CN112382696B - 一种新型晶硅SiON双面电池背钝化工艺 - Google Patents
一种新型晶硅SiON双面电池背钝化工艺 Download PDFInfo
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- 238000002161 passivation Methods 0.000 title claims abstract description 20
- 238000000034 method Methods 0.000 title claims abstract description 15
- 229910052814 silicon oxide Inorganic materials 0.000 title claims abstract description 11
- 229910021419 crystalline silicon Inorganic materials 0.000 title claims abstract description 8
- 239000010410 layer Substances 0.000 claims abstract description 32
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 21
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 20
- 239000010703 silicon Substances 0.000 claims abstract description 20
- 238000000137 annealing Methods 0.000 claims abstract description 18
- 239000007789 gas Substances 0.000 claims abstract description 12
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 11
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000002356 single layer Substances 0.000 claims abstract description 7
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 3
- 238000000151 deposition Methods 0.000 claims description 22
- 230000008021 deposition Effects 0.000 claims description 19
- 239000013078 crystal Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 3
- 229910020286 SiOxNy Inorganic materials 0.000 description 17
- 229910020776 SixNy Inorganic materials 0.000 description 12
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 4
- 101001073212 Arabidopsis thaliana Peroxidase 33 Proteins 0.000 description 2
- 101001123325 Homo sapiens Peroxisome proliferator-activated receptor gamma coactivator 1-beta Proteins 0.000 description 2
- 102100028961 Peroxisome proliferator-activated receptor gamma coactivator 1-beta Human genes 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006388 chemical passivation reaction Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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Abstract
本发明涉及太阳能电池生产领域,特别涉及双面太阳能电池生产领域。一种新型晶硅SiON双面电池背钝化工艺,在背面晶硅基体上直接制备氮氧化硅层,然后在进行退火,最后再制备氮化硅层;氮氧化硅层为单层膜,采用PECVD的方式沉积,工艺参数为,压力1500‑2000mTorr,温度450‑500℃,功率为8500‑12000W,脉冲开关比为1:10至1:16,所通SiH4/NH3/N2O=1.65/1/4至2.5/1/5,且三种气体SiH4、NH3、N2O总流量需大于7000sccm,时间40‑60s。本发明不仅有效降低了双面电池的背面钝化制造成本,同时创造性的解决钝化SiON膜层变薄后钝化效果变差的问题。
Description
技术领域
本发明涉及太阳能电池生产领域,特别涉及双面太阳能电池生产领域。
背景技术
当前,在单晶PERC双面电池的制备工艺中,背面钝化技术是关键的技术难点,不同钝化方式的选择,直接影响电池的制造成本。这其中,氧化铝是应用比较广泛的背钝化技术,主要原因为其制备工艺简单且转换效率较高。氮氧化硅作为另外一种背面钝化技术,电池转换效率与氧化铝相当,但制造成本较低。将氮氧化硅应用于双面电池时,需要考虑背面光子利用率,背膜厚度有所减薄,从而导致氮氧化硅钝化效果变差。
发明内容
本发明所要解决的技术问题是:如何提供一种晶硅SiON双面电池背钝化工艺,其正面安常规单面晶硅电池钝化工艺生产,背面采用新型工业,使得该单面晶硅电池背面效率得到提高。
本发明所采用的技术方案是:一种新型晶硅SiON双面电池背钝化工艺,在背面晶硅基体上直接制备氮氧化硅层,然后在进行退火,最后再制备氮化硅层;氮氧化硅层为单层膜,采用PECVD的方式沉积,工艺参数为,压力1500-2000mTorr,温度450-500℃,功率为8500-12000W,脉冲开关比为1:10至1:16,所通SiH4/NH3/N2O=1.65/1/4至2.5/1/5,且三种气体SiH4、NH3、N2O总流量需大于7000sccm,时间40-60s;退火时工艺参数,压力1500-1800mTorr,温度400-450℃,功率为8000-10000W,脉冲开关比1:10至1:16, 所通N2O/NH3 =0.5/1至1/1,时间300-500s;氮化硅层采用PECVD的方式沉积,工艺参数为,压力1500-2000mTorr,温度450-500℃,功率为7000-13500W,脉冲开关比为1:15至1:17.5,所通SiH4/NH3 =1/4至1/10,时间为720-820s,与氮氧化硅接触的第一层氮化硅膜沉积功率为7000-9000W。
氮氧化硅层的折射率为1.7-2.0,厚度为3-10nm,氮化硅层的折射率为2.1-2.3,厚度为65-85nm,氮化硅层为一层或多层,叠层总厚度为,75-95nm。
本发明的有益效果是:本发明不仅有效降低了双面电池的背面钝化制造成本,同时创造性的解决钝化SiON膜层变薄后钝化效果变差的问题,实现单纯依靠化学钝化实现双面电池较高转换效率的先例。
具体实施方式
实施例1
步骤1 :SiOxNy沉积,SiOxNy为单层膜,沉积SiOxNy时压力为1500-2000mTorr,温度450-500℃,功率为8500-12000W,脉冲开关比为1:10至1:16,所通SiH4/NH3/N2O=1.65/1/4至2.5/1/5,且三种气体SiH4、NH3、N2O总流量需大于7000sccm,时间为25-35s。
步骤2: SixNy沉积,SixNy膜层沉积时,压力为1500-2000mTorr,温度450-500℃,功率为7000-13500W,脉冲开关比为1:15至1:17.5,所通SiH4/NH3 =1/4至1/10,时间为720-820s。SixNy可制作多层膜,其中多层膜主要差异在于SiH4、NH3流量比。需重点说明,沉积多层膜时,SiOxNy膜层之下第一层SixNy膜沉积功率为7000-9000W,其他沉积参数与上述一致。
实施例2
步骤1:SiOxNy沉积,SiOxNy为单层膜,沉积SiOxNy时压力为1500-2000mTorr,温度450-500℃,功率为8500-12000W,脉冲开关比为1:10至1:16,所通SiH4/NH3/N2O=1.65/1/4至2.5/1/5,且且三种气体SiH4、NH3、N2O总流量需大于7000sccm,时间为40-60s。
步骤2: 退火处理,退火时压力为1500-1800mTorr,温度400-450℃,功率为8000-10000W,脉冲开关比为1:10至1:16, 所通N2O/NH3 =0.5/1至1/1,时间为300-500s。
步骤3:SixNy沉积,SixNy膜层沉积时,压力为1500-2000mTorr,温度450-500℃,功率为7000-13500W,脉冲开关比为1:15至1:17.5,所通SiH4/NH3 =1/4至1/10,时间为720-820s。SixNy可制作多层膜,其中多层膜主要差异在于SiH4、NH3流量比。需重点说明,沉积多层膜时,SiOxNy膜层之下第一层SixNy膜沉积功率为7000-9000W,其他沉积参数与上述一致。
实施例3
步骤1:SiOxNy沉积,SiOxNy为单层膜,沉积SiOxNy时压力为1500-2000mTorr,温度450-500℃,功率为8500-12000W,脉冲开关比为1:10至1:16,所通SiH4/NH3/N2O=1/1/2.5至2.5/1/3.5,且三种气体SiH4、NH3、N2O总流量需大于3500sccm,时间为120-140s。
步骤2: 退火处理,退火时压力为1500-1800mTorr,温度400-450℃,功率为8000-10000W,脉冲开关比为1:10至1:16, 所通N2O/NH3 =1/1至2/1,时间为500-1000s。
步骤3:SixNy沉积,SixNy膜层沉积时,压力为1500-2000mTorr,温度450-500℃,功率为7000-13500W,脉冲开关比为1:15至1:17.5,所通SiH4/NH3 =1/4至1/10,时间为720-820s。SixNy可制作多层膜,其中多层膜主要差异在于SiH4、NH3流量比。需重点说明,沉积多层膜时,SiOxNy膜层之下第一层SixNy膜沉积功率为7000-9000W,其他沉积参数与上述一致。
对比例(一种单面太阳能电池)
步骤1:SiOxNy沉积,SiOxNy为单层膜,沉积SiOxNy时压力为1500-2000mTorr,温度450-500℃,功率为8500-12000W,脉冲开关比为1:10至1:20,所通SiH4/NH3/N2O=0.2/1/2.0至3.5/1/4.0,时间为700-900s。
步骤2:SixNy沉积,SixNy膜层沉积时,压力为1500-2000mTorr,温度450-500℃功率为7000-13500W,脉冲开关比为1:10至1:20,所通SiH4/NH3流量比为1/4至1/10,时间为800-900s。
其中实施例1与实施例2相比,主要区别在于沉积反应时间,实施例1氮氧化硅沉积时间25-35s,实施例2沉积时间40-60s,因反应时间存在差异,导致实施例1与实施例2实际生成的SiOxNy膜结构发生变化,因此实施例2需要增加退火步骤,且退火氛围为N2O/NH3 =0.5/1至1/1,退火时间限定300-500s,需要强调退火氛围N2O至关重要,且流量比控制合适方可。
实施例3与实施例1/2的区别在于SiOxNy膜的气体流量比存在差异,实施例1/2所要求SiH4/NH3/N2O=1.65/1/4至2.5/1/5,而实施例3所要求SiH4/NH3/N2O=1/1/2.5至2.5/1/3.5,由于流量比的差异,实施例3亦增加退火,且退火氛围、时间差别较大,实施例2退火氛围N2O/NH3 =0.5/1至1/1、时间300-500s,实施例3退火氛围N2O/NH3 =1/1至2/1、时间500-1000s,需要强调退火氛围N2O至关重要,且流量比控制合适方可。
需要重点说明,本发明专利所提到的3种实施例,所通气体流量比、沉积时间、退火气体氛围与流量比、退火时间都需精准搭配,微弱变化皆可导致电池片转换效率出现大幅变化,同时不同实施例对SiOxNy膜结构所需气体总流量皆有限制,不同于对比例。此外,实施实施例背面膜层总厚度为75-95nm,对比例背面膜层厚度150-200nm,因膜层厚度的不同导致实际背钝化工艺差异较大,本发明实施例针对不同SiOxNy膜的气体流量比,不增加SiOxNy膜厚度的情况下,通过特殊退火或特殊气体流量比,实现SiOxNy双面电池较高电池转换效率。
表1
如表1所示,3种实施例与对比例(单面PERC工业化电池转换效率)相比,均可实现双面电池的工业化应用。综合评价,实施例1所需工艺时间较短,实施例2电池转换效率最佳,实施例3针对不同规格原料适应性广。
Claims (2)
1.一种新型晶硅SiON双面电池背钝化工艺,其特征在于:在背面晶硅基体上直接制备氮氧化硅层,然后在进行退火,最后再制备氮化硅层;氮氧化硅层为单层膜,采用PECVD的方式沉积,工艺参数为,压力1500-2000mTorr,温度450-500℃,功率为8500-12000W,脉冲开关比为1:10至1:16,所通SiH4/NH3/N2O=1.65/1/4至2.5/1/5,且三种气体SiH4、NH3、N2O总流量需大于7000sccm,时间40-60s;退火时工艺参数,压力1500-1800mTorr,温度400-450℃,功率为8000-10000W,脉冲开关比1:10至1:16, 所通N2O/NH3 =0.5/1至1/1,时间300-500s;氮化硅层采用PECVD的方式沉积,工艺参数为,压力1500-2000mTorr,温度450-500℃,功率为7000-13500W,脉冲开关比为1:15至1:17.5,所通SiH4/NH3 =1/4至1/10,时间为720-820s,与氮氧化硅接触的第一层氮化硅膜沉积功率为7000-9000W。
2.根据权利要求1所述的一种新型晶硅SiON双面电池背钝化工艺,其特征在于:氮氧化硅层的折射率为1.7-2.0,厚度为3-10nm,氮化硅层的折射率为2.1-2.3,厚度为65-85nm,氮化硅层为一层或多层。
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