CN112367828B - Precision compensation system suitable for chip mounter - Google Patents
Precision compensation system suitable for chip mounter Download PDFInfo
- Publication number
- CN112367828B CN112367828B CN202011140899.9A CN202011140899A CN112367828B CN 112367828 B CN112367828 B CN 112367828B CN 202011140899 A CN202011140899 A CN 202011140899A CN 112367828 B CN112367828 B CN 112367828B
- Authority
- CN
- China
- Prior art keywords
- standard
- head
- mounting
- patch
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0818—Setup of monitoring devices prior to starting mounting operations; Teaching of monitoring devices for specific products; Compensation of drifts during operation, e.g. due to temperature shifts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides a precision compensation system suitable for a chip mounter, which comprises: the device comprises a first camera, a second camera, a chip mounting head, an image processing module and a control module, wherein the first camera is used for acquiring image information of an actually mounted component of the chip mounting head; the second camera is used for acquiring image information of a standard mounting component preset on the PCB; calculating characteristic parameters of the actual surface-mounted component according to the image information of the actual surface-mounted component, and comparing the characteristic parameters of the actual surface-mounted component with the characteristic parameters of the standard surface-mounted component to obtain a comparison result; and controlling to close and open an air valve of a suction nozzle on the head attaching sheet according to the obtained comparison result so as to confirm whether to mount the component. According to the invention, the information image of the actual mounted component is compared with the information image of the standard mounted component, so that whether the center coordinate and the deflection angle of the adsorbed actual mounted component meet the preset requirements or not is judged to prompt the accuracy of the mounting.
Description
Technical Field
The invention relates to the technical field of chip mounters, in particular to a precision compensation system suitable for a chip mounter.
Background
With the change of times and the continuous development of science and technology, the production and manufacturing efficiency of the integrated circuit is greatly improved due to the appearance of the chip mounter in the generation and manufacturing of the integrated circuit.
After an electronic element is absorbed by a mounting head of a chip mounter, the electronic element is mounted on a PCB through a single chip microcomputer control program, and mounting work is completed. However, problems occur when the electronic component is mounted on the PCB, and because the suction nozzle of the chip mounter sucks the electronic component in the mounting process, the electronic component can deflect in angle during sucking, and the electronic component cannot be accurately positioned in the center area of the mounting head, so that the mounting precision is inaccurate.
Disclosure of Invention
The invention provides a precision compensation system suitable for a chip mounter, which is used for solving the problem of inaccurate mounting precision.
A precision compensation system suitable for a chip mounter is used for the chip mounter and is characterized by comprising:
the chip mounting module is used for controlling a chip mounting head of the chip mounter to pick up and place the electronic element so as to complete the chip mounting function;
the first camera module is used for acquiring an upward-looking mounting image of the mounting head through a first camera preset on the mounting head;
the second camera module is used for acquiring an under-view mounting image of the mounting head through a second camera arranged below the mounting head;
the image processing module is used for acquiring the actual characteristic parameters of the top-view mounting image and the bottom-view mounting image, comparing the actual characteristic parameters with the standard characteristic parameters of the prestored standard mounting image and acquiring a comparison result; wherein the content of the first and second substances,
if the comparison result is that the characteristic parameters are the same, feeding back patch confirmation information to the patch module, and controlling the patch head to execute patch operation through the patch module;
and if the comparison result is that the characteristic parameters are different, feeding back the paster error information to the paster module, and controlling the paster head to perform precision adjustment through the paster module.
As an embodiment of the present invention, the patch head includes a single-head patch and a multi-head patch; wherein the content of the first and second substances,
the multi-head patch comprises a fixed patch and a rotary patch;
the chip mounting head also comprises a suction nozzle, a sensor and a CCD camera; wherein the content of the first and second substances,
the CCD camera is used for providing corresponding light sources according to the colors of electronic elements when different electronic elements are mounted;
the suction nozzle is used for mounting according to the height of the electronic component and controlling the suction nozzle to place the electronic component on the PCB through pressure according to the pressure obtained by the sensor.
As an embodiment of the present invention, the sensor is a pressure sensor, and is configured to acquire pressure information of a suction nozzle on the chip mounting head, send the pressure information to a chip mounting module, and determine whether the suction nozzle is abnormal; wherein the content of the first and second substances,
the chip mounter is also provided with an alarm device which alarms in a preset alarm mode when the suction nozzle is abnormal, wherein,
the alarm mode is acousto-optic alarm.
As an embodiment of the present invention, the controlling of the suction nozzle to pressure-place the component onto the PCB board according to the pressure acquired by the pressure sensor includes the steps of:
step 1: acquiring pressure data of the suction nozzle through the pressure sensor;
step 2: comparing the pressure data information with a preset pressure threshold value to obtain a comparison result;
and step 3: and outputting a feedback response according to the comparison result, determining the pressure required to be output by the suction nozzle according to the feedback response, and placing the electronic component on the PCB according to the pressure required to be output by the suction nozzle.
As an embodiment of the present invention, the image processing module includes:
the storage module is used for establishing a standard mounting feature library and storing the standard mounting image and the standard feature parameters of the standard mounting image;
a standard parameter acquisition module: the system comprises a cloud terminal network, a server and a server, wherein the cloud terminal network is used for acquiring standard mounting information and standard mounting pictures;
an actual parameter acquisition module: the system comprises a chip head, a top view mounting image, a bottom view mounting image and a plurality of chip mounting images, wherein the chip head is used for mounting a chip on a substrate;
a processing module for calculating the correlation value of the actual characteristic parameter and the standard characteristic parameter according to a correlation algorithm, and judging whether the actual characteristic parameter and the standard characteristic parameter are the same according to the correlation value, wherein,
when the comparison result is that the characteristic parameters are the same, the patch module controls an air valve connected with a suction nozzle on the patch head to be opened, and patches are carried out through the air pressure of the air valve;
and when the comparison result is that the characteristic parameters are different, the patch module controls an air valve connected with a suction nozzle on the patch head to be closed.
As an embodiment of the present invention: the system further comprises:
a binary image generating unit, configured to perform threshold segmentation on the standard mounting image to obtain a binary image of a standard mounted electronic component;
a contour extraction unit for extracting a standard contour of a binary image of the standard mounted electronic component;
and the processing unit is used for acquiring the extracted contour information according to the standard contour to verify whether the characteristic parameters of the standard surface-mounted component are correct or not.
8. As an embodiment of the present invention, the processing unit verifying whether the characteristic parameters of the standard mounted component are correct includes:
step 1: respectively acquiring characteristic parameter sets of the standard outline and the standard surface mount component:
wherein H represents a set of coordinates, xijRepresenting a jth contour feature in an ith coordinate type; y isijRepresenting a jth standard feature in an ith coordinate type;
step 2: according to the characteristic parameter set, calculating the entropy ratio of the contour characteristic to the standard characteristic:
wherein G isijRepresenting a jth common parameter in the ith coordinate type;
and step 3: verifying whether the characteristic parameters of the standard surface-mounted component are correct through the entropy ratio:
wherein the content of the first and second substances,
δ represents a characteristic parameter ratio of the standard outline and a standard mount component; x is the number ofiA profile feature representing an ith coordinate type; y isiRepresenting standard features in the ith coordinate type; when P is more than 1, the characteristic parameters of the standard mounting component are correct; and when the P is less than or equal to 1, the characteristic parameters of the standard surface mount component are inaccurate.
As an embodiment of the present invention, when performing threshold segmentation on the standard patch element image, the binary image generation unit is further configured to perform pixel setting on the binary image; wherein the content of the first and second substances,
and setting the background pixel value of the binary image to be 0 and the foreground pixel value to be 255.
As an embodiment of the present invention, the image processing module includes:
a first compensation module: the adjusting coefficient of the chip mounter is determined according to the position of a chip mounting head and the chip mounting error information fed back by the chip mounting module;
a second compensation module: constructing a standard working three-dimensional model of the chip mounting head according to the adjustment coefficient;
a second compensation module: constructing an actual working three-dimensional model of the chip mounting head during actual working according to the top-view mounting image and the bottom-view mounting image;
a compensation module: and the system is used for dynamically adjusting the actual working three-dimensional model according to the standard working three-dimensional model, determining a compensation coefficient for the dynamic adjustment of the chip mounting head according to a dynamic adjustment result, and controlling the chip mounting head to automatically adjust according to the compensation coefficient.
As an embodiment of the present invention, a method of making,
the compensation module controls the chip mounting head to automatically adjust, and comprises:
step 1: acquiring the actual characteristic parameters, and constructing a deviation model according to the compensation coefficient:
wherein, the importance degree of the epsilon actual characteristic parameter; dlRepresenting the ith actual characteristic parameter;
representing the mean value of the actual characteristic parameters; b islA compensation coefficient representing the l-th actual characteristic parameter; 1, 2, 3, … … K; k actual characteristic parameters in total;
step 2: constructing a position model W of the patch head:
wherein the content of the first and second substances,
a deviation coefficient representing the g-th position of the patch head; o isgRepresenting a g-th position of the placement head; o ismaxRepresenting a maximum deviation position of the placement head; o isminRepresenting a minimum deviation position of the placement head; dgRepresenting the distance between the g-th position of the patch head and a standard patch point; g is 1, 2, 3, … … F, and F patch head positions;
and step 3: according to the position model of the patch head and the deviation model, constructing an adjustment model:
substituting the actual position and the actual characteristic parameters of the chip mounting head into the adjusting model, and when T is more than or equal to 1, indicating that the adjusting model is automatically adjusted; when T < 1, the adjustment model cannot be adjusted.
The invention has the beneficial effects that: the invention can acquire the upper and lower view images of the chip mounting head during chip mounting based on the first camera module and the second camera module, compares the characteristics of the upper and lower attempt images with the pre-stored standard parameters, and realizes precision compensation based on the feedback error information when the chip mounting head does not meet the mounting standard. The mounting failure caused by inaccurate precision and mounting error of the chip mounter due to insufficient precision are prevented, and dynamic real-time adjustment can be realized from a mounting action point through precision compensation.
The technical solution of the present invention is further described in detail by the accompanying drawings and embodiments.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a diagram illustrating a precision compensation system for a chip mounter according to an embodiment of the present invention;
fig. 2 is a flowchart of a precision compensation system suitable for a chip mounter in an embodiment of the present invention;
FIG. 3 is a flow chart of placement of components onto a PCB by a placement head in an embodiment of the present invention;
fig. 4 is a functional block diagram of a processing module in an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The accuracy compensation system suitable for the chip mounter in the embodiment is used for the chip mounter, and is characterized by comprising:
the chip mounting module is used for controlling a chip mounting head of the chip mounter to pick up and place the electronic element so as to complete the chip mounting function;
the first camera module is used for acquiring an upward-looking mounting image of the mounting head through a first camera preset on the mounting head;
the second camera module is used for acquiring an under-view mounting image of the mounting head through a second camera arranged below the mounting head;
the image processing module is used for acquiring the actual characteristic parameters of the top-view mounting image and the bottom-view mounting image, comparing the actual characteristic parameters with the standard characteristic parameters of the prestored standard mounting image and acquiring a comparison result; wherein the content of the first and second substances,
if the comparison result is that the characteristic parameters are the same, feeding back patch confirmation information to the patch module, and controlling the patch head to execute patch operation through the patch module;
and if the comparison result is that the characteristic parameters are different, feeding back the paster error information to the paster module, and controlling the paster head to perform precision adjustment through the paster module.
According to the embodiment, the characteristic parameters of the actual surface-mounted component image can be compared with the characteristic parameters of the standard surface-mounted component, whether the surface-mounted component adsorbed by the suction nozzle meets the preset requirements or not can be judged, whether the central coordinate, the deflection angle and the like of the surface-mounted component meet the preset requirements or not can be judged according to the parameter requirements, and the opening and closing of the suction nozzle air valve can be controlled or not, so that the surface-mounted accuracy is compensated.
The beneficial effects of the above technical scheme are that: the invention can acquire the upper and lower view images of the chip mounting head during chip mounting based on the first camera module and the second camera module, compares the characteristics of the upper and lower attempt images with the pre-stored standard parameters, and realizes precision compensation based on the feedback error information when the chip mounting head does not meet the mounting standard. The mounting failure caused by inaccurate precision and mounting error of the chip mounter due to insufficient precision are prevented, and dynamic real-time adjustment can be realized from a mounting action point through precision compensation.
As shown in fig. 1, a flow chart of a precision compensation system for a chip mounter includes:
step S101: acquiring image information of an actual surface-mounted component of a surface-mounted head, and acquiring image information of a standard surface-mounted component;
step S102: calculating characteristic parameters of a pickup element according to the image information of the actual surface-mounted element, and comparing the characteristic parameters of the actual surface-mounted element with the characteristic parameters of a standard surface-mounted element to obtain a comparison result;
step S103: controlling to close and open an air valve of a suction nozzle on the head attaching sheet according to the obtained comparison result so as to confirm whether to mount the component;
in one embodiment: the image information of the suction nozzle when sucking the attached component is obtained through the first camera, the image information of the standard attached component obtained by the second camera is compared with the characteristic parameters, when the characteristic parameters calculated by the actual attached component are the same as the characteristic parameters calculated by the standard attached component, the air valve connected with the suction nozzle on the attaching head is controlled to be opened, the component is attached to the PCB, when the characteristic parameters calculated by the actual attached component are different from the attached parameters calculated by the standard attached component, the air valve connected with the suction nozzle on the attaching head is controlled to be closed, the attached component is abandoned, and new attached components are re-adsorbed.
As shown in fig. 2, a flow chart of the component placement on the PCB in the embodiment of the present invention includes:
s201, acquiring pressure data information through the pressure sensor;
s202, comparing the data information of the pressure sensor with a preset pressure threshold value to obtain a comparison result;
s203, controlling the pressure output of the chip mounting head according to the comparison result, and placing the component on the PCB.
In one embodiment, when the chip mounter mounts, the pressure sensor on the chip mounter head is very important, and through pressure information data obtained by the pressure sensor, the chip mounter can output the required pressure according to a preset pressure threshold value, so that the component is successfully mounted on the PCB.
Fig. 3 is a schematic block diagram of a processing module in an embodiment of the present invention, including:
s301, a binary image generating unit is used for carrying out threshold segmentation on a standard mounted component image to obtain a binary image of the standard mounted component;
s302, a contour extraction unit is used for carrying out standard contour chain extraction on the binary image of the standard mounted component;
and S303, the processing unit is used for calculating the characteristic parameters of the corresponding standard surface-mounted component by using the profile information extracted by the standard profile chain, forming a characteristic file of the standard surface-mounted component, and storing the characteristic file of the standard surface-mounted component in a standard surface-mounted component characteristic library.
As an embodiment of the present invention, the patch head includes a single-head patch and a multi-head patch; wherein the content of the first and second substances,
the multi-head patch comprises a fixed patch and a rotary patch; different patches may be applied in different ways. Prevent the patch from being mistaken.
The chip mounting head also comprises a suction nozzle, a sensor and a CCD camera; wherein the content of the first and second substances,
the CCD camera is used for providing corresponding light sources according to the colors of electronic elements when different electronic elements are mounted; different light sources are convenient for identifying different electronic elements. Meanwhile, the color of the electronic element is more suitable.
The suction nozzle is used for mounting according to the height of the electronic component and controlling the suction nozzle to place the electronic component on the PCB through pressure according to the pressure obtained by the sensor. The final precision adjustment of the present invention is to place the necessary electronic components on the PCB board in the manner of the suction nozzle pressure.
As an embodiment of the present invention, the sensor is a pressure sensor, and is configured to acquire pressure information of a suction nozzle on the chip mounting head, send the pressure information to a chip mounting module, and determine whether the suction nozzle is abnormal; wherein the content of the first and second substances,
the chip mounter is also provided with an alarm device which alarms in a preset alarm mode when the suction nozzle is abnormal, wherein,
the alarm mode is acousto-optic alarm.
The invention can compensate the precision in a pressure control mode, so that an audible and visual alarm can be carried out when the pressure is abnormal, and the compensation failure can be prevented.
As an embodiment of the present invention, the controlling of the suction nozzle to pressure-place the component onto the PCB board according to the pressure acquired by the pressure sensor includes the steps of:
step 1: acquiring pressure data of the suction nozzle through the pressure sensor;
step 2: comparing the pressure data information with a preset pressure threshold value to obtain a comparison result;
and step 3: and outputting a feedback response according to the comparison result, determining the pressure required to be output by the suction nozzle according to the feedback response, and placing the electronic component on the PCB according to the pressure required to be output by the suction nozzle.
The three steps of the invention embody the specific operation when the precision compensation is realized, the invention judges the specific compensation information needing to be compensated based on the comparison, and then the electronic component is placed on the PCB board through the pressure control of the suction nozzle.
As an embodiment of the present invention, the image processing module includes:
the storage module is used for establishing a standard mounting feature library and storing the standard mounting image and the standard feature parameters of the standard mounting image; historical standard mounting information or standard mounting information input by a user is preset in the standard mounting characteristic library.
A standard parameter acquisition module: the system comprises a cloud terminal network, a server and a server, wherein the cloud terminal network is used for acquiring standard mounting information and standard mounting pictures; different standard mounting acquisition modes can enable mounting parameters to be more accurate.
An actual parameter acquisition module: the system comprises a chip head, a top view mounting image, a bottom view mounting image and a plurality of chip mounting images, wherein the chip head is used for mounting a chip on a substrate;
a processing module for calculating the correlation value of the actual characteristic parameter and the standard characteristic parameter according to a correlation algorithm, and judging whether the actual characteristic parameter and the standard characteristic parameter are the same according to the correlation value, wherein,
when the comparison result is that the characteristic parameters are the same, the patch module controls an air valve connected with a suction nozzle on the patch head to be opened, and patches are carried out through the air pressure of the air valve;
and when the comparison result is that the characteristic parameters are different, the patch module controls an air valve connected with a suction nozzle on the patch head to be closed.
As an embodiment of the present invention: the system further comprises:
a binary image generating unit, configured to perform threshold segmentation on the standard mounting image to obtain a binary image of a standard mounted electronic component;
a contour extraction unit for extracting a standard contour of a binary image of the standard mounted electronic component;
and the processing unit is used for acquiring the extracted contour information according to the standard contour to verify whether the characteristic parameters of the standard surface-mounted component are correct or not.
As an embodiment of the present invention, the processing unit verifying whether the characteristic parameters of the standard mounted component are correct includes:
step 1: respectively acquiring characteristic parameter sets of the standard outline and the standard surface mount component:
wherein H represents a set of coordinates, xijRepresenting a jth contour feature in an ith coordinate type; y isijRepresenting a jth standard feature in an ith coordinate type;
step 2: according to the characteristic parameter set, calculating the entropy ratio of the contour characteristic to the standard characteristic:
wherein G isijRepresenting a jth common parameter in the ith coordinate type;
and step 3: verifying whether the characteristic parameters of the standard surface-mounted component are correct through the entropy ratio:
wherein the content of the first and second substances,
δ represents a characteristic parameter ratio of the standard outline and a standard mount component; x is the number ofiA profile feature representing an ith coordinate type; y isiRepresenting standard features in the ith coordinate type; when P is more than 1, the characteristic parameters of the standard mounting component are correct; and when the P is less than or equal to 1, the characteristic parameters of the standard surface mount component are inaccurate.
The principle of the technical scheme is as follows: the invention is based on the entropy ratio of standard body mounting and actual mounting as the tendency ratio of two types of characteristics, and the effect of the entropy is the value reflecting the tendency direction, so the invention judges whether the parameter is correct or not in a comparison mode based on the entropy ratio and the parameter characteristics during actual mounting.
As an embodiment of the present invention, when performing threshold segmentation on the standard patch element image, the binary image generation unit is further configured to perform pixel setting on the binary image;
wherein the content of the first and second substances,
and setting the background pixel value of the binary image to be 0 and the foreground pixel value to be 255.
Assigning 0 to the background pixel value and the foreground pixel value of the binary image: 255 is a most surprising, most characteristic pixel performance value.
As an embodiment of the present invention, the image processing module includes:
a first compensation module: the adjusting coefficient of the chip mounter is determined according to the position of a chip mounting head and the chip mounting error information fed back by the chip mounting module;
a second compensation module: constructing a standard working three-dimensional model of the chip mounting head according to the adjustment coefficient;
a second compensation module: constructing an actual working three-dimensional model of the chip mounting head during actual working according to the top-view mounting image and the bottom-view mounting image;
a compensation module: and the system is used for dynamically adjusting the actual working three-dimensional model according to the standard working three-dimensional model, determining a compensation coefficient for the dynamic adjustment of the chip mounting head according to a dynamic adjustment result, and controlling the chip mounting head to automatically adjust according to the compensation coefficient. The beneficial effects of the above technical scheme are that: the image processing module of the invention constructs the three-dimensional models under different conditions in different modes respectively when processing images, and the three-dimensional models are put in comparison, thereby being easier to determine errors, realizing real-time adjustment of the suction nozzle through the errors and realizing dynamic control.
As an embodiment of the present invention: the compensation module controls the chip mounting head to automatically adjust, and comprises:
step 1: acquiring the actual characteristic parameters, and constructing a deviation model according to the compensation coefficient:
wherein, the importance degree of the epsilon actual characteristic parameter; dlRepresenting the ith actual characteristic parameter;
representing the mean value of the actual characteristic parameters; b islA compensation coefficient representing the l-th actual characteristic parameter; 1, 2, 3, … … K; k actual characteristic parameters in total;
step 2: constructing a position model W of the patch head:
wherein the content of the first and second substances,
a deviation coefficient representing the g-th position of the patch head; o isgRepresenting a g-th position of the placement head; o ismaxRepresenting a maximum deviation position of the placement head; o isminRepresenting a minimum deviation position of the placement head; dgRepresenting the distance between the g-th position of the patch head and a standard patch point; g is 1, 2, 3, … … F, and F patch head positions;
and step 3: according to the position model of the patch head and the deviation model, constructing an adjustment model:
substituting the actual position and the actual characteristic parameters of the chip mounting head into the adjusting model, and when T is more than or equal to 1, indicating that the adjusting model is automatically adjusted; when T < 1, the adjustment model cannot be adjusted.
The principle and the beneficial effects of the technical scheme are as follows: when the chip mounting head is dynamically adjusted, a deviation model is constructed according to the actual characteristic parameters and the compensation coefficients, the chip wiping model can display the deviation degree of the chip, and the important degree of the actual characteristic parameters determines the influence possibly caused by the deviation. For example, directly leading to patch failure. After the deviation calculation is completed, a position model is constructed based on the position of the chip mounting head, and the position model determines a global position model of the chip mounting head through an exponential function based on all spatial points (position points) which can be extended by the chip mounting head. Indicating that the pick head has errors that may exist at all locations. According to the method, the adjustment model is finally constructed, data of the deviation model and data of the position model are substituted, whether the adjustment model can not be adjusted or not is judged, an additional technical scheme which can not be adjusted can be added for alarming, and abnormal conditions are reduced before the possible measurement conditions occur.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (8)
1. A precision compensation system suitable for a chip mounter is used for the chip mounter and is characterized by comprising:
the chip mounting module is used for controlling a chip mounting head of the chip mounter to pick up and place the electronic element so as to complete the chip mounting function;
the first camera module is used for acquiring an upward-looking mounting image of the mounting head through a first camera preset on the mounting head;
the second camera module is used for acquiring an under-view mounting image of the mounting head through a second camera arranged below the mounting head;
the image processing module is used for acquiring the actual characteristic parameters of the top-view mounting image and the bottom-view mounting image, comparing the actual characteristic parameters with the standard characteristic parameters of the prestored standard mounting image and acquiring a comparison result; wherein the content of the first and second substances,
if the comparison result is that the characteristic parameters are the same, feeding back patch confirmation information to the patch module, and controlling the patch head to execute patch operation through the patch module;
if the comparison result shows that the characteristic parameters are different, feeding back patch error information to the patch module, and controlling the patch head to perform precision adjustment through the patch module;
the system further comprises:
a binary image generating unit, configured to perform threshold segmentation on the standard mounting image to obtain a binary image of a standard mounted electronic component;
a contour extraction unit for extracting a standard contour of a binary image of the standard mounted electronic component;
the processing unit is used for acquiring the extracted contour information according to the standard contour to verify whether the characteristic parameters of the standard surface-mounted component are correct or not;
the processing unit verifying whether the characteristic parameters of the standard mounted component are correct comprises the following steps:
step 1: respectively acquiring characteristic parameter sets of the standard outline and the standard surface mount component:
wherein H represents a set of coordinates, xijRepresenting a jth contour feature in an ith coordinate type; y isijRepresenting a jth standard feature in an ith coordinate type;
step 2: according to the characteristic parameter set, calculating the entropy ratio of the contour characteristic to the standard characteristic:
wherein G isijRepresenting a jth common parameter in the ith coordinate type;
and step 3: verifying whether the characteristic parameters of the standard surface-mounted component are correct through the entropy ratio:
wherein the content of the first and second substances,
δ represents a characteristic parameter ratio of the standard outline and a standard mount component; x is the number ofiA profile feature representing an ith coordinate type; y isiRepresenting standard features in the ith coordinate type; when P is more than 1, the characteristic parameters of the standard mounting component are correct; and when the P is less than or equal to 1, the characteristic parameters of the standard surface mount component are inaccurate.
2. The accuracy compensation system for chip mounter according to claim 1, wherein: the patch head comprises a single-head patch and a multi-head patch; wherein the content of the first and second substances,
the multi-head patch comprises a fixed patch and a rotary patch;
the chip mounting head also comprises a suction nozzle, a sensor and a CCD camera; wherein the content of the first and second substances,
the CCD camera is used for providing corresponding light sources according to the colors of electronic elements when different electronic elements are mounted;
the suction nozzle is used for mounting according to the height of the electronic component and controlling the suction nozzle to place the electronic component on the PCB through pressure according to the pressure obtained by the sensor.
3. The accuracy compensation system for chip mounter according to claim 2, comprising: the sensor is a pressure sensor and is used for acquiring pressure information of a suction nozzle on the chip mounting head, sending the pressure information to a chip mounting module and judging whether the suction nozzle is abnormal or not; wherein the content of the first and second substances,
the chip mounter is also provided with an alarm device which alarms in a preset alarm mode when the suction nozzle is abnormal, wherein,
the alarm mode is acousto-optic alarm.
4. The accuracy compensation system for chip mounter according to claim 2, wherein said controlling the suction nozzle to pressure-place the component onto the PCB board according to the pressure obtained by the pressure sensor comprises the steps of:
step 1: acquiring pressure data of the suction nozzle through the pressure sensor;
step 2: comparing the pressure data information with a preset pressure threshold value to obtain a comparison result;
and step 3: and outputting a feedback response according to the comparison result, determining the pressure required to be output by the suction nozzle according to the feedback response, and placing the electronic component on the PCB according to the pressure required to be output by the suction nozzle.
5. The accuracy compensation system for chip mounter according to claim 1, wherein said image processing module comprises:
the storage module is used for establishing a standard mounting feature library and storing the standard mounting image and the standard feature parameters of the standard mounting image;
a standard parameter acquisition module: the system comprises a cloud terminal network, a server and a server, wherein the cloud terminal network is used for acquiring standard mounting information and standard mounting pictures;
an actual parameter acquisition module: the system comprises a chip head, a top view mounting image, a bottom view mounting image and a plurality of chip mounting images, wherein the chip head is used for mounting a chip on a substrate;
a processing module for calculating the correlation value of the actual characteristic parameter and the standard characteristic parameter according to a correlation algorithm, and judging whether the actual characteristic parameter and the standard characteristic parameter are the same according to the correlation value, wherein,
when the comparison result is that the characteristic parameters are the same, the patch module controls an air valve connected with a suction nozzle on the patch head to be opened, and patches are carried out through the air pressure of the air valve;
and when the comparison result is that the characteristic parameters are different, the patch module controls an air valve connected with a suction nozzle on the patch head to be closed.
6. The accuracy compensation system applicable to the chip mounter according to claim 1, wherein the binary image generation unit is further configured to perform pixel setting on the binary image when performing threshold segmentation on the standard chip component image; wherein the content of the first and second substances,
and setting the background pixel value of the binary image to be 0 and the foreground pixel value to be 255.
7. The accuracy compensation system for chip mounter according to claim 1, wherein said image processing module comprises:
a first compensation module: the adjusting coefficient of the chip mounter is determined according to the position of a chip mounting head and the chip mounting error information fed back by the chip mounting module;
a second compensation module: constructing a standard working three-dimensional model of the chip mounting head according to the adjustment coefficient;
a second compensation module: constructing an actual working three-dimensional model of the chip mounting head during actual working according to the top-view mounting image and the bottom-view mounting image;
a compensation module: and the system is used for dynamically adjusting the actual working three-dimensional model according to the standard working three-dimensional model, determining a compensation coefficient for the dynamic adjustment of the chip mounting head according to a dynamic adjustment result, and controlling the chip mounting head to automatically adjust according to the compensation coefficient.
8. The system of claim 7, wherein the compensation module controls the placement head to perform automatic adjustment, and comprises:
step 1: acquiring the actual characteristic parameters, and constructing a deviation model according to the compensation coefficient:
wherein, the importance degree of the epsilon actual characteristic parameter; dlRepresenting the ith actual characteristic parameter;
representing the mean value of the actual characteristic parameters; b islA compensation coefficient representing the l-th actual characteristic parameter; 1, 2, 3, … … K; k actual characteristic parameters in total;
step 2: constructing a position model W of the patch head:
wherein the content of the first and second substances,
a deviation coefficient representing the g-th position of the patch head; o isgRepresenting a g-th position of the placement head; o ismaxRepresenting a maximum deviation position of the placement head; o isminRepresenting a minimum deviation position of the placement head; dgRepresenting the distance between the g-th position of the patch head and a standard patch point; g is 1, 2, 3, … … F, and F patch head positions;
and step 3: according to the position model of the patch head and the deviation model, constructing an adjustment model:
substituting the actual position and the actual characteristic parameters of the chip mounting head into the adjusting model, and when T is more than or equal to 1, indicating that the adjusting model is automatically adjusted; when T < 1, the adjustment model cannot be adjusted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011140899.9A CN112367828B (en) | 2020-10-22 | 2020-10-22 | Precision compensation system suitable for chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011140899.9A CN112367828B (en) | 2020-10-22 | 2020-10-22 | Precision compensation system suitable for chip mounter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112367828A CN112367828A (en) | 2021-02-12 |
| CN112367828B true CN112367828B (en) | 2021-08-17 |
Family
ID=74511626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011140899.9A Active CN112367828B (en) | 2020-10-22 | 2020-10-22 | Precision compensation system suitable for chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112367828B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113141770B (en) * | 2021-03-26 | 2023-02-10 | 广东省电信规划设计院有限公司 | Electronic component mounting system |
| CN115442979B (en) * | 2022-11-02 | 2023-03-24 | 南京航空航天大学 | Patch system for pressure real-time monitoring feedback and monitoring control method |
| CN117594491B (en) * | 2023-11-23 | 2024-06-25 | 东莞触点智能装备有限公司 | Mounting pressure correction method and system based on chip high-precision die bonder |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582310A (en) * | 2013-09-18 | 2014-02-12 | 深圳市腾世机电有限公司 | Surface-mounting control method and system for surface-mounted element of surface-mounting machine |
| CN107645904A (en) * | 2017-11-08 | 2018-01-30 | 无锡市正先自动化设备有限公司 | A kind of chip mounter |
-
2020
- 2020-10-22 CN CN202011140899.9A patent/CN112367828B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103582310A (en) * | 2013-09-18 | 2014-02-12 | 深圳市腾世机电有限公司 | Surface-mounting control method and system for surface-mounted element of surface-mounting machine |
| CN107645904A (en) * | 2017-11-08 | 2018-01-30 | 无锡市正先自动化设备有限公司 | A kind of chip mounter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112367828A (en) | 2021-02-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112367828B (en) | Precision compensation system suitable for chip mounter | |
| CN112906529B (en) | Face recognition light supplementing method, device, face recognition equipment and system thereof | |
| CN111060515A (en) | PCBA quality detection method, system and computer equipment | |
| TW201515433A (en) | Image calibration system and calibration method of a stereo camera | |
| US6037641A (en) | Optical device package including an aligned lens | |
| CN106506831A (en) | Control method and control device | |
| US20080228295A1 (en) | Production program creating system | |
| CN116337412A (en) | Screen detection method, device and storage medium | |
| CN105897987A (en) | Intelligent manufacturing calibrating device for sensor, and calibrating method thereof | |
| TWI719499B (en) | Pcb printing system and pcb printing method | |
| CN115100299A (en) | Calibration method, device, equipment and storage medium | |
| CN112334000B (en) | Visual identification method and device suitable for chip mounter | |
| CN112929623A (en) | Lens shadow repairing method and device applied to whole screen in correction process | |
| CN115578462B (en) | Machine vision positioning control system applied to automatic opposite pasting of display screen optical films | |
| CN116182710A (en) | Method and system for detecting abnormal chip position | |
| KR101894827B1 (en) | The device and methods for controlling width of coating fluid emission using vision and power regulator | |
| CN115631110A (en) | Alignment method, alignment system and apparatus, computer device, and storage medium | |
| JPH05251898A (en) | Parts deciding method of electronic parts mounting machine | |
| CN114589069B (en) | Intelligent dispensing method based on 3D vision | |
| CN115542941A (en) | Control method and system for guiding unmanned aerial vehicle to land accurately | |
| CN115371543A (en) | Surface mounting precision calibration method | |
| CN107079620A (en) | Fitting machine and used fitting machine electronic component absorption posture inspection method | |
| CN114862963A (en) | Bonding positioning method, device, equipment and storage medium | |
| CN112561740A (en) | Intelligent auxiliary device and method for construction of assembly type building component | |
| CN115540747A (en) | Method for measuring logs by using log measuring instrument |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |