CN112366159A - Substrate pushing mechanism of automatic chip blanking equipment - Google Patents
Substrate pushing mechanism of automatic chip blanking equipment Download PDFInfo
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- CN112366159A CN112366159A CN202011362039.XA CN202011362039A CN112366159A CN 112366159 A CN112366159 A CN 112366159A CN 202011362039 A CN202011362039 A CN 202011362039A CN 112366159 A CN112366159 A CN 112366159A
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- 239000000758 substrate Substances 0.000 title claims abstract description 77
- 230000007246 mechanism Effects 0.000 title claims abstract description 26
- 238000003825 pressing Methods 0.000 claims abstract description 56
- 230000001360 synchronised effect Effects 0.000 claims abstract description 15
- 239000000523 sample Substances 0.000 claims abstract description 13
- 238000003860 storage Methods 0.000 claims abstract description 10
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract 1
- 210000001503 joint Anatomy 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Abstract
The invention discloses a substrate pushing mechanism of automatic chip blanking equipment, which comprises a transfer component, a synchronization component, a pressing plate component, a stop block component, a storage bin, a proximity switch, a switch probe and a correlation laser sensor, wherein the transfer component is used for transferring a substrate to the storage bin; move and carry subassembly and include backup pad, backup pad ejector pad, ejector pad support slider and linear slide rail, and synchronous subassembly includes step motor, action wheel, follows driving wheel and hold-in range, and the clamp plate subassembly includes two clamp plates, two side push plate cylinder and two clamp plate supports, and the dog subassembly includes dog, dog cylinder and dog cylinder support, and the feed bin is located the place ahead of dog, and the entry of feed bin and the front side butt joint of backup pad initial position. The invention can well control the transplanting precision of the substrate, can prevent the substrate from sinking when being pushed into the bin, can prevent the substrate from bending due to self arching after passing through the BTU, provides guarantee for the stability and safety of pushing the substrate into the bin, and improves the transplanting efficiency.
Description
Technical Field
The invention belongs to the field of automatic chip blanking equipment, and particularly relates to a substrate pushing mechanism required by pushing various substrates into a bin in the automatic chip blanking equipment, which is used for carrying Lead Freem and chips.
Background
In the semiconductor industry, in order to increase the production speed, an automatic chip blanking device equipped with a substrate pushing mechanism is usually adopted to rapidly and orderly stack the Lead Freem (Lead frame) or the chips in a corresponding jig, and the substrate pushing mechanism is used to rapidly and orderly push the Lead Freem (Lead frame) or the chips into a bin, so as to realize the subsequent automatic blanking of the chips.
Most of the existing substrate pushing mechanisms need to manually push the substrate into the bin, and although a small part of the existing substrate pushing mechanisms capable of automatically pushing the substrate into the bin are available in the market at present, most of the existing mechanisms adopt belts to transport the substrate, so that the risk of substrate sinking or substrate folding easily exists, and the space capable of improving the production efficiency is almost developed completely.
Meanwhile, the periphery of the substrate cannot be collided or extruded, and the conventional substrate pushing mechanism can collide parts except the bottom surface of the substrate more or less in the processes of sucking the substrate, transporting the substrate and putting the substrate into a bin, so that the stability is low, and the whole efficiency of the equipment is not high.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides the substrate pushing mechanism of the automatic chip blanking equipment, which can improve the transplanting precision, prevent the substrate from sinking and folding and improve the production efficiency of the equipment.
In order to solve the technical problems and achieve the technical effects, the invention is realized by the following technical scheme:
a substrate pushing mechanism of automatic chip blanking equipment comprises a transfer component, a synchronization component, a pressing plate component, a stop block component and a stock bin;
the shifting assembly comprises a supporting plate for bearing a substrate, a supporting plate push block, a push block support sliding block and a linear sliding rail, the supporting plate push block is fixedly connected with the rear end of the supporting plate, the linear sliding rail is positioned below the supporting plate, the push block support sliding block is slidably arranged on the linear sliding rail, and the supporting plate push block is arranged on the push block support sliding block through the push block support;
the synchronous component comprises a stepping motor, a driving wheel, a driven wheel and a synchronous belt, the driving wheel is positioned at one end of the linear slide rail, the driven wheel is positioned at the other end of the linear slide rail, the output end of the stepping motor is connected with the driving wheel, the synchronous belt is sleeved on the driving wheel and the driven wheel at the same time, and one side of the synchronous belt is fixedly connected with the push block support sliding block;
the pressing plate assembly comprises two pressing plates for pressing the left edge and the right edge of the substrate, two side pressing plate cylinders and two pressing plate supports, the two pressing plate supports are respectively positioned at the left side and the right side of the initial position of the supporting plate, the two pressing plates are respectively arranged on the two pressing plate supports in a left-right moving manner, the two side pressing plate cylinders are respectively arranged on the two pressing plate supports, and the output ends of the two side pressing plate cylinders are respectively connected with the two pressing plates;
the stop block assembly comprises a stop block, a stop block air cylinder and a stop block air cylinder support, the stop block air cylinder is used for blocking the substrate on the stock bin, the stop block air cylinder support is positioned on one side in front of the initial position of the support plate, the stop block air cylinder is suspended above the front side of the initial position of the support plate through the stop block air cylinder support, and the stop block is connected with the output end of the stop block air cylinder;
the bin is positioned in front of the stop block, and an inlet of the bin is butted with the front side of the initial position of the support plate.
Furthermore, the backup pad ejector pad passes through backup pad ejector pad slide rail setting and is in on the backup pad ejector pad support, just install one on the backup pad ejector pad support and be used for responding to the switch probe of backup pad forward push resistance, the switch probe pass through the spring with the backup pad ejector pad is connected, if the switch probe is in when the backup pad impels forward senses certain resistance, then automatic alarm to control step motor stops work.
Furthermore, a proximity switch used for sensing whether the substrate is in place is arranged near the initial position of the supporting plate, and only when the proximity switch senses that the substrate is in place on the supporting plate, the stepping motor can be started to drive the supporting plate to push the substrate forwards.
Furthermore, a through groove is formed in the middle of the supporting plate, the proximity switch is arranged below the initial position of the supporting plate, and the horizontal position corresponds to the through groove.
Furthermore, the left and right sides of dog is provided with at least a set of correlation laser sensor, only works as correlation laser sensor detects to be about to push the horizontal position of base plate with when the track that corresponds on the feed bin is unanimous, step motor can drive the backup pad will the base plate pushes on the track that corresponds in the feed bin, otherwise correlation laser sensor automatic alarm to through feedback control step motor stop work.
Furthermore, the height of the lower surfaces of the left and right pressing plates is equal to or slightly greater than the height of the upper surface of the base plate when the base plate is supported on the supporting plate, so that when the two pressing plates are folded inwards, the two pressing plates are only slightly pressed or slightly suspended on the left and right edges of the base plate, which is equivalent to temporarily forming a material pushing track, so that the base plate can be aligned with the inlet of the storage bin, and meanwhile, the base plate is prevented from being damaged.
Furthermore, when the two pressure plates are opened outwards, the two pressure plates are not respectively overlapped with the left edge and the right edge of the supporting plate on the plane; when the two pressing plates are folded inwards, the two pressing plates are partially overlapped with the left edge and the right edge of the supporting plate on the plane respectively.
The linear sliding rail is characterized by further comprising a bottom plate, the driving wheel, the driven wheel, the linear sliding rail, the pressing plate support and the stop block air cylinder support are all arranged on the bottom plate, and the stepping motor is arranged on the bottom plate through a motor support.
Further, the size of the support plate corresponds to the size of the space of each track of the magazine, and the stroke of the support plate is not shorter than the length of the magazine, thereby ensuring that the substrate can be completely pushed into the magazine.
Furthermore, the supporting plate consists of a left sub-plate and a right sub-plate, the distance between the left sub-plate and the right sub-plate is adjustably arranged on the supporting plate pushing block, and the distance between the two sub-plates can be adjusted according to the width of the base plate when the supporting plate is used.
The invention has the beneficial effects that:
1. the power source of the invention is driven by a stepping motor, and the mechanism is closed-loop controlled, so that the transplanting precision of the substrate can be well controlled, and the transplanting efficiency is improved.
2. The bottom surface of the substrate is supported by the supporting plate and matched with the diagonal proximity switch, so that the substrate is prevented from sinking when being pushed into the storage bin, and the stability of pushing the substrate into the storage bin is guaranteed.
3. According to the invention, the left and right pressing plates are adopted to assist in pushing the substrate, so that the risk of material folding caused by self arching of the substrate after passing through the BTU can be effectively prevented, and the safety of pushing the substrate into the bin is guaranteed.
4. The invention adopts the switch probe and the correlation laser sensor at the same time, which are used for respectively sensing the resistance when the supporting plate is pushed forward and detecting the horizontal position of each layer of track and the base plate of the storage bin, thereby effectively improving the practicability of the equipment.
5. The supporting plate with the adjustable width is adopted, and the distance between the two sub supporting plates can be adjusted according to the product requirements, so that the compatibility of various products is realized, and the practicability of the equipment is improved.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings. The detailed description of the present invention is given in detail by the following examples and the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
FIG. 1 is a schematic diagram of a left side structure of a substrate pushing mechanism of the automatic chip blanking apparatus of the present invention when a substrate is loaded;
fig. 2 is a right-side structural schematic view of the substrate pushing mechanism of the automatic chip blanking apparatus of the present invention when loading a substrate.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments. The description set forth herein is intended to provide a further understanding of the invention and forms a part of this application and is intended to be an exemplification of the invention and is not intended to limit the invention to the particular embodiments illustrated.
Referring to fig. 1-2, a substrate pushing mechanism of an automatic chip blanking device includes a transfer component, a synchronization component, a pressing plate component, a stop block component and a stock bin 9;
the shifting assembly comprises a supporting plate 14 for bearing a substrate 6, a supporting plate push block 13, a push block support 16, a push block support sliding block 17 and a linear sliding rail 18, wherein the supporting plate push block 13 is fixedly connected with the rear end of the supporting plate 14, the linear sliding rail 18 is positioned below the supporting plate 14, the push block support sliding block 17 is slidably arranged on the linear sliding rail 18, and the supporting plate push block 13 is arranged on the push block support sliding block through the push block support 16;
the synchronous component comprises a stepping motor 5, a driving wheel 19, a driven wheel and a synchronous belt 2, the driving wheel 19 is positioned at one end of the linear slide rail 18, the driven wheel is positioned at the other end of the linear slide rail 18, the output end of the stepping motor 5 is connected with the driving wheel 19, the synchronous belt 2 is sleeved on the driving wheel 19 and the driven wheel at the same time, and one side of the synchronous belt 2 is fixedly connected with the push block support sliding block 17;
the pressing plate assembly comprises two pressing plates 4 for pressing the left edge and the right edge of the substrate 6, two side pressing plate cylinders 3 and two pressing plate supports 20, the two pressing plate supports 20 are respectively positioned at the left side and the right side of the initial position of the supporting plate 14, the two pressing plates 4 are respectively arranged on the two pressing plate supports 20 in a manner of being capable of moving left and right, the two side pressing plate cylinders 3 are respectively arranged on the two pressing plate supports 20, and the output ends of the two side pressing plate cylinders 3 are respectively connected with the two pressing plates 4;
the stop block assembly comprises a stop block 8, a stop block air cylinder 7 and a stop block air cylinder support 21, the stop block air cylinder support 21 is used for blocking the base plate 6 in the storage bin 9, the stop block air cylinder support 21 is located on one side in front of the initial position of the support plate 14, the stop block air cylinder 7 is suspended above the front side of the initial position of the support plate 14 through the stop block air cylinder support 21, and the stop block 8 is connected with the output end of the stop block air cylinder 7;
the bin 9 is located in front of the stopper 8, and an inlet of the bin 9 is butted against a front side of an initial position of the support plate 14.
As a further embodiment, the supporting plate pushing block 13 is arranged on the supporting plate pushing block support 16 through a supporting plate pushing block sliding rail 12, a switch probe 10 for sensing the forward pushing resistance of the supporting plate 14 is installed on the supporting plate pushing block support 16, the switch probe 10 is connected with the supporting plate pushing block 13 through a spring 11, and if the switch probe 10 senses a certain resistance when the supporting plate 14 is pushed forward, an automatic alarm is given and the stepping motor 5 is controlled to stop working.
As a further embodiment, a proximity switch 15 for sensing whether the substrate 6 is in place is disposed near the initial position of the supporting plate 14, and only when the proximity switch 15 senses that the substrate 6 is in place on the supporting plate 14, the stepping motor 5 can be activated to drive the supporting plate 14 to push the substrate 6 forward.
As a further embodiment, a through slot is provided in the middle of the support plate 14, the proximity switch 15 is provided below the initial position of the support plate 14, and the horizontal position corresponds to the through slot.
As a further embodiment, at least one set of correlation laser sensors 1 is disposed on the left and right sides of the stopper 8, only when the correlation laser sensors 1 detect that the horizontal position of the substrate 6 to be pushed is consistent with the corresponding track on the bin 9, the stepping motor 5 can drive the supporting plate 14 to push the substrate 6 into the corresponding track in the bin 9, otherwise, the correlation laser sensors 1 automatically alarm, and the stepping motor 5 stops working through feedback control.
As a further embodiment, the height of the lower surfaces of the left and right pressing plates 4 is equal to or slightly greater than the height of the upper surface of the substrate 6 when the substrate 6 is supported on the supporting plate 14, so that when the two pressing plates 4 are folded inward, the two pressing plates are only lightly pressed or slightly suspended on the left and right edges of the substrate 6, which is equivalent to temporarily forming a material pushing track, so that the substrate 6 can be aligned with the inlet of the storage bin 9, and meanwhile, the substrate 6 is prevented from being damaged.
As a further example, when the two pressing plates 4 are opened outwards, the two pressing plates 4 are not overlapped with the left and right edges of the supporting plate 14 on the plane respectively; when the two pressing plates 4 are folded inwards, the two pressing plates 4 are partially overlapped with the left edge and the right edge of the supporting plate 14 on the plane respectively.
As a further embodiment, the present invention further includes a bottom plate 22, the driving wheel 19, the driven wheel, the linear slide rail 18, the pressing plate support 20, and the stopper cylinder support 21 are all mounted on the bottom plate 22, and the stepping motor 5 is mounted on the bottom plate 22 through a motor support 23.
As a further example, the size of the support plate 14 corresponds to the spatial size of each layer of track of the magazine 9, and the stroke of the support plate 14 is not shorter than the length of the magazine 9, thereby ensuring that the substrate 6 can be completely pushed into the magazine 9.
As a further embodiment, the supporting plate 14 is composed of a left sub-plate and a right sub-plate, and the left sub-plate and the right sub-plate are arranged on the supporting plate pushing block 13 with adjustable distance, so that the distance between the two sub-plates can be adjusted according to the width of the base plate 6 during use.
When the suction nozzle mechanism places the substrate 6 on the support plate 14, the left and right side push plate cylinders 3 operate to fold the left and right press plates 4 inward and lightly press the left and right edges of the substrate 6.
When the proximity switch 15 senses that the substrate 6 is in place, the stepping motor 5 drives the synchronous belt 2 to rotate through the driving wheel 19 and the driven wheel, so that the pushing block support sliding block 17, the pushing block support 16 and the supporting block pushing block push the supporting plate 14 to move forwards, and the substrate 6 is pushed to the inlet of the storage bin 9.
At the moment, the correlation laser sensor 1 detects the horizontal position of the base plate 6 and the corresponding track of the bin 9, if OK, the stepping motor 5 continues to drive the supporting plate 14 to drive the base plate 6 to be pushed into the corresponding track of the bin 9, if NG, the correlation laser sensor 1 feeds back, and the stepping motor 5 stops working.
After step motor 5 drives backup pad 14 and pushes base plate 6 into feed bin 9 completely, dog cylinder 7 work drives dog 8 downstream and blocks the rear end of base plate 6, then step motor 5 reverse work withdraws from feed bin 9 with backup pad 14, owing to blockking of dog 8 this moment, base plate 6 has been stayed in feed bin 9 to realize the function of pushing into feed bin 9 of base plate 6.
In addition, in the whole process that the supporting plate 14 drives the substrate 6 to be pushed into the bin 9, the switch probe 10 senses the resistance received when the supporting plate 14 is pushed forwards in real time through the spring 11 between the switch probe and the supporting plate pushing block 13, and if the resistance sensed by the switch probe 10 exceeds a set value, an alarm is automatically given, and the stepping motor 5 is controlled to stop working.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a base plate pushing equipment of automatic unloading equipment of chip which characterized in that: comprises a shifting component, a synchronous component, a pressure plate component, a stop block component and a stock bin (9);
the transfer assembly comprises a supporting plate (14) for bearing a substrate (6), a supporting plate push block (13), a push block support (16), a push block support sliding block (17) and a linear sliding rail (18), wherein the supporting plate push block (13) is fixedly connected with the rear end of the supporting plate (14), the linear sliding rail (18) is positioned below the supporting plate (14), the push block support sliding block (17) is slidably arranged on the linear sliding rail (18), and the supporting plate push block (13) is arranged on the push block support sliding block through the push block support (16);
the synchronous component comprises a stepping motor (5), a driving wheel (19), a driven wheel and a synchronous belt (2), the driving wheel (19) is located at one end of the linear sliding rail (18), the driven wheel is located at the other end of the linear sliding rail (18), the output end of the stepping motor (5) is connected with the driving wheel (19), the synchronous belt (2) is sleeved on the driving wheel (19) and the driven wheel at the same time, and one side of the synchronous belt (2) is fixedly connected with the push block support sliding block (17);
the pressing plate assembly comprises two pressing plates (4) used for pressing the left edge and the right edge of the substrate (6), two side pressing plate cylinders (3) and two pressing plate supports (20), the two pressing plate supports (20) are respectively positioned at the left side and the right side of the initial position of the supporting plate (14), the two pressing plates (4) are respectively arranged on the two pressing plate supports (20) in a left-right moving mode, the two side pressing plate cylinders (3) are respectively arranged on the two pressing plate supports (20), and the output ends of the two side pressing plate cylinders (3) are respectively connected with the two pressing plates (4);
the stop block assembly comprises a stop block (8) for blocking the base plate (6) on the stock bin (9), a stop block air cylinder (7) and a stop block air cylinder support (21), the stop block air cylinder support (21) is located on one side in front of the initial position of the support plate (14), the stop block air cylinder (7) is suspended above the front side of the initial position of the support plate (14) through the stop block air cylinder support (21), and the stop block (8) is connected with the output end of the stop block air cylinder (7);
the bin (9) is positioned in front of the stop block (8), and the inlet of the bin (9) is butted with the front side of the initial position of the supporting plate (14).
2. The substrate pushing mechanism of the automatic chip blanking device according to claim 1, characterized in that: the supporting plate pushing block (13) is arranged on the supporting plate pushing block support (16) through a supporting plate pushing block sliding rail (12), a switch probe (10) used for sensing the forward pushing resistance of the supporting plate (14) is installed on the supporting plate pushing block support (16), and the switch probe (10) is connected with the supporting plate pushing block (13) through a spring (11).
3. The substrate pushing mechanism of the automatic chip blanking device according to claim 1, characterized in that: and a proximity switch (15) for sensing whether the base plate (6) is in place is arranged near the initial position of the supporting plate (14).
4. The substrate pushing mechanism of the automatic chip blanking device according to claim 3, characterized in that: the middle part of the supporting plate (14) is provided with a through groove, the proximity switch (15) is arranged below the initial position of the supporting plate (14), and the horizontal position corresponds to the through groove.
5. The substrate pushing mechanism of the automatic chip blanking device according to claim 1, characterized in that: the left side and the right side of the stop block (8) are provided with at least one group of correlation laser sensors (1) which are used for detecting and feeding back each layer of tracks on the storage bin (9) and the horizontal position of the substrate (6) to be pushed or not.
6. The substrate pushing mechanism of the automatic chip blanking device according to claim 1, characterized in that: the height of the lower surfaces of the left pressure plate (4) and the right pressure plate (4) is equal to or slightly greater than the height of the upper surface of the base plate (6) when the base plate (6) is loaded on the supporting plate (14).
7. The substrate pushing mechanism of the automatic chip blanking device according to claim 6, wherein: when the two pressure plates (4) are opened outwards, the two pressure plates (4) are not overlapped with the left edge and the right edge of the supporting plate (14) on the plane respectively; when the two pressing plates (4) are folded inwards, the two pressing plates (4) are partially overlapped with the left edge and the right edge of the supporting plate (14) on the plane respectively.
8. The substrate pushing mechanism of the automatic chip blanking device according to claim 1, characterized in that: still include a bottom plate (22), action wheel (19), follow driving wheel linear slide rail (18), clamp plate support (20), dog cylinder support (21) are all installed on bottom plate (22), step motor (5) are installed through motor support (23) on bottom plate (22).
9. The substrate pushing mechanism of the automatic chip blanking device according to claim 1, characterized in that: the size of the supporting plate (14) corresponds to the space size of each layer of track of the silo (9), and the stroke of the supporting plate (14) is not shorter than the length of the silo (9).
10. The substrate pushing mechanism of the automatic chip blanking device according to claim 1, characterized in that: the supporting plate (14) is composed of a left sub-plate and a right sub-plate, and the distance between the left sub-plate and the right sub-plate is adjustably arranged on the supporting plate pushing block (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011362039.XA CN112366159B (en) | 2020-11-27 | Substrate pushing mechanism of automatic chip discharging equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011362039.XA CN112366159B (en) | 2020-11-27 | Substrate pushing mechanism of automatic chip discharging equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112366159A true CN112366159A (en) | 2021-02-12 |
| CN112366159B CN112366159B (en) | 2024-05-03 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808984A (en) * | 2021-11-18 | 2021-12-17 | 武汉飞恩微电子有限公司 | Pressure chip processing material receiving and feeding device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103979302A (en) * | 2014-05-21 | 2014-08-13 | 苏州博众精工科技有限公司 | Automatic material distributing and acquiring mechanism |
| CN109720839A (en) * | 2017-10-31 | 2019-05-07 | 江苏凯尔生物识别科技有限公司 | Conveying device for the detection of fingerprint mould group |
| CN210338436U (en) * | 2019-07-11 | 2020-04-17 | 苏州市盛百威包装设备有限公司 | Front and rear auxiliary cylinder mechanism for material pushing device |
| CN213691969U (en) * | 2020-11-27 | 2021-07-13 | 苏州茂特斯自动化设备有限公司 | Substrate pushing mechanism of automatic chip blanking equipment |
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103979302A (en) * | 2014-05-21 | 2014-08-13 | 苏州博众精工科技有限公司 | Automatic material distributing and acquiring mechanism |
| CN109720839A (en) * | 2017-10-31 | 2019-05-07 | 江苏凯尔生物识别科技有限公司 | Conveying device for the detection of fingerprint mould group |
| CN210338436U (en) * | 2019-07-11 | 2020-04-17 | 苏州市盛百威包装设备有限公司 | Front and rear auxiliary cylinder mechanism for material pushing device |
| CN213691969U (en) * | 2020-11-27 | 2021-07-13 | 苏州茂特斯自动化设备有限公司 | Substrate pushing mechanism of automatic chip blanking equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113808984A (en) * | 2021-11-18 | 2021-12-17 | 武汉飞恩微电子有限公司 | Pressure chip processing material receiving and feeding device |
| CN113808984B (en) * | 2021-11-18 | 2022-03-18 | 武汉飞恩微电子有限公司 | Pressure chip processing material receiving and feeding device |
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