JP2018021828A - Radiation imaging apparatus and radiation imaging system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a radiation imaging apparatus advantageous for the imaging by an energy subtraction method and the imaging of a large area.SOLUTION: A radiation imaging apparatus includes a radiation detector and a driving circuit. The radiation detector includes a first imaging unit and second imaging unit, and a wiring unit disposed between the first imaging unit and second imaging unit. Each of the first imaging unit and second imaging unit includes a plurality of pixels arranged so as to form a plurality of rows and a plurality of columns, and a plurality of row drive wires corresponding to the plurality of rows, respectively. The driving circuit generates a plurality of driving signals to be supplied to the plurality of row drive wires, respectively. The wiring unit includes a connection unit to which the driving circuit is connected.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a radiation imaging apparatus and a radiation imaging system.

  An apparatus that obtains high-quality radiographic images by converting the intensity distribution of the radiation that has passed through the subject into an electrical signal and detecting it, and digitally processing the electrical signal and reproducing it on a monitor or the like as a visible image is a non-industrial device. Widely used in destructive testing and medical diagnosis. Further, with recent progress in semiconductor process technology, an apparatus for taking a radiation image using a semiconductor sensor has been developed. This apparatus is advantageous in obtaining an image having a wide dynamic range as compared with a radiographic imaging system using a conventional photosensitive film.

  As an application of such a radiographic image to medical diagnosis, there is a radiographic image diagnosis using an energy subtraction method. The radiological image acquisition method for realizing the energy subtraction method involves exposing radiation to a subject only once and acquiring two (multiple) radiographic images obtained by radiation with different energy components by some method. There is a method of obtaining by subtracting. A method of acquiring a radiation image used for the energy subtraction method by exposing the subject only once in this way is called a one-shot energy subtraction method.

  As a method for realizing the one-shot energy subtraction method, there is a configuration in which two radiation detectors are prepared, and a radiation energy separation filter that absorbs a predetermined energy component of radiation is disposed between the radiation detectors (Patent Document 1). reference). There is also a radiation imaging apparatus in which two radiation detection panels are housed in individual units and each unit is rotatably connected (see Patent Document 2).

JP 2001-133554 A JP 2011-137804 A

  According to Patent Documents 1 and 2, two radiation detection panels are used to acquire a radiation image used in the energy subtraction method, and each radiation detection panel is driven individually, which costs parts and production. . In view of such problems, it is an object of the present invention to provide a radiation imaging apparatus that is advantageous for imaging by an energy subtraction method and imaging of a large area.

In order to solve the above problems, an imaging apparatus according to the present invention includes a radiation detector and a drive circuit, and the radiation detector includes a first imaging unit, a second imaging unit, and the first imaging unit. A wiring unit disposed between the second imaging unit and the second imaging unit, wherein the first imaging unit and the second imaging unit are arranged to form a plurality of rows and a plurality of columns. A plurality of pixels, and a plurality of row drive lines corresponding to the plurality of rows, respectively, and the drive circuit generates a plurality of drive signals to be supplied to the plurality of row drive lines, respectively, and is arranged in the wiring portion The plurality of row drive lines of the first image pickup unit and the plurality of row drive lines of the second image pickup unit are connected to each other by the plurality of common wires,
The wiring part is provided with a connection part for connecting the plurality of common wirings and the driving circuit, and the wiring part is flexible.

  According to the present invention, it is possible to provide a radiation imaging apparatus having a structure advantageous for imaging by the energy subtraction method and imaging of a large area.

1 is a schematic diagram of a radiation imaging apparatus according to a first embodiment of the present invention. 1 is a cross-sectional view of a radiation imaging apparatus according to a first embodiment of the present invention. 1 is a schematic circuit diagram of a radiation imaging apparatus according to a first embodiment of the present invention. It is the schematic of the radiation imaging device which concerns on the 2nd Embodiment of this invention. It is the schematic of the radiation imaging device which concerns on the 3rd Embodiment of this invention. It is a figure explaining the radiation imaging system which concerns on the 4th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The radiation in the present invention includes a beam having energy of the same degree or more, such as X-rays, β-rays, γ-rays, etc., which are beams formed by particles (including photons) emitted by radiation decay, such as X Lines, particle beams, cosmic rays, etc. are also included.

(First embodiment)
First, an outline of a radiation imaging apparatus according to the present invention will be described with reference to FIGS. FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG. As shown in FIG. 1, the radiation detector 100 of the present embodiment includes a first imaging unit 190a and a second imaging unit 190b. A plurality of pixels for detecting radiation are arranged in a matrix in the first imaging unit 190a and the second imaging unit 190b. The pixel includes a photoelectric conversion element that converts light into an electrical signal and a switch element that controls the photoelectric conversion element. A scintillator layer 9 that converts radiation into visible light is disposed in the first imaging unit 190a and the second imaging unit 190b. The first imaging unit 190a and the second imaging unit 190b are provided with a plurality of row drive lines 4 wired to gate electrodes of switch elements for controlling the pixels. The row drive line 4 supplies a drive signal for selecting a plurality of pixels in a predetermined row among the plurality of pixels arranged in a matrix to the switch element. The row drive line 4 is provided corresponding to a plurality of rows of the first imaging unit 190a and the second imaging unit 190b. In a portion sandwiched between the first imaging unit 190a and the second imaging unit 190b, there is a wiring unit 200 in which a common wiring 500 is arranged. The plurality of row drive lines 4 of the first imaging unit and the plurality of row drive lines 4 of the second imaging unit are connected to each other by a plurality of common wirings 500 arranged in the wiring unit 200.

  Further, the wiring part 200 is provided with a connection part 160 for connecting the drive circuit 210 and a plurality of common wirings. The drive circuit 210 is mounted on a circuit board 211 and a flexible printed circuit board (FPC) 215, and a circuit for controlling transfer of an image signal detected by a pixel is formed. The FPC 215 outputs a drive signal for driving the pixels of the imaging units 190a and 190b from its output terminal. In the present embodiment, the FPC 215 has a plurality of output terminals for supplying a plurality of drive signals to the plurality of row drive lines 4 that drive the switch elements of the plurality of pixels arranged in the imaging unit. The drive circuit 210 is connected to the connection unit 160 of the wiring unit 200 via the output terminal of the FPC 215. A plurality of drive signals from the drive circuit 210 are supplied to the common wiring 500 of the wiring unit 200 through the connection unit 160. The drive signal supplied to the common wiring 500 is input to the row drive line 4 of the first imaging unit 190a and the second imaging unit 190b. A plurality of column signal lines for reading signals from the pixels are wired in the imaging units 190a and 190b. The plurality of column signal lines are arranged for each column of a plurality of pixels arranged in a matrix. The reading circuit 220 includes a reading circuit board 221 and an FPC 222 on which an IC is mounted, and forms a circuit that reads an image signal sent from a pixel via a column signal line. The readout circuit 220 is provided corresponding to each of the first imaging unit 190a and the second imaging unit 190b.

  The structure of the radiation detector will be described with reference to FIG. 2 showing a cross section of the radiation detector 100 at the position indicated by A-A ′ in FIG. In the radiation detector 100, a pixel region 150 in which a plurality of pixels are formed is formed on a detector substrate 101 made of an insulating substrate, and a scintillator layer 9 that converts radiation into visible light is formed on the pixel region 150. . The plurality of pixels are arranged in a matrix in the first imaging unit 190a and the second imaging unit 190b on the detector substrate 101. In the pixel, a photoelectric conversion element for detecting radiation converted into visible light by the scintillator layer 9 and a TFT element as a switching element responsible for transfer control of an image signal detected by the photoelectric conversion element are arranged. In addition to wiring for connecting elements such as photoelectric conversion elements and TFT elements to the imaging units 190a and 190b, for example, image signals obtained from the row drive lines 4 and pixels for inputting drive signals to the gate electrodes of the TFTs. Column signal lines for outputting to the outside. The scintillator layer 9 includes columnar crystals such as cesium iodide CsI, and can convert radiation incident on the scintillator layer 9 into visible light.

  The detector substrate 101 is a member serving as a base of the radiation detector 100 and has strength to support the pixel region 150 and the scintillator layer 9. A flexible resin or glass thin plate is applied to the detector substrate 101 of the present embodiment. The material of the detector substrate 101 may be a flexible plate-like or sheet-like member, and is not limited to resin or glass. In addition, the radiation detector 100 improves the efficiency of detection of light emission from the scintillator layer 9, a protective layer (not shown) for protecting the scintillator layer 9, an adhesive layer (not shown) for bonding the layers. A reflective layer (not shown). A flexible member including the detector substrate 101 is applied to the radiation detector. For this reason, the radiation detector 100 can have flexibility. In the present embodiment, the pixel area 150 including the pixels and the scintillator layer 9 are not arranged in the wiring part 200.

  Next, the circuit and operation of the radiation imaging apparatus of this embodiment will be described with reference to FIG. FIG. 3 is a circuit diagram showing an outline corresponding to the configuration of the present embodiment. Switch elements 2 and 3 for reading a signal are connected to the photoelectric conversion element 1 included in the pixel. Here, the present embodiment will be described using an example in which a TFT element is used as a switch element. The switch elements 2 and 3 are driven on or off by a signal input to the gate electrode of each switch element. The row driving line 4 in a predetermined row of the first imaging unit 190a and the row driving line 4 in a predetermined row of the second imaging unit 190b are connected by a common wiring 500. The switch elements 2 of a plurality of pixels arranged in predetermined rows of the first imaging unit 190a and the second imaging unit 190b can be simultaneously driven by a driving signal supplied from the driving circuit 210 to the common wiring 500. In the example of FIG. 3, the row drive line 4 can input a drive signal in common to the gate electrodes of the switch elements 2 in a predetermined row of the imaging unit 190a and the imaging unit 190b. A drive signal from the drive circuit 210 is input to the pixel through the row drive line 4 and input to the gate electrode of the switch element 2. The gate line 5 is connected to the gate electrode of the switch element 3 in a predetermined row of the imaging unit 190a and the imaging unit 190b. The gate line 5 is a wiring for supplying a reset signal for controlling the switch element 3 in order to supply a voltage for resetting the photoelectric conversion element 1 to the photoelectric conversion element 1 via the switch element 3.

  The row drive line 4 is connected to the drive circuit 210 on the FPC 215 at the connection unit 160 via the common wiring 500 provided in the wiring unit 200. The drive circuit 210 can select a predetermined row by supplying a drive signal to the predetermined row via the connection unit 160. An example in which pixels are arranged in three rows and three columns in each of the first imaging unit 190a and the second imaging unit 190b as shown in FIG. 3 will be described. The drive signal from the drive circuit 210 is supplied to the row drive line 4 to the switch element 2 of the three pixels arranged in the second row of the image pickup unit 190a and to the switch element 2 of the three pixels arranged in the second row of the image pickup unit 190b. Supply through. In response to the drive signal being input to the switch element, the switch element 2 arranged in the second row of each imaging unit is driven to be turned on or off together. The column signal line 6 is a signal line for reading a signal from the photoelectric conversion element 1 for each column. The column signal line 6 of each column is connected to the read circuit 220 mounted on the FPC 222.

  In the present embodiment, the photoelectric conversion element 1 is represented as a photodiode for convenience. A reverse bias is applied to the photodiode, and the cathode electrode side of the photodiode is biased to + (plus). A voltage for biasing the photodiode can be supplied from the power source Vs via the bias line 7. In this example, the bias line 7 is commonly connected to the cathode electrode of the photodiode. A reset line 8 for applying a reset voltage to the photodiodes is commonly connected to the photodiodes. A reset voltage can be applied to the photodiode from the power supply Vr via the reset line 8. As the photoelectric conversion element 1, for example, a MIS type or PIN type thin film photoelectric conversion element using a hydrogenated amorphous silicon film, a PN photodiode using single crystal silicon, or the like can be used. When these photoelectric conversion elements are used, radiation such as X-rays incident by the scintillator layer 9 is converted into visible light, visible light is incident on the photoelectric conversion element, and an electric signal corresponding to the intensity of visible light is photoelectrically converted. It can output from a conversion element.

  Further, amorphous selenium, gallium arsenide, mercury iodide, lead iodide and cadmium telluride as a direct conversion element that directly converts X-rays into an electrical signal can be used as a photoelectric conversion element. When a direct conversion element is used, the scintillator layer 9 may not be provided. As the switching elements 2 and 3, a thin film transistor (TFT) using amorphous silicon, polycrystalline silicon, single crystal silicon, or the like, or a well-known MOS transistor can be used. The switch element 2 is a transfer switch element (hereinafter referred to as a transfer TFT) for transferring an electric signal based on the charge photoelectrically converted by the photoelectric conversion element. The switch element 3 functions as a reset switch element (hereinafter referred to as a reset TFT) for resetting the photoelectric conversion element 1.

  The drive circuit 210 can selectively control the switch elements 2 in the predetermined rows disposed in the imaging units 190a and 190b by applying a drive signal to the row drive lines 4 in the predetermined rows. The drive circuit 210 may include a timing circuit for performing control for selectively supplying a drive signal to a predetermined row. As described above, pixels in a predetermined row in the first imaging unit 190a and the second imaging unit 190b can be selected by the driving signal from the driving circuit 210. The plurality of transfer TFTs in the row selected by the drive signal can connect the anode electrodes of the photoelectric conversion elements 1 of the plurality of pixels in the row to the column signal line 6 in each column.

  The read circuit 220 may include the first-stage integrating amplifier 11 for reading the electric charge generated in the photoelectric conversion element 1. An integrating capacitor 12 is connected to the first stage integrating amplifier 11. The first-stage integrating amplifier 11 is supplied with power from the power supply Vref. Signals from the photoelectric conversion elements 1 of a plurality of pixels in a row selected by the drive signal from the drive circuit 210 are input to the first stage integration amplifier 11 of the readout circuit 220 outside the radiation detector via the column signal line 6. Is done.

  The output signal of the photoelectric conversion element output from the column signal line 6 is amplified by the first-stage integrating amplifier 11 and sampled and held in the capacitor 13. The multiplexer 14 sequentially switches the output signal sampled and held in the capacitor 13 and outputs it to an A / D (analog / digital) converter 15. The A / D converter 15 converts the signal output from the multiplexer 14 into a digital signal. The signal converted into the digital signal can be stored in the frame memory 16. Signals stored in the frame memory are read out serially or in parallel through the interface 18. The configuration of the readout circuit 220 of this embodiment is an example, and an AD converter can be provided for each column.

  Next, the operation of the radiation imaging apparatus of the present embodiment will be described based on the signal flow. The radiation detector 100 is irradiated with radiation, for example, X-rays. The irradiated X-rays enter the scintillator layer 9 after passing through the subject. The scintillator layer 9 converts the wavelength of X-rays into visible light. The light converted into visible light is incident on the photoelectric conversion element 1 included in a plurality of pixels, converted into electric charge, and accumulated. Next, a driving signal for driving a predetermined row is supplied from the driving circuit 210 to the common wiring 500 of the predetermined row through the connection portion 160. The row drive lines 4 in predetermined rows of the first imaging unit 190a and the second imaging unit 190b are connected by a common wiring 500, respectively. The drive signal is input to the gate electrode of the transfer TFT 2 in a predetermined row of the image pickup unit 190a and the image pickup unit 190b via the respective row drive lines 4 of the first image pickup unit 190a and the second image pickup unit 190b and transferred. The TFT 2 is controlled to be turned on. As a result of the transfer TFT 2 being turned on, an electric signal based on the electric charge accumulated in the photoelectric conversion elements 1 included in a plurality of pixels in a predetermined row is supplied to the integration capacitor of the first-stage integration amplifier 11 via the plurality of column signal lines 6. 12 and the transferred electrical signal is converted into a voltage signal. As described above, in this embodiment, signals are read together from the photoelectric conversion elements 1 of a plurality of pixels in a predetermined row in the first imaging unit 190a and the second imaging unit 190b.

  The voltage signal output from the first stage integrating amplifier 11 is sampled and held in the capacitor 13. The analog signal that is a voltage signal sampled and held in the capacitor 13 is sequentially selected and read by the multiplexer 14. The read voltage signal is converted into a digital signal by the A / D converter 15 and stored in the frame memory 16. By repeating such a readout operation by sequentially driving a plurality of row drive lines 4 for each row, a two-dimensional image can be obtained from pixels arranged in a matrix. When all the image signals of the imaging unit are read out, the reset TFT 3 connected to the gate lines 5 of the first imaging unit 190a and the second imaging unit 190b by a reset signal from the drive circuit 210 before acquiring the next image. Is controlled on. As a result, a reset potential is supplied from the power source Vr to the photoelectric conversion element 1 via the reset TFT 3, and the photoelectric conversion element 1 is reset. Here, for the sake of explanation, each imaging unit is assumed to be composed of 3 × 3 pixels, but in reality, an area sensor having a large area of several thousand × several thousand pixels or more is controlled to perform imaging.

  As described above, the common wiring 500 wired to the wiring unit 200 connects the row drive lines 4 of the imaging units. A common wiring 500 is connected to the connection section 160 provided in the wiring section 200. By supplying a driving signal from the driving circuit 210 to the connection unit 160, the first imaging unit 190 a and the second imaging unit 190 b can be controlled by the single driving circuit 210. Since there is no need to separately provide a drive signal connecting portion for each imaging unit, the number of parts and manufacturing costs can be reduced. By supplying a signal from the connection unit 160 of the wiring unit 200 between the imaging units, the pixel that is farthest from the connection unit 160 among the pixels of the first imaging unit 190a and the second imaging unit 190b. The wiring length up to can be made the same. Therefore, the wiring resistance (wiring length) that affects the drive signal can be made the same in both imaging units.

  That is, the driving circuit 210 that drives the imaging unit is shared by the first imaging unit 190a and the second imaging unit 190b, and the first imaging unit 190a and the second imaging unit 190b are output from the driving circuit 210. Can be controlled simultaneously. In addition, the wiring length from the position of the connection unit 160 to the pixel with the longest distance among the pixels in each row of each imaging unit can be shortened. Specifically, since the wiring length of the row drive line 4 can be halved with respect to the total length of the first imaging unit 190a and the second imaging unit 190b in the direction along the gate line. The influence of signal delay due to an increase in wiring resistance can be reduced despite the long imaging unit. When the wiring length is halved, it is possible to suppress the waveform of the drive signal transmitted on the gate line from being distorted, so that variations in operation and delay of the switch elements can be reduced. Furthermore, the difference in driving timing between the side closer to the driving circuit and the side far from the driving circuit can be reduced. Therefore, variation in the quality of the image signal obtained from each of the first imaging unit 190a and the second imaging unit 190b can be suppressed, and a high-performance and low-cost radioactive imaging device can be provided.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. Note that the configuration, material, and the like of the radiation imaging apparatus are the same as those in the first embodiment, and a description thereof will be omitted. The detector substrate 101 has flexibility as a whole. In this example, the radiation detector 100 of the present embodiment is woven in an inverted S shape as viewed in FIG. 4 at the portion of the wiring portion 200 between the imaging portions 190a and 190b of the detector substrate 101.

  In the present embodiment, when the detector substrate 101 is viewed from a direction perpendicular to the plane on which the pixels of the detector substrate 101 are arranged, the first imaging unit 190a and the second imaging unit 190b are continuous. Both imaging units are held so as to look like. Then, the position is aligned so that the images obtained by the first imaging unit 190a and the second imaging unit 190b are bent by the wiring unit 200 in the central portion of the radiation detector so as not to be missing. As shown by the dotted line, the first image capturing unit 190a and the second image capturing unit 190b are held so as to overlap when viewed from the direction perpendicular to the pixels, thereby preventing image loss in the wiring unit 200. Can do. It is also possible to prevent the missing portion by holding the portion so as to partially overlap. When a part overlaps, it can process so that the image obtained by the overlap part may seem to be continuous. In addition, even when the first imaging unit 190a and the second imaging unit 190b do not overlap, the influence due to the missing image can be reduced. In this case, the first imaging unit 190a and the second imaging unit 190b are held in parallel with a predetermined plane, and the first imaging unit and the second imaging unit are orthogonally projected onto the predetermined plane. If the distance between the orthogonally projected first image pickup unit and the second image pickup unit is narrow, the influence of image omission is small. For example, if the distance between the center of the photoelectric conversion element included in the pixel and the center of the photoelectric conversion element included in the pixel adjacent to the pixel is 0.5 to 3 times, The effect on the captured image is small. In this case, if the distance between the first image pickup unit and the second image pickup unit is approximately between the centers of the photoelectric conversion elements, the influence can be further reduced. Therefore, the interval between the orthogonally projected image pickup units is set between the centers of the photoelectric conversion elements. It may be 0.7 to 1.3 times the interval. When the first imaging unit 190a and the second imaging unit 190b are spread and used for imaging, an image loss occurs in the wiring unit 200 where no pixels are formed. By folding and holding the radiation detector 100 as in the present embodiment, imaging with a large area and a long length can be performed. In addition, by holding the imaging units so that the imaging units partially overlap or the interval between the imaging units is small, it is possible to reduce the influence of the missing image in the wiring unit 200 in which no pixels are formed.

  In FIG. 4, the radiation source that emits X-rays is located above the detector substrate side of the radiation imaging apparatus (the side opposite to the side where the drive circuit 210 is disposed), and the X-rays are emitted from the top to the bottom. . Also in this embodiment, the drive signal from the drive circuit 210 is commonly supplied to the row drive line 4 wired to each imaging unit. Since a drive signal can be input together from the drive circuit 210 to the switch elements arranged in the same row of the first imaging unit 190a and the second imaging unit 190b, the first imaging unit 190a and the second imaging unit 190b The switch elements can be driven simultaneously. That is, it is possible to simultaneously input drive signals that are controlled to be on or off to the switch elements 2 arranged in the same row of the left and right imaging units as seen in FIG.

  When the radiation detector 100 is used without being bent, the wiring portion 200 is provided in the central portion of the radiation detector 100, and therefore, an image may be lost in the central portion. By bending as in the present embodiment, it is possible to eliminate portions that cannot be imaged when imaging a large screen using the entire detection substrate. Here, in order to obtain an inverted S shape, a step is generated between the imaging unit near the radiation source and the imaging unit far from the radiation source when viewed in the vertical direction. However, the step is a few millimeters and has little effect on the intensity of radiation. If necessary, the influence can be removed by image processing.

(Third embodiment)
Next, an example used for the energy subtraction method will be described with reference to FIG. In the present embodiment, the radiation detector 100 is bent 180 degrees at the portion of the wiring unit 200 between the imaging units 190a and 190b, so that the first imaging unit 190a and the second imaging unit 190b are parallel to each other and overlap each other. Is held so. The filter 600 for absorbing radiation is held between the first image pickup unit 190a and the second image pickup unit 190b held in parallel so as to overlap the image pickup unit in parallel. The filter 600 absorbs low energy components (low frequency components, soft radiation) from radiation. For the filter 600, for example, a thin metal plate such as aluminum, copper, molybdenum, or tungsten is used. With such a configuration, imaging using the energy subtraction method can be performed.

  In the present embodiment, imaging by the one-shot energy subtraction method can be realized by bending the two imaging units and holding them in parallel, and sandwiching the filter 600 therebetween. When the substrate is configured in the order of the scintillator layer 9 and the pixel region 150 including the photoelectric conversion element from one surface of the detector substrate 101, the order of the scintillator layer and the pixel region with respect to the radiation source is changed by bending the wiring part 200. The detector substrate 101 changes between the upper surface and the lower surface. For this purpose, the detector substrate 101 is made of a material that transmits radiation from the back side to the scintillator layer 9 so that radiation from any surface can be detected. Further, there may be a difference in the intensity of the signal obtained on the upper surface and the lower surface, but this problem can be solved by processing the signal by image processing. Also in the present embodiment, since the drive signal can be supplied together from the drive circuit 210 to the switch elements 2 arranged in the same row of the first imaging unit 190a and the second imaging unit 190b, the first imaging unit 190a and the first imaging unit 190a The switch elements of the two imaging units 190b can be driven simultaneously.

  As described above, by using the radiation detector 100 of the present embodiment, general imaging, long imaging, and imaging using the energy subtraction method are realized using the common radiation detector 100. Can do.

(Fourth embodiment)
FIG. 6 is a diagram showing an application example of the X-ray imaging apparatus according to the present invention to an X-ray diagnostic system (radiation imaging system). X-rays 6060 generated by the X-ray tube 6050 (radiation source) pass through the chest 6062 of the patient or subject 6061 and enter the photoelectric conversion device 6040 on which the scintillator is mounted. This incident X-ray includes information inside the body of the patient 6061. The scintillator emits light in response to the incidence of X-rays, and this is converted into an electrical signal by a photoelectric conversion element to obtain electrical information. This information is converted into a digital signal, image-processed by an image processor 6070 as a signal processing means, and can be observed on a display 6080 as a display means in a control room. Note that the radiation imaging system includes at least a radiation imaging apparatus and a signal processing circuit that processes a signal from the radiation imaging apparatus. Further, this information can be transferred to a remote place by transmission processing means such as a communication line 6090, and can be displayed on a display 6081 serving as a display means such as a doctor room in another place or stored in a recording means such as an optical disk. It is also possible for a doctor to make a diagnosis. Moreover, it can also record on the film 6110 used as a recording medium by the film processor 6100 used as a recording means.

  4: row drive line, 9: scintillator layer, 100: radiation detector, 101: detector substrate, 200: wiring unit, 190a: first imaging unit, 190b: second imaging unit, 210: drive circuit, 215 : FPC, 220: readout circuit, 221: readout circuit board, 222: FPC

Claims (10)

A radiation imaging apparatus comprising a radiation detector and a drive circuit,
The radiation detector includes a first imaging unit, a second imaging unit, and a wiring unit disposed between the first imaging unit and the second imaging unit,
The first imaging unit and the second imaging unit include a plurality of pixels arranged to form a plurality of rows and a plurality of columns, and a plurality of row drive lines respectively corresponding to the plurality of rows. Have
The driving circuit generates a plurality of driving signals respectively supplied to the plurality of row driving lines;
The plurality of row drive lines of the first imaging unit and the plurality of row drive lines of the second imaging unit are connected to each other by a plurality of common wires arranged in the wiring unit,
The wiring part is provided with a connection part for connecting the plurality of common wirings and the drive circuit, and the wiring part has flexibility. The radiation detector includes a flexible detector substrate,
The first imaging unit and the second imaging unit are disposed on the detector substrate,
The radiation imaging apparatus according to claim 1, wherein the wiring unit is a portion sandwiched between the first imaging unit and the second imaging unit of the detector substrate.   The said radiation detector is bent by the said wiring part, The said 1st imaging part and a said 2nd imaging part are hold | maintained so that it may mutually parallel and may mutually overlap. Radiation imaging device.   A filter that absorbs radiation is held at a position parallel to the first imaging unit between the first imaging unit and the second imaging unit held in parallel. The radiation imaging apparatus according to claim 3.   The said radiation detector is bent by the said wiring part, The said 1st imaging part and the said 2nd imaging part are hold | maintained so that it may mutually parallel and a part may overlap. Radiation imaging device. Each of the plurality of pixels includes a photoelectric conversion element and a switch element,
The radiation detector is bent at the wiring section, and the first imaging section and the second imaging section are made parallel to a predetermined plane, and the first imaging section and the second imaging section When the imaging unit is orthogonally projected onto the predetermined plane, the distance between the centers of the photoelectric conversion elements of 0. 0 is between the orthogonal projection of the first imaging unit and the orthogonal projection of the second imaging unit. The radiation imaging apparatus according to claim 1, wherein the radiation imaging apparatus is held so that there is an interval of 5 times or more and 3 times or less.   The radiation imaging apparatus according to claim 1, wherein the radiation detector includes a scintillator layer.   The radiation imaging apparatus according to claim 1, wherein the plurality of driving signals are controlled by the driving circuit to select pixels in a predetermined row.   8. The readout circuit for reading out signals from the plurality of pixels is provided corresponding to each of the first imaging unit and the second imaging unit. 9. The radiation imaging apparatus described in 1. The radiation imaging apparatus according to any one of claims 1 to 9,
A signal processing circuit for processing a signal read from the radiation imaging apparatus;
A radiation imaging system comprising:

Images