CN112410518A - Air inlet device of annealing cavity - Google Patents
Air inlet device of annealing cavity Download PDFInfo
- Publication number
- CN112410518A CN112410518A CN201910784371.6A CN201910784371A CN112410518A CN 112410518 A CN112410518 A CN 112410518A CN 201910784371 A CN201910784371 A CN 201910784371A CN 112410518 A CN112410518 A CN 112410518A
- Authority
- CN
- China
- Prior art keywords
- air
- air inlet
- cavity
- inlet cylinder
- annealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/26—Methods of annealing
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/74—Methods of treatment in inert gas, controlled atmosphere, vacuum or pulverulent material
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0068—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for particular articles not mentioned below
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Heat Treatment Of Articles (AREA)
Abstract
The invention provides an air inlet device of an annealing cavity, which comprises an air supply pipeline, a plurality of air supply branches, a plurality of air dispersing cavities and an air inlet cylinder, wherein each air dispersing cavity is communicated with the air supply pipeline through one air supply branch, one end of the air inlet cylinder is connected with an air outlet of the air supply branch and is positioned in the air dispersing cavity, and a plurality of air dispersing holes are formed in the side wall of the air inlet cylinder. According to the invention, the air inlet cylinder for buffering the uniformly distributed process air flow is added in each heat dissipation cavity, so that the problem that the process air in the conventional device flows into the air dissipation cavity at once and cannot uniformly enter the annealing cavity after being uniformly distributed in the air dissipation cavity is solved, and the uniformity of the process air in the annealing cavity is ensured.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to an annealing cavity air inlet device.
Background
In the copper interconnection technology of very large scale integrated circuits, wafers need to be annealed and CMP polished after wet copper plating. The copper annealing process is not only beneficial to eliminating residual stress, stabilizing size, refining grains, adjusting structure and reducing the condition of deformation or crack of the wafer, but also has important influence on the subsequent CMP polishing processing.
In the existing semiconductor technology, the metal interconnection line in the chip is very extensive in ECP copper plating technology, and after the ECP copper plating technology, an annealing process is needed to stabilize the electroplated copper layer and form a stable lattice structure. N needs to be introduced in the annealing process2、H2And the processing gas is used, and a plurality of annealing chambers are arranged in the machine table to achieve the production efficiency. The process gas normally used in the annealing process after ECP copper plating is 4% or less of H2And N2The mixed gas is pure H2Gas and pure N2The gas is mixed according to the set proportion after entering the equipment, and then is used as the process gas to be introduced into the process cavity after being mixed, and the gas mixing device is called as a gas mixing module. When the process gas is guided into the gas inlet chamber of each layer after passing through the gas mixing module, the process gas can be quickly diffused into the annealing chamber, the annealing chamber has a certain width, most of the process gas rushes into the annealing chamber from the front end close to the gas inlet of the gas inlet chamber, and only a small amount of the process gas flows to the rear end far away from the gas inlet and then enters the annealing chamber, so that the process gas in the annealing chamber is unevenly distributed.
Disclosure of Invention
Therefore, the invention provides an air inlet device of an annealing cavity, which comprises an air supply pipeline, a plurality of air supply branches, a plurality of air dispersing cavities and an air inlet cylinder, wherein each air dispersing cavity is communicated with the air supply pipeline through one air supply branch, one end of the air inlet cylinder is connected with an air outlet of the air supply branch and is positioned in the air dispersing cavity, and the side wall of the air inlet cylinder is provided with a plurality of air dispersing holes.
Preferably, the plurality of air dispersing holes are uniformly distributed on the wall of the air inlet cylinder.
Preferably, the air inlet cylinder decreases in aperture one by one from one end close to the air supply branch to the air diffusion hole on the other end.
Preferably, the other end of the air inlet cylinder is connected with the air bar, and the inner diameter of the air bar is smaller than that of the air inlet cylinder.
Preferably, the air bar is detachably fixed with the air dispersing cavity.
Preferably, the air supply system further comprises a plurality of air flow control wedges, each air supply branch being connected to an air supply line by one air flow control wedge, the air flow control wedges comprising:
the fixed end is detachably fixed with the air supply pipeline;
the air guide pipe is hollow, one end of the air guide pipe is connected with the fixed end, the other end of the air guide pipe is provided with an air outlet and extends into the air supply branch after penetrating into the air supply pipeline, an air guide hole penetrating through the air guide pipe is formed in the air guide pipe, and the air guide hole is positioned in the air supply pipeline;
wherein, the air outlet of the air duct is communicated with the air inlet cylinder.
Preferably, a sealing ring is arranged between the air inlet cylinder and the air flow control wedge.
According to the invention, the air inlet cylinder for buffering the uniformly distributed process air flow is added in each heat dissipation cavity, so that the problem that the process air in the conventional device flows into the air dissipation cavity at once and cannot uniformly enter the annealing cavity after being uniformly distributed in the air dissipation cavity is solved, and the uniformity of the process air in the annealing cavity is ensured;
in addition, an airflow control wedge is additionally arranged between the air supply pipeline and each air supply branch pipeline, and the airflow in a plurality of annealing cavities can be stable by replacing airflow control wedges with different inner pipe diameters in the process.
Drawings
Fig. 1 discloses a schematic structural view of an annealing chamber according to an embodiment of the present invention.
Fig. 2 shows a block diagram of an annealing chamber air inlet apparatus according to an embodiment of the invention (not installed before the air inlet cylinder).
Fig. 3 discloses a structural diagram of an annealing chamber air inlet device according to an embodiment of the invention.
FIG. 4 discloses a block diagram of an intake barrel according to one embodiment of the present invention.
Figure 5 discloses a block diagram of a gas stick according to one embodiment of the invention.
Figure 6 illustrates an exploded view of the attachment of an airflow control wedge to an inlet barrel according to one embodiment of the present invention.
Figure 7 discloses a cross-sectional view of an air flow control wedge according to one embodiment of the invention.
Detailed Description
To explain the technical content, structural features, and achieved objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in combination with the embodiments.
Referring to fig. 1, the annealing chamber air inlet device includes an air inlet device 100, an annealing chamber 200, and an air outlet device 300.
As shown in fig. 2, the gas inlet device 100 includes a gas supply pipeline 101, a plurality of gas supply branches 102 and a plurality of gas dissipation chambers 103, the plurality of gas dissipation chambers 103 are preferably arranged in a stacked manner from bottom to top, each gas dissipation chamber 103 is communicated with the gas supply pipeline 101 through one gas supply branch 102, the lower end of the gas supply pipeline 101 is connected with an external gas supply device, and the process gas is supplied into the gas dissipation chamber 103 through the gas supply pipeline 101 and the gas supply branches 102, and further supplied into the annealing chamber 200.
After the process gas enters the gas diffusion chamber 103 from the gas outlet of the gas supply branch 102, the gas is accumulated at the front end of the gas inlet plate (i.e. the end close to the gas supply branch 102) of the gas diffusion chamber 103, and directly enters the annealing chamber 200, and cannot be uniformly distributed in the gas diffusion chamber 103 and then uniformly enters the annealing chamber 200, i.e. the supply amount of the process gas in the gas diffusion chamber 103 is gradually reduced towards the direction far away from the gas supply branch 102, which will result in the uneven distribution of the process gas in the annealing chamber 200.
For the above reasons, an air inlet tube 105 for uniformly distributing the process gas is connected to the air outlet of the air supply branch 102, and the air inlet tube 105 is located in the air-dispersing chamber 103, as shown in fig. 3.
Referring to fig. 3 and 4, the wall of the air inlet tube 105 is provided with a plurality of air diffusing holes 1051, so that the process gas can enter the air diffusing cavity 103 from the air diffusing holes 1051 on the wall of the air inlet tube 105 after entering the air inlet tube 105, and then enter the annealing cavity 200 through the air inlet plate after being uniformly distributed in the air diffusing cavity 103. The other end of the air inlet cylinder 105 is also provided with a vent bar 106, the inner diameter of the vent bar 106 is smaller than that of the air inlet cylinder 105, the vent bar 106 is also provided with a plurality of through holes, a part of process gas in the air inlet cylinder 105 can be guided into the rear end of the gas diffusion cavity 103, the uniformity of the process gas in the gas diffusion cavity 103 is further ensured, and the process gas can uniformly enter the annealing cavity 200. Referring to fig. 5, the air bar 106 may be secured within the air dispersion chamber 103 by a retainer clip to secure the air inlet barrel 105.
The air pressure at one end of the air inlet cylinder 105 close to the air supply branch 102 is minimum, the pressure gradually increases along the air inlet cylinder 105 towards the inside, and the uniform air outlet of the air flow is controlled by adopting a mode that the aperture of the air dispersing hole 1051 gradually decreases. Specifically, referring to fig. 4, the wall of the air inlet tube 105 is provided with a plurality of air diffusing holes 1051, the air diffusing holes 1051 are uniformly distributed on the air inlet tube 105, the aperture of the air diffusing holes 1051 decreases gradually in the horizontal direction, and the end with the larger aperture is connected to the air supply branch 102.
At present, a plurality of annealing cavities are generally required to be arranged in ECP (electrochemical copper plating) equipment for production, if each annealing cavity is provided with a gas mixing module, the manufacturing cost of the equipment can be greatly improved, but if the same gas mixing module is used for supplying process gas to the plurality of annealing cavities, the gas flow of each cavity cannot be well controlled. In view of this problem, each air supply branch 102 is connected to the air supply line 101 through an air flow control wedge 104, and referring to fig. 1 and 7, an air inlet cylinder 105 is connected to an air outlet 1044 of the air flow control wedge 104. Fig. 6 is an exploded view showing the connection relationship between the air flow control wedge and the air inlet cylinder, and a sealing ring is further provided between the air inlet cylinder 105 and the air flow control wedge 104 for sealing between the air flow control wedge 104 and the air inlet cylinder 105.
Specifically, the air supply pipeline 101 is provided with a small hole, the position of the small hole is opposite to the air supply branch 102, the air flow control wedge 104 is inserted into the small hole and detachably fixed with the air supply pipeline 101, and the air flow control wedge 104 penetrates through the air supply pipeline 101 and then extends into the air dissipation chamber 103 through the air supply branch 102.
Referring to FIG. 7, the air flow control wedge 104 includes a fixed end 1041 and an air conduit 1042, the fixed end 1041 is detachably fixed to the air supply line 101. The air duct 1042 is hollow, one end of the air duct 1042 is connected with the fixed end 1041, and the other end is provided with an air outlet 1044. The air duct 1042 is provided with an air hole 1043 penetrating the air duct 1042, and the air hole 1043 is located in the air supply pipeline 101. After the external air supply device supplies air into the air supply pipeline 101, the process gas moves upwards in the air supply pipeline 101, part of the process gas continues to move upwards through the air guide holes 1043 after encountering the air flow control wedge 104, and part of the process gas is divided into the air guide pipes 1042 to move horizontally, enters the air inlet cylinder 105 through the air outlets 1044, and then is uniformly distributed into the annealing chambers through the heat dissipation chambers. In the process, the airflow control wedges 104 with different inner pipe diameters can be replaced, so that the airflow in the plurality of annealing chambers 200 is uniform and stable, and the stability of the airflow in each annealing chamber 200 is further improved by the air inlet cylinder 105.
According to the invention, the air inlet cylinder for buffering the uniformly distributed process air flow is added in each heat dissipation cavity, so that the problem that the process air in the conventional device flows into the air dissipation cavity at once and cannot uniformly enter the annealing cavity after being uniformly distributed in the air dissipation cavity is solved, and the uniformity of the process air in the annealing cavity is ensured;
in addition, an airflow control wedge is additionally arranged between the air supply pipeline and each air supply branch pipeline, and the airflow in a plurality of annealing cavities can be stable by replacing airflow control wedges with different inner pipe diameters in the process.
In summary, the present invention has been described in detail with reference to the above embodiments and the accompanying drawings, so that those skilled in the art can implement the invention. The above-described embodiments are intended to be illustrative, but not limiting, of the present invention, the scope of which is defined by the appended claims. Variations on the number of elements described herein or substitutions of equivalent elements are intended to be within the scope of the present invention.
Claims (7)
1. The utility model provides an annealing chamber air inlet unit, its characterized in that includes air supply line, many air feed branch roads, a plurality of scattered air cavity and an air inlet cylinder, and every scattered air cavity is linked together with the air supply line by an air feed branch road, the one end of air inlet cylinder links to each other with the gas outlet of air feed branch road and is located scattered air cavity, it has a plurality of scattered air holes to open on the lateral wall of air inlet cylinder.
2. The annealing chamber air inlet apparatus according to claim 1, wherein the plurality of air dispersing holes are uniformly distributed on the wall of the air inlet barrel.
3. The annealing chamber air inlet device according to claim 1, wherein the air inlet cylinder decreases in aperture one by one from one end near the air supply branch to the air diffusing hole on the other end.
4. The annealing chamber air inlet device according to claim 1, wherein the other end of the air inlet cylinder is connected with a breather bar, and the inside diameter of the breather bar is smaller than the inside diameter of the air inlet cylinder.
5. The annealing chamber air inlet device of claim 4, wherein the air bar is detachably fixed with the air dispersing chamber.
6. The annealing chamber air inlet apparatus of claim 1, further comprising a plurality of air flow control wedges, each air supply branch being connected to an air supply line by one air flow control wedge, the air flow control wedges comprising:
the fixed end is detachably fixed with the air supply pipeline;
the air guide pipe is hollow, one end of the air guide pipe is connected with the fixed end, the other end of the air guide pipe is provided with an air outlet and extends into the air supply branch after penetrating into the air supply pipeline, an air guide hole penetrating through the air guide pipe is formed in the air guide pipe, and the air guide hole is positioned in the air supply pipeline;
wherein, the air outlet of the air duct is communicated with the air inlet cylinder.
7. The annealing chamber air intake device of claim 6, wherein a sealing ring is arranged between the air intake barrel and the air flow control wedge.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910784371.6A CN112410518A (en) | 2019-08-23 | 2019-08-23 | Air inlet device of annealing cavity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910784371.6A CN112410518A (en) | 2019-08-23 | 2019-08-23 | Air inlet device of annealing cavity |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112410518A true CN112410518A (en) | 2021-02-26 |
Family
ID=74780125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910784371.6A Pending CN112410518A (en) | 2019-08-23 | 2019-08-23 | Air inlet device of annealing cavity |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112410518A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06349761A (en) * | 1993-06-03 | 1994-12-22 | Kokusai Electric Co Ltd | Gas supply nozzle for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus |
CN201562667U (en) * | 2009-08-04 | 2010-08-25 | 中芯国际集成电路制造(上海)有限公司 | Annealing device |
CN102534713A (en) * | 2012-02-28 | 2012-07-04 | 上海华力微电子有限公司 | Electroplating machine annealing chamber gas pipeline |
CN205241767U (en) * | 2015-12-18 | 2016-05-18 | 鹰潭盛发铜业有限公司 | Even tubular copper product annealing stove of gas distribution |
CN107086189A (en) * | 2016-02-15 | 2017-08-22 | 株式会社日立国际电气 | Lining processor |
CN207987304U (en) * | 2018-03-26 | 2018-10-19 | 浙江万兴铜业有限公司 | A kind of COPPER WIRES PRODUCTION annealing furnace |
-
2019
- 2019-08-23 CN CN201910784371.6A patent/CN112410518A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06349761A (en) * | 1993-06-03 | 1994-12-22 | Kokusai Electric Co Ltd | Gas supply nozzle for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus |
CN201562667U (en) * | 2009-08-04 | 2010-08-25 | 中芯国际集成电路制造(上海)有限公司 | Annealing device |
CN102534713A (en) * | 2012-02-28 | 2012-07-04 | 上海华力微电子有限公司 | Electroplating machine annealing chamber gas pipeline |
CN205241767U (en) * | 2015-12-18 | 2016-05-18 | 鹰潭盛发铜业有限公司 | Even tubular copper product annealing stove of gas distribution |
CN107086189A (en) * | 2016-02-15 | 2017-08-22 | 株式会社日立国际电气 | Lining processor |
CN207987304U (en) * | 2018-03-26 | 2018-10-19 | 浙江万兴铜业有限公司 | A kind of COPPER WIRES PRODUCTION annealing furnace |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI437401B (en) | Mixed gas supply device | |
KR102564514B1 (en) | Azimuthal mixer | |
KR200482352Y1 (en) | Gaseous diffusion apparatus for wafer cassette | |
CN113097106B (en) | Semiconductor device and semiconductor chamber | |
JP2015181152A (en) | Apparatus and method for improving wafer uniformity | |
KR20070054089A (en) | Plating apparatus | |
JP4971376B2 (en) | Gas injection module | |
CN112410518A (en) | Air inlet device of annealing cavity | |
CN115505904A (en) | Spray set of many gas flow channel | |
CN110400768A (en) | Reaction chamber | |
CN112410693B (en) | Annealing chamber air inlet device | |
CN219793198U (en) | Diffusion furnace and diffusion device | |
WO2023279445A1 (en) | Machine table and wafer processing device | |
CN115786881A (en) | Chemical vapor deposition equipment and gas mixing device thereof | |
CN114059164B (en) | Silicon carbide epitaxial growth device | |
TWI521623B (en) | Air tension device | |
CN115863212A (en) | System and apparatus for gas distribution | |
CN212322956U (en) | Reaction chamber of horizontal semiconductor process furnace and horizontal semiconductor process furnace | |
US11253970B2 (en) | Slurry cooling device and slurry supply system having the same | |
CN114210217A (en) | Semiconductor processing equipment and gas mixing device thereof | |
CN208954949U (en) | Vertical diffusion furnace | |
CN116190282B (en) | Etching device and method for uniformly etching wafer | |
CN103839746A (en) | Etching equipment process gas gas-feeding device | |
CN217314845U (en) | Bubble tube structure, washing tank and cleaning equipment | |
CN220106445U (en) | Air inlet nozzle and dry chemical etching equipment |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination |