CN113141770B - Electronic component mounting system - Google Patents
Electronic component mounting system Download PDFInfo
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- CN113141770B CN113141770B CN202110330709.8A CN202110330709A CN113141770B CN 113141770 B CN113141770 B CN 113141770B CN 202110330709 A CN202110330709 A CN 202110330709A CN 113141770 B CN113141770 B CN 113141770B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
Abstract
The application relates to the technical field of electronic component mounting, in particular to an electronic component mounting system. The method comprises the steps that a standard mounting template image is stored in a mounting template library, when the electronic component is required to be mounted, a first chip mounter can obtain the corresponding standard mounting template image from the mounting template library, and mounting efficiency of the electronic component is improved; and if the first chip mounter does not receive the feedback of the mounting template library within a certain period of time, the communication link between the first chip mounter and the mounting template library is in failure, and at the moment, the first chip mounter can request a corresponding standard mounting template image from the mounting template library by means of a second chip mounter interacting with the mounting template library via a third communication link, so that the normal mounting of the electronic component is ensured.
Description
Technical Field
The application relates to the technical field of electronic component mounting, in particular to an electronic component mounting system.
Background
With the development of electronic technology, a technology for mounting electronic components on a circuit board based on a chip mounter has appeared. In order to ensure the accuracy of the mounting position of the electronic components, before the electronic components are placed on the circuit board, the mounting machine needs to adjust the mounting position of the electronic components by using machine vision, that is, the current position image of the electronic components is compared with the standard position image, and the positions of the electronic components are adjusted based on the comparison result. In the mounting production process, engineers need to manually set a standard template image of an electronic component, which results in low mounting efficiency of the electronic component.
Disclosure of Invention
In view of the above, it is necessary to provide an electronic component mounting system for solving the above technical problems.
An electronic component mounting system, the system comprising:
the surface mounting template library is used for storing standard surface mounting template images of various electronic components;
the first chip mounter is used for acquiring the types of the electronic components to be mounted, which are input by a user, and sending the types of the electronic components to be mounted to the mounting template library through a first communication link;
the first chip mounter is further used for determining that the first communication link fails if an available standard mounting template image fed back by the first communication link from the mounting template library is not received within a preset time after the type of the electronic component to be mounted is sent, and sending the type of the electronic component to be mounted to the second chip mounter through the second communication link; the available standard mounting template image is a standard mounting template image matched with the type of the electronic component to be mounted;
the second chip mounter is used for sending the category of the electronic component to be mounted to the mounting template library through a third communication link when the second chip mounter determines that the available standard mounting template image is not stored at the local terminal after receiving the category of the electronic component to be mounted; wherein the second placement machine and the placement template library are performing placement template interaction via the third communication link;
the mounting template library is further used for sending the available target standard mounting template image stored at the local terminal to the second chip mounter through the third communication link after receiving the type of the electronic component to be mounted sent by the second chip mounter;
the second chip mounter is further used for sending the available standard mounting template images fed back by the mounting template library to the first chip mounter through the second communication link.
In one of the embodiments, the first and second electrodes are,
the second chip mounter is on the same production line with the first chip mounter, and the second chip mounter is an upstream chip mounter of the first chip mounter; the first chip mounter is further configured to receive a first mounting trigger instruction from the second chip mounter via the second communication link; the first mounting trigger instruction is used for indicating the first chip mounter to start a mounting task;
or the like, or, alternatively,
the second chip mounter is on the same production line as the first chip mounter, and the second chip mounter is on the same production line as the first chip mounter and is a downstream chip mounter of the first chip mounter; the first chip mounter is further used for sending a second mounting trigger instruction to the second chip mounter through the second communication link; and the second mounting triggering instruction is used for indicating the second chip mounter to start a mounting task.
In one of the embodiments, the first and second parts of the device,
the second chip mounter is used for sending the type of the electronic component to be mounted to the mounting template library through the third communication link and requesting the mounting template library to feed back forming time when the second chip mounter confirms that the local terminal stores the available standard mounting template image after receiving the type of the electronic component to be mounted;
the mounting template library is also used for determining available standard mounting template images which are stored at the local terminal and matched with the types of the electronic components to be mounted, and feeding back the forming time of the available standard mounting template images stored at the local terminal to the second mounting machine;
and the second chip mounter is also used for sending the available standard mounting template image stored at the local terminal to the first chip mounter if the forming time fed back by the mounting template library is consistent with the forming time of the available standard mounting template image stored at the local terminal.
In one of the embodiments, the first and second electrodes are,
the second chip mounter is further configured to determine that the available standard mounting template image stored in the mounting template library is the latest available standard mounting template image if it is determined that the formation time fed back by the mounting template library is inconsistent with the formation time of the available standard mounting template image stored at the home terminal, and request the latest available standard mounting template image from the mounting template library;
the second chip mounter is further configured to send the latest available standard mounting template image to the first chip mounter after receiving the latest available standard mounting template image.
In one embodiment, the second placement machine is further configured to update the available standard placement template image stored at the local end with the latest available standard placement template image.
In one of the embodiments, the first and second electrodes are,
the second chip mounter is a candidate second chip mounter with the latest forming time of available standard mounting template images stored in a plurality of candidate second chip mounters; the plurality of candidate second chip mounters store available standard mounting template images and have corresponding forming time.
In one embodiment, the mounting template library is further configured to send the available target standard mounting template image stored at the local end to the second chip mounter via the third communication link after determining that the first chip mounter is a legal chip mounter.
In one embodiment, the mounting template library is further configured to determine whether the first chip mounter is a legal chip mounter based on the identifier of the first chip mounter fed back by the second chip mounter.
In one of the embodiments, the first and second electrodes are,
the mounting template library is also used for acquiring the adjustment time and the actual mounting positions of a plurality of first chip mounters; the multiple first chip mounters use the same available standard mounting template image to carry out mounting positions of the electronic components;
the mounting template library is also used for determining the distance between each actual mounting position and the standard mounting position of the same available standard mounting template image;
the placement template library is further configured to determine whether to prompt an engineer to update the same available standard placement template image based on statistics of the distances and the times spent for adjustments.
In one embodiment, the mounting template library is further configured to determine a weight of each first mounter, and assign a corresponding weight to each distance and each adjustment elapsed time to obtain a distance average value and an adjustment elapsed time average value;
the size of the weight of any first chip mounter has positive correlation with the number of first chip mounters in the same version; the first chip mounter of the same version is a first chip mounter of the same version as any one of the first chip mounters.
In one embodiment, the placement template library is further configured to prompt the engineer to update the same available standard placement template image if the distance average is greater than a distance threshold and the adjustment takes a time average greater than a time threshold.
Above-mentioned electronic components pastes dress system includes: the surface mounting template library is used for storing standard surface mounting template images of various electronic components; the first chip mounter is used for acquiring the type of the electronic component to be mounted input by a user and sending the type of the electronic component to be mounted to the mounting template library through a first communication link; the first chip mounter is further used for determining that the first communication link fails if an available standard mounting template image fed back by the first communication link from the mounting template library is not received within a preset time after the type of the electronic component to be mounted is sent, and sending the type of the electronic component to be mounted to the second chip mounter through the second communication link; the available standard mounting template image is a standard mounting template image matched with the type of the electronic component to be mounted; the second chip mounter is used for sending the type of the electronic component to be mounted to the mounting template library through a third communication link when the second chip mounter confirms that the local terminal does not store the available standard mounting template image after receiving the type of the electronic component to be mounted; wherein the second placement machine and the placement template library are performing placement template interaction via the third communication link; the mounting template library is further used for sending the available target standard mounting template image stored at the local terminal to the second chip mounter through the third communication link after receiving the type of the electronic component to be mounted sent by the second chip mounter; the second chip mounter is further used for sending the available standard mounting template images fed back by the mounting template library to the first chip mounter through the second communication link. In the system, the standard mounting template images are stored in the mounting template library, and when the electronic components are required to be mounted, the corresponding first chip mounter can acquire the corresponding standard mounting template images from the mounting template library, so that the mounting efficiency of the electronic components is improved; and if the first chip mounter does not receive the feedback of the mounting template library within a certain period of time, the communication link between the first chip mounter and the mounting template library is in failure, and at the moment, the first chip mounter can request a corresponding standard mounting template image from the mounting template library by means of a second chip mounter interacting with the mounting template library via a third communication link, so that the normal mounting of the electronic component is ensured.
Drawings
Fig. 1 is a block diagram of an electronic component mounting system in one embodiment;
fig. 2 is a schematic flow diagram of an electronic component mounting system in one embodiment;
fig. 3 is a schematic flow chart of an electronic component mounting system according to an embodiment;
FIG. 4 is a schematic illustration of a statistical flow chart of a library of mounting templates in one embodiment;
fig. 5 is an internal structural view of a mounting template library in one embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by a person skilled in the art that the embodiments described herein can be combined with other embodiments.
Fig. 1 shows an architecture diagram of an electronic component mounting system provided in the present application. The electronic component mounting system provided by the present application is introduced with reference to fig. 1, and the system provided by the present application includes: the surface mounting template library is used for storing standard surface mounting template images of various electronic components; the first chip mounter is used for acquiring the type of the electronic component to be mounted input by a user and sending the type of the electronic component to be mounted to the mounting template library through a first communication link; the first chip mounter is further used for determining that the first communication link fails if an available standard mounting template image fed back by the first communication link from the mounting template library is not received within a preset time after the type of the electronic component to be mounted is sent, and sending the type of the electronic component to be mounted to the second chip mounter through the second communication link; the available standard mounting template image is a standard mounting template image matched with the type of the electronic component to be mounted; the second chip mounter is used for sending the type of the electronic component to be mounted to the mounting template library through a third communication link when the second chip mounter confirms that the local terminal does not store the available standard mounting template image after receiving the type of the electronic component to be mounted; the second chip mounter and the mounting template library carry out mounting template interaction through the third communication link; the mounting template library is also used for sending the available target standard mounting template image stored at the local terminal to the second chip mounter through the third communication link after receiving the type of the electronic component to be mounted sent by the second chip mounter; the second chip mounter is further used for sending the available standard mounting template images fed back by the mounting template library to the first chip mounter through the second communication link.
For example, if the mounter a needs to mount electronic components, the mounter a may be regarded as a first mounter. After a user inputs the type of the electronic component to be mounted to the mounter a, the mounter a requests an available standard mounting template image (hereinafter, referred to as an available standard image) matching the type of the electronic component to be mounted to the mounting template library. If the chip mounter A does not receive the available standard image fed back by the mounting template library within the set time, the communication link between the chip mounter A and the mounting template library is in failure. At this time, the mounter B (equivalent to a second mounter) is performing mounting template interaction with the mounting template library via the third communication link, and the mounter a may request an available standard image from the mounting template library via the mounter B. Specifically, the chip mounter a may send the category of the electronic component to be mounted to the chip mounter B; when the chip mounter B determines that the local terminal does not store the available standard images, the chip mounter B requests the available standard images from the chip mounter template library; and the mounting template library feeds the available standard image back to the chip mounter A through the chip mounter B so that the chip mounter A mounts the to-be-mounted electronic component based on the available standard image.
The mounting template interaction between the chip mounter B and the mounting template library can be understood as follows: when the chip mounter B mounts the electronic component of the chip mounter B, it needs to request a corresponding standard mounting template image from the mounting template library.
Therefore, in the system, the standard mounting template images are stored in the mounting template library, and when a chip mounter needs to mount electronic components, the corresponding standard mounting template images can be obtained from the mounting template library, so that the mounting efficiency of the electronic components is improved; and if the first chip mounter does not receive the feedback of the mounting template library within a certain period of time, the communication link between the first chip mounter and the mounting template library is in failure, and at the moment, the first chip mounter can request a corresponding standard mounting template image from the mounting template library by means of a second chip which is interacting with the mounting template library via a third communication link, so that the normal mounting of the electronic component is ensured.
In one embodiment, the second chip mounter is on the same production line as the first chip mounter, and the second chip mounter is an upstream chip mounter of the first chip mounter; the first placement machine is further configured to receive a first placement trigger instruction by the second placement machine via the second communication link; the first mounting triggering instruction is used for indicating the first chip mounter to start a mounting task.
Specifically, the first chip mounter and the second chip mounter are chip mounters of the same production line and are used for mounting electronic components on the same circuit board, wherein the electronic components mounted by the first chip mounter and the electronic components mounted by the second chip mounter may be different. If the second chip mounter is the upstream chip mounter of the first chip mounter, the second chip mounter can inform the first chip mounter of starting the corresponding mounting task of the electronic component through a second communication link with the first chip mounter after completing the mounting task of the electronic component of the second chip mounter.
In one embodiment, the second placement machine is on the same production line as the first placement machine, and the second placement machine is a downstream placement machine on the same production line as the first placement machine and the first placement machine; the first chip mounter is further used for sending a second mounting trigger instruction to the second chip mounter through the second communication link; and the second mounting triggering instruction is used for indicating the second chip mounter to start a mounting task.
The above description of the embodiments may refer to the description of the embodiment of the upstream chip mounter, and is not repeated here.
It can be seen that, in the above embodiment, when the first mounter requests the mounting template library for an available standard mounting template image by means of the second mounter, the request is performed by using the existing second communication link with the second mounter, and compared with a case where a plurality of communication links are provided between the first mounter and the mounting template library, the cost can be reduced in the above embodiment.
In an embodiment, the second placement machine is configured to, after receiving the category of the electronic component to be placed, send the category of the electronic component to be placed to the placement template library via the third communication link and request the placement template library to feed back a formation time when it is determined that an available standard placement template image is stored at a local terminal; the mounting template library is also used for determining available standard mounting template images which are stored at the local terminal and matched with the types of the electronic components to be mounted, and feeding back the forming time of the available standard mounting template images stored at the local terminal to the second chip mounter; the second chip mounter is further used for sending the available standard mounting template images stored at the local end to the first chip mounter if the forming time fed back by the mounting template library is consistent with the forming time of the available standard mounting template images stored at the local end.
Further, the second placement machine is further configured to determine that the available standard placement template image stored in the placement template library is the latest available standard placement template image if it is determined that the formation time fed back by the placement template library is inconsistent with the formation time of the available standard placement template image stored at the local end, and request the latest available standard placement template image from the placement template library; the second chip mounter is further configured to send the latest available standard mounting template image to the first chip mounter after receiving the latest available standard mounting template image.
Furthermore, the second placement machine is further configured to update the available standard placement template image stored at the local end with the latest available standard placement template image.
The above embodiments are described in connection with fig. 2 and a placement machine A, B: step S201, after receiving the type of the electronic component to be mounted sent by the chip mounter A, the chip mounter B firstly judges whether an available standard image matched with the type of the electronic component to be mounted is stored in the local terminal (step S202), if not, the chip mounter B requests the available standard image from a mounting template library (step S203); if the chip mounter B determines that the available standard image exists at the home terminal, the forming time of the available standard image stored in the mounting template library is requested from the mounting template library (step S204), so as to determine whether the available standard image stored at the home terminal of the chip mounter B is consistent with that stored in the mounting template library.
After receiving the forming time of the available standard image stored in the mounting template library, the chip mounter B compares the forming time of the available standard image stored in the chip mounter B with the forming time of the available standard image stored in the chip mounter B (step S205); if the chip mounter B judges that the forming time of the chip mounter B and the forming time of the chip mounter B are consistent, the usable standard image stored in the chip mounter B is consistent with the storage of the mounting template library, therefore, the mounting template library does not need to feed back the usable standard image to the chip mounter B, the chip mounter B can directly feed back the usable standard image stored in the local terminal to the chip mounter A (step S206), the situation that the mounting template library directly transmits the usable standard image occupying large bandwidth resources is avoided, and the transmission efficiency is improved.
If the chip mounter B judges that the forming time of the chip mounter B and the forming time of the chip mounter B are inconsistent, the available standard image stored by the chip mounter B is inconsistent with the available standard image stored by the mounting template library and is not the latest available standard image; therefore, the mounter B requests the latest available standard image from the mounting template library, and forwards the requested latest available standard image to the mounter a (step S207).
In addition, in order to prevent the subsequent chip mounter B from requesting the available standard image from the mounting template library again, the chip mounter B may update the available standard image stored at the local terminal to the latest available standard image (step S208), so that the mounting processing efficiency of the electronic component is improved.
In one embodiment, the second placement machine is a candidate second placement machine whose formation time of an available standard placement template image stored in a plurality of candidate second placement machines is latest; the plurality of candidate second chip mounters store available standard mounting template images and have corresponding forming time.
The above embodiment is described with reference to fig. 3: the chip mounter A can broadcast the category of the electronic components to be mounted to a plurality of chip mounters; after the chip mounter which stores available standard images matched with the types of the electronic components to be mounted are B, C and D, B, C and D feed back corresponding forming time to the chip mounter A, and the chip mounter A determines that the forming time B fed back by the chip mounter B is latest, so that the chip mounter A triggers the chip mounter B to interact with a mounting template library.
Therefore, in the above manner, the chip mounter a triggers the chip mounter storing the available standard image with the latest formation time to interact with the mounting template library, so that the time consistency result of step S205 can be further ensured, and the mounting efficiency of the electronic component is improved.
In an embodiment, the mounting template library is further configured to send the available target standard mounting template image stored at the local end to the second chip mounter via the third communication link after determining that the first chip mounter is a legal chip mounter.
Further, the mounting template library is further configured to determine whether the first chip mounter is a legal chip mounter based on the identifier of the first chip mounter, which is fed back by the second chip mounter.
Therefore, in the above manner, the available standard image is sent only after the mounting template library verifies that the chip mounter A belongs to the chip mounter of the system, so that the leakage of the available standard image is avoided.
In one embodiment, the mounting template library is further configured to obtain time taken for adjustment and actual mounting positions of a plurality of first chip mounters; the multiple first chip mounters use the same available standard mounting template image to carry out mounting positions of the electronic components; the mounting template library is also used for determining the distance between each actual mounting position and the standard mounting position of the same available standard mounting template image; the placement template library is further configured to determine whether to prompt an engineer to update the same available standard placement template image based on statistics of the distances and the times spent for adjustments.
For example, if the chip mounters E to J all use the same available standard image to mount the electronic component, the mounting template library may count the adjustment time of the chip mounters E to J, and count the distance between the actual mounting position of the electronic component and the available standard image by each chip mounter; and the mounting template library determines whether to remind an engineer to update the available standard image based on the statistical result, so that the available standard image is reasonably updated.
Further, the mounting template library is further configured to determine weights of the first chip mounters, and assign corresponding weights to the distances and the adjustment spending times to obtain a distance average value and an adjustment spending time average value; the size of the weight of any first chip mounter has positive correlation with the number of first chip mounters in the same version; the first chip mounter of the same version is a first chip mounter of the same version as any one of the first chip mounters.
The above steps are described with reference to fig. 4: each chip mounter can be divided into corresponding versions according to factors affecting the mounting efficiency of the chip mounter, such as the service time of the chip mounter, the manufacturer and the like, and for example, the chip mounters E to H belong to the version (1) and the chip mounters I to J belong to the version (2). Since the number of the chip mounters in different versions is different, a corresponding weight may be set for each version based on the number of the chip mounters, for example, 4 chip mounters in version (1) and 2 chip mounters in version (2), and thus the weight of version (1) is greater than the weight of version (2).
When the average value of the time spent in the statistical adjustment of the mounting template library is calculated, the mounting template library canAccording to the formula 70% × (t) e +t f +t g +t h )/4+30％×(t i +t j ) Determining; similarly, the placement template library may be calculated according to the formula 70% × (d) when calculating the distance average e +d f +d g +d h )/4+30％×(d i +d j ) And/2 determining.
In the above manner, the corresponding weight is determined by combining the number of the chip mounters of each version, so that the situation that the available standard images are updated by the chip mounters of the versions with a small number of factors can be avoided under the condition that the efficiency and the accuracy of the chip mounters of the versions with a large number are ensured, and the situation that the adjustment efficiency and the adjustment accuracy of the chip mounters of the same version with the large number are possibly lower based on the updated element templates can also be avoided.
Furthermore, the mounting template library is further configured to prompt the engineer to update the same available standard mounting template image if the distance average value is greater than a distance threshold value and the adjustment time average value is greater than a time threshold value, so that the engineer updates the corresponding available standard image in time.
It should be understood that, although the steps in the flowcharts of fig. 1 to 4 are shown in sequence as indicated by the arrows, the steps are not necessarily performed in sequence as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 1 to 4 may include multiple steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of performing the steps or stages is not necessarily sequential, but may be performed alternately or alternately with other steps or at least some of the other steps or stages.
In one embodiment, a mounting template library is provided, and an internal structure diagram of the mounting template library may be as shown in fig. 5. The mounting template library comprises a processor, a memory and a network interface which are connected through a system bus. Wherein the processor of the placement template library is configured to provide computational and control capabilities. The memory of the mounting template library comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The database of the mounting template library is used for storing standard mounting template images. The network interface of the mounting template library is used for being connected and communicated with an external chip mounter through a network.
It will be understood by those skilled in the art that the configuration shown in fig. 5 is a block diagram of only a portion of the configuration associated with the present application, and does not constitute a limitation on the library of mounting templates to which the present application is applied, and a particular library of mounting templates may include more or fewer components than those shown in the figures, or some components may be combined, or have a different arrangement of components.
It will be understood by those skilled in the art that all or part of the processes of the methods of the embodiments described above can be implemented by hardware instructions of a computer program, which can be stored in a non-volatile computer-readable storage medium, and when executed, can include the processes of the embodiments of the methods described above. Any reference to memory, storage, database or other medium used in the embodiments provided herein can include at least one of non-volatile and volatile memory. Non-volatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical storage, or the like. Volatile Memory can include Random Access Memory (RAM) or external cache Memory. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM), among others.
All possible combinations of the technical features in the above embodiments may not be described for the sake of brevity, but should be considered as being within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.
The above examples only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. An electronic component mounting system, comprising:
the surface mounting template library is used for storing standard surface mounting template images of various electronic components;
the first chip mounter is used for acquiring the type of the electronic component to be mounted input by a user and sending the type of the electronic component to be mounted to the mounting template library through a first communication link;
the first chip mounter is further used for sending the type of the electronic component to be mounted to a second chip mounter through a second communication link if an available standard mounting template image fed back by the mounting template library through the first communication link is not received within a preset time period after the type of the electronic component to be mounted is sent; the available standard mounting template image is a standard mounting template image matched with the type of the electronic component to be mounted;
the second chip mounter is used for sending the type of the electronic component to be mounted to the mounting template library through a third communication link when the second chip mounter confirms that the local terminal does not store the available standard mounting template image after receiving the type of the electronic component to be mounted; wherein the second placement machine and the placement template library are performing placement template interaction via the third communication link;
the mounting template library is further used for sending the available target standard mounting template image stored at the local terminal to the second chip mounter through the third communication link after receiving the type of the electronic component to be mounted sent by the second chip mounter;
the second chip mounter is further used for sending the available standard mounting template images fed back by the mounting template library to the first chip mounter through the second communication link;
the mounting template library is also used for acquiring the adjustment time and the actual mounting positions of the first chip mounters; the plurality of first chip mounters are chip mounters for mounting electronic components by using the same available standard mounting template image;
the mounting template library is also used for determining the distance between each actual mounting position and the standard mounting position of the same available standard mounting template image;
the placement template library is further configured to determine whether to prompt an engineer to update the same available standard placement template image based on statistics of time spent for each of the distances and each of the adjustments.
2. The system of claim 1,
the second chip mounter is on the same production line with the first chip mounter, and the second chip mounter is an upstream chip mounter of the first chip mounter; the first placement machine is further configured to receive a first placement trigger instruction by the second placement machine via the second communication link; the first mounting triggering instruction is used for indicating the first chip mounter to start a mounting task;
or the like, or, alternatively,
the second chip mounter is on the same production line with the first chip mounter, and the second chip mounter is on the same production line with the first chip mounter and is a downstream chip mounter of the first chip mounter; the first chip mounter is further used for sending a second mounting trigger instruction to the second chip mounter through the second communication link; and the second mounting triggering instruction is used for indicating the second chip mounter to start a mounting task.
3. The system of claim 1,
the second chip mounter is used for sending the type of the electronic component to be mounted to the mounting template library through the third communication link and requesting the mounting template library to feed back forming time when the second chip mounter confirms that the local terminal stores the available standard mounting template image after receiving the type of the electronic component to be mounted;
the mounting template library is also used for determining available standard mounting template images which are stored at the local terminal and matched with the types of the electronic components to be mounted, and feeding back the forming time of the available standard mounting template images stored at the local terminal to the second mounting machine;
the second chip mounter is further used for sending the available standard mounting template images stored at the local end to the first chip mounter if the forming time fed back by the mounting template library is consistent with the forming time of the available standard mounting template images stored at the local end.
4. The system of claim 3,
the second chip mounter is further configured to determine that the available standard mounting template image stored in the mounting template library is the latest available standard mounting template image if it is determined that the formation time fed back by the mounting template library is inconsistent with the formation time of the available standard mounting template image stored at the home terminal, and request the latest available standard mounting template image from the mounting template library;
the second chip mounter is further configured to send the latest available standard mounting template image to the first chip mounter after receiving the latest available standard mounting template image.
5. The system of claim 4, wherein the second placement machine is further configured to update the locally stored available standard placement template images with the latest available standard placement template image.
6. The system of claim 3,
the second chip mounter is a candidate second chip mounter with the latest forming time of available standard mounting template images stored in a plurality of candidate second chip mounters; the plurality of candidate second chip mounters store available standard mounting template images and have corresponding forming time.
7. The system of claim 1, wherein the placement template library is further configured to send locally stored available target standard placement template images to the second placement machine via the third communication link after determining that the first placement machine is a legitimate placement machine.
8. The system of claim 7, wherein the mounting template library is further configured to determine whether the first mounter is a legitimate mounter based on the identifier of the first mounter fed back by the second mounter.
9. The system according to claim 1, wherein the placement template library is further configured to determine a weight of each first placement machine, and assign a corresponding weight to each distance and each adjustment elapsed time, so as to obtain a distance average value and an adjustment elapsed time average value;
the size of the weight of any first chip mounter has positive correlation with the number of first chip mounters in the same version; the first chip mounter of the same version is a first chip mounter of the same version as any one of the first chip mounters.
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| CN105590143A (en) * | 2015-12-17 | 2016-05-18 | 兰州理工大学 | Optimization method for balancing loads of multiple chip mounters in assembly line in PCB assembling technology |
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| JP2996501B2 (en) * | 1990-09-28 | 2000-01-11 | マツダ株式会社 | Equipment control method and device |
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| US10285319B2 (en) * | 2013-10-30 | 2019-05-07 | Fuji Corporation | Component mounting line management device |
| CN108737528B (en) * | 2018-05-11 | 2021-11-26 | 青岛海尔科技有限公司 | Networking method and device, Internet of things equipment, control terminal and storage medium |
| CN112333054B (en) * | 2020-07-22 | 2024-04-05 | 深圳Tcl新技术有限公司 | Device communication method, device and computer readable storage medium |
| CN112367828B (en) * | 2020-10-22 | 2021-08-17 | 爱微(江苏)电力电子有限公司 | Precision compensation system suitable for chip mounter |
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| CN105590143A (en) * | 2015-12-17 | 2016-05-18 | 兰州理工大学 | Optimization method for balancing loads of multiple chip mounters in assembly line in PCB assembling technology |
| CN111836212A (en) * | 2020-06-02 | 2020-10-27 | 珠海格力电器股份有限公司 | Air conditioner data transmission method and device and air conditioner |
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