CN112397950A - 线缆连接器组件 - Google Patents

线缆连接器组件 Download PDF

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Publication number
CN112397950A
CN112397950A CN201910752965.9A CN201910752965A CN112397950A CN 112397950 A CN112397950 A CN 112397950A CN 201910752965 A CN201910752965 A CN 201910752965A CN 112397950 A CN112397950 A CN 112397950A
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circuit board
cable
gaskets
coaxial line
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董月军
孙风军
陈钧
徐扬尊
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Foxconn Kunshan Computer Connector Co Ltd
Hongteng Precision Technology Co Ltd
Foxconn Interconnect Technology Ltd
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Foxconn Kunshan Computer Connector Co Ltd
Hongteng Precision Technology Co Ltd
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Priority to CN201910752965.9A priority Critical patent/CN112397950A/zh
Priority to US16/995,731 priority patent/US11349267B2/en
Publication of CN112397950A publication Critical patent/CN112397950A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/515—Terminal blocks providing connections to wires or cables
    • H—ELECTRICITY
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    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/53—Fixed connections for rigid printed circuits or like structures connecting to cables except for flat or ribbon cables
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    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
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    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
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    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
    • H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
    • H01R9/0515—Connection to a rigid planar substrate, e.g. printed circuit board
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02—Details
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/58—Means for relieving strain on wire connection, e.g. cord grip, for avoiding loosening of connections between wires and terminals within a coupling device terminating a cable
    • H01R13/5804—Means for relieving strain on wire connection, e.g. cord grip, for avoiding loosening of connections between wires and terminals within a coupling device terminating a cable comprising a separate cable clamping part
    • H01R13/5812—Means for relieving strain on wire connection, e.g. cord grip, for avoiding loosening of connections between wires and terminals within a coupling device terminating a cable comprising a separate cable clamping part the cable clamping being achieved by mounting the separate part on the housing of the coupling device
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    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6591—Specific features or arrangements of connection of shield to conductive members
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    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
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    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
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    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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Abstract

本发明公开了一种线缆连接器组件，其包括电连接器、与电连接器电性连接的电路板、及与电路板电性连接的线缆，所述电路板包括与线缆焊接的第一排垫片及位于所述第一排垫片后并且与第一排垫片隔开的第二排垫片，所述线缆包括若干同轴线及单芯线，所述同轴线包括中心导体及屏蔽层，所述单芯线包括导体，所述同轴线的所述中心导体焊接于所述电路板上的第一排垫片，所述单芯线的导体和所述同轴线的所述屏蔽层焊接于所述电路板上的第二排垫片，本发明线缆连接器组件将同轴线前移，增加了屏蔽层的焊接空间，缩短了同轴线的信号传输的路径，提升了同轴线的高速信号传输的性能，同时减小了线缆连接器组件的整体空间。

Description

线缆连接器组件
【技术领域】
本发明有关一种线缆连接器组件，尤指一种包含电路板的线缆连接器组件。
【背景技术】
请参照2019年2月26日公开的中国发明专利第CN105702327A号，其揭示了一种线缆连接器组件，其包括电连接器、与电连接器电性连接的电路板、及与电路板电性连接的线缆，所述电路板后侧设有与线缆连接的焊接片，所述线缆包括若干同轴线和单芯线，所述同轴线可传输高速信号，所述所有线缆均并排的焊接在电路板上的同一排焊接片，线缆排列紧密容易造成空焊的可能，另外信号在电路板上传输的路径过长，影响信号传输的性能、同时线缆连接器组件的整体空间较大，所以需要提供一种改进的线缆连接器组件。
【发明内容】
本发明的主要目的在于提供一种线缆连接器组件，使得线缆在电路板上焊接可靠，同轴线在电路板上传输距离较短，从而增加同轴线的高速信号传输的性能，另外整个线缆连接器组件的空间较小。
为实现上述目的，本发明采用以下技术方案：一种线缆连接器组件，其包括电连接器、与电连接器电性连接的电路板及与电路板电性连接的线缆，所述电路板包括与线缆焊接的第一排垫片及位于所述第一排垫片后并且与第一排垫片隔开的第二排垫片，所述线缆包括若干同轴线及单芯线，所述同轴线包括中心导体及屏蔽层，所述单芯线包括导体，所述同轴线的所述中心导体焊接于所述电路板上的第一排垫片，所述单芯线的导体和所述同轴线的所述屏蔽层焊接于所述电路板上的第二排垫片。
进一步地，所述电路板还包括电子元件，所述电子元件至少部分地设置于所述电路板上的第一排垫片之间。
进一步地，所述同轴线包括第一种同轴线及第二种同轴线，所述第一种同轴线的径向尺寸大于所述第二种同轴线的径向尺寸，所述第一种同轴线所传输信号的速率大于所述第二种同轴线所传输信号的速率。
进一步地，所述第二种同轴线位于所述电路板上的所述第一种同轴线的外侧。
进一步地，所述第二排垫片的左右两侧侧边向外延伸超出所述电路板的相应侧边。
进一步地，所述电路板包括第一面和与所述第一面相反的第二面，所述第一面和所述第二面都包括所述第一排垫片和所述第二排垫片，所述同轴线和单芯线对称地设置的在所述电路板的第一面和第二面。
进一步地，所述电连接器包括与对接连接器对接的对接端，所述对接端可以沿正反两个相反的方向与对接连接器对接。
为实现上述目的，本发明还可以采用以下技术方案：
一种线缆连接器组件的制造方法，其特征在于包括如下步骤：
提供电连接器；
提供可与电连接器电性连接的电路板，所述电路板包括第一排垫片及位于所述第一排垫片后并与第一排垫片隔开的第二排垫片；
提供线缆，所述线缆包括若干同轴线及单芯线，所述同轴线包括中心导体及屏蔽层，所述单芯线包括导体；
将所述同轴线的所述中心导体一次焊接于所述电路板的所述第一排垫片；
将所述同轴线的所述屏蔽层和所述单芯线的所述导体一次焊接于所述电路板的所述第二排垫片。
进一步地，提供理线块，所述理线块包括贯穿所述理线块的孔，在焊接前先将所述线缆固定于所述理线块的所述孔。
进一步地，所述电路板包括第一面和与所述第一面相反的第二面，所述第一面和所述第二面都包括所述第一排垫片和所述第二排垫片，所述同轴线和所述单芯线对称地设置的在所述电路板的所述第一面和所述第二面。
与现有技术相比，本发明的优点在于：本发明在提高焊接稳定性的同时，还提高了同轴线的高速信号传输的性能，同时有效地缩小了线缆连接器组件整体的空间。
【附图说明】
图1是本发明线缆连接器组件的立体图。
图2是图1所示的线缆连接器组件的部分分解图。
图3是图1所示的线缆连接器组件的进一步的部分分解图。
图4是图3所示的线缆连接器组件的另一视角的分解图。
图5是图3所示的线缆连接器组件的进一步的部分分解图。
图6是图5所示的线缆连接器组件的另一视角的分解图。
图7是图3所示的线缆连接器组件的去除壳体和内模的俯视图。
图8是图7所示的线缆连接器组件的仰视图。
图9是图1所示的线缆连接器组件的电连接器与电路板的立体图。
图10是图9所示的线缆连接器组件的另一视角的立体图。
【主要组件符号说明】
线缆连接器组件 100 电连接器 10
对接端 11 绝缘本体 12
导电端子 13 金属壳体 14
电路板 20 第一面 21
第二面 22 侧面 23
端子垫片 211 第一排垫片 213
第二排垫片 215 电子元件 26
第一垫片 2131 第二垫片 2132
导体垫片 2151 接地垫片 2152
线缆 30 芯线 31
同轴线 32 单芯线 35
中心导体 320 内绝缘层 323
屏蔽层 325 外绝缘层 327
第一种同轴线 322 第二种同轴线 324
导体 350 绝缘层 351
电源芯线 353 低速信号线 355
金属外壳 40 内模 50
绝缘外壳 60 理线块 70
上理线块 71 孔 721
下理线块 72
如下具体实施方式将结合上述附图进一步说明本发明。
【具体实施方式】
请参照图1至图10所示，本发明的线缆连接器组件100，其可与对接连接器沿相反的两个方向配合。所述线缆连接器组件100包括电连接器10、与电连接器10电性连接的电路板20、与电路板20电性连接的线缆30、包覆在电连接器10后部及线缆30前部并收容所述电路板20的金属外壳40、包覆在金属外壳40后部与线缆30前部的内模50、设置在金属外壳40外部及内模50前部的绝缘外壳60及定位线缆30的理线块70。所述线缆连接器组件100符合雷电(Thunderbolt)3.0的规范，其每通道传输速度可以达到10Gbps甚至更高。
所述电连接器10包括对接端11，所述对接端11可以沿正反两个方向与对接连接器对接。所述电连接器10包括绝缘本体12、固持在绝缘本体12内的若干导电端子13及设置在绝缘本体12外侧的金属壳体14。所述导电端子13包括上排导电端子和下排导电端子。
所述线缆30包括若干芯线31，所述芯线31包括同轴线32和单芯线35。所述同轴线32在结构上包括中心导体320、包覆所述中心导体320的内绝缘层323、包覆所述内绝缘层323的屏蔽层325及成型于屏蔽层325外的外绝缘层327。所述同轴线32在种类上包括第一种同轴线322和第二种同轴线324，所述第一种同轴线322的径向尺寸大于所述第二种同轴线324的径向尺寸，即第一种同轴线322的横截面直径尺寸大于所述第二种同轴线324的横截面直径尺寸。所述第一种同轴线322所传输信号的速率大于所述第二种同轴线324所传输信号的速率。在本实施例中第一种同轴线322是用于传输高速信号的高速信号线，其共包括四对，每对可用于传输一对差分信号，可以传输四对高速差分信号。所述第二种同轴线324用于传输低速信号的低速信号线。所述单芯线35包括导体350及包覆在导体350外侧的绝缘层351。所述单芯线35包括传输电源的电源芯线353和传输USB2.0信号的低速信号线355。线缆连接器组件100还包括用于固定若干芯线31的理线块70，所述理线块70包括上理线块71及与上理线块71相互配合的下理线块72。所述上理线块71和所述下理线块72都包括在前后方向上贯穿理线块70的孔721。所述线缆30在焊接于电路板20之前先分成上下两排，并分别穿过对应的上理线块71及下理线块72的孔721，并通过点胶等工艺将线缆30固定于上理线块71与下理线块72。所述线缆30的前端穿过所述理线块70的孔721并暴露在理线块70的前端，以方便线缆30焊接至电路板20。
所述电路板20包括第一面21、与第一面21相反设置的第二面22及连接第一面21与第二面22的两侧面23。所述电路板20的第一面21和第二面22均包括设于前端的一排端子垫片211、位于端子垫片211后的第一排垫片213及位于第一排垫片213后的第二排垫片215。所述第二排垫片215与第一排垫片213间隔设置。所述电路板20上还设置有若干电子元件26，所述电子元件26至少部分地设置在电路板20上的第一排垫片213之间。本实施例中所述电子元件26位于第一排垫片213的中间位置。所述上排导电端子和下排导电端子分别焊接于所述端子垫片211。分别位于电路板20第一面21和第二面22的所述第一排垫片213均包括位于电子元件26两侧的第一垫片2131和位于第一垫片2131外侧的第二垫片2132，第二垫片2132位于电路板20的横向方向最外侧区域两边。位于电路板20第一面21和第二面22的所述第二排垫片215均包括位于中间位置的导体垫片2151和位于导体垫片2151的两侧的接地垫片2152。两侧的所述接地垫片2152各自连接成一整体。两侧的所述接地垫片2152分别向外延伸出超出电路板20的相应侧边24。所述第一垫片2131及第二垫片2132对称设置的在电路板20的第一面21及第二面22的第一排垫片213中。所述导体垫片2151及接地垫片2152对称设置在电路板20的第一面21及第二面22的第二排垫片215中。
所述同轴线32的中心导体320焊接于第一排垫片213，并且所述第一种同轴线322的中心导体320焊接于第一垫片2131，所述第二种同轴线324的中心导体320焊接于第二垫片2132。这样所述第二种同轴线324位于所述电路板20的所述第一种同轴线322的外侧。因为第一种同轴线322是用来传输高速信号的高速信号线，高速信号是以差分对传输的，所以第一种同轴线322是以对的形式存在的。在电路板20上同轴线32的横向排列顺序是：第二种同轴线324、一对第一种同轴线322、一对第一种同轴线322、第二种同轴线324。所述单芯线35的导体350和同轴线32的屏蔽层325焊接于第二排垫片215，并且所述单芯线35的导体350焊接于中间位置的导体垫片2151，所述同轴线32的屏蔽层325焊接于接地垫片2152。这样所述单芯线35焊接在所述电路板20的中间位置。所述同轴线32和所述单芯线35对称地设置在电路板20的第一面21和第二面22，即在第一面21焊接同轴线32的位置，相反的第二面22也焊接同轴线32，在第一面焊接单芯线35的位置，相反的第二面22也焊接单芯线35。所述第一种同轴线322和所述第二种同轴线324对称的设置在电路板20的第一面21和第二面22，即在电路板20的第一面21上焊接第一种同轴线322的位置，相反的第二面22也对应焊接第一种同轴线322，在第一面21焊接第二种同轴线324的位置，相反的第二面22也焊接第二种同轴线324。
所述接地垫片2152分别向外侧延伸出超出电路板20的相应侧边24，增大了接地垫片2152的面积，使得屏蔽层325在焊接到接地垫片2152时有充足的接触面积，确保屏蔽层325不会虚焊，增加焊接品质和接地的效果，保证焊接的稳定性。另外在电路板20上有电子元件26的情况下，将线缆30分成前后两排焊接，同轴线32焊接于第一排垫片213，单芯线35和同轴线32的屏蔽层325焊接于第二排垫片215，不仅增加了线缆30焊接在电路板20上的焊接空间，同时减小了整个线缆连接器组件100的空间，使得整个线缆连接器组件100的结构更加紧凑。因为高速信号在同轴线32中传输，将同轴线32的中心导体320焊接在更靠近电连接器10的第一排垫片213，缩短了高速信号在电路板20中传输的路径，有效地提高了高速信号的传输性能。
所述线缆连接器组件100组装方法包括如下步骤：
提供所述电连接器10。
提供所述电路板20。
提供所述线缆30。
提供所述理线块70。将所述线缆30分成上、下两排，并分别穿过对应的所述上理线块71及下理线块72的孔721。并使线缆30暴露于理线块70的前端；保持同轴线32的前端对齐以使同轴线暴露于所述理线块70前端的长度保持一致，并使得同轴线32并排排列。将单芯线35导体与同轴线屏蔽层325固定在同一排，并将所述线缆30固定于所述理线块70。
将所述上排线缆的同轴线32的中心导体320一次同时地焊接于所述电路板20的第一面21的第一排垫片213。
将所述上排线缆的同轴线32的屏蔽层325和上排线缆的所述单芯线35的导体350一次同时地焊接于所述电路板20的第一面21的第二排垫片215。
将所述下排线缆的同轴线32的中心导体320一次同时地焊接于所述电路板20的第二面22的第一排垫片213。
将所述下排线缆的同轴线32的屏蔽层325和下排线缆的所述单芯线35的导体350一次同时地焊接于所述电路板20的第二面22的第二排垫片215。
本发明中将同轴线32的屏蔽层325和单芯线35的导体350设置在同一排，焊接时可以将屏蔽层325和单芯线35导体350一次同时的焊接在电路板20上，减少了焊接工时。
以上所述仅为本发明的一种实施方式，不是全部或唯一的实施方式，本领域普通技术人员通过阅读本发明说明书而对本发明技术方案采取的任何等效的变化，均为本发明的权利要求所涵盖。

Claims (10)

1.一种线缆连接器组件，其包括电连接器、与电连接器电性连接的电路板及与电路板电性连接的线缆，所述电路板包括第一排垫片及位于所述第一排垫片后并且与所述第一排垫片隔开的第二排垫片，所述线缆包括若干同轴线及单芯线，所述同轴线包括中心导体及屏蔽层，所述单芯线包括导体，其特征在于：所述同轴线的所述中心导体焊接于所述电路板的所述第一排垫片，所述单芯线的所述导体和所述同轴线的所述屏蔽层焊接于所述电路板的所述第二排垫片。
2.如权利要求1所述的线缆连接器组件，其特征在于：所述电路板还包括电子元件，所述电子元件至少部分地设置于所述电路板上的所述第一排垫片之间。
3.如权利要求1所述的线缆连接器组件，其特征在于：所述同轴线包括第一种同轴线及第二种同轴线，所述第一种同轴线的径向尺寸大于所述第二种同轴线的径向尺寸，所述第一种同轴线所传输信号的速率大于所述第二种同轴线所传输信号的速率。
4.如权利要求3所述的线缆连接器组件，其特征在于：所述第二种同轴线位于所述电路板上的所述第一种同轴线的外侧。
5.如权利要求1所述的线缆连接器组件，其特征在于：所述第二排垫片的左右两侧侧边向外延伸超出所述电路板的相应侧边。
6.如权利要求1所述的线缆连接器组件，其特征在于：所述电路板包括第一面和与所述第一面相反的第二面，所述第一面和所述第二面都包括所述第一排垫片和所述第二排垫片，所述同轴线和所述单芯线对称地设置的在所述电路板的第一面和第二面。
7.如权利要求1所述的线缆连接器组件，其特征在于：所述电连接器包括与对接连接器对接的对接端，所述对接端可以沿正反两个相反的方向与对接连接器对接。
8.一种线缆连接器组件的制造方法，其特征在于包括如下步骤：
提供电连接器；
提供可与电连接器电性连接的电路板，所述电路板包括第一排垫片及位于所述第一排垫片后并与第一排垫片隔开的第二排垫片；
提供线缆，所述线缆包括若干同轴线及单芯线，所述同轴线包括中心导体及屏蔽层，所述单芯线包括导体；
将所述同轴线的所述中心导体一次焊接于所述电路板的所述第一排垫片；
将所述同轴线的所述屏蔽层和所述单芯线的所述导体一次焊接于所述电路板的所述第二排垫片。
9.如权利要求8所述的线缆连接器组件的制造方法，其特征在于：提供理线块，所述理线块包括贯穿所述理线块的孔，在焊接前先将所述线缆固定于所述理线块的所述孔。
10.如权利要求9所述的线缆连接器组件的制造方法，其特征在于：所述电路板包括第一面和与所述第一面相反的第二面，所述第一面和所述第二面都包括所述第一排垫片和所述第二排垫片，所述同轴线和所述单芯线对称地设置的在所述电路板的所述第一面和所述第二面。
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