of the present invention, as shown in fig. 1 and 5, the baffle 4 has a bent connecting portion 10 at each end, and the two bent connecting portions 10 are respectively fixed at the inner sides of the front wall and the rear wall perpendicular to the side walls. The provision of the bent connecting portion 10 makes the middle portion of the baffle plate form a raised shape, which compresses the space between the baffle plate 4, each heat dissipating module, and the front and rear walls, so that heat is concentrated on the heat dissipating fins 51 of each heat dissipating module.
FIG. 2 is a perspective view of a support frame according to one embodiment of the present invention, viewed from the inside of a cabinet;
fig. 4 is a perspective view of a fan assembly according to an embodiment of the present invention.
In an embodiment of the present invention, as shown in fig. 2 and 4, the first heat dissipation assembly 5 includes a plurality of heat dissipation fins 51 extending along the longitudinal direction and arranged in parallel, and two fan assemblies 11 are respectively arranged at two ends of the heat dissipation fins 51 to discharge heat of the heat dissipation fins 51 out of the box. The first heat dissipation assembly 5 is matched with the baffle 4 to transfer and concentrate heat generated by the circuit board on the heat dissipation fins 51, a plurality of adjacent heat dissipation fins 51 form a plurality of heat dissipation passages, and the heat is discharged out of the case through the fan assembly 11, so that quick heat dissipation of the case is realized.
In one embodiment of the present invention, as shown in fig. 1, two ends of each of the supporting frames 7 in the longitudinal direction respectively abut against the inner sides of the front wall and the rear wall, so as to facilitate the internal airtight connection.
In an embodiment of the present invention, as shown in fig. 2, the inner side of the supporting frame 7 is provided with a plurality of slots for supporting the circuit board, so as to fix the circuit board and transmit heat generated by the circuit board to the first heat dissipation assembly 5.
In one embodiment of the present invention, as shown in fig. 2, the supporting frame 7 is provided with a threaded hole 12 for installing a feedthrough capacitor, the feedthrough capacitor has an outer glass insulating layer and an inner sealing layer, and is provided with an electrical conduction wire. The arrangement of the feedthrough capacitor not only can supply power to the fan assembly 11, but also can further meet the performance of electromagnetic shielding.
Fig. 3 is an enlarged schematic view of a portion a in fig. 2.
In an embodiment of the present invention, as shown in fig. 2 and 3, the supporting frame 7, the upper outer edges and the lower edges of the front wall and the rear wall are provided with grooves 9, and the grooves 9 are provided with electromagnetic shielding strips. The groove 9 is arranged, and the electromagnetic shielding strip is arranged, so that a closed space can be formed inside the case, and the case has good electromagnetic shielding performance.
In an embodiment of the present invention, as shown in fig. 1, a guide rail 3 is disposed on an outer side of each of the sidewalls, and the guide rail 3 is combined with a matching guide rail on a mounting bracket for mounting the air-cooled chassis, so as to realize drawer-type movement of the air-cooled chassis relative to the mounting bracket, thereby facilitating mounting of the air-cooled chassis on the mounting bracket.
In one embodiment of the present invention, as shown in fig. 1, at least one mounting groove is provided on the inner side of each of the support frames 7, at least one partition plate 13 is mounted in the opposite mounting grooves of the two support frames to partition the interior of the support frames into at least two spaces, a circuit board or a processor can be placed in each space, and the arrangement of the partition plate 13 can be adjusted according to the number and size of the circuit boards.
In one embodiment of the utility model, as shown in fig. 1, the front wall panels each have a handle 14, and the two handles 14 are respectively disposed on the outer sides of the fan assembly 11 of the front wall. The handle 14 can be matched with the guide rail 3, so that the air-cooled case is convenient to install and remove.
According to the air-cooled case of the embodiment of the utility model, on one hand, aiming at the heat dissipation problem of the case, the heat dissipation assembly, the fan assembly and the baffle are arranged, the heat dissipation assembly guides out heat generated during the operation of the circuit board, the heat is concentrated on the heat dissipation fins by matching with the baffle, and the heat is quickly guided out of the case through the fan assembly; in addition, the heat dissipation assembly, the fan assembly and the baffle can be made of metal materials, so that the filling area of poor heat dissipation conductors (air) is reduced, and a good heat dissipation effect is achieved. On the other hand, to the problem that electromagnetic shield performance reduces, all be equipped with the recess on braced frame, antetheca and the upside outer fringe and the downside edge of back wall respectively, be equipped with the electromagnetic shield strip in the recess for quick-witted incasement portion forms a confined space, has promoted electromagnetic shield's performance.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An air-cooled cabinet, comprising:
the box includes two relative lateral walls (1), is equipped with a heat abstractor in every lateral wall, and every heat abstractor includes:
a support frame (7) arranged inside the side wall (1);
a first heat sink assembly (5) and a second heat sink assembly (2), the first heat sink assembly (5) being mounted outside the support frame (7); the second heat dissipation assembly (2) is mounted on the inner side of the support frame (7);
the baffle (4) is arranged outside the first heat dissipation assembly (5) and connected to the inner side of the side wall; and
and the two fan assemblies (11) are respectively arranged at two ends of the first heat dissipation assembly (5) in the longitudinal direction and are arranged on the front wall and the rear wall of the box body, which are vertical to the side wall (1).
2. The air-cooled cabinet according to claim 1, characterized in that the baffle (4) has a bent connecting portion (10) at each end, and the two bent connecting portions are fixed at the inner sides of the front wall and the rear wall respectively.
3. The air-cooled cabinet according to claim 1, wherein the first heat dissipation assembly (5) comprises a plurality of heat dissipation fins (51) extending along the longitudinal direction and arranged in parallel, and two fan assemblies (11) are respectively arranged at two ends of the heat dissipation fins (51) to discharge heat of the heat dissipation fins (51) out of the cabinet.
4. An air-cooled cabinet according to claim 1, characterized in that both ends of each of the support frames (7) in the longitudinal direction abut against the inner sides of the front and rear walls, respectively.
5. An air-cooled cabinet according to any one of claims 1-4, characterized in that the inside of the support frame (7) is provided with a plurality of card slots (8) for supporting circuit boards.
6. An air-cooled cabinet according to any one of claims 1-4, characterized in that the support frame (7) is provided with threaded holes (12) for mounting feedthrough capacitors.
7. An air-cooled cabinet according to any one of claims 1-4, characterized in that the supporting frame, the front and rear walls are provided with grooves (9) on their upper and lower outer edges, and that electromagnetic shielding strips are provided in the grooves.
8. An air-cooled cabinet according to any one of claims 1-4, characterized in that a guide rail (3) is provided outside each of the side walls.
9. An air-cooled cabinet according to any one of claims 1-4, characterized in that the inner side of each support frame (7) is provided with at least one mounting slot, and at least one partition plate (13) is mounted in the opposite mounting slots of the two support frames to divide the interior of the support frames into at least two spaces.
10. An air-cooled cabinet according to any one of claims 1-4, characterized in that the front walls each have a handle (14), and that the two handles (14) are arranged outside the fan assembly (11) of the front walls.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122956043.5U CN216700765U (en) | 2021-11-29 | 2021-11-29 | Air-cooled case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122956043.5U CN216700765U (en) | 2021-11-29 | 2021-11-29 | Air-cooled case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216700765U true CN216700765U (en) | 2022-06-07 |
Family
ID=81835294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122956043.5U Active CN216700765U (en) | 2021-11-29 | 2021-11-29 | Air-cooled case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216700765U (en) |
-
2021
- 2021-11-29 CN CN202122956043.5U patent/CN216700765U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |