CN112420557A - Row-connected type reciprocating turnover double-station combined IC card packaging robot assembly line - Google Patents

Row-connected type reciprocating turnover double-station combined IC card packaging robot assembly line Download PDF

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Publication number
CN112420557A
CN112420557A CN202011226686.8A CN202011226686A CN112420557A CN 112420557 A CN112420557 A CN 112420557A CN 202011226686 A CN202011226686 A CN 202011226686A CN 112420557 A CN112420557 A CN 112420557A
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CN
China
Prior art keywords
card
turnover
packaging
fixed
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN202011226686.8A
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Chinese (zh)
Inventor
张霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Manwen Intelligent Equipment Co ltd
Original Assignee
Ningbo Manwen Intelligent Equipment Co ltd
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Publication date
Application filed by Ningbo Manwen Intelligent Equipment Co ltd filed Critical Ningbo Manwen Intelligent Equipment Co ltd
Priority to CN202011226686.8A priority Critical patent/CN112420557A/en
Publication of CN112420557A publication Critical patent/CN112420557A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Abstract

The invention discloses a row-type double-station combined IC card packaging robot assembly line capable of realizing reciprocating turnover, which comprises a rack table, a conveying device, a collecting chute and a plurality of packaging robot units, wherein the conveying device is arranged on the rack table, the collecting chute and the packaging robot units are arranged on the rack table at intervals, the packaging robot units are distributed on two sides of the conveying device in two rows, the conveying device is used for conveying IC cards packaged by the packaging robot units, and the collecting chute is fixed at one end part of the conveying device; the packaging robot unit comprises a supporting seat, two turnover supporting frames which are arranged on the supporting seat in a bilateral symmetry manner, a top plate, a packaging assembly, a turnover mechanism and a card vacuum carrier arranged on the turnover mechanism, wherein two ends of the top plate are fixedly connected to the top ends of the two turnover supporting frames; the invention forms a reciprocating cycle packaging mode, has more compact structure, reduces the space occupation volume of the whole structure, shortens the circulation path of the IC card driven by the card vacuum carrier, realizes mechanical operation, forms synchronous batch type flow line production and greatly improves the production efficiency.

Description

Row-connected type reciprocating turnover double-station combined IC card packaging robot assembly line
Technical Field
The invention relates to a row-type reciprocating turnover double-station combined IC card packaging robot assembly line.
Background
In the production and processing of IC cards, packaging of IC cards is an important step, and existing IC cards generally include an IC chip and an IC card base.
The existing IC card packaging equipment mostly adopts rotary circulation type multi-station flow process, and has the problems of low integration level, large equipment occupation space and long flow path.
Disclosure of Invention
The invention aims to overcome the defects and provide a row-type reciprocating turnover double-station combined IC card packaging robot assembly line.
In order to achieve the purpose, the invention adopts the following specific scheme:
the utility model provides a row formula of ally oneself with reciprocal two station combination IC-card packaging robot assembly line that overturns, includes the rack platform, locates conveyor on the rack platform and collects the chute to and a plurality of interval sets up the encapsulation robot cell on the rack platform, and is a plurality of encapsulation robot cell is two rows of both sides of distributing at conveyor, conveyor is used for carrying the IC-card of accomplishing via the encapsulation of encapsulation robot cell, collect the chute and fix the one end tip at conveyor.
The packaging robot unit comprises a supporting seat, two turnover supporting frames which are arranged on the supporting seat in a bilateral symmetry mode, a top plate, a packaging assembly, a turnover mechanism and a card vacuum carrier, wherein the two ends of the top plate are fixedly connected to the top ends of the two turnover supporting frames;
the packaging assembly comprises a card placing mechanism, a glue injection mechanism, a chip placing mechanism, a hot pressing mechanism and a cold pressing mechanism, wherein the card placing mechanism, the glue injection mechanism, the chip placing mechanism and the hot pressing mechanism are respectively arranged on the top plate, and the cold pressing mechanism is correspondingly arranged on the supporting seat;
tilting mechanism includes upset driving motor, roll-over table, screw rod, spiral guide cylinder and slide bar, upset driving motor fixes on being located the roll-over support frame on the left side, the left end of screw rod is rotated through the nut and is connected on being located the roll-over support frame on the left side, the nut is connected with the transmission of upset driving motor, the left side at the roll-over table is fixed to the right-hand member of screw rod, the spiral guide cylinder is fixed on being located the roll-over support frame on the right, be equipped with upset direction track on the spiral guide cylinder, the right side at the roll-over table is fixed to the left end of slide bar, the right-hand member activity of slide bar stretches into in the spiral guide cylinder, the slide bar is equipped with movable card and goes into the.
The number of the packaging assemblies is two, the two groups of packaging assemblies are arranged in a central symmetry manner, and card vacuum carriers are respectively arranged on the top surface and the bottom surface of the overturning platform; the cold pressing mechanism is characterized by further comprising a discharge chute, wherein the discharge chute is fixed on the supporting seat, and a through hole matched with the cold pressing mechanism is correspondingly formed in the discharge chute.
The turnover guide rail comprises two turnover guide grooves arranged in parallel, each turnover guide groove comprises two translation sections and a spiral turnover section, the two ends of each spiral turnover section correspond to the two translation sections respectively and are connected with the two translation sections, and the two ends of each turnover pin correspond to the two movable embedding parts respectively and are arranged in the two turnover guide grooves.
The card vacuum carrier is provided with a card containing groove, the front end and the rear end of the card vacuum carrier are respectively provided with a movable permanent magnet, the card placing mechanism comprises a card trough and a card distributing seat, the card trough is fixed on the card distributing seat, the front end and the rear end of the card distributing seat are respectively provided with a plurality of elastic clamping components at equal intervals, each elastic clamping component comprises a pressing claw, a pressing spring and a fixed permanent magnet, the pressing claw is movably clamped in the card distributing seat, one end of the pressing claw penetrates out of the card distributing seat, the pressing spring is movably sleeved on the pressing claw, two ends of the pressing spring are respectively abutted against the pressing claw and the card distributing seat, the fixed permanent magnet is fixed on one end of the pressing claw, and the fixed permanent magnet and the movable permanent magnet are opposite in polarity.
The chip placing mechanism comprises a chip placing seat, a chip trough and a piezoelectric altitude mixture control piece, wherein the piezoelectric altitude mixture control piece is fixed on the top plate, the chip trough penetrates through the top plate in a movable mode and is fixedly connected with the piezoelectric altitude mixture control piece, the chip placing seat is fixedly connected to the lower end of the chip trough, and two piezoelectric micro-motion pieces used for clamping and loosening the IC chip are oppositely arranged in the chip placing seat.
The invention has the beneficial effects that: according to the invention, the screw rod and the slide rod are respectively arranged on the two sides of the overturning platform, and the overturning pin of the slide rod is matched with the overturning guide track of the spiral guide cylinder, so that the card vacuum carrier realizes horizontal reciprocating motion and overturning motion under the drive of the same motor, the traditional card annular circulation type packaging mode is changed into a reciprocating circulation type packaging mode, the structure is more compact, the space occupation volume of the whole structure is reduced, and meanwhile, the circulation path of the card vacuum carrier driving the IC card is shortened.
According to the invention, the packaging robot units are distributed on two sides of the conveying device in two rows, and are mechanically operated, so that synchronous batch type flow line production is formed, and the production efficiency is greatly improved.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of another aspect of the present invention;
FIG. 3 is a perspective view of the packaging robot unit of the present invention;
FIG. 4 is a perspective view of the turnover mechanism of the present invention engaged with a card vacuum carrier;
FIG. 5 is a perspective view of the spiral guide cylinder of the present invention;
FIG. 6 is a cross-sectional view of the card vacuum carrier of the present invention;
FIG. 7 is a top view of the card placement mechanism of the present invention;
FIG. 8 is a cross-sectional view of the card placement mechanism of the present invention;
FIG. 9 is an enlarged schematic view of a portion of the structure at I in FIG. 8;
FIG. 10 is a cross-sectional view of the chip placement mechanism of the present invention;
description of reference numerals: frame stand-a 1; the conveying device-a 2; collection chute-a 3; encapsulating robot cell-a 4;
a support seat-1; turning over the support frame-2; a top plate-3; a card placement mechanism-41; a card slot-411; a card dispensing receptacle-412; an elastic clamping member-413; compacting jaws-4131; a hold-down spring-4132; a fixed permanent magnet-4133; a glue injection mechanism-42; chip placement mechanism-43; chip holder-431; chip trough-432; a piezoelectric height adjusting sheet-433; piezoelectric micromotion pieces-434; a hot-pressing mechanism-44; cold pressing mechanism-45; a turnover driving motor-51; a flipping table-52; screw-53; a spiral guide cylinder-54; turning over the guide groove-541; a slide bar-55; a roll-over pin-551; a nut-56; a card vacuum carrier-6; a card receiving slot-61; a moving permanent magnet-62; a carrier bottom frame-63; carrier upper frame-64; a discharge chute-7.
Detailed Description
The invention will be described in further detail with reference to the following figures and specific examples, without limiting the scope of the invention.
As shown in fig. 1 to 10, the assembly line of the IC card packaging robot with the coupled row type reciprocating and reversing dual-station combination according to the present embodiment includes a frame a1, a conveying device a2 and a collecting chute a3 disposed on the frame, and a plurality of packaging robot units a4 disposed on the frame a1 at intervals, wherein the packaging robot units a4 are distributed in two rows on two sides of the conveying device a2, the conveying device a2 is configured to convey IC cards packaged by the packaging robot units a4, and the collecting chute a3 is fixed at an end of the conveying device a 2.
When the packaging robot unit works, the packaging robot units a4 perform IC card packaging at the same time, the packaged IC cards are transferred to the conveying device a2, then the conveying device a2 conveys the packaged IC cards to the collecting chute a3, and the IC cards packaged by the packaging robot units a4 are uniformly collected and transferred by the collecting chute a3, so that mechanical operation is realized, synchronous batch type flow line production is formed, and the production efficiency is greatly improved.
Based on the above embodiment, further, the packaging robot unit a4 includes a supporting base 1, two turning supports 2 symmetrically arranged on the supporting base 1, a top plate 3 with two ends fixedly connected to the top ends of the two turning supports 2, a packaging component, a turning unit, and a card vacuum carrier 6 arranged on the turning unit;
the packaging assembly comprises a card placing unit 41, a glue injection unit 42, a chip placing unit 43, a hot pressing unit 44 and a cold pressing unit 45, wherein the card placing unit 41, the glue injection unit 42, the chip placing unit 43 and the hot pressing unit 44 are respectively arranged on the top plate 3, and the cold pressing unit 45 is correspondingly arranged on the supporting seat 1;
the upset unit includes upset driving motor 51, roll-over table 52, screw rod 53, spiral guide cylinder 54 and slide bar 55, upset driving motor 51 is fixed on being located the upset support frame 2 on the left side, the left end of screw rod 53 rotates through nut 56 and connects on being located the upset support frame 2 on the left side, nut 56 is connected with upset driving motor 51 transmission, the left side at roll-over table 52 is fixed to the right-hand member of screw rod 53, spiral guide cylinder 54 is fixed on being located the upset support frame 2 on the right, be equipped with the upset guide rail on the spiral guide cylinder 54, the left end of slide bar 55 is fixed on the right side of roll-over table 52, the right-hand member activity of slide bar 55 stretches into in the spiral guide cylinder 54, slide bar 55 is equipped with the activity card and goes into the upset round pin 551 in the upset guide rail, card vacuum carrier 6 is fixed.
In this embodiment, the turnover driving motor 51 is in transmission connection with the nut 56 through a synchronous belt and a synchronous wheel, the nut 56 is rotatably arranged on the turnover supporting frame 2, and the screw 53 penetrates through the nut 56 in a threaded manner.
During operation, the nut 56 is driven to rotate by the overturning driving motor 51 through a synchronous belt and a synchronous wheel in a forward direction, the nut 56 drives the screw 53 to move, the screw 53 drives the card vacuum carrier 6 on the overturning table 52 to move to the position below the card placing unit 41, meanwhile, the overturning table 52 drives the slide rod 55 to move, the overturning pin 551 on the slide rod 55 moves along the overturning guide track of the spiral guide cylinder 54, at the moment, the card vacuum carrier 6 is matched with the card placing unit 41 through the card vacuum carrier 6, the card placing unit 41 places the IC card base on the card vacuum carrier 6, then the card vacuum carrier 6 carries out vacuum adsorption on the IC card base, after the IC card base is placed, the screw 53 continues to drive the card vacuum carrier 6 bearing the IC card base to move to the position below the glue injection unit 42, then the glue injection unit 42 carries out glue injection to the glue accommodating groove on the IC card base, after the glue injection is completed, the card vacuum carrier 6 moves to the position below, then the chip placing unit 43 places the IC chip in the chip containing groove of the IC card base, after the IC chip is placed, the card vacuum carrier 6 moves to the position below the hot pressing unit 44 for hot pressing treatment, after the hot pressing treatment is completed, the turning table 52 continues to move along with the driving of the screw 53, the slide bar 55 drives the turning table 52 to turn over for 180 degrees under the action of the turning guide track, the turning table 52 drives the card vacuum carrier 6 to turn over for 180 degrees and simultaneously move to the position above the cold pressing unit 45, then the cold pressing unit 45 carries out cold pressing treatment, thus the IC card packaging process is completed, after the packaging is completed, the card vacuum carrier 6 loosens the IC card, and then the IC card is transferred out of the working area; then, under the reverse driving of the reverse driving motor 51, the card vacuum carrier 6 is reset to perform the next IC card packaging process, and this is repeated, so that the IC card packaging can be continuously performed.
In the embodiment, the screw 53 and the slide rod 55 are respectively arranged on the two sides of the overturning platform 52, and the overturning guide rail matching of the overturning pin 551 of the slide rod 55 and the spiral guide cylinder 54 is utilized, so that the card vacuum carrier 6 realizes horizontal reciprocating motion and overturning motion under the driving of the same motor, the traditional card annular circulation type packaging mode is changed into a reciprocating circulation packaging mode, the structure is more compact, the occupied space of the whole structure is reduced, and meanwhile, the circulation path of the card vacuum carrier 6 driving an IC card is shortened.
Based on the above embodiment, further, the number of the package assemblies is two, two sets of the package assemblies are arranged in a central symmetry manner, and the top surface and the bottom surface of the turnover table 52 are respectively provided with the card vacuum carriers 6. By the arrangement, the idle state time of the card vacuum carrier 6 in the resetting process can be reduced, and the production efficiency is improved; during the in-service use, suppose that card vacuum carrier 6 moves from right to left first, and accomplish the IC-card encapsulation process via the encapsulation subassembly that is located the right under the drive of upset driving motor 51, at this moment, two card vacuum carrier 6 positions on the roll-over table 52 are reversed, upset driving motor 51 continues the forward drive, make the card vacuum carrier 6 translation that is located the top surface of roll-over table 52 this moment to be located the card below of unit 41 that places of encapsulation subassembly on the left, then upset driving motor 51 back drive, make roll-over table 52 move from left to right, so carry out another IC-card encapsulation process, another IC-card encapsulation is accomplished the back, roll-over table 52 translation is to initial position, so reciprocal circulation goes on, constantly carry out IC-package, form double-station integrated form IC-card encapsulation, and the production efficiency is higher.
On the basis of the above embodiment, further, still include blown down tank 7, blown down tank 7 is fixed on supporting seat 1, blown down tank 7 corresponds and is equipped with the through-hole with cold pressing unit 45 looks adaptation. So set up, after the IC-card encapsulation is accomplished, the IC-card that the encapsulation was accomplished is loosened to card vacuum carrier 6 for the IC-card drops to the blown down tank 7 of below on, shifts out the workspace by blown down tank 7, accomplishes and unloads, and the structure is more reasonable.
Based on the above embodiment, further, the overturning guide track includes two overturning guide grooves 541 arranged in parallel, the overturning guide groove 541 includes two translation sections and a spiral overturning section, two ends of the spiral overturning section are respectively connected with the two translation sections correspondingly, and two ends of the overturning pin 551 are respectively and movably embedded in the two overturning guide grooves 541 correspondingly. In practical use, the turning driving motor 51 drives the turning table 52 and the slide rod 55 to move via the screw 53, since the turning pin 551 of the slide rod 55 is limited by the translation section of the turning guide groove 541, the turning table 52 drives the card vacuum carrier 6 to keep linear translation, and when the turning pin 551 enters into cooperation with the spiral turning section, the slide rod 55 drives the turning table 52 to perform turning motion, so as to perform cold pressing treatment and facilitate the transfer of the packaged IC card out of the working area.
Based on the above embodiment, further, the card vacuum carrier 6 is provided with a card accommodating groove 61, the card vacuum carrier 6 is provided with moving permanent magnets 62 at the front end and the rear end, respectively, the card placing unit 41 includes a card slot 411 and a card dispensing base 412, the card slot 411 is fixed on a card distributing seat 412, a plurality of elastic clamping components 413 are respectively arranged at the front end and the rear end of the card distributing seat 412 at equal intervals, each elastic clamping component 413 comprises a pressing claw 4131, a pressing spring 4132 and a fixed permanent magnet 4133, the pressing claw 4131 is movably clamped in the card dispensing seat 412 and one end thereof penetrates through the card dispensing seat 412, the pressing spring 4132 is movably sleeved on the pressing claw 4131, and two ends of the pressing spring are respectively abutted against the pressing claw 4131 and the card distributing seat 412, the fixed permanent magnet 4133 is fixed to one end of the pressing claw 4131, and the polarity of the fixed permanent magnet 4133 is opposite to that of the movable permanent magnet 62.
In practical use, the card vacuum carrier 6 gradually moves to the lower part of the card placing unit 41, the movable permanent magnet 62 on the card vacuum carrier 6 gradually generates magnetic attraction to the fixed permanent magnet 4133 of each elastic clamping component 413 to drive the pressing claw 4131 to loosen the IC card base, when the card vacuum carrier 6 finishes entering the lower part of the card placing unit 41, the IC card base falls into the card accommodating groove 61 of the card vacuum carrier 6, then the fixed permanent magnet 4133 and the movable permanent magnet 62 gradually reduce the number of interaction with each other along with the gradual translation of the card vacuum carrier 6 out of the lower part of the card placing unit 41, and the elastic clamping components 413 which are not acted by the movable permanent magnet 62 reset under the action of the pressing spring 4132, so that the pressing claw 4131 clamps the IC card base until the movable permanent magnet 62 is completely moved out, and each elastic clamping component 413 resets to a clamping state; thus, a plurality of elastic clamping components 413 are arranged at the front end and the rear end of the card distributing seat 412, and the interaction between the movable permanent magnet 62 and the fixed permanent magnet 4133 is utilized, so that the plurality of elastic clamping components 413 clamp and position the IC card base in a partitioning manner in the moving process of the card vacuum carrier 6, and the IC card base is displaced to cause card material in the moving process of the carrier.
Based on the basis of the above-mentioned embodiment, further, card vacuum carrier 6 includes carrier underframe 63 and carrier upper ledge 64, carrier upper ledge 64 is fixed on carrier underframe 63 and is formed with the surge bin between the carrier underframe 63, card storage tank 61 has been seted up to carrier upper ledge 64, card storage tank 61 is equipped with the micropore of breathing in that is the matrix array distribution and communicates with the surge bin, carrier underframe 63 is equipped with the gas outlet, two move permanent magnet 62 and fix the both ends at carrier upper ledge 64. During the actual use, the IC-card base is placed in the card storage tank 61 of carrier upper frame 64, then carries out the evacuation to the surge bin through the gas outlet of carrier underframe 63, and then lives IC-card base vacuum adsorption for the IC-card base location is firm, is difficult for the skew.
Based on the above embodiment, further, the chip placing unit 43 includes a chip placing seat 431, a chip trough 432 and a piezoelectric height adjusting sheet 433, the piezoelectric height adjusting sheet 433 is fixed on the top plate 3, the chip trough 432 movably penetrates through the top plate 3 and is fixedly connected with the piezoelectric height adjusting sheet 433, the chip placing seat 431 is fixedly connected to the lower end of the chip trough 432, and two piezoelectric micro moving sheets 434 for clamping and releasing the IC chip are oppositely arranged in the chip placing seat 431.
During the in-service use, card vacuum carrier 6 removes the below that the unit 43 was placed to the chip, then two piezoelectricity micromotion pieces 434 in the chip seat 431 loosen the IC chip, the IC chip of bottommost layer drops in the chip storage tank of IC-card base, then two piezoelectricity micromotion pieces 434 are in the opposite direction clamping time IC chip of bottommost layer, then piezoelectricity altitude mixture control piece 433 work, place the unit 43 with the chip and lift up, prevent that the IC-card base on card vacuum carrier 6 from causing the IC chip to damage with IC chip surface friction in translation process, the structure is more reliable.
The above description is only a preferred embodiment of the present invention, and all equivalent changes or modifications of the structure, characteristics and principles described in the present patent application are included in the protection scope of the present patent application.

Claims (6)

1. The utility model provides a reciprocating two station combination IC-card encapsulation robot assembly line of formula of alliing oneself with arranging, includes rack platform (a 1), locates conveyor (a 2) and collection chute (a 3) on the rack platform to and a plurality of interval sets up encapsulation robot cell (a 4) on rack platform (a 1), and is a plurality of encapsulation robot cell (a 4) are two rows and distribute in conveyor (a 2's both sides, conveyor (a 2) are used for carrying the IC-card that accomplishes through encapsulation robot cell (a 4), collect chute (a 3) and fix the one end tip at conveyor (a 2).
2. The assembly line of claim 1, wherein the packaging robot unit (a 4) comprises a support base (1), two turnover supports (2) symmetrically arranged on the support base (1), a top plate (3) with two ends fixedly connected to the top ends of the two turnover supports (2), a packaging component, a turnover mechanism, and a card vacuum carrier (6) arranged on the turnover mechanism;
the packaging assembly comprises a card placing mechanism (41), a glue injection mechanism (42), a chip placing mechanism (43), a hot pressing mechanism (44) and a cold pressing mechanism (45), wherein the card placing mechanism (41), the glue injection mechanism (42), the chip placing mechanism (43) and the hot pressing mechanism (44) are respectively arranged on the top plate (3), and the cold pressing mechanism (45) is correspondingly arranged on the supporting seat (1);
the turnover mechanism comprises a turnover driving motor (51), a turnover table (52), a screw rod (53), a spiral guide cylinder (54) and a slide rod (55), wherein the turnover driving motor (51) is fixed on a turnover support frame (2) positioned on the left side, the left end of the screw rod (53) is rotatably connected on the turnover support frame (2) positioned on the left side through a nut (56), the nut (56) is in transmission connection with the turnover driving motor (51), the right end of the screw rod (53) is fixed on the left side of the turnover table (52), the spiral guide cylinder (54) is fixed on the turnover support frame (2) positioned on the right side, a turnover guide track is arranged on the spiral guide cylinder (54), the left end of the slide rod (55) is fixed on the right side of the turnover table (52), the right end of the slide rod (55) movably extends into the spiral guide cylinder (54), the slide rod (55) is provided with a turnover pin (551) which is movably clamped into the turnover, the card vacuum carrier (6) is fixed on the overturning platform (52).
3. The gang row type reciprocating turnover double-station combined IC card packaging robot assembly line as claimed in claim 1, wherein the number of the packaging assemblies is two, the two groups of packaging assemblies are arranged in a central symmetry manner, and card vacuum carriers (6) are respectively arranged on the top surface and the bottom surface of the turnover table (52); the cold press is characterized by further comprising a discharge chute (7), wherein the discharge chute (7) is fixed on the supporting seat (1), and the discharge chute (7) is correspondingly provided with a through hole matched with the cold press mechanism (45).
4. The assembly line of claim 2, wherein the reverse guide track comprises two reverse guide grooves (541) arranged in parallel, the reverse guide groove (541) comprises two translation sections and a spiral reverse section, two ends of the spiral reverse section are correspondingly connected with the two translation sections, and two ends of the reverse pin (551) are movably embedded in the two reverse guide grooves (541) respectively.
5. The robot assembly line of claim 2, wherein the card vacuum carrier (6) is provided with a card accommodating slot (61), the front end and the rear end of the card vacuum carrier (6) are respectively provided with a movable permanent magnet (62), the card placing mechanism (41) comprises a card slot (411) and a card distributing seat (412), the card slot (411) is fixed on the card distributing seat (412), the front end and the rear end of the card distributing seat (412) are respectively provided with a plurality of elastic clamping components (413) at equal intervals, each elastic clamping component (413) comprises a pressing claw (4131), a pressing spring (4132) and a fixed permanent magnet (4133), the pressing claw (4131) is movably clamped in the card distributing seat (412), and one end of the pressing claw penetrates out of the card distributing seat (412), the pressing spring (4132) is movably sleeved on the pressing claw (4131), two ends of the pressing spring are respectively abutted against the pressing claw (4131) and the card distributing seat (412), the fixed permanent magnet (4133) is fixed on one end of the pressing claw (4131), and the polarity of the fixed permanent magnet (4133) is opposite to that of the movable permanent magnet (62).
6. The assembly line of claim 2, wherein the chip placement mechanism (43) comprises a chip placement seat (431), a chip trough (432) and a piezoelectric height adjusting sheet (433), the piezoelectric height adjusting sheet (433) is fixed on the top plate (3), the chip trough (432) movably penetrates through the top plate (3) and is fixedly connected with the piezoelectric height adjusting sheet (433), the chip placement seat (431) is fixedly connected to the lower end of the chip trough (432), and two piezoelectric micro-motion sheets (434) for clamping and loosening the IC chip are oppositely arranged in the chip placement seat (431).
CN202011226686.8A 2020-11-06 2020-11-06 Row-connected type reciprocating turnover double-station combined IC card packaging robot assembly line Withdrawn CN112420557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202011226686.8A CN112420557A (en) 2020-11-06 2020-11-06 Row-connected type reciprocating turnover double-station combined IC card packaging robot assembly line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011226686.8A CN112420557A (en) 2020-11-06 2020-11-06 Row-connected type reciprocating turnover double-station combined IC card packaging robot assembly line

Publications (1)

Publication Number Publication Date
CN112420557A true CN112420557A (en) 2021-02-26

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Application Number Title Priority Date Filing Date
CN202011226686.8A Withdrawn CN112420557A (en) 2020-11-06 2020-11-06 Row-connected type reciprocating turnover double-station combined IC card packaging robot assembly line

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CN (1) CN112420557A (en)

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Application publication date: 20210226