CN217453303U - Round edge device for quartz wafer production - Google Patents

Round edge device for quartz wafer production Download PDF

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Publication number
CN217453303U
CN217453303U CN202123380006.0U CN202123380006U CN217453303U CN 217453303 U CN217453303 U CN 217453303U CN 202123380006 U CN202123380006 U CN 202123380006U CN 217453303 U CN217453303 U CN 217453303U
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fixed
round edge
quartz wafer
supporting plate
wafer production
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CN202123380006.0U
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Chinese (zh)
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许开港
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Lianyungang Ruijing Quartz Material Co ltd
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Lianyungang Ruijing Quartz Material Co ltd
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Abstract

The utility model discloses a round edge device for quartz wafer production, which comprises a device body, wherein a hydraulic cylinder is arranged at the top of the device body, a round edge support is arranged on the lower surface of the inner wall of the top of the device body, a round edge head is arranged at the bottom of the round edge support, a transmission shaft is arranged at the bottom of the device body, and a control motor is fixedly connected to one side of the transmission shaft; through the transmission shaft of design, the control motor, the movable baffle, the carriage release lever is convenient for this quartz wafer production's round edge device in the use with the rotation motor, it rises to drive the movable baffle through the motor, then it rises to drive the rotating electrical machines, thereby accomplish the round edge processing that altitude mixture control is used for satisfying various model quartz wafers, avoid traditional artifical the wasting time and energy of polishing and the accidental injury risk that exists, when having reduced staff's work burden, staff's work efficiency has been strengthened, great promotion the convenience and the security when this round edge device uses.

Description

Round edge device for quartz wafer production
Technical Field
The utility model relates to a quartz wafer production technical field, more specifically say, relate to a round edge device for quartz wafer production.
Background
Quartz is one of the main rock-making minerals, generally referred to as low-temperature quartz, and is one of the most widely distributed minerals in the quartz family. The quartz in a broad sense also includes high temperature quartz, coesite, and the like. Colorless and transparent, often containing a small amount of impurity components, and become translucent or opaque crystals with hard texture. Quartz is a mineral resource with stable physical and chemical properties, and the crystal belongs to oxide minerals of trigonal systems. The quartz block is also called silica, and is mainly used as raw material for producing quartz sand (also called silica sand), as well as quartz refractory material and raw material for firing ferrosilicon. In the process of processing the quartz wafer, chamfering processing is generally required, and if the wafer is assembled, chamfering operation is not performed on the wafer, so that the edge of the wafer is sharp, operators are easily cut, and the assembly difficulty of the wafer is increased.
The existing round edge device for quartz wafer production is not easy to correct quartz wafers with different sizes when in use, so that the quartz wafers are easy to have larger errors when in round edges, the production quality and subsequent use of the quartz wafers are influenced, and the quartz wafers are fixed only by adopting a single fixing structure, so that the stability of the quartz wafers when in round edges is poor, and the deviation in the production process is easy to occur.
To the above problem, the utility model provides a round edge device for quartz wafer production.
SUMMERY OF THE UTILITY MODEL
1. Technical problem to be solved
An object of the utility model is to provide a round edge device for quartz wafer production to solve the problem that proposes among the above-mentioned background art.
2. Technical scheme
The utility model provides a round edge device for quartz chip production, includes the bottom plate, the upper surface fixed of bottom plate has first backup pad and second backup pad, the inboard fixed mounting at first backup pad top has driving motor, driving motor's output shaft end is fixed with first cylindricality gear, the upper surface of bottom plate is connected with the fixed column through the bearing rotation, the outside fixed cover of fixed column has cup jointed second cylindricality gear, and second cylindricality gear and first cylindricality gear intermeshing, the top of fixed column is fixed with the connecting seat, the top fixed mounting of connecting seat has round edge locating component, the inboard fixed mounting at second backup pad top has fixed subassembly, and fixed subassembly is used for fixing quartz chip on round edge locating component, round edge locating component is used for handling quartz chip round edge.
Preferably, the round edge positioning assembly comprises a supporting plate, the supporting plate is fixedly installed at the top of the connecting seat, a rotating rod penetrates through the axis of the supporting plate, the joint of the supporting plate and the rotating rod is rotatably connected through a bearing, and a plurality of rectangular frame plates distributed in a circular array are fixed on the upper surface of the supporting plate.
Preferably, a first bevel gear is fixed at the top end of the rotating rod, a handle is fixed at the bottom end of the rotating rod, a threaded screw rod is rotatably connected between the opposite inner walls of the rectangular frame plates through a bearing, a second bevel gear is fixed at one end of the threaded screw rod, and the second bevel gears are meshed with the first bevel gear.
Preferably, threaded connection has the slider on the screw lead screw, slider and the inner wall sliding fit of rectangle framed lamella, the top of slider is fixed with the spliced pole, the top fixed mounting of spliced pole has the mill, and a plurality of the mill is circular array distribution.
Preferably, a fixed plate is fixed on the tops of the rectangular frame plates, a support column is rotatably connected to the axis of the upper surface of the fixed plate through a bearing, and a first clamping plate is fixed to the top end of the support column.
Preferably, the fixed subassembly includes air pump and two electric push rods, and two electric push rods set up about the air pump symmetry, the equal fixed mounting of air pump and electric push rod is in the second backup pad, the fixed intercommunication of air inlet end of air pump has the gas-supply pipe, the fixed intercommunication of the other end of gas-supply pipe has the sucking disc, two the output end fixed mounting of electric push rod has the second splint.
Preferably, the second splint are fixedly sleeved outside the sucker opening, an air inlet pipe is fixedly penetrated on the air delivery pipe, and a valve is arranged on the air inlet pipe.
3. Advantageous effects
Compared with the prior art, the utility model has the advantages of:
1. the handle is screwed to drive the first bevel gear to rotate, so that the first bevel gear is meshed with the second bevel gears to drive the plurality of threaded screw rods to synchronously rotate, the threaded screw rods adjust the positions of the polishing disks in a screw rod transmission mode, the plurality of polishing disks are utilized to correct the positions of the quartz wafers, the quartz wafers can be tightly attached to the polishing disks when the round edges are processed, and the better polished round edges are processed.
2. Promote the second splint through two electric push rods and move down for the second splint mutually supports with first splint, can carry out preliminary centre gripping to quartz wafer, and the sucking disc moves down along with the second splint, starts the air pump and can be discharged the inside partial air of sucking disc, makes the inside negative pressure state that is of sucking disc, thereby holds quartz wafer, makes quartz wafer by further reinforcement, ensures quartz wafer's stability when the round edge, thereby promotes quartz wafer's round edge quality and precision.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural diagram of the driving motor, the first cylindrical gear, the fixed column and the second cylindrical gear of the present invention;
FIG. 3 is a schematic structural view of the middle round edge positioning assembly of the present invention;
FIG. 4 is a schematic view of a part of the structure of the middle round edge positioning assembly of the present invention;
FIG. 5 is a schematic structural view of the middle screw lead screw, the slider, the connecting post and the polishing disc of the present invention;
fig. 6 is a schematic structural view of the middle fixing assembly of the present invention.
The numbering in the figures illustrates: 1. a base plate; 2. a first support plate; 3. a second support plate; 4. a drive motor; 5. a first cylindrical gear; 6. fixing a column; 7. a second cylindrical gear; 8. a connecting seat; 9. a support plate; 10. a rotating rod; 11. a handle; 12. a first bevel gear; 13. a rectangular frame plate; 14. a threaded lead screw; 15. a second bevel gear; 16. a slider; 17. connecting columns; 18. grinding disc; 19. a fixing plate; 20. a pillar; 21. a first splint; 22. an air pump; 23. an electric push rod; 24. a gas delivery pipe; 25. a suction cup; 26. a second splint; 27. an air inlet pipe.
Detailed Description
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "sleeved/connected", "connected", and the like are to be understood in a broad sense, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-6, the present invention provides a technical solution:
the utility model provides a round edge device for quartz wafer production, comprising a base plate 1, the last fixed surface of bottom plate 1 has first backup pad 2 and second backup pad 3, the inboard fixed mounting at 2 tops of first backup pad has driving motor 4, driving motor 4's output shaft end is fixed with first cylindricality gear 5, the upper surface of bottom plate 1 is connected with fixed column 6 through bearing rotation, the fixed cover in outside of fixed column 6 has connect second cylindricality gear 7, and second cylindricality gear 7 and first cylindricality gear 5 intermeshing, the top of fixed column 6 is fixed with connecting seat 8, the top fixed mounting of connecting seat 8 has round edge locating component, the inboard fixed mounting at 3 tops of second backup pad has fixed subassembly, and fixed subassembly is used for fixing quartz wafer on round edge locating component, round edge locating component is used for handling quartz wafer round edge.
Utilize driving motor 4 to drive first cylindricality gear 5 and rotate for first cylindricality gear 5 and the meshing of second cylindricality gear 7 drive round edge locating component and rotate, carry out the round edge to the quartz wafer after fixed subassembly and handle.
Further, the round edge positioning assembly comprises a supporting plate 9, the supporting plate 9 is fixedly installed at the top of the connecting seat 8, a rotating rod 10 penetrates through the axis of the supporting plate 9, the joint of the supporting plate 9 and the rotating rod 10 is rotatably connected through a bearing, a plurality of rectangular frame plates 13 distributed in a circular array are fixed on the upper surface of the supporting plate 9, a fixing plate 19 is fixed on the tops of the rectangular frame plates 13, a supporting column 20 is rotatably connected at the axis of the upper surface of the fixing plate 19 through a bearing, a first clamping plate 21 is fixed at the top end of the supporting column 20, a first bevel gear 12 is fixed at the top end of the rotating rod 10, a handle 11 is fixed at the bottom end of the rotating rod 10, a threaded lead screw 14 is rotatably connected between the opposite inner walls of the rectangular frame plates 13 through a bearing, a second bevel gear 15 is fixed at one end of the threaded lead screw 14, the second bevel gears 15 are all meshed with the first bevel gear 12, and a sliding block 16 is connected on the threaded lead screw 14, the slider 16 is in sliding fit with the inner wall of the rectangular frame plate 13, a connecting column 17 is fixed at the top of the slider 16, a polishing disc 18 is fixedly installed at the top end of the connecting column 17, and the polishing discs 18 are distributed in a circular array.
Twist and move handle 11 and drive first conical gear 12 and rotate, make first conical gear 12 and a plurality of second conical gear 15 meshing, drive a plurality of screw lead screws 14 synchronous rotations, make screw lead screw 14 adjust the position of polishing dish 18 with screw rod transmission's mode, utilize a plurality of polishing dishes 18 to carry out the correction of position to quartz wafer, and make quartz wafer closely laminate with polishing dish 18 when the round edge is handled, control driving motor 4 and drive first cylindricality gear 5 and rotate, make first cylindricality gear 5 and second cylindricality gear 7 meshing, drive layer board 9 and a plurality of polishing dishes 18 on it rotate, carry out the round edge to quartz wafer and handle.
Further, the fixing component comprises an air pump 22 and two electric push rods 23, the two electric push rods 23 are symmetrically arranged about the air pump 22, the air pump 22 and the electric push rods 23 are both fixedly installed on the second support plate 3, an air inlet end of the air pump 22 is fixedly communicated with an air pipe 24, the other end of the air pipe 24 is fixedly communicated with a sucker 25, an output end of the two electric push rods 23 is fixedly provided with a second clamping plate 26, the second clamping plate 26 is fixedly sleeved outside an opening of the sucker 25, an air inlet pipe 27 penetrates through and is fixedly arranged on the air pipe 24, a valve is arranged on the air inlet pipe 27, the two electric push rods 23 are controlled to push the second clamping plate 26 to move downwards, so that the second clamping plate 26 is matched with the first clamping plate 21, the quartz wafer is preliminarily clamped, the sucker 25 moves downwards along with the second clamping plate 26, the air pump 22 is started to discharge partial air inside the sucker 25, the sucker 25 is in a negative pressure state, and the quartz wafer is sucked, so that the quartz wafer is further reinforced, after the round edge of the quartz wafer is finished, the valve on the air inlet pipe 27 is opened, the internal air pressure of the suction cup 25 is recovered to be the same as the external air pressure, and then the two electric push rods 23 can be controlled to drive the second clamping plate 26 to move upwards, so that the quartz wafer behind the round edge can be taken down.
The components referred to in the present invention are prior art and can be implemented completely by those skilled in the art without redundancy, nor does the present invention relate to improvements to the internal structure and method.
The working principle is as follows: a quartz wafer to be processed is placed on a first clamping plate 21, a handle 11 is screwed to drive a first bevel gear 12 to rotate, the first bevel gear 12 is meshed with a plurality of second bevel gears 15, a plurality of threaded lead screws 14 are driven to synchronously rotate, the threaded lead screws 14 adjust the positions of polishing discs 18 in a lead screw transmission mode, the quartz wafer is corrected by the aid of the polishing discs 18, two electric push rods 23 are controlled to push second clamping plates 26 to move downwards, the second clamping plates 26 are matched with the first clamping plates 21 to preliminarily clamp the quartz wafer, a suction cup 25 moves downwards along with the second clamping plates 26, an air pump 22 is started to exhaust partial air inside the suction cup 25, the suction cup 25 is in a negative pressure state to suck the quartz wafer, the quartz wafer is further reinforced, a driving motor 4 is controlled to drive a first cylindrical gear 5 to rotate, the first cylindrical gear 5 is meshed with a second cylindrical gear 7, the supporting plate 9 and a plurality of polishing discs 18 on the supporting plate are driven to rotate, and the quartz wafer is processed with round edges until the round edge processing is finished.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (7)

1. A round edge device for quartz wafer production, characterized in that: the quartz wafer edge positioning device comprises a bottom plate (1), wherein a first supporting plate (2) and a second supporting plate (3) are fixed on the upper surface of the bottom plate (1), a driving motor (4) is fixedly installed on the inner side of the top of the first supporting plate (2), a first cylindrical gear (5) is fixed at the output shaft end of the driving motor (4), a fixed column (6) is rotatably connected to the upper surface of the bottom plate (1) through a bearing, a second cylindrical gear (7) is fixedly sleeved outside the fixed column (6), the second cylindrical gear (7) is meshed with the first cylindrical gear (5), a connecting seat (8) is fixed at the top end of the fixed column (6), a round edge positioning component is fixedly installed at the top of the connecting seat (8), a fixing component is fixedly installed on the inner side of the top of the second supporting plate (3), and the fixing component is used for fixing a quartz wafer on the round edge positioning component, the round edge positioning assembly is used for processing the round edge of the quartz wafer.
2. A round edge apparatus for quartz wafer production as set forth in claim 1, wherein: the round edge positioning assembly comprises a supporting plate (9), the supporting plate (9) is fixedly installed at the top of the connecting seat (8), a rotating rod (10) penetrates through the axis center of the supporting plate (9), the combination position of the supporting plate (9) and the rotating rod (10) is rotatably connected through a bearing, and a plurality of rectangular frame plates (13) distributed in a circular array are fixed on the upper surface of the supporting plate (9).
3. A round edge apparatus for quartz wafer production as set forth in claim 2, wherein: the top of bull stick (10) is fixed with first conical gear (12), the bottom mounting of bull stick (10) has handle (11), rotate through the bearing between the relative inner wall of rectangle framed panel (13) and be connected with screw lead screw (14), and the one end of screw lead screw (14) is fixed with second conical gear (15), and is a plurality of second conical gear (15) all with first conical gear (12) intermeshing.
4. A round edge apparatus for quartz wafer production as set forth in claim 3, wherein: threaded connection has slider (16) on screw lead screw (14), the inner wall sliding fit of slider (16) and rectangle deckle board (13), the top of slider (16) is fixed with spliced pole (17), the top fixed mounting of spliced pole (17) has the mill dish (18), and is a plurality of the mill dish (18) are circular array and distribute.
5. A round edge apparatus for quartz wafer production as set forth in claim 2, wherein: the top of a plurality of rectangular frame plates (13) is fixed with a fixing plate (19), the axle center of the upper surface of the fixing plate (19) is rotatably connected with a supporting column (20) through a bearing, and the top end of the supporting column (20) is fixed with a first clamping plate (21).
6. A round edge apparatus for quartz wafer production as set forth in claim 1, wherein: fixed subassembly includes air pump (22) and two electric push rod (23), and two electric push rod (23) set up about air pump (22) symmetry, equal fixed mounting in second backup pad (3) of air pump (22) and electric push rod (23), the fixed intercommunication of air inlet end of air pump (22) has air-supply pipe (24), the fixed intercommunication of the other end of air-supply pipe (24) has sucking disc (25), two the output fixed mounting of electric push rod (23) has second splint (26).
7. A round edge apparatus for quartz wafer production as set forth in claim 6, wherein: the fixed cover of second splint (26) is connected in the outside of the uncovered department of sucking disc (25), run through on gas-supply pipe (24) and be fixed with intake pipe (27), be provided with the valve on intake pipe (27).
CN202123380006.0U 2021-12-29 2021-12-29 Round edge device for quartz wafer production Active CN217453303U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116276629A (en) * 2023-05-19 2023-06-23 连云港浩尔晶电子有限公司 Multi-station quartz wafer grinding device and application method thereof
CN116766029A (en) * 2023-08-02 2023-09-19 苏州博宏源机械制造有限公司 Wafer clamping type edge polishing device and process thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116276629A (en) * 2023-05-19 2023-06-23 连云港浩尔晶电子有限公司 Multi-station quartz wafer grinding device and application method thereof
CN116276629B (en) * 2023-05-19 2023-11-07 连云港浩尔晶电子有限公司 Multi-station quartz wafer grinding device and application method thereof
CN116766029A (en) * 2023-08-02 2023-09-19 苏州博宏源机械制造有限公司 Wafer clamping type edge polishing device and process thereof

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