CN112366159B - Substrate pushing mechanism of automatic chip discharging equipment - Google Patents
Substrate pushing mechanism of automatic chip discharging equipment Download PDFInfo
- Publication number
- CN112366159B CN112366159B CN202011362039.XA CN202011362039A CN112366159B CN 112366159 B CN112366159 B CN 112366159B CN 202011362039 A CN202011362039 A CN 202011362039A CN 112366159 B CN112366159 B CN 112366159B
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- 239000000758 substrate Substances 0.000 title claims abstract description 80
- 230000007246 mechanism Effects 0.000 title claims abstract description 27
- 238000007599 discharging Methods 0.000 title description 3
- 238000003825 pressing Methods 0.000 claims abstract description 69
- 238000003860 storage Methods 0.000 claims abstract description 28
- 230000001360 synchronised effect Effects 0.000 claims abstract description 19
- 239000000523 sample Substances 0.000 claims abstract description 14
- 210000001503 joint Anatomy 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Abstract
The invention discloses a substrate pushing mechanism of automatic chip blanking equipment, which comprises a transfer component, a synchronous component, a pressing plate component, a stop block component, a stock bin, a proximity switch, a switch probe and a correlation laser sensor, wherein the transfer component is connected with the synchronous component; the transfer assembly comprises a supporting plate, a supporting plate pushing block, a pushing block support sliding block and a linear sliding rail, the synchronous assembly comprises a stepping motor, a driving wheel, a driven wheel and a synchronous belt, the pressing plate assembly comprises two pressing plates, two side pressing plate cylinders and two pressing plate supports, the stop block assembly comprises a stop block, a stop block cylinder and a stop block cylinder support, the storage bin is located in front of the stop block, and an inlet of the storage bin is in butt joint with the front side of the initial position of the supporting plate. The invention can well control the transplanting precision of the substrate, can prevent the substrate from sinking when being pushed into the bin, can prevent the risk of material folding caused by the arching of the substrate after the substrate passes through the BTU, provides guarantee for the stability and the safety of the substrate pushing into the bin, and improves the transplanting efficiency.
Description
Technical Field
The invention belongs to the field of automatic chip blanking equipment, and particularly relates to a substrate pushing mechanism for pushing various substrates into a bin in automatic chip blanking equipment, which is used for LEAD FREAM and chip carrying.
Background
In the semiconductor industry, in order to increase the production speed, an automatic chip blanking device equipped with a substrate pushing mechanism is generally used to quickly and orderly stack LEAD FREAM (lead frame) or chips in corresponding jigs, and the substrate pushing mechanism is used to quickly and orderly push LEAD FREAM (lead frame) or chips into a bin, so as to realize subsequent automatic chip blanking.
Most of the existing substrate pushing mechanisms need to push the substrate into the storage bin manually, although a few of the existing substrate pushing mechanisms can push the substrate into the storage bin automatically at present, most of the mechanisms adopt belts to transport the substrate, so that the risk of substrate sinking or substrate folding easily exists, and the space capable of improving the production efficiency is almost developed completely.
Meanwhile, the periphery of the substrate cannot be collided or extruded, and the existing substrate pushing mechanism can collide more or less parts except the bottom surface of the substrate in the processes of sucking the substrate, transporting the substrate and placing the substrate into a storage bin, so that the stability is low, and the substrate pushing mechanism is one of the reasons of low overall efficiency of equipment.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the substrate pushing mechanism of the automatic chip blanking equipment, which can improve the transplanting precision, prevent the substrate from sinking and folding and improve the production efficiency of the equipment.
In order to solve the technical problems and achieve the technical effects, the invention is realized by the following technical scheme:
a substrate pushing mechanism of automatic chip blanking equipment comprises a transfer assembly, a synchronous assembly, a pressing plate assembly, a stop block assembly and a stock bin;
The transfer assembly comprises a supporting plate for bearing a substrate, a supporting plate pushing block, a pushing block support sliding block and a linear sliding rail, wherein the supporting plate pushing block is fixedly connected with the rear end of the supporting plate, the linear sliding rail is positioned below the supporting plate, the pushing block support sliding block is slidably arranged on the linear sliding rail, and the supporting plate pushing block is arranged on the pushing block support sliding block through the pushing block support;
the synchronous assembly comprises a stepping motor, a driving wheel, a driven wheel and a synchronous belt, wherein the driving wheel is positioned at one end of the linear slide rail, the driven wheel is positioned at the other end of the linear slide rail, the output end of the stepping motor is connected with the driving wheel, the synchronous belt is sleeved on the driving wheel and the driven wheel at the same time, and one side of the synchronous belt is fixedly connected with the push block support sliding block;
The pressing plate assembly comprises two pressing plates for pressing the left and right edges of the substrate, two side pressing plate air cylinders and two pressing plate brackets, the two pressing plate brackets are respectively positioned at the left side and the right side of the initial position of the supporting plate, the two pressing plates are respectively arranged on the two pressing plate brackets in a left-right movable mode, the two side pressing plate air cylinders are respectively arranged on the two pressing plate brackets, and the output ends of the two side pressing plate air cylinders are respectively connected with the two pressing plates;
The stop block assembly comprises a stop block, a stop block air cylinder and a stop block air cylinder bracket, wherein the stop block is used for stopping the base plate at the storage bin, the stop block air cylinder bracket is positioned at one side in front of the initial position of the support plate, the stop block air cylinder is suspended above the front side of the initial position of the support plate through the stop block air cylinder bracket, and the stop block is connected with the output end of the stop block air cylinder;
The bin is located in front of the stop block, and an inlet of the bin is in butt joint with the front side of the initial position of the supporting plate.
Further, the supporting plate pushing block is arranged on the supporting plate pushing block support through a supporting plate pushing block sliding rail, a switch probe used for sensing forward pushing resistance of the supporting plate is arranged on the supporting plate pushing block support, the switch probe is connected with the supporting plate pushing block through a spring, and if the switch probe senses certain resistance when the supporting plate is pushed forward, the automatic alarm is given out, and the stepping motor is controlled to stop working.
Further, a proximity switch for sensing whether the substrate is in place is arranged near the initial position of the support plate, and the stepping motor can be started to drive the support plate to push the substrate forward only when the proximity switch senses that the substrate is in place on the support plate.
Further, a through groove is formed in the middle of the supporting plate, the proximity switch is arranged below the initial position of the supporting plate, and the horizontal position corresponds to the through groove.
Further, at least one group of correlation laser sensors are arranged on the left side and the right side of the stop block, the stepping motor can drive the supporting plate to push the substrate into the corresponding track in the storage bin only when the correlation laser sensors detect that the horizontal position of the substrate to be pushed in is consistent with the corresponding track on the storage bin, otherwise, the correlation laser sensors automatically alarm and stop working through feedback control of the stepping motor.
Further, the height of the lower surfaces of the left pressing plate and the right pressing plate is equal to or slightly greater than the height of the upper surface of the base plate when the base plate is supported on the supporting plate, so that when the two pressing plates are folded inwards, the two pressing plates are only slightly pressed or slightly suspended on the left edge and the right edge of the base plate, which is equivalent to temporarily forming a pushing track, so that the base plate can be aligned to the inlet of the storage bin, and damage to the base plate is avoided.
Further, when the two pressing plates are opened outwards, the two pressing plates are not overlapped with the left edge and the right edge of the supporting plate on the plane respectively; when the two pressing plates are folded inwards, the two pressing plates are respectively overlapped with the left edge and the right edge of the supporting plate partially on the plane.
Further, the device also comprises a bottom plate, wherein the driving wheel, the driven wheel, the linear slide rail, the pressing plate support and the stop block cylinder support are all installed on the bottom plate, and the stepping motor is installed on the bottom plate through a motor support.
Further, the size of the supporting plate corresponds to the space size of each layer of rail of the storage bin, and the travel of the supporting plate is not shorter than the length of the storage bin, so that the substrate can be pushed into the storage bin completely.
Further, the backup pad comprises two piece left and right sides daughter board, and two piece left and right sides daughter board interval is adjustable to be set up on the backup pad ejector pad, can be according to during the use the interval of two daughter boards of width adjustment of base plate.
The beneficial effects of the invention are as follows:
1. the power source is driven by the stepping motor, the mechanism is controlled in a closed loop, the transplanting precision of the substrate can be well controlled, and the transplanting efficiency is improved.
2. The invention adopts the supporting plate to support the bottom surface of the substrate and is matched with the diagonal proximity switch, thereby preventing the substrate from sinking when pushing into the storage bin and providing guarantee for the stability of pushing the substrate into the storage bin.
3. The invention adopts the pressing plates at the left side and the right side to assist in pushing the substrate, can effectively prevent the risk of material folding caused by the arching of the substrate after the substrate passes through the BTU, and provides guarantee for the safety of pushing the substrate into the storage bin.
4. The invention adopts the switch probe and the correlation laser sensor simultaneously, is used for respectively sensing the resistance of the supporting plate during the pushing and detecting the horizontal position of each layer of track and the substrate of the storage bin, and effectively improves the practicability of the equipment.
5. The invention adopts the supporting plates with adjustable width, and the distance between the two sub supporting plates can be adjusted according to the product requirement, thereby realizing the compatibility of various products and improving the practicability of the equipment.
The foregoing description is only an overview of the present invention, and is intended to provide a better understanding of the present invention, as it is embodied in the following description, with reference to the preferred embodiments of the present invention and the accompanying drawings. Specific embodiments of the present invention are given in detail by the following examples and the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic view of a left side structure of a substrate pushing mechanism of an automatic chip discharging device according to the present invention when the substrate pushing mechanism is loaded with a substrate;
Fig. 2 is a schematic diagram of a right side structure of the substrate pushing mechanism of the automatic chip blanking apparatus according to the present invention when the substrate pushing mechanism is used for loading a substrate.
Detailed Description
The application will be described in detail below with reference to the drawings in combination with embodiments. The description herein is to be taken in a providing further understanding of the application and is made in the accompanying drawings, which illustrate and explain the application by way of example and not of limitation.
Referring to fig. 1-2, a substrate pushing mechanism of automatic chip blanking equipment comprises a transfer component, a synchronization component, a pressing plate component, a stop block component and a stock bin 9;
The transfer assembly comprises a supporting plate 14 for bearing the substrate 6, a supporting plate pushing block 13, a pushing block support 16, a pushing block support sliding block 17 and a linear sliding rail 18, wherein the supporting plate pushing block 13 is fixedly connected with the rear end of the supporting plate 14, the linear sliding rail 18 is positioned below the supporting plate 14, the pushing block support sliding block 17 is slidably arranged on the linear sliding rail 18, and the supporting plate pushing block 13 is arranged on the pushing block support sliding block through the pushing block support 16;
the synchronous assembly comprises a stepping motor 5, a driving wheel 19, a driven wheel and a synchronous belt 2, wherein the driving wheel 19 is positioned at one end of the linear slide rail 18, the driven wheel is positioned at the other end of the linear slide rail 18, the output end of the stepping motor 5 is connected with the driving wheel 19, the synchronous belt 2 is sleeved on the driving wheel 19 and the driven wheel at the same time, and one side of the synchronous belt 2 is fixedly connected with the push block support sliding block 17;
The pressing plate assembly comprises two pressing plates 4 used for pressing the left and right edges of the base plate 6, two side pressing plate air cylinders 3 and two pressing plate supports 20, the two pressing plate supports 20 are respectively positioned at the left and right sides of the initial position of the supporting plate 14, the two pressing plates 4 are respectively arranged on the two pressing plate supports 20 in a left and right movable mode, the two side pressing plate air cylinders 3 are respectively arranged on the two pressing plate supports 20, and the output ends of the two side pressing plate air cylinders 3 are respectively connected with the two pressing plates 4;
The stop block assembly comprises a stop block 8, a stop block cylinder 7 and a stop block cylinder bracket 21, wherein the stop block 8 is used for stopping the base plate 6 on the storage bin 9, the stop block cylinder bracket 21 is positioned at one side in front of the initial position of the supporting plate 14, the stop block cylinder 7 is suspended above the front side of the initial position of the supporting plate 14 through the stop block cylinder bracket 21, and the stop block 8 is connected with the output end of the stop block cylinder 7;
The bin 9 is located in front of the stop block 8, and the inlet of the bin 9 is in butt joint with the front side of the initial position of the supporting plate 14.
As a further embodiment, the support plate pushing block 13 is disposed on the support plate pushing block support 16 through a support plate pushing block sliding rail 12, and a switch probe 10 for sensing the forward pushing resistance of the support plate 14 is installed on the support plate pushing block support 16, the switch probe 10 is connected with the support plate pushing block 13 through a spring 11, and if the switch probe 10 senses a certain resistance when the support plate 14 advances forward, the switch probe automatically alarms and controls the stepper motor 5 to stop working.
As a further embodiment, a proximity switch 15 for sensing whether the substrate 6 is in place is provided near the initial position of the support plate 14, and the stepper motor 5 can be started to drive the support plate 14 to push the substrate 6 forward only when the proximity switch 15 senses that the substrate 6 is in place on the support plate 14.
As a further embodiment, a through slot is provided in the middle of the supporting plate 14, and the proximity switch 15 is disposed below the initial position of the supporting plate 14, and the horizontal position corresponds to the through slot.
As a further embodiment, at least one set of correlation laser sensors 1 are disposed on the left and right sides of the stop block 8, and the stepper motor 5 can drive the support plate 14 to push the substrate 6 onto the corresponding track in the storage bin 9 only when the correlation laser sensors 1 detect that the horizontal position of the substrate 6 to be pushed in is consistent with the corresponding track on the storage bin 9, otherwise, the correlation laser sensors 1 automatically alarm, and the stepper motor 5 is controlled by feedback to stop working.
As a further embodiment, the height of the lower surfaces of the left and right pressing plates 4 is equal to or slightly greater than the height of the upper surface of the base plate 6 when the base plate 6 is supported on the supporting plate 14, so that when the two pressing plates 4 are folded inwards, only a slight pressure or a slight suspension is applied to the left and right edges of the base plate 6, which is equivalent to temporarily forming a pushing track, so that the base plate 6 can be aligned with the inlet of the bin 9, and damage to the base plate 6 is avoided.
As a further example, when two of the pressing plates 4 are opened outward, the two pressing plates 4 do not coincide with the left and right edges of the support plate 14, respectively, in plan; when the two pressing plates 4 are folded inwards, the two pressing plates 4 are partially overlapped with the left and right edges of the supporting plate 14 on the plane.
As a further embodiment, the invention further comprises a bottom plate 22, wherein the driving wheel 19, the driven wheel, the linear slide rail 18, the pressing plate bracket 20 and the stop block cylinder bracket 21 are all arranged on the bottom plate 22, and the stepping motor 5 is arranged on the bottom plate 22 through a motor bracket 23.
As a further example, the dimensions of the support plate 14 correspond to the spatial dimensions of each layer of track of the magazine 9, and the travel of the support plate 14 is not shorter than the length of the magazine 9, ensuring that the base plate 6 can be pushed completely into the magazine 9.
As a further embodiment, the supporting plate 14 is composed of two sub-boards, wherein the distance between the two sub-boards is adjustable, and the distance between the two sub-boards can be adjusted according to the width of the base plate 6 when in use.
When the suction nozzle mechanism places the substrate 6 on the support plate 14, the left and right side pressing plate cylinders 3 operate to fold the left and right pressing plates 4 inward and lightly press the left and right edges of the substrate 6.
When the proximity switch 15 senses that the substrate 6 is in place, the stepping motor 5 drives the synchronous belt 2 to rotate through the driving wheel 19 and the driven wheel, and then drives the push block support sliding block 17, the push block support 16 and the support block push block to push the support plate 14 to move forwards, so that the substrate 6 is pushed to the inlet of the storage bin 9.
At this time, the opposite laser sensor 1 detects the horizontal position of the corresponding track of the substrate 6 and the bin 9, if OK, the stepper motor 5 continues to drive the support plate 14 to drive the substrate 6 to push into the corresponding track of the bin 9, if NG, the opposite laser sensor 1 feeds back, and the stepper motor 5 stops working.
After the step motor 5 drives the supporting plate 14 to completely push the substrate 6 into the storage bin 9, the stop block cylinder 7 works to drive the stop block 8 to move downwards and block the rear end of the substrate 6, then the step motor 5 works reversely to withdraw the supporting plate 14 from the storage bin 9, and at the moment, the substrate 6 is left in the storage bin 9 due to the blocking of the stop block 8, so that the function of pushing the substrate 6 into the storage bin 9 is realized.
In addition, in the whole process that the supporting plate 14 drives the base plate 6 to push into the bin 9, the switch probe 10 senses the resistance received by the supporting plate 14 when the supporting plate 14 is pushed forward in real time through the spring 11 between the switch probe and the supporting plate pushing block 13, and if the resistance sensed by the switch probe 10 exceeds a set value, the automatic alarm is given out, and the stepping motor 5 is controlled to stop working.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a base plate pushing equipment of automatic unloading equipment of chip which characterized in that: comprises a transfer component, a synchronous component, a pressing plate component, a stop block component and a stock bin (9);
The transfer assembly comprises a supporting plate (14) for bearing a substrate (6), a supporting plate pushing block (13), a pushing block support (16), a pushing block support sliding block (17) and a linear sliding rail (18), wherein the supporting plate pushing block (13) is fixedly connected with the rear end of the supporting plate (14), the linear sliding rail (18) is positioned below the supporting plate (14), the pushing block support sliding block (17) is slidably arranged on the linear sliding rail (18), and the supporting plate pushing block (13) is arranged on the pushing block support sliding block through the pushing block support (16);
The synchronous assembly comprises a stepping motor (5), a driving wheel (19), a driven wheel and a synchronous belt (2), wherein the driving wheel (19) is positioned at one end of the linear slide rail (18), the driven wheel is positioned at the other end of the linear slide rail (18), the output end of the stepping motor (5) is connected with the driving wheel (19), the synchronous belt (2) is sleeved on the driving wheel (19) and the driven wheel at the same time, and one side of the synchronous belt (2) is fixedly connected with the push block support sliding block (17);
The pressing plate assembly comprises two pressing plates (4) used for pressing the left and right edges of the substrate (6), two side pressing plate air cylinders (3) and two pressing plate supports (20), the two pressing plate supports (20) are respectively positioned at the left side and the right side of the initial position of the supporting plate (14), the two pressing plates (4) are respectively arranged on the two pressing plate supports (20) in a left-right movable mode, the two side pressing plate air cylinders (3) are respectively arranged on the two pressing plate supports (20), and the output ends of the two side pressing plate air cylinders (3) are respectively connected with the two pressing plates (4);
The stop block assembly comprises a stop block (8), a stop block cylinder (7) and a stop block cylinder bracket (21) which are used for stopping the base plate (6) at the storage bin (9), the stop block cylinder bracket (21) is positioned at one side in front of the initial position of the supporting plate (14), the stop block cylinder (7) is suspended above the front side of the initial position of the supporting plate (14) through the stop block cylinder bracket (21), and the stop block (8) is connected with the output end of the stop block cylinder (7);
The bin (9) is positioned in front of the stop block (8), and an inlet of the bin (9) is in butt joint with the front side of the initial position of the supporting plate (14);
The support plate pushing block (13) is arranged on the support plate pushing block support (16) through a support plate pushing block sliding rail (12), a switch probe (10) for sensing forward pushing resistance of the support plate (14) is arranged on the support plate pushing block support (16), and the switch probe (10) is connected with the support plate pushing block (13) through a spring (11);
A proximity switch (15) for sensing whether the substrate (6) is in place or not is provided near the initial position of the support plate (14).
2. The substrate pushing mechanism of the automatic chip blanking apparatus of claim 1, wherein: the middle part of backup pad (14) is provided with logical groove, proximity switch (15) set up the below of backup pad (14) initial position, and horizontal position with logical groove corresponds.
3. The substrate pushing mechanism of the automatic chip blanking apparatus of claim 1, wherein: at least one group of correlation laser sensors (1) used for detecting and feeding back whether each layer of track on the storage bin (9) corresponds to the horizontal position of the substrate (6) to be pushed in or not are arranged on the left side and the right side of the stop block (8).
4. The substrate pushing mechanism of the automatic chip blanking apparatus of claim 1, wherein: the position heights of the lower surfaces of the left pressing plate (4) and the right pressing plate (4) are equal to or slightly larger than the position height of the upper surface of the base plate (6) when the base plate is supported on the supporting plate (14).
5. The substrate pushing mechanism of the automatic chip blanking apparatus of claim 4, wherein: when the two pressing plates (4) are outwards opened, the two pressing plates (4) are not overlapped with the left edge and the right edge of the supporting plate (14) on the plane respectively; when the two pressing plates (4) are folded inwards, the two pressing plates (4) are respectively overlapped with the left edge and the right edge of the supporting plate (14) in part on the plane.
6. The substrate pushing mechanism of the automatic chip blanking apparatus of claim 1, wherein: still include a bottom plate (22), action wheel (19), from the driving wheel linear slide rail (18), clamp plate support (20) dog cylinder support (21) all install on bottom plate (22), step motor (5) are installed through motor support (23) on bottom plate (22).
7. The substrate pushing mechanism of the automatic chip blanking apparatus of claim 1, wherein: the size of the supporting plate (14) corresponds to the space size of each layer of track of the storage bin (9), and the stroke of the supporting plate (14) is not shorter than the length of the storage bin (9).
8. The substrate pushing mechanism of the automatic chip blanking apparatus of claim 1, wherein: the supporting plate (14) consists of a left sub-plate and a right sub-plate, and the distance between the left sub-plate and the right sub-plate is arranged on the supporting plate pushing block (13) in an adjustable mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011362039.XA CN112366159B (en) | 2020-11-27 | 2020-11-27 | Substrate pushing mechanism of automatic chip discharging equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011362039.XA CN112366159B (en) | 2020-11-27 | 2020-11-27 | Substrate pushing mechanism of automatic chip discharging equipment |
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| CN112366159A CN112366159A (en) | 2021-02-12 |
| CN112366159B true CN112366159B (en) | 2024-05-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011362039.XA Active CN112366159B (en) | 2020-11-27 | 2020-11-27 | Substrate pushing mechanism of automatic chip discharging equipment |
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| CN (1) | CN112366159B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113808984B (en) * | 2021-11-18 | 2022-03-18 | 武汉飞恩微电子有限公司 | Pressure chip processing material receiving and feeding device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103979302A (en) * | 2014-05-21 | 2014-08-13 | 苏州博众精工科技有限公司 | Automatic material distributing and acquiring mechanism |
| CN109720839A (en) * | 2017-10-31 | 2019-05-07 | 江苏凯尔生物识别科技有限公司 | Conveying device for the detection of fingerprint mould group |
| CN210338436U (en) * | 2019-07-11 | 2020-04-17 | 苏州市盛百威包装设备有限公司 | Front and rear auxiliary cylinder mechanism for material pushing device |
| CN213691969U (en) * | 2020-11-27 | 2021-07-13 | 苏州茂特斯自动化设备有限公司 | Substrate pushing mechanism of automatic chip blanking equipment |
-
2020
- 2020-11-27 CN CN202011362039.XA patent/CN112366159B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103979302A (en) * | 2014-05-21 | 2014-08-13 | 苏州博众精工科技有限公司 | Automatic material distributing and acquiring mechanism |
| CN109720839A (en) * | 2017-10-31 | 2019-05-07 | 江苏凯尔生物识别科技有限公司 | Conveying device for the detection of fingerprint mould group |
| CN210338436U (en) * | 2019-07-11 | 2020-04-17 | 苏州市盛百威包装设备有限公司 | Front and rear auxiliary cylinder mechanism for material pushing device |
| CN213691969U (en) * | 2020-11-27 | 2021-07-13 | 苏州茂特斯自动化设备有限公司 | Substrate pushing mechanism of automatic chip blanking equipment |
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| CN112366159A (en) | 2021-02-12 |
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