CN112353410A - Miniature positron emission imaging detector and miniature positron emission imaging equipment - Google Patents
Miniature positron emission imaging detector and miniature positron emission imaging equipment Download PDFInfo
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Abstract
The application relates to a miniature positron emission imaging detector and miniature positron emission imaging equipment. The detection unit includes a crystal array and a photoelectric converter array board. The photoelectric converter array board includes a flexible board. The flexible sheet has a conforming portion and an extending portion. The bonding part is provided with a photoelectric converter array and is electrically connected with the photoelectric converter array. The extension portion is electrically connected with the back-end circuit. The rear end circuit in this application passes through the extension with the photoelectric conversion array board is connected, has reduced the use of plug connector on the one hand, and then has reduced the crystal clearance. On the other hand, due to the use of the flexible board, the problem of insertion loss of the plug connector is avoided, and then the interference of signals in the transmission process is avoided as much as possible.
Description
Technical Field
The application relates to the field of positron emission imaging, in particular to a miniature positron emission imaging detector and miniature positron emission imaging equipment.
Background
A Positron Emission Tomography (PET) system is a device for displaying the internal structure of a human or animal body using a radioactive element tracing method. The positron emission tomography system is widely applied to early diagnosis, treatment scheme formulation, prognosis effect prediction, drug efficacy evaluation and the like of tumors, cardiovascular and cerebrovascular diseases and neurodegenerative diseases in clinic.
The micro PET equipment is a miniature positron emission tomography device which is developed based on a positron emission tomography clinical diagnosis technology and is specially used for small animal in-vivo experimental research. Compared with clinical PET, the micro PET device has higher system spatial resolution and sensitivity and smaller aperture so as to adapt to the requirement of small-volume animal model research. The most important element in a micro PET device is the micro PET detector. However, in the conventional micro PET detector design, there is still a problem that the crystal gap is large.
Disclosure of Invention
Based on this, this application provides a miniature positron emission imaging detector and miniature positron emission imaging equipment to reduce the crystal clearance.
A miniature positron emission imaging detector, includes back-end circuit and with at least one detecting element that the back-end circuit electricity is connected, detecting element includes crystal array, photoelectric converter array board, its characterized in that, photoelectric converter array board includes:
the flexible board has laminating portion and extension, set up the photoelectric converter array in the laminating portion to be connected with photoelectric converter array electricity, the extension with back-end circuit electricity is connected.
In one embodiment, the photoelectric converter array board further includes a hard board, the photoelectric converter array is connected to the flexible board through the hard board, and the photoelectric converter array and the flexible board are respectively disposed on opposite surfaces of the hard board.
In one embodiment, the detection unit includes two photoelectric converter array plates, and the two photoelectric converter array plates are respectively arranged on the crystal array photon incidence surface and the surface opposite to the incidence surface.
In one embodiment, the flexible board is a flexible PCB board.
In one embodiment, the flexible plate is integrally formed with the rigid plate.
In one embodiment, the photoelectric converter array is disposed on the hard plate by printing or welding, and is electrically connected to the hard plate.
In one embodiment, the crystal array photon incidence surface is taken as the front surface of the detection unit, and the extension part of the photoelectric converter array plate extends from at least one side surface of the detection unit to the back end circuit.
In one embodiment, the extended portion of the photoelectric converter array board disposed on the photon incident surface of the crystal array is bent to connect with the back-end circuit along the side surface of the detection unit.
In one embodiment, the method further comprises the following steps:
the cold plate is arranged on the surface of the back end circuit close to the detection unit;
the two ends of the cold plate are respectively oppositely provided with one heat exchange module, and at least one detection unit is arranged between the two heat exchange modules.
A miniature positron emission imaging device comprises a stand and a scanning bed, wherein the stand is internally provided with a miniature positron emission imaging detector as in any one of the above embodiments.
The miniature positron emission imaging detector comprises a back end circuit and at least one detection unit. The detection unit includes a crystal array and a photoelectric converter array board. The photoelectric converter array board includes a flexible board. The flexible sheet has a conforming portion and an extending portion. The bonding part is provided with a photoelectric converter array and is electrically connected with the photoelectric converter array. The extension portion is electrically connected with the back-end circuit. The rear end circuit in this application passes through the extension with the photoelectric conversion array board is connected, has reduced the use of plug connector on the one hand, and then has reduced the crystal clearance. On the other hand, due to the use of the flexible board, the problem of insertion loss of the plug connector is avoided, and then the interference of signals in the transmission process is avoided as much as possible.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a three-dimensional structural layout of a miniature positron emission imaging detector provided by an embodiment of the present application;
FIG. 2 is a schematic diagram of the major components of a miniature positron emission imaging detector provided in accordance with one embodiment of the present application;
FIG. 3 is a schematic view of an asymmetric rigid-flex bonded panel provided in accordance with an embodiment of the present application;
fig. 4 is a schematic structural diagram of an annular miniature positron emission imaging detection device according to an embodiment of the present application.
Description of the main element reference numerals
Miniature positron emission imaging detector 100
First photoelectric conversion array plate 210
Second photoelectric conversion array plate 220
First flexible board 310
First hard plate 311
First attaching portion 312
Back-end circuit 40
Analog-to-digital conversion module 410
Digital signal processing module 420
Digital signal transmission module 430
Heat conducting pad 70
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and it is therefore not intended to be limited to the embodiments disclosed below.
It will be understood that, as used herein, the terms "first," "second," and the like may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, a first acquisition module may be referred to as a second acquisition module, and similarly, a second acquisition module may be referred to as a first acquisition module, without departing from the scope of the present application. The first acquisition module and the second acquisition module are both acquisition modules, but are not the same acquisition module.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The layout problem of narrow space mainly reduces the crystal gap between the miniature positron emission imaging detectors, thereby avoiding the loss of sampling points as much as possible.
In one embodiment, a miniature positron emission imaging detector 100 is provided. The miniature positron emission imaging detector 100 is used in miniature positron emission imaging equipment. The miniature positron emission imaging detector 100 includes a back-end circuit 40 and at least one detection unit 10. The detection unit 10 includes a crystal array 110, and a photoelectric converter array board. The photoelectric converter array board includes a flexible board. The flexible sheet has a conforming portion and an extending portion. The bonding part is provided with a photoelectric converter array and is electrically connected with the photoelectric converter array. The extension portion is electrically connected with the back-end circuit.
The photoelectric conversion array plates are all optically coupled to the crystal array 110. The flexible board includes a transmission line thereon. The back-end circuit 40 is configured to receive an electrical signal formed by the optical-to-electrical conversion array board transmitted through the transmission line on the flexible board.
It is understood that the structure of the crystal array 110 is not particularly limited as long as it is possible to receive gamma photons and the gamma photons generate fluorescence events in the crystal array 110. In an alternative embodiment, the crystal array 110 includes a number of crystal dies.
It is to be understood that the kind of the photoelectric converter is not limited. In an alternative embodiment, the photoelectric converter employs a photomultiplier tube or an avalanche photodiode. In another alternative embodiment, the photoelectric converter employs Silicon Photomultipliers (SiPM). The silicon photomultiplier combines the advantages of the photomultiplier PMT and the avalanche photodiode APD, and has the advantages of high gain, low bias voltage, small size and compatibility with a magnetic field.
It is to be understood that the connection manner of the photoelectric converter array and the flexible board is not particularly limited, and alternatively, the photoelectric converter array is disposed on the flexible board by printing or welding, and is electrically connected with the flexible board.
In this embodiment, the back-end circuit 40 in the present application is connected to the photoelectric conversion array board through the extension portion, so that on one hand, the use of the plug connector is reduced, and further, the crystal gap is reduced. On the other hand, due to the use of the flexible board, the problem of insertion loss of the plug connector is avoided, and then the interference of signals in the transmission process is avoided as much as possible.
In one embodiment, the photoelectric converter array board further comprises a hard board, the photoelectric converter array is connected with the flexible board through the hard board, and the photoelectric converter array and the flexible board are respectively arranged on opposite surfaces of the hard board. The hard plate is attached to the photon incidence surface of the crystal array 110, or the hard plate is attached to the surface opposite to the photon incidence surface of the crystal array 110. At this time, it is understood that the connection manner of the photoelectric converter array and a hard board is not particularly limited, and optionally, the photoelectric converter array is disposed on the hard board by printing or welding, and is electrically connected with the hard board.
In one embodiment, the detection unit includes two photoelectric converter array plates, and is disposed on a face of the crystal array opposite to the photon incidence face. Referring specifically to fig. 1, the miniature positron emission imaging detector 100 includes a back-end circuit 40 and at least one detection unit 10. The detection unit includes a crystal array 110, a first photoelectric conversion array plate 210, and a second photoelectric conversion array plate 220. The first photoelectric converter array board 210 includes a first hard board 311, a first photoelectric converter, and a first flexible board 310. The first hard plate 311 is attached to the surface opposite to the photon incidence surface of the crystal array. The first photoelectric converter is disposed on a plane of the first rigid 311 plate close to the crystal array 110. The first flexible sheet 310 has a first fitting portion 312 and a first extension portion 313. The first attaching portion 312 is disposed on a plane of the first hard plate 311 away from the crystal array 110. The first attaching portion 312 is electrically connected to the first cardboard 311. The first extension portion 313 is electrically connected to the back-end circuit 40. The second photoelectric converter array board 220 includes a second hard board, a second photoelectric converter, and a second flexible board. The second hard plate is attached to the photon incidence surface of the crystal array 110. The second photoelectric converter is arranged on the plane of the second hard plate close to the crystal array. The second flexible sheet has a second abutment and a second extension 323. The second bonding portion is disposed on a plane of the second hard plate away from the crystal array 110. The second attaching portion is electrically connected to the second cardboard. The second extension portion 323 is electrically connected to the back-end circuit 40.
The first and second photoelectric conversion array plates 210 and 220 are both optically coupled to one of the crystal arrays 110. The first flexible board 310 includes a transmission line thereon. The back-end circuit 40 is configured to receive an electrical signal formed by the first photoelectric conversion array board 210 transmitted through the transmission line on the first flexible board 310.
It is to be understood that the connection manner of the photoelectric converter and a hard board is not particularly limited, and alternatively, the first photoelectric converter is disposed on the first hard board by printing or welding, and is electrically connected to the first hard board. The second photoelectric converter is arranged on the second hard plate in a printing or welding mode and is electrically connected with the second hard plate.
In order to improve the spatial resolution of the micro PET system, especially to solve the parallax (parallax error) problem in PET imaging under a small aperture (generally less than or equal to 10cm), the general miniature positron emission imaging detector 100 is designed with a Depth of Deposition (DOI) providing technology, and double-end readout is a DOI technical solution with wide applicability. In addition, since sipms have great advantages in thickness compared to conventional photoelectric converters, the design of DOI PET miniature positron emission tomography detectors 100 using a double-ended readout scheme becomes the first solution for a full-ring long-axis PET system.
In one embodiment, to achieve double-ended readout, each of the crystal arrays 110 is coupled to two of the photo-conversion array plates. The first attaching portion 312 of the first flexible board 310 is connected to the first hard board 311. The connection mode between the first bonding portion 312 and the first hard plate 311 is not particularly limited as long as the first photoelectric conversion array plate 210 can transmit the electrical signal converted by the first photoelectric conversion array plate. In one optional embodiment, the first attaching portion 312, the first extending portion 313 and the first hard plate 311 are integrally formed. A transmission line is etched on the first extension portion 313 of the first flexible board 310. The second attaching portion of the second flexible board is connected with the second hard board. The connection manner of the second bonding portion and the second hard plate is not particularly limited as long as the electrical signal converted by the second photoelectric conversion array plate 220 can be transmitted. In one optional embodiment, the second attaching portion, the second extending portion 323 and the second hard plate are integrally formed. The transmission line is etched on the second extension 323 of the second flexible plate.
It is understood that in an alternative embodiment, the first flexible board 310 and the second flexible board are both flexible PCB boards to realize bending at proper positions.
It is understood that the positions of the first extension portion 313 and the second extension portion 323 are not particularly limited as long as corresponding electrical signals can be transmitted to the back-end circuit through the first extension portion 313 and the second extension portion 323. Optionally, with a photon incidence plane of the crystal array 110 as a front surface of the detection unit 10, the first extension portion 313 and the second extension portion 323 extend from at least one side surface of the detection unit 10 to the back-end circuit 40. As shown in fig. 1, the first extension portion 313 and the second extension portion 323 extend from the same side of the detection unit 10 to the back-end circuit 40.
It is understood that the first and second photoelectric conversion array plates 210 and 220 may have the same structure, but are disposed on two opposite contact surfaces of the crystal array 110. Alternatively, one of the photoelectric conversion array plates may be disposed on a photon incident surface of the crystal array 110. The photoelectric conversion array plate may be further disposed on a face opposite to the photon incident face of the crystal array 110.
It will be appreciated that the crystal arrays 110 are opaque between them. Each crystal array 110 is for receiving gamma photons. The gamma photons produce fluorescence events in the crystal array 110. A photoelectric converter optically coupled to the crystal array 110 converts the optical signal of the fluorescence event into an electrical signal. In order to prevent leakage of optical signals, a reflective film may be provided on each of the first contact surface and the second contact surface other than the crystal array 110. The reflective film in the crystal array 110 may be made of a thin high-reflectivity film material. In another embodiment, the reflective film may also be a high reflectivity coating. The reflective film on the crystal array 110 reflects the optical signal of the fluorescence event by reflection means to be received by the photoelectric converter in its entirety. The electrical signals generated by the optical-to-electrical converter are sent to the back-end circuit 40 through two flexible boards. The back-end circuit 40 receives the electrical signal and performs a preliminary processing on the electrical signal. The back-end circuit 40 may include a variety of functions such as rectification, analog-to-digital conversion, and the like. The signal after the preliminary processing is sent to the next-stage processor through the back-end circuit 40 for signal amplification, filtering, correction, etc., thereby outputting an image.
Optionally, the back-end circuit 40 may include an analog-to-digital conversion module 410, a digital signal processing module 420, and a digital signal transmission module 430. The analog-to-digital conversion module 410, the digital signal processing module 420 and the digital signal transmission module 430 may be integrated on the same PCB board. Of course, the analog-to-digital conversion module 410, the digital signal processing module 420 and the digital signal transmission module 430 may also be correspondingly disposed on different PCB boards. Referring to fig. 2, the analog-to-digital conversion module 410 is separately disposed on a PCB. The digital signal processing module 420 and the digital signal transmission module 430 are disposed on another PCB. A cold plate 60 and a thermal pad 70 are placed between the two PCB boards to eliminate the effect of temperature.
The above-described miniature positron emission imaging detector 100 is used for a miniature positron emission imaging apparatus. The miniature positron emission imaging detector 100 includes a back-end circuit 40 and at least one detection unit 10. The detecting unit 10 includes a crystal array 110, a first photoelectric conversion array plate 210, and a second photoelectric conversion array plate 220. The first photoelectric converter array board 210 includes a first hard board 311, a first photoelectric converter, and a first flexible board 310. The first hard plate 311 is attached to the surface opposite to the photon incidence surface of the crystal array. The first photoelectric converter is disposed on a plane of the first rigid 311 plate close to the crystal array 110. The first flexible sheet 310 has a first fitting portion 312 and a first extension portion 313. The first attaching portion 312 is disposed on a plane of the first hard plate 311 away from the crystal array 110. The first attaching portion 312 is electrically connected to the first cardboard 311. The first extension portion 313 is electrically connected to the back-end circuit 40. The second photoelectric converter array board 220 includes a second hard board, a second photoelectric converter, and a second flexible board. The second hard plate is attached to the photon incidence surface of the crystal array 110. The second photoelectric converter is arranged on the plane of the second hard plate close to the crystal array. The second flexible sheet has a second abutment and a second extension 323. The second bonding portion is disposed on a plane of the second hard plate away from the crystal array 110. The second attaching portion is electrically connected to the second cardboard. The second extension portion 323 is electrically connected to the back-end circuit 40. In this application back-end circuit 40 pass through first extension 313 with first photoelectric conversion array board 210 connects, and passes through second extension 323 with second photoelectric conversion array board 220 connects, has reduced the use of plug connector, has increased the radial space in the miniature positron emission imaging detector, and then has reduced the crystal clearance. On the other hand, the first flexible board 310 and the second flexible board avoid the insertion loss problem of the plug connector, thereby avoiding the interference of signals in the transmission process as much as possible.
Referring also to fig. 3, in one embodiment, the first flexible board 310 and the first rigid board 311 are integrally formed as an asymmetric rigid-flex printed board. The lower part of the asymmetric rigid-flex printed circuit board is a rigid board, and the upper part of the asymmetric rigid-flex printed circuit board is a flexible board. Namely, the board on which the photoelectric converter is provided is the hard board. And setting the wiring area of the transmission line as the flexible board. Particularly, the asymmetric rigid-flex printed circuit board is adopted in the present application, and the thickness of the first flexible board 310 is much smaller than that of the hard paperboard, so as to ensure that the maximum width of the miniature positron emission tomography detector 100 is the width of the first hard board 311, and it is not necessary to additionally reserve a bending space of the first flexible board 310 in the design of the whole ring positron emission tomography imaging device, thereby effectively reducing the crystal gap of the crystal along the circumferential direction.
In one embodiment, the first extension 312 of the first flexible board 310 is bent to connect with the back-end circuit 40 along the side of the detection unit 10. In an alternative embodiment, the first extension 312 of the first flexible sheet 310 may be bent by 0-90 °. The extension of the flexible PCB from the sides also makes it possible to design a long axis positron emission tomography miniature positron emission imaging detector 100.
In an alternative embodiment, the second flexible plate and the second rigid plate are integrally formed into an asymmetric rigid-flex bonded plate. The lower part of the asymmetric rigid-flex printed circuit board is a rigid board, and the upper part of the asymmetric rigid-flex printed circuit board is a flexible board. Namely, the board on which the photoelectric converter is provided is the hard board. And setting the wiring area of the transmission line as the flexible board. It is particularly noted that, in the asymmetric rigid-flex printed circuit board, the thickness of the second flexible board is far smaller than that of the hard paperboard, so that the maximum width of the miniature positron emission tomography detector 100 is ensured to be the width of the second hard board, and a bending space of the second flexible board does not need to be additionally reserved in the design of the whole ring positron emission tomography equipment, so that the annular crystal gap of the crystal along the annular direction is effectively reduced.
In one embodiment, the second extension 323 of the second flexible board is bent to connect with the back-end circuit 40 along the side of the detection unit 10. In an alternative embodiment, the second extension 323 of the second flexible sheet may be bent 0-90. The extension of the flexible PCB from the sides also makes it possible to design a long axis positron emission tomography miniature positron emission imaging detector 100.
In this embodiment, the SiPM array boards are disposed at both ends of the crystal array 110(Block), the visible light generated by the gamma light incident crystal is converted into an electrical signal after being subjected to a photoelectric converter on the SiPM array board, the electrical signal is processed integrally with the SiPM array board to transmit an analog signal to the back-end circuit 40 and converted into a digital signal, and then an event for completing information processing such as time, position, energy, and the like is packaged according to a predetermined data format and then transmitted via a data transmission link.
In one embodiment, the miniature positron emission imaging detector 100 further comprises a substrate and a cold plate 60.
The crystal array 10 is disposed on one side of the substrate. The substrate is used to support the crystal array 10. The substrate serves as a base of the miniature positron emission imaging detector 100 and provides a support structure and a fixing space for other miniature positron emission imaging detector 100 components. The cold plate 60 is disposed on the surface of the back-end circuit 40 near the unit under test 10. The cold plate 60 may be disposed in close proximity to the back end circuit 40.
It is to be understood that the material for forming the substrate is not particularly limited as long as it can support the substrate. In an alternative embodiment, the substrate is made of metal, and in another embodiment, the substrate may be replaced by other suitable types of materials. Optionally, a thermal pad 70 may be disposed between the substrate and the crystal array 10. The cold plate 60 is connected to the thermal pad 70 through a heat exchange module 80 for eliminating the influence of temperature. The two ends of the cold plate 60 are respectively oppositely provided with one heat exchange module 80. The at least one detection unit 10 is disposed between the two heat exchange modules 80. In one alternative embodiment, the back-end circuit 40 is fixedly or removably attached to the cold plate 60. The back end circuit 40 is fixedly or removably attached to the cold plate 60
Referring to fig. 4, the miniature positron emission tomography detector 100 of the present embodiment can be used as a basic unit to design various shapes of miniature positron emission tomography detecting devices. The miniature positron emission imaging detection device may be in the shape of an annular miniature positron emission imaging detection device as described in figure 4. The shape of the miniature positron emission imaging detection equipment can also be a plane circle or a square, etc. According to the actual requirement for the shape design of the miniature positron emission imaging detector 100, the basic structure of the miniature positron emission imaging detector 100 can be designed into the shape of the corresponding miniature positron emission imaging detection equipment, and the miniature positron emission imaging detection equipment can be used in the corresponding detection equipment.
The application provides a miniature positron emission imaging device in one embodiment. The miniature positron emission imaging equipment comprises a frame and a scanning bed. A miniature positron emission imaging detector 100 as described in any of the above embodiments is disposed within the gantry.
The miniature positron emission imaging detector 100 is used in miniature positron emission imaging equipment. The miniature positron emission imaging detector 100 includes a back-end circuit 40 and at least one detection unit 10. The detection unit includes a crystal array 110, a first photoelectric conversion array plate 210, and a first flexible plate 310. The first hard plate 311 is attached to the surface opposite to the photon incidence surface of the crystal array. The first photoelectric converter is disposed on a plane of the first rigid 311 plate close to the crystal array 110. The first flexible sheet 310 has a first fitting portion 312 and a first extension portion 313. The first attaching portion 312 is disposed on a plane of the first hard plate 311 away from the crystal array 110. The first attaching portion 312 is electrically connected to the first cardboard 311. The first extension portion 313 is electrically connected to the back-end circuit 40. The second photoelectric converter array board 220 includes a second hard board, a second photoelectric converter, and a second flexible board. The second hard plate is attached to the photon incidence surface of the crystal array 110. The second photoelectric converter is arranged on the plane of the second hard plate close to the crystal array. The second flexible sheet has a second abutment and a second extension 323. The second bonding portion is disposed on a plane of the second hard plate away from the crystal array 110. The second attaching portion is electrically connected to the second cardboard. The second extension portion 323 is electrically connected to the back-end circuit 40.
The first and second photoelectric conversion array plates 210 and 220 are both optically coupled to one of the crystal arrays 110. The first flexible board 310 includes a transmission line thereon. The back-end circuit 40 is configured to receive an electrical signal formed by the first photoelectric conversion array board 210 transmitted through the transmission line on the first flexible board 310.
It is understood that the structure of the crystal array 110 is not particularly limited as long as it is possible to receive gamma photons and the gamma photons generate fluorescence events in the crystal array 110. In an alternative embodiment, the crystal array 110 includes a number of crystal dies.
It is to be understood that the kind of the photoelectric converter is not limited. In an alternative embodiment, the photoelectric converter employs a photomultiplier tube or an avalanche photodiode. In another alternative embodiment, the photoelectric converter employs Silicon Photomultipliers (SiPM). The silicon photomultiplier combines the advantages of the photomultiplier PMT and the avalanche photodiode APD, and has the advantages of high gain, low bias voltage, small size and compatibility with a magnetic field.
It is to be understood that the connection manner of the photoelectric converter and a hard board is not particularly limited, and alternatively, the first photoelectric converter is disposed on the first hard board by printing or welding, and is electrically connected to the first hard board. The second photoelectric converter is arranged on the second hard plate in a printing or welding mode and is electrically connected with the second hard plate.
In order to improve the spatial resolution of the micro PET system, especially to solve the parallax (parallax error) problem in PET imaging under a small aperture (generally less than or equal to 10cm), the general miniature positron emission imaging detector 100 is designed with a Depth of Deposition (DOI) providing technology, and double-end readout is a DOI technical solution with wide applicability. In addition, since sipms have great advantages in thickness compared to conventional photoelectric converters, the design of DOI PET miniature positron emission tomography detectors 100 using a double-ended readout scheme becomes the first solution for a full-ring long-axis PET system.
In one embodiment, to achieve double-ended readout, each of the crystal arrays 110 is coupled to two of the photo-conversion array plates. The first attaching portion 312 of the first flexible board 310 is connected to the first hard board 311. The connection mode between the first bonding portion 312 and the first hard plate 311 is not particularly limited as long as the first photoelectric conversion array plate 210 can transmit the electrical signal converted by the first photoelectric conversion array plate. In one optional embodiment, the first attaching portion 312, the first extending portion 313 and the first hard plate 311 are integrally formed. A transmission line is etched on the first extension portion 313 of the first flexible board 310. The second attaching portion of the second flexible board is connected with the second hard board. The connection manner of the second bonding portion and the second hard plate is not particularly limited as long as the electrical signal converted by the second photoelectric conversion array plate 220 can be transmitted. In one optional embodiment, the second attaching portion, the second extending portion 323 and the second hard plate are integrally formed. The transmission line is etched on the second extension 323 of the second flexible plate.
It is understood that in an alternative embodiment, the first flexible board 310 and the second flexible board are both flexible PCB boards to realize bending at proper positions.
It is understood that the positions of the first extension portion 313 and the second extension portion 323 are not particularly limited as long as corresponding electrical signals can be transmitted to the back-end circuit through the first extension portion 313 and the second extension portion 323. Optionally, with a photon incidence plane of the crystal array 110 as a front surface of the detection unit 10, the first extension portion 313 and the second extension portion 323 extend from at least one side surface of the detection unit 10 to the back-end circuit 40. As shown in fig. 1, the first extension portion 313 and the second extension portion 323 extend from the same side of the detection unit 10 to the back-end circuit 40.
It is understood that the first and second photoelectric conversion array plates 210 and 220 may have the same structure, but are disposed on two opposite contact surfaces of the crystal array 110. Alternatively, one of the photoelectric conversion array plates may be disposed on a photon incident surface of the crystal array 110. The photoelectric conversion array plate may be further disposed on a face opposite to the photon incident face of the crystal array 110.
It will be appreciated that the crystal arrays 110 are opaque between them. Each crystal array 110 is for receiving gamma photons. The gamma photons produce fluorescence events in the crystal array 110. A photoelectric converter optically coupled to the crystal array 110 converts the optical signal of the fluorescence event into an electrical signal. In order to prevent leakage of optical signals, a reflective film may be provided on each of the first contact surface and the second contact surface other than the crystal array 110. The reflective film in the crystal array 110 may be made of a thin high-reflectivity film material. In another embodiment, the reflective film may also be a high reflectivity coating. The reflective film on the crystal array 110 reflects the optical signal of the fluorescence event by reflection means to be received by the photoelectric converter in its entirety. The electrical signals generated by the optical-to-electrical converter are sent to the back-end circuit 40 through two flexible boards. The back-end circuit 40 receives the electrical signal and performs a preliminary processing on the electrical signal. The back-end circuit 40 may include a variety of functions such as rectification, analog-to-digital conversion, and the like. The signal after the preliminary processing is sent to the next-stage processor through the back-end circuit 40 for signal amplification, filtering, correction, etc., thereby outputting an image.
Optionally, the back-end circuit 40 may include an analog-to-digital conversion module 410, a digital signal processing module 420, and a digital signal transmission module 430. The analog-to-digital conversion module 410, the digital signal processing module 420 and the digital signal transmission module 430 may be integrated on the same PCB board. Of course, the analog-to-digital conversion module 410, the digital signal processing module 420 and the digital signal transmission module 430 may also be correspondingly disposed on different PCB boards. Referring to fig. 2, the analog-to-digital conversion module 410 is separately disposed on a PCB. The digital signal processing module 420 and the digital signal transmission module 430 are disposed on another PCB. A cold plate 60 and a thermal pad 70 are placed between the two PCB boards to eliminate the effect of temperature.
The above-described miniature positron emission imaging detector 100 is used for a miniature positron emission imaging apparatus. The miniature positron emission imaging detector 100 includes a back-end circuit 40 and at least one detection unit 10. The detecting unit 10 includes a crystal array 110, a first photoelectric conversion array plate 210, and a second photoelectric conversion array plate 220. The first photoelectric converter array board 210 includes a first hard board 311, a first photoelectric converter, and a first flexible board 310. The first hard plate 311 is attached to the surface opposite to the photon incidence surface of the crystal array. The first photoelectric converter is disposed on a plane of the first rigid 311 plate close to the crystal array 110. The first flexible sheet 310 has a first fitting portion 312 and a first extension portion 313. The first attaching portion 312 is disposed on a plane of the first hard plate 311 away from the crystal array 110. The first attaching portion 312 is electrically connected to the first cardboard 311. The first extension portion 313 is electrically connected to the back-end circuit 40. The second photoelectric converter array board 220 includes a second hard board, a second photoelectric converter, and a second flexible board. The second hard plate is attached to the photon incidence surface of the crystal array 110. The second photoelectric converter is arranged on the plane of the second hard plate close to the crystal array. The second flexible sheet has a second abutment and a second extension 323. The second bonding portion is disposed on a plane of the second hard plate away from the crystal array 110. The second attaching portion is electrically connected to the second cardboard. The second extension portion 323 is electrically connected to the back-end circuit 40. In this application back-end circuit 40 pass through first extension 313 with first photoelectric conversion array board 210 connects, and passes through second extension 323 with second photoelectric conversion array board 220 connects, has reduced the use of plug connector, has increased the radial space in the miniature positron emission imaging detector, and then has reduced the crystal clearance. On the other hand, the first flexible board 310 and the second flexible board avoid the insertion loss problem of the plug connector, thereby avoiding the interference of signals in the transmission process as much as possible.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A miniature positron emission imaging detector, includes back-end circuit and with at least one detecting element that the back-end circuit electricity is connected, detecting element includes crystal array, photoelectric converter array board, its characterized in that, photoelectric converter array board includes:
the flexible board has laminating portion and extension, set up the photoelectric converter array in the laminating portion to be connected with photoelectric converter array electricity, the extension with back-end circuit electricity is connected.
2. The miniature positron emission imaging detector as claimed in claim 1, wherein said photoelectric transducer array board further comprises a rigid board, said photoelectric transducer array is connected to said flexible board through said rigid board, and said photoelectric transducer array and said flexible board are respectively disposed on opposite sides of said rigid board.
3. The miniature positron emission imaging detector as claimed in claim 2, wherein the detection unit comprises two of the photoelectric converter array plates and is disposed on a face of the crystal array opposite to a photon incident face and the incident face, respectively.
4. The miniature positron emission imaging detector of claim 3, wherein the flexible sheet is a flexible PCB sheet.
5. The miniature positron emission imaging detector as claimed in claim 2, wherein said flexible plate is integrally formed with said rigid plate.
6. The miniature positron emission imaging detector as claimed in claim 5, wherein said array of photoelectric converters is disposed on said rigid plate by printing or soldering, and electrically connected to said rigid plate.
7. The miniature positron emission imaging detector as claimed in any one of claims 1 to 6, wherein the crystal array photon incident plane is a front surface of the detection unit, and the extended portion of the photoelectric converter array board extends from at least one side surface of the detection unit to the back end circuit.
8. The positron emission tomography detector as claimed in claim 7, wherein the extended portion of the photo-electric converter array board disposed on the photon incident surface of the crystal array is bent to connect with the back end circuit along the side of the detector unit.
9. The miniature positron emission imaging detector as set forth in claim 8 further comprising:
the cold plate is arranged on the surface of the back end circuit close to the detection unit;
the two ends of the cold plate are respectively oppositely provided with one heat exchange module, and at least one detection unit is arranged between the two heat exchange modules.
10. A miniature positron emission imaging apparatus comprising a gantry and a couch, the gantry having a miniature positron emission imaging detector as defined in any one of claims 1 to 9 disposed therein.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002054955A2 (en) * | 2000-11-16 | 2002-07-18 | Koninklijke Philips Electronics N.V. | Back-illuminated photodiodes for computed tomography detectors |
| US20040179645A1 (en) * | 2003-03-12 | 2004-09-16 | Hoffman David M. | Ct detector having a segmented optical coupler and method of manufacturing same |
| US20070096031A1 (en) * | 2003-06-19 | 2007-05-03 | Ideas As | Modular radiation detector with scintillators and semiconductor photodiodes and integrated readout and method for assembly thereof |
| US20130153774A1 (en) * | 2010-03-24 | 2013-06-20 | Sensl Technologies Ltd. | Pixellated scintillator readout arrangement and method |
| CN104067146A (en) * | 2011-12-27 | 2014-09-24 | 皇家飞利浦有限公司 | Flexible connectors for pet detectors |
| CN105723243A (en) * | 2013-11-15 | 2016-06-29 | 皇家飞利浦有限公司 | Double-sided organic photodetector on flexible substrate |
| CN105769230A (en) * | 2016-02-03 | 2016-07-20 | 上海联影医疗科技有限公司 | Detector module and medical imaging device |
| JP2017049101A (en) * | 2015-09-01 | 2017-03-09 | キヤノン株式会社 | Radiation detection device, and radiation detection system |
| CN110441811A (en) * | 2019-08-20 | 2019-11-12 | 上海联影医疗科技有限公司 | Pet detector and medical imaging device with it |
| CN110477942A (en) * | 2019-08-20 | 2019-11-22 | 上海联影医疗科技有限公司 | A kind of pet detector and medical imaging device |
-
2020
- 2020-10-26 CN CN202011154416.0A patent/CN112353410B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002054955A2 (en) * | 2000-11-16 | 2002-07-18 | Koninklijke Philips Electronics N.V. | Back-illuminated photodiodes for computed tomography detectors |
| US20040179645A1 (en) * | 2003-03-12 | 2004-09-16 | Hoffman David M. | Ct detector having a segmented optical coupler and method of manufacturing same |
| US20070096031A1 (en) * | 2003-06-19 | 2007-05-03 | Ideas As | Modular radiation detector with scintillators and semiconductor photodiodes and integrated readout and method for assembly thereof |
| US20130153774A1 (en) * | 2010-03-24 | 2013-06-20 | Sensl Technologies Ltd. | Pixellated scintillator readout arrangement and method |
| CN104067146A (en) * | 2011-12-27 | 2014-09-24 | 皇家飞利浦有限公司 | Flexible connectors for pet detectors |
| CN105723243A (en) * | 2013-11-15 | 2016-06-29 | 皇家飞利浦有限公司 | Double-sided organic photodetector on flexible substrate |
| JP2017049101A (en) * | 2015-09-01 | 2017-03-09 | キヤノン株式会社 | Radiation detection device, and radiation detection system |
| CN105769230A (en) * | 2016-02-03 | 2016-07-20 | 上海联影医疗科技有限公司 | Detector module and medical imaging device |
| CN110441811A (en) * | 2019-08-20 | 2019-11-12 | 上海联影医疗科技有限公司 | Pet detector and medical imaging device with it |
| CN110477942A (en) * | 2019-08-20 | 2019-11-22 | 上海联影医疗科技有限公司 | A kind of pet detector and medical imaging device |
Non-Patent Citations (1)
| Title |
|---|
| 李天然等: "《临床PET/CT诊断学》", 31 August 2008, 人民军医出版社 * |
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