CN212810261U

CN212810261U - Wafer positioning device

Info

Publication number: CN212810261U
Application number: CN202022126366.7U
Authority: CN
Inventors: 戚孝峰; 周鹏程; 王哲琦
Original assignee: Zhengfeng Semiconductor Technology Suzhou Co ltd
Current assignee: Zhengfeng Semiconductor Technology Suzhou Co ltd
Priority date: 2020-09-24
Filing date: 2020-09-24
Publication date: 2021-03-26
Anticipated expiration: 2030-09-24

Abstract

The utility model relates to a wafer positioner, comprises an operation bench, the vertical link up of operation panel upper surface has seted up the regulation mouth, the vertical bearing platform that is used for placing the wafer that is equipped with in the regulation mouth, be equipped with the cavity in the operation panel, be equipped with in the cavity and be used for driving the adjusting part that the bearing platform removed along the horizontal plane, be equipped with the control assembly who is used for detecting the wafer position and controls the adjusting part operation on the operation panel. The wafer taking device has the advantages of improving accuracy of the wafer in taking and improving wafer processing quality.

Description

Wafer positioning device

Technical Field

The application relates to the field of wafer processing equipment, in particular to a wafer positioning device.

Background

Wafer refers to a silicon wafer used for making semiconductor circuits, the starting material of which is silicon. After the silicon crystal bar is ground, polished and sliced, a silicon wafer, namely a wafer, is formed. A serial number, namely a wafer ID (wafer ID), is arranged on the surface of the wafer in the production process and is mainly used for identifying the information of the wafer; a Flat corner called Flat or a small circular opening called Notch is cut on the wafer to facilitate subsequent positioning.

After the wafer is initially produced, the processing processes such as information identification, sorting, etching and the like need to be carried out, and the wafer needs to be accurately placed on an operation table. In the prior art, a manipulator is generally used for taking a wafer, and the wafer is basically designed into a circular special shape and is easy to displace, so that when the manipulator takes the wafer out of a wafer box and places the wafer on an operation table, certain position deviation is generated, the manipulator cannot accurately take the wafer up again, and subsequent processing procedures are affected.

In view of the above related technologies, the inventor considers that it is necessary to design a device with precise positioning, so as to perform the processing process of the rest of processes more efficiently and accurately on the wafer, and improve the quality of wafer processing.

SUMMERY OF THE UTILITY MODEL

In order to improve the accuracy of wafer positioning and improve the wafer processing quality, the application provides a wafer positioning device.

The application provides a wafer positioning device adopts following technical scheme:

the utility model provides a wafer positioner, includes the operation panel, the vertical regulation mouth that has seted up that link up of operation panel upper surface, the vertical bearing platform that is used for placing the wafer that is equipped with in the regulation mouth, be equipped with the cavity in the operation panel, be equipped with in the cavity and be used for driving the adjusting part that the bearing platform removed along the horizontal plane, be equipped with the control assembly who is used for detecting the wafer position and controls the adjusting part operation on the operation panel.

Through adopting above-mentioned technical scheme, the manipulator is placed the wafer when the bearing platform, utilize the control assembly to detect out the concrete position of wafer, and compare with the standard position of wafer, reachs the concrete position error of wafer, the control assembly turns into control signal transmission with the error value that reachs and gives the adjusting part, thereby make adjusting part control bearing platform move along the horizontal plane, the position of final accurate adjustment wafer, make wafer and standard position coincide, when follow-up manipulator takes, the accuracy when guaranteeing to take, improve the accuracy in the follow-up manufacturing procedure, thereby improve processingquality.

Optionally, the adjusting assembly includes an X track horizontally arranged, an X platform slidably arranged on the X track, a vertical plate vertically arranged on the upper surface of the X platform, a Y track arranged on the vertical plate, and a Y platform slidably arranged on the Y track, the length direction of the X track is perpendicular to the Y track, the supporting table is connected with the Y platform, an X driving assembly for driving the X platform to slide is arranged in the cavity, and a Y driving assembly for driving the Y slider to slide is arranged in the cavity.

Through adopting above-mentioned technical scheme, provided a concrete structure of adjusting part, during the use, utilize X drive assembly to drive the X platform and slide along the orbital length direction of X, utilize Y drive assembly to drive the Y platform and slide along the orbital length direction of Y, and then make the bearing platform along each direction displacement of horizontal plane, further drive the wafer and remove, accomplish the adjustment of wafer position.

Optionally, the X driving assembly includes an X driving motor disposed at the bottom of the cavity, an X lead screw forming belt transmission with the X driving motor, an X moving block threaded on an outer side wall of the X lead screw, and an X connecting block disposed on the X moving block, a length direction of the X lead screw is parallel to a length direction of the X track, and the X connecting block is fixedly connected to the X platform.

Through adopting above-mentioned technical scheme, provide a concrete structure of X drive assembly, during the use, start X driving motor, drive the X lead screw and rotate, the X movable block slides along the length direction of X lead screw, and then drives the X platform and slides along the orbital length direction of X.

Optionally, the Y driving assembly includes a Y driving motor arranged on the vertical plate, a Y lead screw coaxially and fixedly arranged on an output shaft of the Y driving motor, a Y moving block sleeved on an outer side wall of the Y lead screw through a thread, and a Y connecting block arranged on the Y moving block, a length direction of the Y lead screw is parallel to a length direction of the Y track, and the Y connecting block is fixedly connected with the Y platform.

Through adopting above-mentioned technical scheme, provide a specific structure of Y drive assembly, during the use, start Y driving motor, drive the Y lead screw and rotate, and then drive the Y movable block and slide along the orbital length direction of Y, and then drive the Y platform and slide along the orbital length direction of Y, the position adjustment of each position of Y platform horizontal plane is accomplished along the removal of X track length direction to make the more timely accurate adjustment of wafer to the standard position.

Optionally, the supporting platform is rotatably arranged on the Y platform, the control assembly includes a notch detector arranged on the upper surface of the operating platform and a PLC module electrically connected with the notch detector, and the PLC module is electrically connected with the X driving motor and the Y driving motor respectively.

Through adopting above-mentioned technical scheme, provide a concrete structure of control assembly, the manipulator is after placing the wafer on the bearing platform, the bearing platform rotates, the detector detects out the position error of wafer, and turn into the signal of telecommunication with the position error and give the PLC module, the PLC module carries out the analysis and processing back, calculate the difference between the centre of a circle and the standard position centre of a circle of wafer, then send control signal to X driving motor and Y driving motor, after X driving motor and Y driving motor received the signal, open and stop as the case requires, and then control the motion of X platform and Y platform respectively, further accomplish the adjustment of wafer position.

Optionally, be equipped with drive bearing platform pivoted rotating assembly on the Y platform, rotating assembly includes that the level sets up fixed plate on the Y platform, vertical rotation sets up the bearing rod on the fixed plate, sets up driven synchronizing wheel, the vertical rotating electrical machines that sets up on the fixed plate on bearing rod circumference lateral wall, sets up the initiative synchronizing wheel at the rotating electrical machines output shaft tip, form the belt transmission between initiative synchronizing wheel and the driven synchronizing wheel, bearing platform fixed connection is on the top of bearing rod.

Through adopting above-mentioned technical scheme, a rotating assembly's concrete structure is provided, during the use, starts the rotating electrical machines, drives the initiative synchronizing wheel and rotates, and then drives hold-in range and driven synchronizing wheel and rotate, and then drives the bearing pole and rotate, finally drives the bearing platform and rotates.

Optionally, the operating table upper surface is equipped with the ID detector, the bottom of ID detector is equipped with the base, the base can be dismantled and connect on the operating table.

By adopting the technical scheme, the ID detector can identify the Wafer ID on the surface of the Wafer when the Wafer is positioned, and the ID detector transmits the detected information to the mechanical arm, so that the mechanical arm can identify, sort and the like different wafers, the wafers can enter subsequent processing procedures more accurately, and the production quality is improved.

Optionally, a kidney-shaped groove is vertically arranged on the upper surface of the base in a penetrating manner, the length direction of the kidney-shaped groove is arranged through the circle center of the supporting platform, and the base is in threaded connection with the upper surface of the operating platform.

By adopting the technical scheme, when the wafers with different sizes are detected, the position of the base can be adjusted, so that the ID detector can well detect the Wafer ID of the Wafer, and the detection precision is improved.

Optionally, the bearing rod is vertically communicated with an air suction cavity, a cavity is vertically communicated with the bearing platform, the air suction cavity is communicated with the cavity, and an adsorption groove is formed in the upper surface of the bearing platform.

Through adopting above-mentioned technical scheme, when placing the wafer, to breathing in chamber intercommunication breathing pipe to produce the adsorption affinity on cavity and adsorption tank, and then make the more stable placing of wafer on the cushion cap, and then reduce the secondary displacement that the wafer takes place when adjusting the position, improved the accuracy of wafer location.

In summary, the present application includes at least one of the following beneficial technical effects:

1. by arranging the adjusting port, the supporting platform, the control assembly and the adjusting assembly, after the wafer is placed on the supporting platform by the manipulator, the control assembly detects the position of the wafer and controls the adjusting assembly to adjust the position of the wafer, so that the circle center of the wafer is concentric with that of the standard position, the manipulator can take out the wafer more accurately, the accuracy of subsequent processing is improved, and the processing quality is improved;

2. the adjusting process of the wafer is efficiently and quickly realized through the X track, the X platform, the Y track, the Y platform and the rotating assembly;

3. through setting up the ID detector, when the cushion cap is rotatory, the Wafer ID that the ID detector can detect out the Wafer transmits for the manipulator for the information of Wafer can be known to the manipulator timely accurate, thereby improves the precision of processing operations such as the subsequent sequencing of manipulator, improves production quality.

Drawings

FIG. 1 is a schematic view of the overall structure of the positioning device;

FIG. 2 is a schematic view mainly illustrating the internal structure of the adjustment assembly;

FIG. 3 is a schematic diagram showing the structure of the X drive assembly;

FIG. 4 is a schematic view mainly illustrating the structure of the Y drive assembly;

FIG. 5 is a schematic view of the structure primarily used to show the rotating assembly;

FIG. 6 is a cross-sectional view of the support bar and support table along its axis;

fig. 7 is a schematic diagram mainly showing a control module and a control principle thereof.

Description of reference numerals: 1. an operation table; 2. an adjustment port; 3. a support platform; 4. an adjustment assembly; 41. an X track; 42. an X stage; 43. a vertical plate; 44. a Y track; 45. a Y stage; 5. a control component; 51. a notch detector; 52. a PLC module; 6. an X drive assembly; 61. driving a motor by X; 62. an X lead screw; 63. an X moving block; 64. an X connecting block; 7. a Y drive component; 71. a Y drive motor; 72. a Y screw rod; 73. a Y moving block; 74. y connecting blocks; 8. a rotating assembly; 81. a fixing plate; 82. a support rod; 83. a driven synchronizing wheel; 84. a rotating electric machine; 85. a driving synchronizing wheel; 9. an ID detector; 10. a base; 11. a waist-shaped groove; 12. an air suction cavity; 121. a cavity; 13. an adsorption tank; 14. an X fixed block; 15. and a Y fixing block.

Detailed Description

The present application is described in further detail below with reference to figures 1-7.

Referring to fig. 1, a wafer positioning apparatus is disclosed in an embodiment of the present application. This positioner includes the operation panel 1 that the level set up, is equipped with the cavity in the operation panel 1, and the vertical regulation mouth 2 of seting up the rectangle form that link up of operation panel 1 upper surface vertically is equipped with the cushion cap 3 that is used for placing the wafer in the regulation mouth 2.

Referring to fig. 2, an adjusting assembly 4 for moving the supporting platform 3 along a horizontal plane is disposed in the cavity. The adjusting assembly 4 comprises an X rail 41 horizontally arranged at the bottom of the cavity, an X platform 42 slidably arranged on the X rail 41, a vertical plate 43 vertically and fixedly arranged on one side of the length direction of the upper surface of the X platform 42, a Y rail 44 fixedly connected to the vertical plate 43, and a Y platform 45 slidably arranged on the Y rail 44, wherein the length direction of the X rail 41 is perpendicular to the Y rail 44, the length direction of the X rail 41 is parallel to the width direction of the operating platform, the length direction of the Y rail 44 is parallel to the length direction of the operating platform, and the length direction of the vertical plate 43 is parallel to the length direction of the X platform 42. In the present embodiment, the X rail 41 and the Y rail 44 are dovetail grooves, the X stage 42 is slidably provided on the X rail 41 by an X slider, and the Y stage 45 is slidably provided on the Y rail 44 by a Y slider.

Referring to fig. 3, an X driving assembly 6 for driving the X platform 42 to slide is arranged in the cavity, and the X driving assembly 6 includes an X driving motor 61 arranged at the bottom of the cavity, an X lead screw 62 forming belt transmission with the X driving motor 61, an X moving block 63 threaded on the outer side wall of the X lead screw 62, and an X connecting block 64 arranged on the X moving block 63. The length direction of the X lead screw 62 is parallel to the length direction of the X track 41, X fixed blocks 14 are fixedly arranged at two ends of the bottom of the cavity in the length direction of the X lead screw 62, and the X lead screw 62 is rotatably arranged on the two X fixed blocks 14 through a bearing. The X connection block 64 is bolted to the X stage 42, and the X connection block 64 is also bolted to the X movement block 63.

Referring to fig. 4, a Y driving assembly 7 for driving the Y slider to slide is arranged in the cavity, the Y driving assembly 7 includes a Y driving motor 71 fixedly arranged on the vertical plate 43, a Y lead screw 72 coaxially and fixedly arranged on an output shaft of the Y driving motor 71, a Y moving block 73 threadedly sleeved on an outer side wall of the Y lead screw 72, and a Y connecting block 74 arranged on the Y moving block 73, a length direction of the Y lead screw 72 is parallel to a length direction of the Y track 44, and the Y connecting block 74 is fixedly connected with the Y platform 45. The Y-shaped fixing blocks 15 are fixedly arranged at two ends of the vertical side face of the vertical plate 43 in the length direction of the Y-shaped screw rod 72, and the Y-shaped screw rod 72 is rotatably arranged on the two Y-shaped fixing blocks 15 through bearings.

Referring to fig. 5, be equipped with drive bearing platform 3 pivoted rotating assembly 8 on the Y platform 45, rotating assembly 8 includes the fixed plate 81 of the fixed setting on Y platform 45 of level, set up bearing rod 82 on fixed plate 81 through the vertical rotation of bearing, the driven synchronizing wheel 83 of setting on bearing rod 82 circumference lateral wall, vertical rotating electrical machines 84 that sets up on fixed plate 81 and the initiative synchronizing wheel 85 of setting at rotating electrical machines 84 output shaft tip, form the belt drive between initiative synchronizing wheel 85 and the driven synchronizing wheel 83, bearing platform 3 fixed connection is on the top of bearing rod 82. Thereby realizing the function of rotating the supporting platform 3.

Referring to fig. 5 and 6, the bearing rod 82 is vertically and coaxially provided with an air suction cavity 12 in a penetrating manner, a cavity 121 is vertically and coaxially provided in the bearing platform 3 in a penetrating manner, and the upper surface of the bearing platform 3 is provided with an adsorption groove 13. When a wafer is placed, the suction pipe is connected to the suction chamber 12, so that a suction force is generated in the chamber 121 and the suction groove 13, and the wafer is more stably placed on the susceptor 3.

Referring to fig. 7, the control unit 5 includes a notch detector 51 provided on the upper surface of the operation table 1 and a PLC module 52 electrically connected to the notch detector 51, and the PLC module 52 is electrically connected to an X drive motor 61 and a Y drive motor 71, respectively.

After a wafer is placed on the supporting table 3 by the manipulator, the supporting table 3 rotates, the position error of the wafer is detected by the notch detector 51, the position error is converted into an electric signal and transmitted to the PLC module 52, the PLC module 52 analyzes and processes the electric signal, the difference between the circle center of the wafer and the circle center of the standard position is calculated, then control signals are sent to the X driving motor 61 and the Y driving motor 71, the X driving motor 61 and the Y driving motor 71 start and stop according to the situation after receiving the signals, then the movement of the X platform 42 and the movement of the Y platform 45 are controlled respectively, and the adjustment of the position of the wafer is further completed.

Referring to fig. 1, an ID detector 9 is provided on the upper surface of the operation table 1, and the ID detector 9 may be a high-definition camera in the present embodiment. The bottom of the ID detector 9 is provided with a base 10, the base 10 is detachably connected to the operating platform 1, the upper surface of the base 10 is vertically provided with a kidney-shaped groove in a penetrating mode, the length direction of the kidney-shaped groove is arranged through the circle center of the supporting platform 3, and the base 10 is in threaded connection with the upper surface of the operating platform. The setting enables the position of the base 10 to be adjusted by changing the position of the bolted connection of the kidney-shaped groove, and the position of the ID detector 9 is further adjusted, further enabling the ID detector 9 to better adapt to the information identification function of wafers of different sizes.

The implementation principle of the wafer positioning device in the embodiment of the application is as follows: the manipulator places the wafer on the bearing platform 3, provides suction force in the suction cavity and fixes the wafer on the bearing platform 3 in an adsorption manner;

then, the rotating assembly 8 is used for driving the supporting platform 3 to rotate, the notch detector 51 converts the position error into an electric signal through detecting a notch or a notch on the surface of the wafer and transmits the electric signal to the PLC module 52, the PLC module 52 calculates the difference between the circle center of the wafer and the circle center of the standard position after analyzing and processing, and then sends control signals to the X driving motor 61 and the Y driving motor 71;

after receiving the signals, the X driving motor 61 and the Y driving motor 71 start and stop according to the situation, so as to respectively control the movement of the X platform 42 and the movement of the Y platform 45, further drive the wafer to carry out position adjustment in the adjusting opening 2, and finally coincide with the standard position, so that the subsequent mechanical arm can be held more accurately;

in the process of wafer rotation, the ID detector 9 detects and records the information of the wafer, and transmits the information to the manipulator, so that subsequent sequencing and other operations are facilitated.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A wafer positioning device comprises an operation table (1), and is characterized in that: the utility model discloses a wafer cleaning device, including operation panel (1), adjusting port (2) has been seted up to vertical lining up of operation panel (1) upper surface, the vertical bearing platform (3) that are used for placing the wafer that are equipped with in adjusting port (2), be equipped with the cavity in operation panel (1), be equipped with in the cavity and be used for driving bearing platform (3) along adjusting part (4) of horizontal plane removal, be equipped with on operation panel (1) and be used for detecting wafer position and control adjusting part (4) control assembly (5) of operation.

2. The wafer positioning apparatus of claim 1, wherein: the adjusting assembly (4) comprises an X track (41) horizontally arranged, an X platform (42) slidably arranged on the X track (41), a vertical plate (43) vertically arranged on the upper surface of the X platform (42), a Y track (44) arranged on the vertical plate (43) and a Y platform (45) slidably arranged on the Y track (44), wherein the length direction of the X track (41) is vertical to the Y track (44), the bearing platform (3) is connected with the Y platform (45), an X driving assembly (6) used for driving the X platform (42) to slide is arranged in the cavity, and a Y driving assembly (7) used for driving the Y sliding block to slide is arranged in the cavity.

3. The wafer positioning apparatus of claim 2, wherein: the X driving assembly (6) comprises an X driving motor (61) arranged at the bottom of the cavity, an X lead screw (62) with transmission formed between the X driving motor (61), an X moving block (63) sleeved on the outer side wall of the X lead screw (62) in a threaded manner, and an X connecting block (64) arranged on the X moving block (63), wherein the length direction of the X lead screw (62) is parallel to the length direction of the X track (41), and the X connecting block (64) is fixedly connected with the X platform (42).

4. The wafer positioning apparatus of claim 2, wherein: the Y driving assembly (7) comprises a Y driving motor (71) arranged on the vertical plate (43), a Y lead screw (72) coaxially and fixedly arranged on an output shaft of the Y driving motor (71), a Y moving block (73) and a Y connecting block (74), wherein the Y moving block (73) is arranged on the outer side wall of the Y lead screw (72) in a threaded manner, the Y connecting block (74) is arranged on the Y moving block (73), the length direction of the Y lead screw (72) is parallel to the length direction of the Y track (44), and the Y connecting block (74) is fixedly connected with the Y platform (45).

5. The wafer positioning apparatus of claim 1, wherein: the bearing platform (3) is rotatably arranged on the Y platform (45), the control assembly (5) comprises a notch detector (51) arranged on the upper surface of the operating platform (1) and a PLC module (52) electrically connected with the notch detector (51), and the PLC module (52) is respectively electrically connected with the X driving motor (61) and the Y driving motor (71).

6. The wafer positioning apparatus of claim 5, wherein: be equipped with drive bearing platform (3) pivoted rotating assembly (8) on Y platform (45), rotating assembly (8) set up fixed plate (81) on Y platform (45) including the level, vertical rotation sets up bearing rod (82) on fixed plate (81), set up driven synchronizing wheel (83) on bearing rod (82) circumference lateral wall, vertical rotating electrical machines (84) of setting on fixed plate (81), set up initiative synchronizing wheel (85) at rotating electrical machines (84) output shaft tip, form the belt drive between initiative synchronizing wheel (85) and driven synchronizing wheel (83), bearing platform (3) fixed connection is on the top of bearing rod (82).

7. The wafer positioning apparatus of claim 1, wherein: the operating table is characterized in that an ID detector (9) is arranged on the upper surface of the operating table (1), a base (10) is arranged at the bottom of the ID detector (9), and the base (10) is detachably connected to the operating table (1).

8. The wafer positioning apparatus of claim 7, wherein: the upper surface of the base (10) is vertically provided with a kidney-shaped groove in a penetrating mode, the length direction of the kidney-shaped groove is arranged through the circle center of the bearing platform (3), and the base (10) is in threaded connection with the upper surface of the operating platform.

9. The wafer positioning apparatus of claim 6, wherein: the bearing rod (82) is vertically provided with an air suction cavity (12) in a penetrating mode, a cavity (121) is vertically arranged in the bearing platform (3) in a penetrating mode, the air suction cavity (12) is communicated with the cavity (121), and an adsorption groove (13) is formed in the upper surface of the bearing platform (3).