CN221352033U - Chassis, quantum computing measurement and control system and quantum computer - Google Patents
Chassis, quantum computing measurement and control system and quantum computer Download PDFInfo
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- CN221352033U CN221352033U CN202323261725.XU CN202323261725U CN221352033U CN 221352033 U CN221352033 U CN 221352033U CN 202323261725 U CN202323261725 U CN 202323261725U CN 221352033 U CN221352033 U CN 221352033U
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- 238000005259 measurement Methods 0.000 title claims abstract description 22
- 238000001816 cooling Methods 0.000 claims abstract description 9
- 238000004891 communication Methods 0.000 claims abstract description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 22
- 230000000694 effects Effects 0.000 abstract description 15
- 230000009286 beneficial effect Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses a chassis, a quantum computing measurement and control system and a quantum computer, wherein the chassis is used for integrating a plurality of functional board cards and comprises: the top plate, the bottom plate and the side plates are enclosed to form an accommodating space communicated with the outside, and the accommodating space is used for accommodating a plurality of functional board cards; the plurality of side plates comprise first side plates which are oppositely arranged at the communication positions of the accommodating space and the outside, and the first side plates are provided with cooling fans. The heat dissipation fan is arranged on the first side plate which is opposite to the communication part between the accommodating space and the outside, so that air can smoothly flow, the heat dissipation effect is further improved, and the case can meet the heat dissipation requirement when the functional board card works.
Description
Technical Field
The utility model relates to the technical field of quantum computers, in particular to a chassis, a quantum computing measurement and control system and a quantum computer.
Background
The quantum chip is a core component for running quantum computing, and a multi-bit quantum bit is integrated on the quantum chip, so that a special quantum computing measurement and control system is required to be built in order to ensure the normal work of the quantum bit. The quantum computing measurement and control system comprises a plurality of signal source modules, such as a direct current signal source module, a pulse signal source module, a microwave signal source module, a signal acquisition module, a signal processing module and the like. Each signal source module is integrated on a plurality of functional board cards respectively, and the functional board cards are integrated in the case.
The signal source module integrated on each functional board typically includes various integrated elements, such as signal conversion elements, signal processing elements, etc., for generating, transmitting, or processing various driving signals for driving the quantum chip, and control elements for controlling the operation of the signal conversion elements, the signal processing elements, etc. The working frequency of the quantum chip is relatively high, and the frequencies of the driving signals are also relatively high, so that the heat productivity of the functional board card is large when the functional board card works, and the existing chassis is difficult to meet the heat dissipation requirement.
Therefore, a case with good heat dissipation effect is needed to meet the heat dissipation requirement of the functional board card during operation.
It should be noted that the information disclosed in the background section of the present application is only for enhancement of understanding of the general background of the present application and should not be taken as an admission or any form of suggestion that this information forms the prior art already known to those skilled in the art.
Disclosure of utility model
The utility model aims at: the chassis, the quantum computing measurement and control system and the quantum computer with good heat dissipation effect are provided.
In order to achieve the above object, the present utility model provides the following technical solutions:
The first aspect of the present utility model provides a chassis for integrating a plurality of function boards, the chassis comprising: the top plate, the bottom plate and the side plates are enclosed to form an accommodating space communicated with the outside, and the accommodating space is used for accommodating a plurality of functional board cards; the plurality of side plates comprise first side plates which are oppositely arranged at the communication positions of the accommodating space and the outside, and the first side plates are provided with cooling fans.
The chassis further comprises a plurality of first grooves formed in the outer side face of the top plate; or, the outer side surface of the bottom plate is provided with a plurality of second grooves.
The chassis further comprises two supporting side plates arranged between the top plate and the bottom plate, the two supporting side plates are arranged in parallel and opposite to each other, a plurality of limiting grooves matched with the thickness of the functional board card are formed in the supporting side plates, and each limiting groove is used for supporting one end of each functional board card.
The chassis further comprises an inner supporting plate, a second side plate and a cover plate; wherein the inner support plate is parallel to the second side plate and is positioned on the inner side of the second side plate; the cover plate is covered on the end surfaces of the second side plate and the inner support plate, which are far away from the first side plate; the limiting grooves are formed in the inner side face of the inner supporting plate.
The case as described above, further, the second side plate is provided with an air inlet.
The chassis further comprises a plurality of radiating fins arranged in an array on the outer side face of the inner supporting plate.
The chassis further comprises a plurality of third grooves formed in the outer side face of the second side plate; or, one surface of the cover plate, which is far away from the second side plate, is provided with a plurality of fourth grooves.
The chassis further comprises a third groove with a long strip shape, and the groove length direction of the third groove is parallel to the groove length direction of the limiting groove.
The second aspect of the utility model provides a quantum computing measurement and control system, which comprises the chassis and a functional board card positioned in the chassis.
The third aspect of the utility model provides a quantum computer, which comprises the quantum computing measurement and control system and a quantum chip, wherein the quantum chip works based on a driving signal output by the quantum computing measurement and control system.
The utility model has the beneficial effects that:
According to the application, the radiating fan is arranged to play a role in radiating, and meanwhile, the radiating fan is arranged on the first side plate which is arranged opposite to the communication part between the accommodating space and the outside, so that air can flow smoothly, the radiating effect is further improved, and the case can meet the radiating requirement of the functional board card during working.
The quantum computing measurement and control system and the quantum computer provided by the utility model comprise the chassis, so that the quantum computing measurement and control system and the quantum computer have the same beneficial effects and are not repeated here.
Drawings
Fig. 1 is a schematic perspective view of a chassis according to an embodiment of the present utility model;
FIG. 2 is a rear view of a chassis provided by an embodiment of the present utility model;
FIG. 3 is a schematic view of an inner support plate according to an embodiment of the present utility model;
fig. 4 is a schematic structural view of a second side plate according to an embodiment of the present utility model;
In the reference numerals: 10. a top plate; 11. a first groove; 20. a bottom plate; 30. a first side plate; 40. a heat radiation fan; 50. a second side plate; 51. a third groove; 52. an air inlet; 60. an inner support plate; 61. a limit groove; 62. a heat sink; 70. a cover plate; 71. a fourth groove; 80. a support pad; 90. a handle.
Detailed Description
In order to make the technical solution of the present application better understood by those skilled in the art, the technical solution of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
In the description of the present utility model, it should be understood that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", etc., are based on the directions or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
Fig. 1 is a schematic perspective view of a chassis according to an embodiment of the present utility model; FIG. 2 is a rear view of a chassis provided by an embodiment of the present utility model; as shown in fig. 1 and 2: the embodiment of the utility model discloses a case for integrating a plurality of functional board cards, which comprises: the top plate 10, the bottom plate 20 and a plurality of side plates are enclosed to form an accommodating space communicated with the outside, and the accommodating space is used for accommodating a plurality of functional board cards; the plurality of side plates comprise first side plates 30 which are oppositely arranged at the communication positions of the accommodating space and the outside, and the first side plates 30 are provided with cooling fans 40.
Through the arrangement of the cooling fan 40, the cooling effect is achieved, meanwhile, the cooling fan 40 is arranged on the first side plate 30 which is opposite to the communication position of the accommodating space and the outside, so that air can flow smoothly, the cooling effect is further improved, and the case can meet the cooling requirement of the functional board card during operation.
The size of the accommodating space in the present application is specifically determined according to the size and number of the functional boards, and the specific sizes of the top plate 10, the bottom plate 20 and the plurality of side plates are specifically determined according to the size of the accommodating space, which is not specifically limited in the present application. The case is exemplified by a top plate 10, a bottom plate 20 and a plurality of side plates enclosing a cuboid with an opening on the side surface, and the top plate 10, the bottom plate 20 and the plurality of side plates are fixed by screws to realize detachable connection. In some embodiments of the present application, the case is made of an aluminum alloy material, and in other embodiments, the case may be made of other metal materials, which is not particularly limited herein.
Continuing as shown in fig. 2: in some implementations of the embodiments of the present utility model, the heat dissipation fans 40 are provided in a plurality and are arranged in an array on the first side plate 30. By providing a plurality of heat radiation fans 40, the heat radiation effect is improved. Illustratively, 6 heat dissipating fans 40 are provided, and the heat dissipating fans 40 are arranged in an array on the first side plate 30 in a specific arrangement: the heat radiation fans 40 are arranged on the first side plate 30 in 3 rows and 2 columns.
Continuing as shown in fig. 1: in some implementations of the embodiment of the present utility model, the outer side surface of the top plate 10 is provided with a plurality of first grooves 11; or, the outer side surface of the bottom plate 20 is provided with a plurality of second grooves.
The heat dissipation area is increased by arranging a plurality of first grooves 11 on the outer side surface of the top plate 10, so that the heat dissipation effect is enhanced; illustratively, the first grooves 11 are elongated, and a plurality of the first grooves are uniformly spaced along the length direction and/or the width direction of the top plate 10; preferably, in order to further improve the heat dissipation effect, the first groove 11 is specifically provided as follows: the first grooves 11 are elongated grooves having a groove length direction parallel to the groove length direction of the stopper groove 61, and are uniformly arranged at intervals along the width direction of the top plate 10.
The heat dissipation area is increased by forming a plurality of second grooves on the outer side surface of the bottom plate 20, so that the heat dissipation effect is enhanced; illustratively, the second grooves are elongated and are uniformly spaced apart along the length and/or width of the bottom plate 20. Preferably, in order to further improve the heat dissipation effect, the second groove is specifically provided as follows: the second grooves are elongated grooves having a groove length direction parallel to the groove length direction of the stopper groove 61, and are uniformly arranged at intervals along the width direction of the bottom plate 20.
Continuing as shown in fig. 1: in some implementations of the embodiments of the present utility model, the plurality of side plates further includes two supporting side plates disposed between the top plate 10 and the bottom plate 20, the two supporting side plates are disposed in parallel and opposite to each other, and a plurality of limiting grooves 61 matched with the thickness of the functional board card are disposed on the supporting side plates, and each of the limiting grooves 61 is used for supporting one end of each of the functional board cards.
Through setting up the support curb plate, the spacing groove 61 on the support curb plate is used for supporting the both ends of function integrated circuit board, and the installation and the dismantlement of function integrated circuit board of being convenient for simultaneously, owing to be equipped with a plurality of spacing groove 61 on the support curb plate for a plurality of function integrated circuit board can be integrated to the quick-witted case.
Continuing as shown in fig. 1: in some implementations of the present embodiments, both of the support side plates include an inner support plate 60, a second side plate 50, and a cover plate 70;
Wherein the inner support plate 60 is parallel to the second side plate 50 and is located inside the second side plate 50; the cover plate 70 is covered on the end surfaces of the second side plate 50 and the inner support plate 60, which are far away from the first side plate 30; the plurality of limiting grooves 61 are disposed on the inner side surface of the inner support plate 60.
The supporting side plate is provided with the inner supporting plate 60, the second side plate 50 and the cover plate 70, so that the strength of the supporting side plate is ensured, the inner supporting plate 60 is ensured not to deform in the process of inserting and extracting the functional board, and the difficulty of inserting and extracting the functional board is reduced.
Specifically, the inner support plate 60, the second side plate 50 and the cover plate 70 of the support side plates are mounted as follows:
The second side plate 50 is mounted as follows: the upper end surface of the second side plate 50 is fixed on the top plate 10 by a screw, the lower end surface of the second side plate 50 is fixed on the bottom plate 20 by a screw, the rear end surface of the side plate is fixed on the first side plate 30 by a screw, and the front end surface of the second side plate 50 is fixed on the cover plate 70 by a screw.
The inner support plate 60 is mounted as follows: the upper end surface of the inner support plate 60 is fixed to the top plate 10 by screws, and the lower end surface of the inner support plate 60 is fixed to the bottom plate 20 by screws. The front end surface of the inner support plate 60 is fixed to the cover plate 70 by screws.
The cover plate 70 is mounted as follows: the upper end surface of the cover plate 70 is fixed on the top plate 10 by a screw, the lower end surface of the cover plate 70 is fixed on the bottom plate 20 by a screw, the left end surface of the cover plate 70 is fixed on the second side plate 50 by a screw, and the right end surface of the cover plate 70 is fixed on the inner support plate 60 by a screw.
Of course, the above screw fixing manner may be changed to a welding manner according to the specific installation convenience.
Fig. 3 is a schematic structural view of an inner support plate 60 according to an embodiment of the present utility model; further, as shown in fig. 1 and 3: in some implementations of the present embodiment, the limiting groove 61 is specifically disposed as follows: the limiting grooves 61 are uniformly and alternately arranged along the height direction of the inner support plate 60, and in actual arrangement, the limiting grooves 61 can be directly formed on the inner support plate 60, or a plurality of limiting plates can be vertically and alternately arranged on the inner support plate 60, and one limiting groove 61 is formed between two adjacent limiting plates.
As further shown in fig. 3, in some implementations of the present application, the outer side of the inner support plate 60 is provided with a plurality of fins 62 arranged in an array.
By providing the heat sink 62, the heat dissipation effect is further enhanced. Specifically, the heat sink 62 is an elongated thermally conductive metal strip, and the cross-section of the heat sink 62 includes, but is not limited to, rectangular and S-shaped. Illustratively, the heat sink 62 is a heat conductive metal strip with a rectangular cross section, and the length direction of the heat sink 62 is parallel to the slot length direction of the limit slot 61, and a plurality of heat sinks are arranged in an array along the height direction of the inner support plate 60.
Fig. 4 is a schematic structural diagram of a second side plate 50 according to an embodiment of the present utility model; as shown in fig. 4: in some embodiments of the present utility model, the second side plate 50 is provided with an air inlet 52.
By arranging the air inlet 52 on the second side plate 50, convection is formed, so that the ventilation capacity in the case is increased, and the overall heat dissipation performance is improved. In addition, the air inlet 52 is arranged on the second side plate 50 instead of the inner support plate 60, and the shielding and dust-proof effects are improved.
Specifically, the air inlet 52 may be arranged in two ways, the first way is as follows: a plurality of air inlets 52 can be directly formed on the second side plate 50; secondly, a mounting opening is formed in the second side plate 50, a plurality of air inlets 52 are formed in the air inlet plate, and then the air inlet plate is detachably mounted at the mounting opening of the second side plate 50 through screws; thus, the cleaning and maintenance are convenient, the performance of the equipment is improved, and the service life of the equipment is prolonged.
Further, continuing as shown in fig. 1: in some implementations of the embodiment of the present application, the outer side surfaces of the second side plates 50 are provided with a plurality of third grooves 51; or, a surface of the cover plate 70 away from the second side plate 50 is provided with a plurality of fourth grooves 71.
The heat dissipation area is increased by forming a plurality of third grooves 51 on the outer side surface of the second side plate 50, so that the heat dissipation effect is enhanced; illustratively, the third grooves 51 are elongated, and a plurality of the third grooves are uniformly spaced along the length direction and/or the width direction of the second side plate 50. Preferably, in order to further improve the heat dissipation effect, the third groove 51 is specifically provided as follows: the third grooves 51 are elongated grooves having a groove length direction parallel to the groove length direction of the stopper groove 61, and are uniformly arranged at intervals along the height direction of the second side plate 50.
The heat dissipation area is increased by forming a plurality of fourth grooves 71 on the surface of the cover plate 70 away from the second side plate 50, so as to enhance the heat dissipation effect; illustratively, the fourth grooves 71 are elongated, and a plurality of the fourth grooves are uniformly spaced along the length direction and/or the width direction of the cover plate 70.
Further, in some implementations of the embodiments of the present application, a plurality of support pads 80 are disposed on the bottom plate 20, and the support pads 80 are disposed around the bottom plate 20, so that a space is left between the bottom plate 20 and the placement plane when the chassis is placed, thereby facilitating heat dissipation. Illustratively, one support pad 80 is disposed around each periphery of the base plate 20, and a total of 4 support pads 80 are disposed.
Further, in some implementations of the present application, a handle 90 is provided on the second side panel 50 to facilitate transporting the chassis from one location to another.
Based on the same application conception, the embodiment of the application also provides a quantum computing measurement and control system which comprises the chassis and a functional board card positioned in the chassis. The quantum computing measurement and control system comprises the box body, so that the quantum computing measurement and control system has the same beneficial effects as the box body, and is not repeated here.
Based on the same application conception, the embodiment of the application also provides a quantum computer which comprises the quantum computing measurement and control system and a quantum chip, wherein the quantum chip works based on a driving signal output by the quantum computing measurement and control system. The quantum computer provided by the application comprises the quantum computing measurement and control system, so that the quantum computer has the same beneficial effects as the quantum computing measurement and control system, and the detailed description is omitted.
In the description of the present specification, reference to the term "some embodiments" or "examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments. Further, one skilled in the art can engage and combine the different embodiments or examples described in this specification.
The foregoing is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Any person skilled in the art will make any equivalent substitution or modification to the technical solution and technical content disclosed in the utility model without departing from the scope of the technical solution of the utility model, and the technical solution of the utility model is not departing from the scope of the utility model.
Claims (10)
1. A chassis for integrating a plurality of functional boards, the chassis comprising: the top plate, the bottom plate and the side plates are enclosed to form an accommodating space communicated with the outside, and the accommodating space is used for accommodating a plurality of functional board cards;
The plurality of side plates comprise first side plates which are oppositely arranged at the communication positions of the accommodating space and the outside, and the first side plates are provided with cooling fans.
2. The cabinet of claim 1, wherein the top panel has a plurality of first grooves on an outer side thereof;
or, the outer side surface of the bottom plate is provided with a plurality of second grooves.
3. The chassis of claim 1, wherein the plurality of side plates further comprises two supporting side plates disposed between the top plate and the bottom plate, the two supporting side plates are disposed in parallel and opposite to each other, and the supporting side plates are provided with a plurality of limiting grooves matched with the thickness of each functional board card, and each limiting groove is used for supporting one end of each functional board card.
4. A cabinet according to claim 3, wherein both of the support side plates comprise an inner support plate, a second side plate and a cover plate;
Wherein the inner support plate is parallel to the second side plate and is positioned on the inner side of the second side plate; the cover plate is covered on the end surfaces of the second side plate and the inner support plate, which are far away from the first side plate; the limiting grooves are formed in the inner side face of the inner supporting plate.
5. The cabinet of claim 4, wherein the second side panel has an air inlet.
6. The cabinet of claim 4, wherein the outer side of the inner support plate is provided with a plurality of heat sinks arranged in an array.
7. The cabinet of claim 4, wherein the outer side surface of the second side plate is provided with a plurality of third grooves;
Or, one surface of the cover plate, which is far away from the second side plate, is provided with a plurality of fourth grooves.
8. The cabinet of claim 7, wherein the third groove is elongated, and a groove length direction of the third groove is parallel to a groove length direction of the limiting groove.
9. A quantum computing measurement and control system, comprising the chassis of any one of claims 1-8, and a functional board card located within the chassis.
10. A quantum computer comprising the quantum computing measurement and control system of claim 9, and a quantum chip that operates based on a drive signal output by the quantum computing measurement and control system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323261725.XU CN221352033U (en) | 2023-11-28 | 2023-11-28 | Chassis, quantum computing measurement and control system and quantum computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323261725.XU CN221352033U (en) | 2023-11-28 | 2023-11-28 | Chassis, quantum computing measurement and control system and quantum computer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221352033U true CN221352033U (en) | 2024-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323261725.XU Active CN221352033U (en) | 2023-11-28 | 2023-11-28 | Chassis, quantum computing measurement and control system and quantum computer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221352033U (en) |
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2023
- 2023-11-28 CN CN202323261725.XU patent/CN221352033U/en active Active
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