CN112390016A - Large-size wafer adsorption positioning device - Google Patents
Large-size wafer adsorption positioning device Download PDFInfo
- Publication number
- CN112390016A CN112390016A CN202011457020.3A CN202011457020A CN112390016A CN 112390016 A CN112390016 A CN 112390016A CN 202011457020 A CN202011457020 A CN 202011457020A CN 112390016 A CN112390016 A CN 112390016A
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- China
- Prior art keywords
- machine body
- threaded column
- electric cabinet
- integrated structure
- photoreceptor
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/915—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rotary movements only
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a large-size wafer adsorption positioning device, which comprises: the electric cabinet comprises a machine body, an electric cabinet and a first threaded column; an electric cabinet is arranged on the side part of the machine body, and the machine body and the electric cabinet are of an integrated structure; the support is arranged at the upper part of the electric cabinet, and the support and the electric cabinet are of an integrated structure; the first threaded column is arranged in the middle of the machine body and is of an integrated structure with the machine body; the laser is arranged in the middle of the machine body and is fixedly connected with the first threaded column through a nut; the second threaded column is arranged at the lower part of the support column, and the second threaded column and the support column are of an integrated structure; the photoreceptor is arranged at the lower part of the support column and is fixedly connected with the second threaded column through a nut; through the improvement of the existing device, the device has the advantages of high wafer positioning precision, difficulty in detection error and convenience in debugging and maintenance, thereby effectively solving the problems and the defects in the background technology.
Description
Technical Field
The invention relates to the technical field of wafer positioning, in particular to a large-size wafer adsorption positioning device.
Background
Wafer refers to a silicon wafer used for making silicon semiconductor circuits, the starting material of which is silicon. High-purity polycrystalline silicon is dissolved and then doped into silicon crystal seed crystals, the silicon crystal seed crystals are slowly pulled out to form cylindrical monocrystalline silicon, and silicon crystal rods are ground, polished and sliced to form silicon wafer wafers, namely wafers, wherein the current domestic wafer production line mainly comprises 8 inches and 12 inches.
In the wafer notch detection process, a special positioning device is usually needed to position the wafer notch, and then the wafer notch is detected by laser.
In view of this, research and improvement are made to solve the existing problems, and a large-sized wafer adsorption positioning device is provided, aiming at achieving the purpose of solving the problems and improving the practical value through the technology.
Disclosure of Invention
The invention aims to provide a large-size wafer adsorption positioning device to solve the problems and the defects that the conventional wafer positioning device in the background art has low positioning precision and all components are difficult to maintain.
In order to achieve the above object, the present invention provides a large-sized wafer adsorption positioning device, which is achieved by the following specific technical means:
the large-size wafer adsorption positioning device comprises; the device comprises a machine body, an electric cabinet, a control panel, a support column, a first groove, a first threaded column, a laser, a second groove, a second threaded column, a photoreceptor, a machine shell, a sucker pedestal, a vacuum sucker, an air valve assembly and a servo motor; an electric cabinet is arranged on the side part of the machine body, and the machine body and the electric cabinet are of an integrated structure; the control panel is arranged at the front part of the electric cabinet and is connected with the electric cabinet in an embedded mode; the support is arranged at the upper part of the electric cabinet, and the support and the electric cabinet are of an integrated structure; the first groove is arranged in the middle of the machine body; the first threaded column is arranged in the middle of the machine body and is of an integrated structure with the machine body; the laser is arranged in the middle of the machine body and is fixedly connected with the first threaded column through a nut; the second groove is arranged at the lower part of the strut; the second threaded column is arranged at the lower part of the support column, and the second threaded column and the support column are of an integrated structure; the photoreceptor is arranged at the lower part of the support column and is fixedly connected with the second threaded column through a nut; the shell is arranged on one side of the machine body, and the shell and the machine body are of an integrated structure; the sucker pedestal is arranged at the upper part of the shell and is of an integrated structure with the shell; the vacuum chuck is arranged in the middle of the chuck pedestal, and the lower part of the vacuum chuck is connected with an air valve assembly; the servo motor is arranged in the shell and connected with the vacuum chuck through a rotating shaft.
As a further optimization of the technical scheme, the large-size wafer adsorption positioning device body, the electric cabinet, the support column, the first threaded column, the second threaded column, the shell and the sucker pedestal are integrally formed by one-time turning and milling through a numerical control lathe.
As a further optimization of the technical scheme, the first groove of the large-size wafer adsorption positioning device is connected with the laser in a jogged mode.
As a further optimization of the technical scheme, the second groove of the large-size wafer adsorption positioning device is connected with the photoreceptor in an embedded mode.
As a further optimization of the technical scheme, the laser and the photoreceptor of the large-size wafer adsorption positioning device are both in a cuboid structure, and connecting plates with round holes are arranged at two ends of the laser and the photoreceptor.
As a further optimization of the technical scheme, the machine shell of the large-size wafer adsorption positioning device is of a rectangular structure, and the middle part of the machine shell is provided with a rectangular groove.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
1. according to the large-size wafer adsorption positioning device, the machine body, the electric cabinet, the support column, the first threaded column, the second threaded column, the machine shell and the sucker pedestal are integrally formed through one-time turning and milling by the numerical control lathe, so that the defects that a traditional positioning device needs multiple components for assembly and is easy to have assembly errors can be effectively overcome, the wafer positioning and notch detection precision can be effectively improved, meanwhile, the servo motor and the air valve component driven by the vacuum sucker are positioned in the machine shell, the front part of the machine shell is arranged in an open mode, the adjustment and maintenance of the machine shell are facilitated, and the use convenience is effectively improved.
2. The invention has the advantages of high wafer positioning precision, difficult detection error and convenient debugging and maintenance by improving the prior device, thereby effectively solving the problems and the defects of the invention in the background technology.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic front view of the present invention;
FIG. 3 is a schematic view of the body structure of the present invention;
FIG. 4 is a schematic view of the lower part of the strut according to the present invention;
FIG. 5 is a schematic view of a wafer placement structure according to the present invention.
In the figure: organism 1, electric cabinet 2, control panel 3, pillar 4, first recess 5, first screw thread post 6, laser instrument 7, second recess 8, second screw thread post 9, photoreceptor 10, casing 11, sucking disc pedestal 12, vacuum chuck 13, air valve assembly 14, servo motor 15.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
It is to be noted that, in the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention.
Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Meanwhile, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and "connected" should be interpreted broadly, for example, as being fixedly connected, detachably connected, or integrally connected; the connection can be mechanical connection or electrical connection; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 to 5, the present invention provides a specific technical embodiment of a large-sized wafer adsorbing and positioning device:
large-size wafer adsorbs positioner includes: the device comprises a machine body 1, an electric cabinet 2, a control panel 3, a support column 4, a first groove 5, a first threaded column 6, a laser 7, a second groove 8, a second threaded column 9, a photoreceptor 10, a machine shell 11, a sucker pedestal 12, a vacuum sucker 13, an air valve assembly 14 and a servo motor 15; an electric cabinet 2 is arranged on the side part of the machine body 1, and the machine body 1 and the electric cabinet 2 are of an integrated structure; the control panel 3 is arranged at the front part of the electric cabinet 2, and the control panel 3 is connected with the electric cabinet 2 in an embedded mode; the support 4 is arranged at the upper part of the electric cabinet 2, and the support 4 and the electric cabinet 2 are of an integrated structure; the first groove 5 is arranged in the middle of the machine body 1; the first threaded column 6 is arranged in the middle of the machine body 1, and the first threaded column 6 and the machine body 1 are of an integrated structure; the laser 7 is arranged in the middle of the machine body 1, and the laser 7 is fixedly connected with the first threaded column 6 through a nut; the second groove 8 is arranged at the lower part of the strut 4; the second threaded column 9 is arranged at the lower part of the support column 4, and the second threaded column 9 and the support column 4 are of an integrated structure; the photoreceptor 10 is arranged at the lower part of the support 4, and the photoreceptor 10 is fixedly connected with the second threaded column 9 through a nut; the casing 11 is arranged on one side of the machine body 1, and the casing 11 and the machine body 1 are of an integrated structure; the sucker pedestal 12 is arranged on the upper part of the casing 11, and the sucker pedestal 12 and the casing 11 are of an integral structure; the vacuum chuck 13 is arranged in the middle of the chuck pedestal 12, and the lower part of the vacuum chuck 13 is connected with an air valve assembly 14; the servo motor 15 is arranged inside the casing 11, and the servo motor 15 is connected with the vacuum chuck 13 through a rotating shaft.
Specifically, the whole of organism 1, electric cabinet 2, pillar 4, first screw post 6, second screw post 9, casing 11 and sucking disc pedestal 12 through the one-time turn-milling shaping of numerical control lathe, its whole need not the assembly, can eliminate because the precision error that the assembly produced, can improve the location and the detection precision of this device.
Specifically, the first groove 5 is connected with the laser 7 in a fitting manner, so that the mounting precision of the laser 7 can be improved, and the measurement error can be reduced.
Specifically, the second groove 8 is connected with the photoreceptor 10 in a fitting manner, so that the installation accuracy of the photoreceptor 10 is improved, and the measurement error is reduced.
Specifically, the laser 7 and the photoreceptor 10 are both in a rectangular parallelepiped structure, and both ends of the laser 7 and the photoreceptor 10 are provided with connecting plates with round holes, which are respectively used for connecting the first threaded column 6 and the second threaded column 8 to complete installation and fixation.
Specifically, casing 11 is the rectangle column structure, and the middle part of casing 11 is provided with the rectangle recess for installation pneumatic valve assembly 14 and servo motor 15 have the advantage of the debugging maintenance of being convenient for.
The method comprises the following specific implementation steps:
in use of the apparatus, the valve assembly 14 is used to connect to an air pump, and then a wafer is placed on top of the vacuum chuck 13, the vacuum sucker 13 is used for adsorption and positioning, then the servo motor 15 drives the vacuum sucker 13 to rotate slowly, the laser 7 and the photoreceptor 10 are started through the control panel 3, the wafer is detected, the laser penetrates through the wafer gap and is received by the photoreceptor 10, the positioning of the wafer gap is realized at the moment, the machine body 1, the electric cabinet 2, the support 4, the first threaded column 6, the second threaded column 9, the machine shell 11 and the sucker pedestal 12 in the device are formed by one-time turn-milling, the device has the advantages of high wafer positioning and gap detection precision, the air valve assembly 14 and the servo motor 15 which are driven by the vacuum chuck 13 are positioned in the shell 11, and the front part of the shell 11 is provided with an opening, so that the device is convenient to debug and maintain, and the use convenience is improved.
In summary, the following steps: this jumbo size wafer adsorbs positioner, through with the organism, the electric cabinet, the pillar, first screw thread post, the second screw thread post, casing and sucking disc pedestal are whole to be through the one-time turn-milling shaping of numerical control lathe, it can effectively reduce traditional positioner and need the multicomponent to assemble, the defect of assembly error easily exists, can effectively improve wafer location and breach detection precision, this device is used for vacuum chuck driven servo motor and air valve assembly to be located the inside of casing simultaneously, the front portion of casing is open setting, be convenient for adjust it and maintain, the effectual convenience that improves the use, the shortcoming that current wafer positioner has the positioning precision lower has been solved, the difficult problem of maintaining of each subassembly simultaneously.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. Large-size wafer adsorbs positioner includes: the device comprises a machine body (1), an electric cabinet (2), a control panel (3), a support column (4), a first groove (5), a first threaded column (6), a laser (7), a second groove (8), a second threaded column (9), a photoreceptor (10), a machine shell (11), a sucker pedestal (12), a vacuum sucker (13), an air valve assembly (14) and a servo motor (15); the method is characterized in that: an electric cabinet (2) is arranged on the side of the machine body (1), and the machine body (1) and the electric cabinet (2) are of an integrated structure; the control panel (3) is arranged at the front part of the electric cabinet (2), and the control panel (3) is connected with the electric cabinet (2) in an embedded mode; the support post (4) is arranged at the upper part of the electric cabinet (2), and the support post (4) and the electric cabinet (2) are of an integrated structure; the first groove (5) is arranged in the middle of the machine body (1); the first threaded column (6) is arranged in the middle of the machine body (1), and the first threaded column (6) and the machine body (1) are of an integrated structure; the laser (7) is arranged in the middle of the machine body (1), and the laser (7) is fixedly connected with the first threaded column (6) through a nut; the second groove (8) is arranged at the lower part of the strut (4); the second threaded column (9) is arranged at the lower part of the support column (4), and the second threaded column (9) and the support column (4) are of an integrated structure; the photoreceptor (10) is arranged at the lower part of the support column (4), and the photoreceptor (10) is fixedly connected with the second threaded column (9) through a nut; the machine shell (11) is arranged on one side of the machine body (1), and the machine shell (11) and the machine body (1) are of an integrated structure; the sucker pedestal (12) is arranged on the upper part of the shell (11), and the sucker pedestal (12) and the shell (11) are of an integrated structure; the vacuum sucker (13) is arranged in the middle of the sucker pedestal (12), and the lower part of the vacuum sucker (13) is connected with an air valve assembly (14); the servo motor (15) is arranged inside the casing (11), and the servo motor (15) is connected with the vacuum chuck (13) through a rotating shaft.
2. The large-size wafer adsorbing and positioning device as claimed in claim 1, wherein: the machine body (1), the electric cabinet (2), the support column (4), the first threaded column (6), the second threaded column (9), the machine shell (11) and the sucker pedestal (12) are integrally formed through one-time turning and milling by a numerical control lathe.
3. The large-size wafer adsorbing and positioning device as claimed in claim 1, wherein: the first groove (5) is connected with the laser (7) in a embedding manner.
4. The large-size wafer adsorbing and positioning device as claimed in claim 1, wherein: the second groove (8) is connected with the photoreceptor (10) in a fitting mode.
5. The large-size wafer adsorbing and positioning device as claimed in claim 1, wherein: the laser (7) and the photoreceptor (10) are both in a cuboid structure, and connecting plates with round holes are arranged at two ends of the laser (7) and the photoreceptor (10).
6. The large-size wafer adsorbing and positioning device as claimed in claim 1, wherein: the casing (11) is of a rectangular structure, and a rectangular groove is formed in the middle of the casing (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011457020.3A CN112390016A (en) | 2020-12-10 | 2020-12-10 | Large-size wafer adsorption positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011457020.3A CN112390016A (en) | 2020-12-10 | 2020-12-10 | Large-size wafer adsorption positioning device |
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| Publication Number | Publication Date |
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| CN112390016A true CN112390016A (en) | 2021-02-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011457020.3A Pending CN112390016A (en) | 2020-12-10 | 2020-12-10 | Large-size wafer adsorption positioning device |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06334026A (en) * | 1993-05-27 | 1994-12-02 | Nissin High Voltage Co Ltd | Wafer container with built-in orientation flat adjusting machine |
| CN202815412U (en) * | 2012-08-03 | 2013-03-20 | 中芯国际集成电路制造(北京)有限公司 | Pre-alignment mechanism of photoetching machine |
| CN103199048A (en) * | 2012-01-05 | 2013-07-10 | 沈阳新松机器人自动化股份有限公司 | Wafer prealignment control method |
| CN103811387A (en) * | 2012-11-08 | 2014-05-21 | 沈阳新松机器人自动化股份有限公司 | Wafer pre-alignment method and apparatus |
| CN104681475A (en) * | 2014-12-31 | 2015-06-03 | 上海新阳半导体材料股份有限公司 | Wafer location calibrating device |
| CN204857695U (en) * | 2015-07-16 | 2015-12-09 | 上海微松工业自动化有限公司 | High -efficient wafer prealignment controlling means |
| US20170365501A1 (en) * | 2016-06-15 | 2017-12-21 | Semiconductor Technologies And Instruments Pte Ltd | Apparatus and method for automatically setting, calibrating and monitoring or measuring pickup head position and force during component pickup operations |
| CN107768294A (en) * | 2017-11-01 | 2018-03-06 | 成都吱吖科技有限公司 | Wafer prealigning system positioning method, positioner and positioning circuit system |
| CN210854318U (en) * | 2019-08-22 | 2020-06-26 | 深圳市海创嘉科技有限公司 | Novel automatic burning machine of dish dress chip |
-
2020
- 2020-12-10 CN CN202011457020.3A patent/CN112390016A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06334026A (en) * | 1993-05-27 | 1994-12-02 | Nissin High Voltage Co Ltd | Wafer container with built-in orientation flat adjusting machine |
| CN103199048A (en) * | 2012-01-05 | 2013-07-10 | 沈阳新松机器人自动化股份有限公司 | Wafer prealignment control method |
| CN202815412U (en) * | 2012-08-03 | 2013-03-20 | 中芯国际集成电路制造(北京)有限公司 | Pre-alignment mechanism of photoetching machine |
| CN103811387A (en) * | 2012-11-08 | 2014-05-21 | 沈阳新松机器人自动化股份有限公司 | Wafer pre-alignment method and apparatus |
| CN104681475A (en) * | 2014-12-31 | 2015-06-03 | 上海新阳半导体材料股份有限公司 | Wafer location calibrating device |
| CN204857695U (en) * | 2015-07-16 | 2015-12-09 | 上海微松工业自动化有限公司 | High -efficient wafer prealignment controlling means |
| US20170365501A1 (en) * | 2016-06-15 | 2017-12-21 | Semiconductor Technologies And Instruments Pte Ltd | Apparatus and method for automatically setting, calibrating and monitoring or measuring pickup head position and force during component pickup operations |
| CN107768294A (en) * | 2017-11-01 | 2018-03-06 | 成都吱吖科技有限公司 | Wafer prealigning system positioning method, positioner and positioning circuit system |
| CN210854318U (en) * | 2019-08-22 | 2020-06-26 | 深圳市海创嘉科技有限公司 | Novel automatic burning machine of dish dress chip |
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Application publication date: 20210223 |
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