CN112353410B - Miniature positron emission imaging detector and miniature positron emission imaging equipment - Google Patents
Miniature positron emission imaging detector and miniature positron emission imaging equipment Download PDFInfo
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Abstract
The application relates to a miniature positron emission imaging detector and miniature positron emission imaging equipment, wherein the miniature positron emission imaging detector comprises a back-end circuit and at least one detection unit. The detection unit includes a crystal array and a photoelectric converter array plate. The photoelectric converter array panel includes a flexible board. The flexible board has a fitting portion and an extending portion. The attaching part is provided with a photoelectric converter array and is electrically connected with the photoelectric converter array. The extension is electrically connected with the back-end circuit. The back-end circuit in the application is connected with the photoelectric conversion array plate through the extension part, so that on one hand, the use of the plug connector is reduced, and then the crystal gap is reduced. On the other hand, the use of the flexible board avoids the problem of insertion loss of the plug connector, and further avoids interference of signals in the transmission process as much as possible.
Description
Technical Field
The present application relates to the field of positron emission imaging, and in particular, to a miniature positron emission imaging detector and a miniature positron emission imaging device.
Background
Positron emission tomography (Positron Emission Tomography, PET) systems are devices that utilize a radioactive element tracing method to display internal structures of a human or animal body. The positron emission tomography system is widely applied to early diagnosis of tumors, cardiovascular and cerebrovascular diseases and neurodegenerative diseases, treatment scheme formulation, prognosis effect prediction, drug efficacy evaluation and the like in clinic.
micro PET equipment is a miniature positron emission tomography device which is developed based on positron emission tomography clinical diagnosis technology and is specially used for experimental research of living bodies of small animals. Compared with clinical PET, the micro PET device has higher system spatial resolution and sensitivity and smaller aperture, so as to meet the requirement of small-volume animal model research. The most prominent component in micro PET equipment is a micro PET detector. However, in the conventional micro PET detector design, there is still a problem of large crystal gap.
Disclosure of Invention
Based on the above, the application provides a miniature positron emission imaging detector and miniature positron emission imaging equipment so as to reduce a crystal gap.
The utility model provides a miniature positron emission imaging detector, includes back-end circuit and with at least one detection unit that back-end circuit electricity is connected, the detection unit includes crystal array, photoelectric converter array board, its characterized in that, photoelectric converter array board includes:
the flexible board is provided with a bonding part and an extension part, wherein the bonding part is provided with a photoelectric converter array and is electrically connected with the photoelectric converter array, and the extension part is electrically connected with the back-end circuit.
In one embodiment, the photoelectric converter array board further comprises a hard board, the photoelectric converter array is connected with the flexible board through the hard board, and the photoelectric converter array and the flexible board are respectively arranged on opposite faces of the hard board.
In one embodiment, the detection unit includes two photoelectric converter array plates, and the two photoelectric converter array plates are respectively disposed on the crystal array photon incidence surface and the surface opposite to the incidence surface.
In one embodiment, the flexible board is a flexible PCB board.
In one embodiment, the flexible plate is integrally formed with the rigid plate.
In one embodiment, the photoelectric converter array is disposed on the hard board by printing or welding, and is electrically connected with the hard board.
In one embodiment, the crystal array photon incidence surface is taken as the front surface of the detection unit, and the extension part of the photoelectric converter array plate extends from at least one side surface of the detection unit to the back-end circuit.
In one embodiment, the extension part of the photoelectric converter array plate arranged on the photon incidence surface of the crystal array is bent and connected with the back-end circuit along the side surface of the detection unit.
In one embodiment, the method further comprises:
the cold plate is arranged on the surface of the rear-end circuit, which is close to the detection unit;
the heat exchange modules are arranged at two ends of the cold plate respectively in an opposite mode, and at least one detection unit is arranged between the two heat exchange modules.
A miniature positron emission imaging apparatus comprising a gantry within which is disposed a miniature positron emission imaging detector as claimed in any of the foregoing embodiments, and a scanning couch.
The miniature positron emission imaging detector comprises a back-end circuit and at least one detection unit. The detection unit includes a crystal array and a photoelectric converter array plate. The photoelectric converter array panel includes a flexible board. The flexible board has a fitting portion and an extending portion. The attaching part is provided with a photoelectric converter array and is electrically connected with the photoelectric converter array. The extension is electrically connected with the back-end circuit. The back-end circuit in the application is connected with the photoelectric conversion array plate through the extension part, so that on one hand, the use of the plug connector is reduced, and then the crystal gap is reduced. On the other hand, the use of the flexible board avoids the problem of insertion loss of the plug connector, and further avoids interference of signals in the transmission process as much as possible.
Drawings
In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings required for the descriptions of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.
FIG. 1 is a layout view of a three-dimensional structure of a miniature positron emission imaging detector provided in one embodiment of the present application;
FIG. 2 is a schematic diagram of the main components of a miniature positron emission imaging detector provided in one embodiment of the present application;
FIG. 3 is a schematic diagram of an asymmetric rigid-flex board according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of an annular micro positron emission imaging detection apparatus according to an embodiment of the present application.
Description of the main element reference numerals
Miniature positron emission imaging detector 100
First photoelectric conversion array plate 210
Second photoelectric conversion array plate 220
First flexible board 310
First hard plate 311
First attaching portion 312
Back-end circuit 40
Analog-to-digital conversion module 410
Digital signal processing module 420
Digital signal transmission module 430
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other ways than those herein described and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not limited to the specific embodiments disclosed below.
It will be understood that the terms "first," "second," and the like, as used herein, may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another element. For example, a first acquisition module may be referred to as a second acquisition module, and similarly, a second acquisition module may be referred to as a first acquisition module, without departing from the scope of the present application. The first acquisition module and the second acquisition module are both acquisition modules, but they are not the same acquisition module.
It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The problem of narrow space layout is mainly to reduce the crystal gap between miniature positron emission imaging detectors, so that the defect of sampling points is avoided as much as possible.
In one embodiment of the present application, a miniature positron emission imaging detector 100 is provided. The miniature positron emission imaging detector 100 is for a miniature positron emission imaging apparatus. The miniature positron emission imaging detector 100 includes back-end circuitry 40 and at least one detection unit 10. The detection unit 10 includes a crystal array 110, and a photoelectric converter array plate. The photoelectric converter array panel includes a flexible board. The flexible board has a fitting portion and an extending portion. The attaching part is provided with a photoelectric converter array and is electrically connected with the photoelectric converter array. The extension is electrically connected with the back-end circuit.
The photoelectric conversion array plates are all photoelectrically coupled with the crystal array 110. The flexible board comprises a transmission line. The back-end circuit 40 is for receiving an electric signal formed by the photoelectric conversion array board transmitted through the transmission line on the flexible board.
It will be appreciated that the structure of the crystal array 110 is not particularly limited as long as it can be realized to receive gamma photons and that the gamma photons generate fluorescence events in the crystal array 110. In an alternative embodiment, the crystal array 110 includes a plurality of crystal dice.
It is understood that the kind of the photoelectric converter is not limited. In an alternative embodiment, the photoelectric converter employs a photomultiplier tube or an avalanche photodiode. In another alternative embodiment, the photoelectric converter employs a silicon photomultiplier (Silicon Photomultipliers, siPM). The silicon photomultiplier combines the advantages of a photomultiplier PMT and an avalanche photodiode APD, and has the advantages of high gain, low bias voltage, small volume and magnetic field compatibility.
It is to be understood that the connection manner between the photoelectric converter array and the flexible board is not particularly limited, and alternatively, the photoelectric converter array is disposed on the flexible board by printing or welding and is electrically connected with the flexible board.
In this embodiment, the back-end circuit 40 in the present application is connected to the photoelectric conversion array board through the extension portion, so that on one hand, the use of the plug connector is reduced, and further, the crystal gap is reduced. On the other hand, the use of the flexible board avoids the problem of insertion loss of the plug connector, and further avoids interference of signals in the transmission process as much as possible.
In one embodiment, the photoelectric converter array board further comprises a hard board, the photoelectric converter array is connected with the flexible board through the hard board, and the photoelectric converter array and the flexible board are respectively arranged on opposite faces of the hard board. The hard plate is attached to the photon incidence surface of the crystal array 110, or the hard plate is attached to the opposite surface of the photon incidence surface of the crystal array 110. At this time, it is understood that the connection manner of the photoelectric converter array and the cardboard is not particularly limited, and alternatively, the photoelectric converter array is disposed on the cardboard by printing or soldering and is electrically connected to the cardboard.
In one embodiment, the detection unit includes two photoelectric converter array plates, and the two photoelectric converter array plates are respectively disposed on the crystal array photon incidence surface and the surface opposite to the incidence surface. Referring specifically to fig. 1, the miniature positron emission imaging detector 100 includes back-end circuitry 40 and at least one detection unit 10. The detection unit includes a crystal array 110, a first photoelectric conversion array plate 210, and a second photoelectric conversion array plate 220. The first photoelectric converter array plate 210 includes a first hard plate 311, a first photoelectric converter, and a first flexible plate 310. The first hard plate 311 is attached to a surface opposite to the photon incidence surface of the crystal array. The first photoelectric converter is disposed on a plane of the first hard 311 plate, which is close to the crystal array 110. The first flexible board 310 has a first fitting portion 312 and a first extending portion 313. The first bonding portion 312 is disposed on a plane of the first hard plate 311 away from the crystal array 110. The first attaching portion 312 is electrically connected to the first cardboard 311. The first extension 313 is electrically connected to the back-end circuit 40. The second photoelectric converter array plate 220 includes a second hard plate, a second photoelectric converter, and a second flexible plate. The second hard plate is attached to the photon incidence surface of the crystal array 110. The second photoelectric converter is arranged on the plane of the second hard plate, which is close to the crystal array. The second flexible board has a second fitting portion and a second extending portion 323. The second attaching portion is disposed on a plane of the second hard plate away from the crystal array 110. The second attaching portion is electrically connected with the second cardboard. The second extension 323 is electrically connected to the back-end circuit 40.
The first photoelectric conversion array plate 210 and the second photoelectric conversion array plate 220 are each photoelectrically coupled with one of the crystal arrays 110. The first flexible board 310 includes a transmission line thereon. The back-end circuit 40 is configured to receive an electrical signal formed by the first photoelectric conversion array board 210 transmitted through the transmission line on the first flexible board 310.
It is to be understood that the connection manner between the photoelectric converter and the cardboard is not particularly limited, and alternatively, the first photoelectric converter is disposed on the first hard board by printing or welding, and is electrically connected with the first hard board. The second photoelectric converter is arranged on the second hard plate in a printing or welding mode and is electrically connected with the second hard plate.
To improve the spatial resolution of micro PET systems, and in particular to solve the parallax (parallaxes) problem in PET imaging at small apertures (typically 10cm or less), the general micro positron emission imaging detector 100 is designed with depth of deposition (Depth of Interaction, DOI) technology, while double-ended readout is a widely applicable DOI technology solution. Furthermore, because sipms offer great advantages in thickness over conventional opto-electronic converters, the implementation of DOI PET mini positron emission imaging detectors 100 using a double-ended readout scheme is much more the first solution to design a full-loop long-axis PET system.
In one embodiment, to implement dual-end readout, each of the crystal arrays 110 is coupled to two of the photoelectric conversion array plates. The first attaching portion 312 of the first flexible board 310 is connected to the first hard board 311. The connection mode between the first bonding portion 312 and the first hard plate 311 is not particularly limited, as long as the electrical signal converted by the first photoelectric conversion array plate 210 can be transmitted. In one alternative embodiment, the first fitting portion 312 and the first extending portion 313 are integrally formed with the first hard plate 311. The first extension 313 of the first flexible board 310 is etched with a transmission line. The second attaching portion of the second flexible board is connected with the second hard board. The connection mode between the second bonding portion and the second hard plate is not particularly limited, as long as the electrical signal converted by the second photoelectric conversion array plate 220 can be transmitted. In one alternative embodiment, the second engaging portion and the second extending portion 323 are integrally formed with the second rigid plate. The second extension 323 of the second flexible plate has a transmission line etched thereon.
It will be appreciated that in an alternative embodiment, the first flexible board 310 and the second flexible board are flexible PCB boards, so as to achieve bending in a suitable position.
It will be appreciated that the positions of the first extending portion 313 and the second extending portion 323 are not particularly limited, as long as the corresponding electrical signals can be transmitted to the back-end circuit through the first extending portion 313 and the second extending portion 323. Optionally, with the photon incidence plane of the crystal array 110 as the front plane of the detection unit 10, the first extension 313 and the second extension 323 extend from at least one side plane of the detection unit 10 to the back-end circuit 40. As shown in fig. 1, the first extension 313 and the second extension 323 extend from the same side of the detecting unit 10 to the back-end circuit 40.
It is understood that the first and second photoelectric conversion array plates 210 and 220 may have the same structure, but are disposed on two opposite contact surfaces of the crystal array 110. Alternatively, one of the photoelectric conversion array plates may be disposed on the photon incidence plane of the crystal array 110. The photoelectric conversion array plate may also be disposed on a surface opposite to the photon incidence surface of the crystal array 110.
It will be appreciated that the crystal arrays 110 are opaque therebetween. Each crystal array 110 is configured to receive gamma photons. The gamma photons produce fluorescent events in the crystal array 110. A photoelectric converter on the crystal array 110, which is photoelectrically coupled thereto, converts the optical signal of the fluorescence event into an electrical signal. In order to prevent leakage of the optical signal, reflective films may be provided on the other surfaces of the crystal array 110 except the first contact surface and the second contact surface. The reflective film in the crystal array 110 may be made of a thin high reflectivity thin film material. In another embodiment, the reflective film may also be a high reflectivity coating. The reflective film on the crystal array 110 receives the optical signal of the fluorescent event by reflection means all of which are received by the photoelectric converter. The electrical signal generated by the photoelectric converter is sent to the back-end circuit 40 through two flexible boards. The back-end circuit 40 receives the electrical signal and subjects the electrical signal to preliminary processing. The back-end circuit 40 may include a variety of functions such as rectification, analog-to-digital conversion, and the like. The primarily processed signal is then sent to the next stage processor through the back-end circuit 40 for signal amplification, filtering, correction, etc., thereby outputting an image.
Optionally, the back-end circuit 40 may include an analog-to-digital conversion module 410, a digital signal processing module 420, and a digital signal transmission module 430. The analog-to-digital conversion module 410, the digital signal processing module 420, and the digital signal transmission module 430 may be integrated on the same PCB board. Of course, the analog-to-digital conversion module 410, the digital signal processing module 420 and the digital signal transmission module 430 may also be disposed on different PCBs. Referring to fig. 2, the analog-to-digital conversion module 410 is separately disposed on a PCB board. The digital signal processing module 420 and the digital signal transmission module 430 are disposed on another PCB board. A cold plate 60 and a thermal pad 70 are disposed between the two PCBs to eliminate the effect of temperature.
The miniature positron emission imaging detector 100 described above is used in miniature positron emission imaging devices. The miniature positron emission imaging detector 100 includes back-end circuitry 40 and at least one detection unit 10. The detection unit 10 includes a crystal array 110, a first photoelectric conversion array plate 210, and a second photoelectric conversion array plate 220. The first photoelectric converter array plate 210 includes a first hard plate 311, a first photoelectric converter, and a first flexible plate 310. The first hard plate 311 is attached to a surface opposite to the photon incidence surface of the crystal array. The first photoelectric converter is disposed on a plane of the first hard 311 plate, which is close to the crystal array 110. The first flexible board 310 has a first fitting portion 312 and a first extending portion 313. The first bonding portion 312 is disposed on a plane of the first hard plate 311 away from the crystal array 110. The first attaching portion 312 is electrically connected to the first cardboard 311. The first extension 313 is electrically connected to the back-end circuit 40. The second photoelectric converter array plate 220 includes a second hard plate, a second photoelectric converter, and a second flexible plate. The second hard plate is attached to the photon incidence surface of the crystal array 110. The second photoelectric converter is arranged on the plane of the second hard plate, which is close to the crystal array. The second flexible board has a second fitting portion and a second extending portion 323. The second attaching portion is disposed on a plane of the second hard plate away from the crystal array 110. The second attaching portion is electrically connected with the second cardboard. The second extension 323 is electrically connected to the back-end circuit 40. The back-end circuit 40 in the present application is connected to the first photoelectric conversion array board 210 through the first extension portion 313, and is connected to the second photoelectric conversion array board 220 through the second extension portion 323, so that the use of connectors is reduced, the radial space in the miniature positron emission imaging detector is increased, and then the crystal gap is reduced. On the other hand, the use of the first flexible board 310 and the second flexible board avoids the problem of insertion loss of the connectors, so as to avoid interference of signals in the transmission process as much as possible.
Referring to fig. 3, in one embodiment, the first flexible board 310 and the first hard board 311 are integrally formed into an asymmetric rigid-flex board. Wherein, the asymmetric rigid-flex board lower part is the stereoplasm board, and upper portion is the flexible board. I.e. the plate on which the photoelectric converter is arranged is the hard plate. And setting a wiring area of the transmission line as the flexible board. It should be noted that, in the present application, the thickness of the first flexible board 310 is far smaller than that of the cardboard, so as to ensure that the maximum width of the micro positron emission imaging detector 100 is the width of the first rigid board 311, without additionally reserving a bending space of the first flexible board 310 in the design of the whole-ring positron emission tomography device, thereby effectively reducing crystal gaps of crystals along the circumferential direction.
In one embodiment, the first extension 313 of the first flexible board 310 is bent to be connected to the back-end circuit 40 along the side of the detecting unit 10. In an alternative embodiment, the first extension 313 of the first flexible plate 310 may be bent 0 ° -90 °. The flexible PCB extends laterally and also enables the design of a long axis positron emission tomography miniature positron emission imaging detector 100.
In one alternative embodiment, the second flexible board and the second hard board are integrally formed into an asymmetric rigid-flex board. Wherein, the asymmetric rigid-flex board lower part is the stereoplasm board, and upper portion is the flexible board. I.e. the plate on which the photoelectric converter is arranged is the hard plate. And setting a wiring area of the transmission line as the flexible board. It should be noted that, the thickness of the second flexible board is far smaller than that of the cardboard by adopting the asymmetric rigid-flex board, so that the maximum width of the micro positron emission imaging detector 100 is ensured to be the width of the second rigid board, and the bending space of the second flexible board is not required to be additionally reserved in the design of the whole-ring positron emission tomography device, thereby effectively reducing the crystal gap of the crystal along the circumferential direction.
In one embodiment, the second extension 323 of the second flexible board is bent to connect with the back-end circuit 40 along the side of the detecting unit 10. In an alternative embodiment, the second extension 323 of the second flexible plate may be bent 0 ° -90 °. The flexible PCB extends laterally and also enables the design of a long axis positron emission tomography miniature positron emission imaging detector 100.
In this embodiment, siPM array boards are disposed at two ends of the crystal array 110 (Block), and visible light generated by gamma-ray incident crystals is converted into an electrical signal after being subjected to photoelectric conversion on the SiPM array boards, the electrical signal is transmitted to the back-end circuit 40 via the flexible circuit board integrally processed with the SiPM array boards to be converted into a digital signal, and then the events of completing information processing such as time, position, energy and the like are packaged and packaged according to a predetermined data format and then sent out via a data transmission link.
In one embodiment, the miniature positron emission imaging detector 100 further includes a base plate and a cold plate 60.
The crystal array 10 is disposed on one side of the substrate. The substrate is used to support the crystal array 10. The substrate serves as a base for the miniature positron emission imaging detector 100, providing support structure and a fixed space for other miniature positron emission imaging detector 100 components. The cold plate 60 is disposed on the surface of the back-end circuit 40 near the detection unit 10. The cold plate 60 may be attached to the back-end circuit 40.
It is understood that the material of the substrate is not particularly limited, as long as the substrate can play a supporting role. In an alternative embodiment, the substrate is a metal material, and in another embodiment the substrate may be replaced with other suitable types of materials. Optionally, a thermal pad 70 may be disposed between the substrate and the crystal array 10. The cold plate 60 is connected to the heat conductive pad 70 through a heat exchange module 80 for eliminating the influence of temperature. The two ends of the cold plate 60 are respectively provided with the heat exchange module 80. The at least one detection unit 10 is arranged between two of the heat exchange modules 80. In one alternative embodiment, the back-end circuit 40 is fixedly or removably attached to the cold plate 60. The back-end circuit 40 is fixedly or detachably connected to the cold plate 60
Referring to fig. 4, the miniature positron emission imaging detector 100 of the present embodiment can be used as a basic unit to design the shape of various types of miniature positron emission imaging detection devices. The miniature positron emission imaging detection device may be in the shape of a ring-shaped miniature positron emission imaging detection device as described in fig. 4. The shape of the miniature positron emission imaging detection equipment can be plane round or square. According to the actual requirement for the shape design of the miniature positron emission imaging detector 100, the basic structure of the miniature positron emission imaging detector 100 described in the application can be utilized to design the shape of the corresponding miniature positron emission imaging detection device, and the miniature positron emission imaging detector 100 can be used in the corresponding detection device.
In one embodiment, a miniature positron emission imaging device is provided. The miniature positron emission imaging apparatus includes a gantry and a scanning bed. Disposed within the gantry is a miniature positron emission imaging detector 100 as claimed in any of the foregoing embodiments.
The miniature positron emission imaging detector 100 is for a miniature positron emission imaging apparatus. The miniature positron emission imaging detector 100 includes back-end circuitry 40 and at least one detection unit 10. The detection unit includes a crystal array 110, a first photoelectric conversion array plate 210, and a first flexible plate 310. The first hard plate 311 is attached to a surface opposite to the photon incidence surface of the crystal array. The first photoelectric converter is disposed on a plane of the first hard 311 plate, which is close to the crystal array 110. The first flexible board 310 has a first fitting portion 312 and a first extending portion 313. The first bonding portion 312 is disposed on a plane of the first hard plate 311 away from the crystal array 110. The first attaching portion 312 is electrically connected to the first cardboard 311. The first extension 313 is electrically connected to the back-end circuit 40. The second photoelectric converter array plate 220 includes a second hard plate, a second photoelectric converter, and a second flexible plate. The second hard plate is attached to the photon incidence surface of the crystal array 110. The second photoelectric converter is arranged on the plane of the second hard plate, which is close to the crystal array. The second flexible board has a second fitting portion and a second extending portion 323. The second attaching portion is disposed on a plane of the second hard plate away from the crystal array 110. The second attaching portion is electrically connected with the second cardboard. The second extension 323 is electrically connected to the back-end circuit 40.
The first photoelectric conversion array plate 210 and the second photoelectric conversion array plate 220 are each photoelectrically coupled with one of the crystal arrays 110. The first flexible board 310 includes a transmission line thereon. The back-end circuit 40 is configured to receive an electrical signal formed by the first photoelectric conversion array board 210 transmitted through the transmission line on the first flexible board 310.
It will be appreciated that the structure of the crystal array 110 is not particularly limited as long as it can be realized to receive gamma photons and that the gamma photons generate fluorescence events in the crystal array 110. In an alternative embodiment, the crystal array 110 includes a plurality of crystal dice.
It is understood that the kind of the photoelectric converter is not limited. In an alternative embodiment, the photoelectric converter employs a photomultiplier tube or an avalanche photodiode. In another alternative embodiment, the photoelectric converter employs a silicon photomultiplier (Silicon Photomultipliers, siPM). The silicon photomultiplier combines the advantages of a photomultiplier PMT and an avalanche photodiode APD, and has the advantages of high gain, low bias voltage, small volume and magnetic field compatibility.
It is to be understood that the connection manner between the photoelectric converter and the cardboard is not particularly limited, and alternatively, the first photoelectric converter is disposed on the first hard board by printing or welding, and is electrically connected with the first hard board. The second photoelectric converter is arranged on the second hard plate in a printing or welding mode and is electrically connected with the second hard plate.
To improve the spatial resolution of micro PET systems, and in particular to solve the parallax (parallaxes) problem in PET imaging at small apertures (typically 10cm or less), the general micro positron emission imaging detector 100 is designed with depth of deposition (Depth of Interaction, DOI) technology, while double-ended readout is a widely applicable DOI technology solution. Furthermore, because sipms offer great advantages in thickness over conventional opto-electronic converters, the implementation of DOI PET mini positron emission imaging detectors 100 using a double-ended readout scheme is much more the first solution to design a full-loop long-axis PET system.
In one embodiment, to implement dual-end readout, each of the crystal arrays 110 is coupled to two of the photoelectric conversion array plates. The first attaching portion 312 of the first flexible board 310 is connected to the first hard board 311. The connection mode between the first bonding portion 312 and the first hard plate 311 is not particularly limited, as long as the electrical signal converted by the first photoelectric conversion array plate 210 can be transmitted. In one alternative embodiment, the first fitting portion 312 and the first extending portion 313 are integrally formed with the first hard plate 311. The first extension 313 of the first flexible board 310 is etched with a transmission line. The second attaching portion of the second flexible board is connected with the second hard board. The connection mode between the second bonding portion and the second hard plate is not particularly limited, as long as the electrical signal converted by the second photoelectric conversion array plate 220 can be transmitted. In one alternative embodiment, the second engaging portion and the second extending portion 323 are integrally formed with the second rigid plate. The second extension 323 of the second flexible plate has a transmission line etched thereon.
It will be appreciated that in an alternative embodiment, the first flexible board 310 and the second flexible board are flexible PCB boards, so as to achieve bending in a suitable position.
It will be appreciated that the positions of the first extending portion 313 and the second extending portion 323 are not particularly limited, as long as the corresponding electrical signals can be transmitted to the back-end circuit through the first extending portion 313 and the second extending portion 323. Optionally, with the photon incidence plane of the crystal array 110 as the front plane of the detection unit 10, the first extension 313 and the second extension 323 extend from at least one side plane of the detection unit 10 to the back-end circuit 40. As shown in fig. 1, the first extension 313 and the second extension 323 extend from the same side of the detecting unit 10 to the back-end circuit 40.
It is understood that the first and second photoelectric conversion array plates 210 and 220 may have the same structure, but are disposed on two opposite contact surfaces of the crystal array 110. Alternatively, one of the photoelectric conversion array plates may be disposed on the photon incidence plane of the crystal array 110. The photoelectric conversion array plate may also be disposed on a surface opposite to the photon incidence surface of the crystal array 110.
It will be appreciated that the crystal arrays 110 are opaque therebetween. Each crystal array 110 is configured to receive gamma photons. The gamma photons produce fluorescent events in the crystal array 110. A photoelectric converter on the crystal array 110, which is photoelectrically coupled thereto, converts the optical signal of the fluorescence event into an electrical signal. In order to prevent leakage of the optical signal, reflective films may be provided on the other surfaces of the crystal array 110 except the first contact surface and the second contact surface. The reflective film in the crystal array 110 may be made of a thin high reflectivity thin film material. In another embodiment, the reflective film may also be a high reflectivity coating. The reflective film on the crystal array 110 receives the optical signal of the fluorescent event by reflection means all of which are received by the photoelectric converter. The electrical signal generated by the photoelectric converter is sent to the back-end circuit 40 through two flexible boards. The back-end circuit 40 receives the electrical signal and subjects the electrical signal to preliminary processing. The back-end circuit 40 may include a variety of functions such as rectification, analog-to-digital conversion, and the like. The primarily processed signal is then sent to the next stage processor through the back-end circuit 40 for signal amplification, filtering, correction, etc., thereby outputting an image.
Optionally, the back-end circuit 40 may include an analog-to-digital conversion module 410, a digital signal processing module 420, and a digital signal transmission module 430. The analog-to-digital conversion module 410, the digital signal processing module 420, and the digital signal transmission module 430 may be integrated on the same PCB board. Of course, the analog-to-digital conversion module 410, the digital signal processing module 420 and the digital signal transmission module 430 may also be disposed on different PCBs. Referring to fig. 2, the analog-to-digital conversion module 410 is separately disposed on a PCB board. The digital signal processing module 420 and the digital signal transmission module 430 are disposed on another PCB board. A cold plate 60 and a thermal pad 70 are disposed between the two PCBs to eliminate the effect of temperature.
The miniature positron emission imaging detector 100 described above is used in miniature positron emission imaging devices. The miniature positron emission imaging detector 100 includes back-end circuitry 40 and at least one detection unit 10. The detection unit 10 includes a crystal array 110, a first photoelectric conversion array plate 210, and a second photoelectric conversion array plate 220. The first photoelectric converter array plate 210 includes a first hard plate 311, a first photoelectric converter, and a first flexible plate 310. The first hard plate 311 is attached to a surface opposite to the photon incidence surface of the crystal array. The first photoelectric converter is disposed on a plane of the first hard 311 plate, which is close to the crystal array 110. The first flexible board 310 has a first fitting portion 312 and a first extending portion 313. The first bonding portion 312 is disposed on a plane of the first hard plate 311 away from the crystal array 110. The first attaching portion 312 is electrically connected to the first cardboard 311. The first extension 313 is electrically connected to the back-end circuit 40. The second photoelectric converter array plate 220 includes a second hard plate, a second photoelectric converter, and a second flexible plate. The second hard plate is attached to the photon incidence surface of the crystal array 110. The second photoelectric converter is arranged on the plane of the second hard plate, which is close to the crystal array. The second flexible board has a second fitting portion and a second extending portion 323. The second attaching portion is disposed on a plane of the second hard plate away from the crystal array 110. The second attaching portion is electrically connected with the second cardboard. The second extension 323 is electrically connected to the back-end circuit 40. The back-end circuit 40 in the present application is connected to the first photoelectric conversion array board 210 through the first extension portion 313, and is connected to the second photoelectric conversion array board 220 through the second extension portion 323, so that the use of connectors is reduced, the radial space in the miniature positron emission imaging detector is increased, and then the crystal gap is reduced. On the other hand, the use of the first flexible board 310 and the second flexible board avoids the problem of insertion loss of the connectors, so as to avoid interference of signals in the transmission process as much as possible.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (10)
1. A miniature positron emission imaging detector comprising a back-end circuit and at least one detection unit electrically connected to the back-end circuit, the detection unit comprising a crystal array, a photoelectric converter array plate, characterized in that the detection unit comprises: a first photoelectric converter array plate and a second photoelectric converter array plate;
the first photoelectric converter array plate and the second photoelectric converter array plate are respectively arranged on the crystal array photon incidence surface and the surface opposite to the incidence surface;
the first photoelectric converter array plate comprises a first hard plate, a first photoelectric converter and a first flexible plate, wherein the first hard plate is attached to the surface opposite to the photon incidence surface of the crystal array, the first photoelectric converter is arranged on the plane, close to the crystal array, of the first hard plate, the first flexible plate is provided with a first attaching part and a first extending part, the first attaching part is arranged on the plane, far away from the crystal array, of the first hard plate, the first attaching part is electrically connected with the first hard plate, and the first extending part is electrically connected with the rear-end circuit;
the second photoelectric converter array plate comprises a second hard plate, a second photoelectric converter and a second flexible plate, wherein the second hard plate is attached to the photon incidence surface of the crystal array, the second photoelectric converter is arranged on the plane, close to the crystal array, of the second hard plate, the second flexible plate is provided with a second attaching part and a second extending part, the second attaching part is arranged on the plane, far away from the crystal array, of the second hard plate, the second attaching part is electrically connected with the second hard plate, and the second extending part is electrically connected with the back-end circuit.
2. The miniature positron emission imaging detector of claim 1, wherein the thickness of the first flexible sheet is less than the thickness of the first rigid sheet such that the width of the miniature positron emission imaging detector is equal to the width of the first rigid sheet.
3. The miniature positron emission imaging detector of claim 2, wherein said first extension is bendable between 0 ° and 90 °.
4. The miniature positron emission imaging detector of claim 3, wherein the first flex board and the second flex board are flexible PCB boards.
5. The miniature positron emission imaging detector of claim 2, wherein said first conforming portion, said first extending portion and said first hard plate are integrally formed; the second attaching part, the second extending part and the second hard plate are integrally formed.
6. The miniature positron emission imaging detector of claim 5, wherein said first photoelectric converter is disposed on said first hard plate by printing or soldering and is electrically connected to said first hard plate; the second photoelectric converter is arranged on the second hard plate in a printing or welding mode and is electrically connected with the second hard plate.
7. The miniature positron emission imaging detector as claimed in any of claims 1-6, wherein,
and the crystal array photon incidence surface is taken as the front surface of the detection unit, and the first extension part and the second extension part extend from at least one side surface of the detection unit to the back-end circuit.
8. The miniature positron emission imaging detector of claim 7, wherein an extension of a photoelectric converter array plate disposed on the photon incidence surface of the crystal array is bent along a side of the detection unit to connect with the back-end circuit.
9. The miniature positron emission imaging detector of claim 8, further comprising:
the cold plate is arranged on the surface of the rear-end circuit, which is close to the detection unit;
the heat exchange modules are arranged at two ends of the cold plate respectively in an opposite mode, and at least one detection unit is arranged between the two heat exchange modules.
10. A miniature positron emission imaging apparatus comprising a gantry and a scanning couch, the miniature positron emission imaging detector of any one of claims 1 to 9 being disposed within the gantry.
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| WO2004111681A1 (en) * | 2003-06-19 | 2004-12-23 | Ideas Asa | Modular radiation detector with scintillators and semiconductor photodiodes and integrated readout and method for assembly thereof |
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| JP2015507742A (en) * | 2011-12-27 | 2015-03-12 | コーニンクレッカ フィリップス エヌ ヴェ | Flexible connector for PET detector |
| JP6574419B2 (en) * | 2013-11-15 | 2019-09-11 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | Double-sided organic photodetector on flexible substrate |
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| CN110441811B (en) * | 2019-08-20 | 2021-05-04 | 上海联影医疗科技股份有限公司 | PET detector and medical imaging equipment with same |
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