CN206148414U - Integrated circuit wafer is aligning device in advance - Google Patents
Integrated circuit wafer is aligning device in advance Download PDFInfo
- Publication number
- CN206148414U CN206148414U CN201621145743.9U CN201621145743U CN206148414U CN 206148414 U CN206148414 U CN 206148414U CN 201621145743 U CN201621145743 U CN 201621145743U CN 206148414 U CN206148414 U CN 206148414U
- Authority
- CN
- China
- Prior art keywords
- wafer
- rotating shaft
- base plate
- slide unit
- alignment device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a IC -manufacture field, purpose provide an integrated circuit wafer is aligning device in advance. An integrated circuit wafer is aligning device in advance, includes: the bottom plate, integrated circuit wafer is aligning device in advance still include: the wafer rotating device who is equipped with the pivot and is connected with the bottom plate, the upper end be equipped with supporting vacuum chuck and with the wafer supporting plate that the pivot upper end is connected, change shaft drive, be located the wafer profile scanner outside the wafer supporting plate, be equipped with the wafer transposition manipulator that wafer transposition fixing coiled. This integrated circuit wafer is aligning device in advance makes wafer go into the position back can not the throw off in X, Y direction and counterpoint breach position, improves wafer cutting efficiency and precision. Integrated circuit wafer is aligning device in advance's counterpoint method in advance can satisfy make the wafer go into the position back can not the throw off in X, Y direction and counterpoint breach position, improve the needs of wafer cutting efficiency and precision.
Description
Technical field
The utility model is related to IC manufacturing field, especially a kind of pre- alignment device of IC wafers.
Background technology
A kind of IC wafers of the disclosure of the invention of Chinese Patent Application No. CN200910254048.4 and a kind of collection
Into circuit method for cutting wafer.IC wafers comprising wafer substrate, multiple integrated circuits, multiple feeler switch, protective layer with
And a plurality of groove；Integrated circuit is formed on wafer substrate in matrix distribution mode；Feeler switch be respectively formed in integrated circuit it
Between；Protective layer covers the side of the integrated circuit of wafer substrate；Groove is formed in the way of self-shield layer surface is extended downwardly
Between integrated circuit and feeler switch.Integrated circuit wafer cutting method is included：Integrated circuit and survey are formed on wafer substrate
Examination key；Form protective layer；Form a plurality of groove；And external force is applied in protective layer in the region folded by two grooves adjacent side by side,
Wafer substrate is made along two lattice separation of at least one of bottom of adjacent trenches down along wafer substrate side by side.Wafer gusset
Contraposition breach is provided with, the wafer position before cutting is random；Wafer by wafer manipulator be transported to cutting bed enter position cut when,
Exist wafer enter behind position X, Y-direction and contraposition breach orientation be also easy to produce error, cause adjust wafer position trouble and reduce
The deficiency of wafer cutting accuracy；Therefore, a kind of wafer of design to enter and will not produce mistake in X, Y-direction and contraposition breach orientation behind position
Difference, improves the pre- alignment device of IC wafers of wafer cutting efficiency and precision, becomes problem demanding prompt solution.
Utility model content
The purpose of this utility model is to enter position cutting to overcome current wafer to be transported to cutting bed by wafer manipulator
When, exist wafer enter behind position X, Y-direction and contraposition breach orientation be also easy to produce error, cause adjust wafer position trouble and drop
The deficiency of low wafer cutting accuracy, there is provided a kind of wafer to enter and will not produce error in X, Y-direction and contraposition breach orientation behind position, carries
The pre- alignment device of IC wafers of high wafer cutting efficiency and precision.
Concrete technical scheme of the present utility model is：
A kind of pre- alignment device of IC wafers, including：Base plate；The pre- alignment device of described IC wafers is also wrapped
Include：The wafer tumbler for being provided with rotating shaft and being connected with base plate, upper end is provided with supporting vacuum cup and is connected with rotating shaft upper end
Wafer supporting disk, rotating shaft driving means, the wafer profile scanner on the outside of wafer supporting disk is provided with wafer indexing fixing disk
Wafer position rotating mechanical hand.The pre- alignment device of IC wafers drives dress by controller control, wafer profile scanner, rotating shaft
Put and be connected with controller signals respectively with wafer position rotating mechanical hand；When wafer is aligned in advance, wafer indexing fixing disk fixes gusset
The wafer of contraposition breach is provided with, wafer is put into wafer supporting disk by the indexing fixing disk motion of wafer position rotating mechanical hand-drive wafer
On, supporting vacuum cup adsorbs wafer；Rotating shaft driving means Jing rotating shaft, wafer supporting disk and supporting vacuum cup drive wafer
Rotate, wafer profile scanner persistently scans and record the marginal position and breach orientation of wafer in wafer rotation process, and
Transmit a signal to controller, controller is calculated the offset and breach orientation of crystal circle center and rotating shaft rotation axis and lacks
The deviation of mouth direction initialization, rotating shaft driving means Jing rotating shaft, wafer supporting disk and supporting vacuum cup drive wafer to rotate will be right
Position breach rotates to the orientation of setting, and supporting vacuum cup adsorbs wafer, and controller controls wafer position rotating mechanical hand by wafer
Center be adjusted to and rotating shaft rotation axis coincident, and drive fixing disk body motion, the wafer for completing pre- contraposition is transported to and is cut
The ceding of Taiwan accurately enters position.The pre- alignment device of the IC wafers enters wafer will not in X, Y-direction and contraposition breach orientation behind position
Error is produced, wafer cutting efficiency and precision is improved.
Preferably, described wafer tumbler includes：The axle sleeve that lower end is connected with base plate upper end, is provided with consolidating for mesopore
Determine screw, rotary pneumatic joint；Base plate is provided with the shaft hole connected with inner hole of shaft sleeve；Rotating shaft is provided with the through hole at insertion two ends；Rotating shaft
With axle sleeve pivot joint and the lower end of rotating shaft is connected through shaft hole with rotary pneumatic joint；One end of the screw rod of fixing screws passes through wafer
Supporting disk is connected with rotating shaft threaded upper ends and mesopore is connected with through hole.Wafer tumbler compact conformation；Rotary pneumatic joint make with
The connecting tube of vacuum plant does not produce winding.
Preferably, described base plate is provided with motor axis hole；Rotating shaft driving means include：The stepping being connected with base plate upper end
Motor, active synchronization belt wheel, the driven synchronous pulley for being enclosed within outside rotating shaft lower end and being connected with rotating shaft, respectively with active synchronization belt wheel
With the Timing Belt of driven synchronous belt pulley transmission connection；The output shaft of stepper motor connects through motor axis hole with active synchronization belt wheel
Connect.Rotating shaft driving device structure is simple, high precision.
Preferably, described wafer position rotating mechanical hand is electric three-dimensional slide unit；Electric three-dimensional slide unit includes：On base plate
The X of end connection is to electric linear slide unit, the Y-direction electric linear slide unit being connected to the slide block of electric linear slide unit with X, with Y-direction electricity
The Z-direction electric linear slide unit of the slide block connection of dynamic straight line slide unit；Wafer indexing fixing disk includes：With Z-direction electric linear slide unit
The fixed block of slide block connection, the fixing disk body that lower end is provided with indexing vacuum sucker and upper end is connected with fixed block；On fixing disk body
End is provided with inlet suction port.Wafer position rotating mechanical hand is electric three-dimensional slide unit high precision and automatically controls beneficial to controller is improved.
Preferably, described wafer profile scanner is surface profiling analyzer；Surface profiling analyzer includes：On lower end and base plate
The riser of end connection, one end illuminating part relative with wafer supporting disk gusset, one end is relative with wafer supporting disk gusset and is located at
Light accepting part above illuminating part；The other end of illuminating part and the other end of light accepting part are connected respectively with riser.Wafer profile scan
Instrument is surface profiling analyzer, general part and high precision.
Preferably, described wafer profile scanner is the two-dimensional laser profile scanner being connected with base plate upper end.It is brilliant
Circle contour scanner is two-dimensional laser profile scanner, general part and high precision.
Compared with prior art, the beneficial effects of the utility model are：The pre- alignment device of the IC wafers makes wafer
Enter and will not produce error in X, Y-direction and contraposition breach orientation behind position, improve wafer cutting efficiency and precision.Wafer tumbler
Compact conformation；Rotary pneumatic joint makes not producing winding with the connecting tube of vacuum plant.Rotating shaft driving device structure is simple, precision
It is high.Wafer position rotating mechanical hand is electric three-dimensional slide unit high precision and automatically controls beneficial to controller is improved.Wafer profile scanner
For surface profiling analyzer or two-dimensional laser profile scanner, general part and high precision.
Description of the drawings
Fig. 1 is the structural representation of the utility model embodiment 1；
Fig. 2 is the structural representation of the utility model embodiment 2；
Fig. 3 is the structural representation of wafer tumbler.
In figure：Base plate 1, rotating shaft 2, supporting vacuum cup 3, wafer supporting disk 4, axle sleeve 5, mesopore 6, fixing screws 7, rotation
Gas joint 8, through hole 10, stepper motor 12, active synchronization belt wheel 13, driven synchronous pulley 14, Timing Belt 15, electric three-dimensional slide unit
16th, X inhales to electric linear slide unit 17, Y-direction electric linear slide unit 18, Z-direction electric linear slide unit 19, fixed block 20, indexing vacuum
Disk 21, fixing disk body 22, inlet suction port 23, surface profiling analyzer 24, riser 25, illuminating part 26, light accepting part 27, two-dimensional laser profile
Scanner 28, contraposition breach 29, wafer 30.
Specific embodiment
It is shown below in conjunction with the accompanying drawings that the utility model is described further.
Embodiment 1, as shown in accompanying drawing 1, accompanying drawing 3：A kind of pre- alignment device of IC wafers, including：Base plate 1, is provided with
Rotating shaft 2 and the wafer tumbler being connected with base plate 1, upper end is provided with supporting vacuum cup 3 and the wafer being connected with the upper end of rotating shaft 2
Supporting disk 4, rotating shaft driving means, positioned at the wafer profile scanner in the outside of wafer supporting disk 4, are provided with wafer indexing fixing disk
Wafer position rotating mechanical hand.
In the present embodiment, described wafer tumbler includes：Lower end and the axle sleeve 5 of the upper end mode connects for screw of base plate 1, are provided with
The fixing screws 7 of mesopore 6, rotary pneumatic joint 8；Base plate 1 is provided with the shaft hole connected with the endoporus of axle sleeve 5（It is not drawn in accompanying drawing）；
Rotating shaft 2 is provided with the through hole 10 at insertion two ends；Rotating shaft 2 passes through the lower end of bearing hinge joint and rotating shaft 2 through shaft hole and rotation with axle sleeve 5
Turn gas joint 8 to be threadedly coupled；One end of the screw rod of fixing screws 7 through wafer supporting disk 4 be connected with the threaded upper ends of rotating shaft 2 and in
Hole 6 connects with through hole 10.
Described base plate 1 is provided with motor axis hole（It is not drawn in accompanying drawing）；Rotating shaft driving means include：With the upper end spiral shell of base plate 1
The stepper motor 12 of nail connection, active synchronization belt wheel 13 is enclosed within driven Timing Belt outside the lower end of rotating shaft 2 and bonded with rotating shaft 2
Wheel 14, the Timing Belt 15 being connected with active synchronization belt wheel 13 and driven synchronous pulley 14 respectively；The output of stepper motor 12
Axle is bonded with the wheel 13 of active synchronization band 15 through motor axis hole.
Described wafer position rotating mechanical hand is electric three-dimensional slide unit 16；Electric three-dimensional slide unit 16 includes：With the upper end spiral shell of base plate 1
The X of nail connection to electric linear slide unit 17, with Y-direction electric linear slide unit from X to the slide block mode connects for screw of electric linear slide unit 17
18, the Z-direction electric linear slide unit 19 with the slide block mode connects for screw of Y-direction electric linear slide unit 18；Wafer indexing fixing disk includes：With
The fixed block 20 of the slide block mode connects for screw of Z-direction electric linear slide unit 19, lower end is provided with indexing vacuum sucker 21 and upper end and fixation
The fixing disk body 22 of the front end mode connects for screw of block 20；Fixing disk body 22 upper end is provided with inlet suction port 23.
Described wafer profile scanner is surface profiling analyzer 24；Surface profiling analyzer 24 includes：Lower end and the upper end spiral shell of base plate 1
The riser 25 of nail connection, one end illuminating part 26 relative with the gusset of wafer supporting disk 4, one end is relative with the gusset of wafer supporting disk 4
And positioned at the light accepting part 27 of the top of illuminating part 26；The other end of illuminating part 26 and the other end of light accepting part 27 respectively with the spiral shell of riser 25
Nail connection.
The pre- alignment device of IC wafers is by controller control；Rotary pneumatic joint 8 and inlet suction port 23 respectively with vacuum
Device is connected.
The pre- alignment method of the pre- alignment device of IC wafers, the pre- alignment device of IC wafers is by controller control
System, wafer profile scanner, rotating shaft driving means and electric three-dimensional slide unit are connected respectively with controller signals；Step one, indexing
Vacuum cup 21 adsorbs the wafer 30 that gusset is provided with contraposition breach 29, and 16 Jing fixed blocks of electric three-dimensional slide unit 20 drive fixing disk
Body 22 moves and wafer is put on wafer supporting disk 4, and the illuminating part 26 and light accepting part of surface profiling analyzer 24 are stretched in the side of wafer
Between 27, indexing vacuum sucker 21 releases vacuum and departs from wafer, and supporting vacuum cup 3 adsorbs wafer；Step 2, rotating shaft
The Jing active synchronizations belt wheel 13, Timing Belt 15 of stepper motor 12 of driving means, driven synchronous pulley 14, rotating shaft 2, wafer supporting disk
4 drive wafer to rotate with supporting vacuum cup 3, and wafer profile scanner persistently scans and record wafer in wafer rotation process
Marginal position and contraposition breach orientation, and send the edge position information for receiving and contraposition breach azimuth information to control
Device is processed, the Jing active synchronizations belt wheel 13, Timing Belt 15 of stepper motor 12 of controller control rotating shaft driving means, driven same
Step belt wheel 14, rotating shaft 2, wafer supporting disk 4 and supporting vacuum cup 3 drive wafer to rotate, will contraposition breach orientation rotation to setting
Fixed orientation；Step 3, controller be calculated crystal circle center and the rotation axis of rotating shaft 2 offset, determine crystal circle center with
Angle between the line and the rotation axis of rotating shaft 2 at contraposition breach midpoint and the line at contraposition breach midpoint；Step 4, electronic three
Dimension slide unit 16 drives the fixing motion of disk body 22 to make indexing vacuum sucker 21 adsorb wafer, and supporting vacuum cup 3 releases vacuum, control
Device control electric three-dimensional slide unit 16 processed is adjusted to the center of wafer and the rotation axis coincident of rotating shaft 2；Step 5, electric three-dimensional is slided
Platform 16 drives fixing disk body 22 to move, and the wafer for completing pre- contraposition is transported to into cutting bed and accurately enters position.
Embodiment 2, as shown in accompanying drawing 2, accompanying drawing 3：A kind of pre- alignment device of IC wafers, including：Base plate 1, is provided with
Rotating shaft 2 and the wafer tumbler being connected with base plate 1, upper end is provided with supporting vacuum cup 3 and the wafer being connected with the upper end of rotating shaft 2
Supporting disk 4, rotating shaft driving means, positioned at the wafer profile scanner in the outside of wafer supporting disk 4, are provided with wafer indexing fixing disk
Wafer position rotating mechanical hand.
In the present embodiment, described wafer tumbler includes：Lower end and the axle sleeve 5 of the upper end mode connects for screw of base plate 1, are provided with
The fixing screws 7 of mesopore 6, rotary pneumatic joint 8；Base plate 1 is provided with the shaft hole connected with the endoporus of axle sleeve 5；Rotating shaft 2 is provided with insertion two
The through hole 10 at end；The lower end that rotating shaft 2 passes through bearing hinge joint and rotating shaft 2 with axle sleeve 5 connects through shaft hole with the screw thread of rotary pneumatic joint 8
Connect；One end of the screw rod of fixing screws 7 is connected with the threaded upper ends of rotating shaft 2 through wafer supporting disk 4 and mesopore 6 connects with through hole 10
It is logical.
Described base plate 1 is provided with motor axis hole；Rotating shaft driving means include：Stepping electricity with the upper end mode connects for screw of base plate 1
Machine 12, active synchronization band 15 wheel 13, be enclosed within the lower end of rotating shaft 2 outside and the driven Timing Belt 15 bonded with rotating shaft 2 take turns 14, respectively with
The Timing Belt 15 that active synchronization is connected with 15 wheels 13 and the wheel of driven Timing Belt 15 14；The output shaft of stepper motor 12 is through electricity
Crankshaft bore is bonded with the wheel 13 of active synchronization band 15.
Described wafer position rotating mechanical hand is electric three-dimensional slide unit 16；Electric three-dimensional slide unit 16 includes：With the upper end spiral shell of base plate 1
The X of nail connection to electric linear slide unit 17, with Y-direction electric linear slide unit from X to the slide block mode connects for screw of electric linear slide unit 17
18, the Z-direction electric linear slide unit 19 with the slide block mode connects for screw of Y-direction electric linear slide unit 18；Wafer indexing fixing disk includes：With
The fixed block 20 of the slide block mode connects for screw of Z-direction electric linear slide unit 19, lower end is provided with indexing vacuum sucker 21 and upper end and fixation
The fixing disk body 22 of the lower end mode connects for screw of block 20；Fixing disk body 22 upper end is provided with inlet suction port 23.
Described wafer profile scanner is the two-dimensional laser profile scanner 28 with the upper end mode connects for screw of base plate 1.
The pre- alignment device of IC wafers is by controller control；Rotary pneumatic joint 8 and inlet suction port 23 respectively with vacuum
Device is connected.
The pre- alignment method of the pre- alignment device of IC wafers, the pre- alignment device of IC wafers is by controller control
System, wafer profile scanner, rotating shaft driving means and electric three-dimensional slide unit are connected respectively with controller signals；Step one, indexing
Vacuum cup 21 adsorbs the wafer 30 that gusset is provided with contraposition breach 29, and 16 Jing fixed blocks of electric three-dimensional slide unit 20 drive fixing disk
Body 22 moves and wafer is put on wafer supporting disk 4, and the side of wafer is located at the upside of two-dimensional laser profile scanner 28, and indexing is true
Suction disk 21 releases vacuum and departs from wafer, and supporting vacuum cup 3 adsorbs wafer；Step 2, the step of rotating shaft driving means
The Jing active synchronizations belt wheel 13, Timing Belt 15 of stepper motor 12, driven synchronous pulley 14, rotating shaft 2, wafer supporting disk 4 and supporting vacuum
Sucker 3 drives wafer to rotate, and wafer profile scanner persistently scans and record the marginal position of wafer in wafer rotation process
With contraposition breach orientation, and the edge position information for receiving and contraposition breach azimuth information are sent at controller
Reason, controller controls the Jing active synchronizations belt wheel 13, Timing Belt 15 of stepper motor 12, the driven synchronous pulley of rotating shaft driving means
14th, rotating shaft 2, wafer supporting disk 4 and supporting vacuum cup 3 drive wafer to rotate, by the side of contraposition breach orientation rotation to setting
Position；Step 3, controller is calculated the offset of crystal circle center and the rotation axis of rotating shaft 2, determines that crystal circle center lacks with contraposition
Angle between the line and the rotation axis of rotating shaft 2 at mouth midpoint and the line at contraposition breach midpoint；Step 4, electric three-dimensional slide unit
16 drive the fixing motion of disk body 22 to make indexing vacuum sucker 21 adsorb wafer, and supporting vacuum cup 3 releases vacuum, controller control
Electric three-dimensional slide unit 16 processed is adjusted to the center of wafer and the rotation axis coincident of rotating shaft 2；Step 5, electric three-dimensional slide unit 16 drives
Dynamic fixing disk body 22 is moved, and the wafer for completing pre- contraposition is transported to into cutting bed and accurately enters position.
The beneficial effects of the utility model are：The pre- alignment device of the IC wafers makes wafer enter behind position in X, Y-direction
And contraposition breach orientation will not produce error, improve wafer cutting efficiency and precision.Wafer tumbler compact conformation；Rotary pneumatic
Joint makes not producing winding with the connecting tube of vacuum plant.Rotating shaft driving device structure is simple, high precision.Wafer position rotating mechanical hand
Automatically control for electric three-dimensional slide unit high precision and beneficial to controller is improved.Wafer profile scanner is surface profiling analyzer or two dimension
Laser profile scanner, general part and high precision.
It is apparent to one skilled in the art that the utility model can change into various ways, and such change is not
Think to depart from scope of the present utility model.All such technical staff to the field obviously change, and will include
Within the scope of present claims.
Claims (6)
1. the pre- alignment device of a kind of IC wafers, including：Base plate；It is characterized in that, described IC wafers are aligned in advance
Device also includes：The wafer tumbler for being provided with rotating shaft and being connected with base plate, upper end be provided with supporting vacuum cup and with rotating shaft on
The wafer supporting disk of end connection, rotating shaft driving means, the wafer profile scanner on the outside of wafer supporting disk is provided with wafer and turns
The wafer position rotating mechanical hand of position fixing disk.
2. the pre- alignment device of IC wafers according to claim 1, is characterized in that：Described wafer tumbler bag
Include：The axle sleeve that lower end is connected with base plate upper end, is provided with the fixing screws of mesopore, rotary pneumatic joint；Base plate is provided with and inner hole of shaft sleeve
The shaft hole of connection；Rotating shaft is provided with the through hole at insertion two ends；The lower end of rotating shaft and axle sleeve pivot joint and rotating shaft is through shaft hole and rotation
Turn the connection of gas joint；One end of the screw rod of fixing screws is connected and mesopore and through hole through wafer supporting disk with rotating shaft threaded upper ends
Connection.
3. the pre- alignment device of IC wafers according to claim 2, is characterized in that：Described base plate is provided with motor shaft
Hole；Rotating shaft driving means include：The stepper motor being connected with base plate upper end, active synchronization belt wheel, be enclosed within outside rotating shaft lower end and with
The driven synchronous pulley of rotating shaft connection, the Timing Belt being connected with active synchronization belt wheel and driven synchronous belt pulley transmission respectively；Stepping
The output shaft of motor is connected through motor axis hole with active synchronization belt wheel.
4. the pre- alignment device of IC wafers according to claim 1 or 2 or 3, is characterized in that：Described wafer indexing
Manipulator is electric three-dimensional slide unit；Electric three-dimensional slide unit includes：The X being connected with base plate upper end to electric linear slide unit, with X to electricity
The Y-direction electric linear slide unit of the slide block connection of dynamic straight line slide unit is electronic with the Z-direction that the slide block of Y-direction electric linear slide unit is connected straight
Line slide unit；Wafer indexing fixing disk includes：The fixed block being connected with the slide block of Z-direction electric linear slide unit, lower end is provided with indexable true
The fixing disk body that suction disk and upper end are connected with fixed block；Fixing disk body upper end is provided with inlet suction port.
5. the pre- alignment device of IC wafers according to claim 1 or 2 or 3, is characterized in that：Described wafer profile
Scanner is surface profiling analyzer；Surface profiling analyzer includes：The riser that lower end is connected with base plate upper end, one end and wafer supporting disk side
Enclose relative illuminating part, one end is relative with wafer supporting disk gusset and light accepting part above illuminating part；Illuminating part it is another
The other end of end and light accepting part is connected respectively with riser.
6. the pre- alignment device of IC wafers according to claim 1 or 2 or 3, is characterized in that：Described wafer profile
Scanner is the two-dimensional laser profile scanner being connected with base plate upper end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621145743.9U CN206148414U (en) | 2016-10-21 | 2016-10-21 | Integrated circuit wafer is aligning device in advance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621145743.9U CN206148414U (en) | 2016-10-21 | 2016-10-21 | Integrated circuit wafer is aligning device in advance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206148414U true CN206148414U (en) | 2017-05-03 |
Family
ID=58623545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621145743.9U Active CN206148414U (en) | 2016-10-21 | 2016-10-21 | Integrated circuit wafer is aligning device in advance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206148414U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106486406A (en) * | 2016-10-21 | 2017-03-08 | 杭州长川科技股份有限公司 | The pre- alignment device of IC wafers and pre- alignment method |
| CN112820682A (en) * | 2021-01-08 | 2021-05-18 | 杭州长川科技股份有限公司 | Wafer conveying mechanism and wafer testing equipment |
-
2016
- 2016-10-21 CN CN201621145743.9U patent/CN206148414U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106486406A (en) * | 2016-10-21 | 2017-03-08 | 杭州长川科技股份有限公司 | The pre- alignment device of IC wafers and pre- alignment method |
| CN112820682A (en) * | 2021-01-08 | 2021-05-18 | 杭州长川科技股份有限公司 | Wafer conveying mechanism and wafer testing equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106486406B (en) | The pre- alignment device of IC wafers and pre- alignment method | |
| CN206148414U (en) | Integrated circuit wafer is aligning device in advance | |
| CN102689239B (en) | Full-symmetrical type five-axis cutter sharpener | |
| JP2008124292A (en) | Wafer positioning jig of processing apparatus | |
| CN104959908B (en) | A kind of optical fiber and lithium niobate crystal chip Pneumatic Pressure grinding mechanism and Ginding process | |
| CN103376673B (en) | Pre-alignment device and pre-alignment method | |
| CN106041133B (en) | A kind of universality off-resonance elliptical vibration cutting flexible apparatus of adjustable angle | |
| CN208409461U (en) | A kind of high-precision lighting glass edge polisher | |
| CN207497012U (en) | A kind of full visual field contraposition film pasting mechanism | |
| CN108655871A (en) | A kind of adjustable glass edge-grinding machine | |
| CN204078688U (en) | A kind of Handling device of silica crucible | |
| CN107393855B (en) | Wafer positioning device and method | |
| CN204214795U (en) | The directed sizing machine of the automatic X-ray of a kind of pole crystal | |
| CN108217179A (en) | A kind of multi-angle carrying mechanism | |
| CN206564241U (en) | A kind of diode turns to positioner | |
| CN113644013B (en) | Die bonding system and method for integrated circuit chip | |
| CN206501006U (en) | Glass three-point fix device and glass grinding system | |
| CN106625235B (en) | Glass three-point fix device and glass grinding system | |
| JP2007203432A (en) | Grinding device and method for substrate | |
| CN209111513U (en) | A kind of vacuum laminator | |
| CN207946054U (en) | The measuring device of cylindric workpiece verticality and slope | |
| CN220641672U (en) | Optical glass processing and transferring equipment | |
| CN212810261U (en) | Wafer positioning device | |
| CN105773491A (en) | Positioning fixture for assembling curved-surface thin plate type parts | |
| CN111710639A (en) | Alignment device for preparing non-silicon-based thin film device with high-density array structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |