JP6719324B2 - Radiation imaging apparatus and radiation imaging system - Google Patents

Description

The present invention relates to a radiation imaging apparatus and a radiation imaging system.

A device that obtains a high-quality radiation image by converting the intensity distribution of the radiation transmitted through the subject into an electric signal and detecting it, and digitally processing this electric signal and reproducing it as a visible image on a monitor or the like Widely used in destructive inspection and medical diagnosis. Further, with the recent progress in semiconductor process technology, an apparatus for capturing a radiation image using a semiconductor sensor has been developed. This apparatus is advantageous in obtaining an image with a wide dynamic range as compared with a radiation image pickup system using a conventional photosensitive film.

As an application of such a radiation image to medical diagnosis, there is a radiation image diagnosis using the energy subtraction method. The radiation image acquisition method for realizing the energy subtraction method is to irradiate a subject only once with a radiation, obtain two radiation images (a plurality of images) obtained by radiation having different energy components by some method, There is a method of obtaining by subtracting. This method of irradiating the subject only once to acquire a radiation image used in the energy subtraction method is called a one-shot energy subtraction method.

As a method for realizing the one-shot energy subtraction method, there is a configuration in which two radiation detectors are prepared and a radiation energy separation filter that absorbs a predetermined energy component of radiation is arranged between the radiation detectors (Patent Document 1). reference). In addition, there is a radiation imaging apparatus in which two radiation detection panels are housed in separate units and each unit is rotatably connected (see Patent Document 2).

JP, 2001-133554, A JP, 2011-137804, A

According to Patent Documents 1 and 2, two radiation detection panels are used to acquire a radiation image used in the energy subtraction method, and each radiation detection panel is driven individually, which requires cost for parts and manufacturing. .. In view of such problems, it is an object of the present invention to provide a radiation imaging apparatus that is advantageous for imaging by the energy subtraction method and imaging of a large area.

In order to solve the above problems, an imaging apparatus of the present invention includes a radiation detector and a drive circuit, and the radiation detector includes a first imaging unit, a second imaging unit, and a first imaging unit. A wiring section arranged between the second image pickup section and the second image pickup section, and the first image pickup section and the second image pickup section are arranged so as to form a plurality of rows and a plurality of columns. A plurality of pixels and a plurality of row drive lines respectively corresponding to the plurality of rows are provided, and the drive circuit generates a plurality of drive signals respectively supplied to the plurality of row drive lines and is arranged in the wiring section. The plurality of row drive lines of the first image pickup unit and the plurality of row drive lines of the second image pickup unit are connected to each other by a plurality of common wirings, respectively.
The wiring portion is provided with a connecting portion that connects the plurality of common wirings to the drive circuit, and the wiring portion has flexibility.

According to the present invention, it is possible to provide a radiation imaging apparatus having a structure that is advantageous for imaging by the energy subtraction method and imaging of a large area.

It is a schematic diagram of a radiation imaging device concerning a 1st embodiment of the present invention. It is sectional drawing of the radiation imaging device which concerns on the 1st Embodiment of this invention. It is a schematic circuit diagram of the radiation imaging device which concerns on the 1st Embodiment of this invention. It is a schematic diagram of a radiation imaging device concerning a 2nd embodiment of the present invention. It is a schematic diagram of a radiation imaging device concerning a 3rd embodiment of the present invention. It is a figure explaining the radiation imaging system which concerns on the 4th Embodiment of this invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The radiation in the present invention includes, in addition to α-rays, β-rays, γ-rays, etc., which are beams produced by particles (including photons) emitted by radiation decay, beams having similar energy or higher, such as X-rays. Rays, particle rays, cosmic rays, etc. are also included.

(First embodiment)
First, the outline of the radiation imaging apparatus according to the present invention will be described with reference to FIGS. 1 and 2. FIG. 2 is a sectional view taken along line AA′ of FIG. The radiation detector 100 of the present embodiment has a first image pickup section 190a and a second image pickup section 190b as shown in FIG. A plurality of pixels for detecting radiation are arranged in a matrix in the first imaging unit 190a and the second imaging unit 190b. Each pixel includes a photoelectric conversion element that converts light into an electric signal and a switch element that controls the photoelectric conversion element. Further, a scintillator layer 9 for converting radiation into visible light is arranged in the first image pickup section 190a and the second image pickup section 190b. A plurality of row drive lines 4 wired to the gate electrodes of the switch elements for controlling the pixels are wired in the first imaging unit 190a and the second imaging unit 190b. The row drive line 4 supplies a drive signal for selecting a plurality of pixels in a predetermined row among the plurality of pixels arranged in a matrix to the switch element. The row drive line 4 is provided corresponding to a plurality of rows of the first imaging unit 190a and the second imaging unit 190b. The wiring section 200 in which the common wiring 500 is arranged is located in a portion sandwiched between the first imaging section 190a and the second imaging section 190b. The plurality of row drive lines 4 of the first image pickup section and the plurality of row drive lines 4 of the second image pickup section are connected to each other by a plurality of common wirings 500 arranged in the wiring section 200.

Further, the wiring section 200 is provided with a connection section 160 for connecting the drive circuit 210 and a plurality of common wirings. The drive circuit 210 is mounted on a circuit board 211 and a flexible printed circuit board (FPC) 215, and a circuit that controls transfer of an image signal detected by a pixel is formed. The FPC 215 outputs a drive signal for driving the pixels of the imaging units 190a and 190b from its output terminal. In this embodiment, the FPC 215 has a plurality of output terminals for supplying a plurality of drive signals to the plurality of row drive lines 4 that drive the switch elements of the plurality of pixels arranged in the image pickup unit. The drive circuit 210 is connected to the connection section 160 of the wiring section 200 via the output terminal of the FPC 215. A plurality of drive signals from the drive circuit 210 are supplied to the common wiring 500 of the wiring section 200 via the connection section 160. The drive signal supplied to the common wiring 500 is input to the row drive line 4 of the first image capturing unit 190a and the second image capturing unit 190b. A plurality of column signal lines for reading out signals from pixels are wired in the imaging units 190a and 190b. The plurality of column signal lines are arranged for each column of a plurality of pixels arranged in a matrix. The reading circuit 220 includes a reading circuit board 221 and an FPC 222 on which an IC is mounted, and forms a circuit that reads an image signal sent from a pixel through a column signal line. The readout circuit 220 is provided corresponding to each of the first imaging unit 190a and the second imaging unit 190b.

The structure of the radiation detector 100 will be described with reference to FIG. 2, which shows a cross section of the radiation detector 100 at the position indicated by A-A′ in FIG. 1. In the radiation detector 100, a pixel region 150 in which a plurality of pixels are formed is formed on a detector substrate 101 made of an insulating substrate, and a scintillator layer 9 that converts radiation into visible light is formed on the pixel region 150. .. The plurality of pixels are arranged in a matrix in the first imaging unit 190a and the second imaging unit 190b on the detector substrate 101. In each pixel, a photoelectric conversion element for detecting radiation converted into visible light by the scintillator layer 9 and a TFT element as a switch element for controlling transfer of an image signal detected by the photoelectric conversion element are arranged. Further, in addition to wiring for connecting elements such as photoelectric conversion elements and TFT elements to the image pickup sections 190a and 190b, for example, row drive lines 4 for inputting drive signals to the gate electrodes of TFTs and image signals obtained from pixels. Column signal lines for outputting the signal to the outside are formed. The scintillator layer 9 contains columnar crystals of, for example, cesium iodide CsI, and can convert the radiation incident on the scintillator layer 9 into visible light.

The detector substrate 101 is a member that serves as a base of the radiation detector 100, and has strength for supporting the pixel region 150 and the scintillator layer 9. A thin plate of resin or glass having flexibility is applied to the detector substrate 101 of this embodiment. The material of the detector substrate 101 may be any flexible plate-shaped or sheet-shaped member, and is not limited to resin or glass. In addition, the radiation detector 100 improves the efficiency of detection of light emitted from the scintillator layer 9 and a protective layer (not shown) for protecting the scintillator layer 9, an adhesive layer (not shown) for bonding the layers. Can include a reflective layer (not shown). A flexible member including the detector substrate 101 is applied to the radiation detector. Therefore, the radiation detector 100 can have flexibility. In the present embodiment, the wiring region 200 is not provided with the pixel region 150 including pixels or the scintillator layer 9.

Next, the circuit and operation of the radiation imaging apparatus of this embodiment will be described with reference to FIG. FIG. 3 is a circuit diagram showing an outline corresponding to the configuration of this embodiment. Switch elements 2 and 3 for reading a signal are connected to a photoelectric conversion element 1 included in a pixel. Here, the present embodiment will be described using an example in which a TFT element is used as a switch element. The switch elements 2 and 3 are driven on or off by a signal input to the gate electrode of each switch element. The row drive line 4 of a predetermined row of the first imaging unit 190a and the row drive line 4 of a predetermined row of the second imaging unit 190b are connected by a common wiring 500. The drive signal supplied from the drive circuit 210 to the common wiring 500 can simultaneously drive the switch elements 2 of a plurality of pixels arranged in a predetermined row of the first imaging unit 190a and the second imaging unit 190b. In the example of FIG. 3, the row drive line 4 can commonly input a drive signal to the gate electrodes of the switch elements 2 of the predetermined rows of the image capturing units 190a and 190b. The drive signal from the drive circuit 210 is input to the pixel through the row drive line 4 and is input to the gate electrode of the switch element 2. The gate line 5 is connected to the gate electrodes of the switch elements 3 in the predetermined rows of the image pickup units 190a and 190b. The gate line 5 is a wiring for supplying a reset signal for controlling the switch element 3 in order to supply a voltage for resetting the photoelectric conversion element 1 to the photoelectric conversion element 1 via the switch element 3.

The row drive line 4 is connected to the drive circuit 210 on the FPC 215 at the connection portion 160 via the common wiring 500 provided in the wiring portion 200. The drive circuit 210 can select a predetermined row by supplying a drive signal to the predetermined row through the connection portion 160. An example will be described in which pixels are arranged in 3 rows and 3 columns in each of the first imaging unit 190a and the second imaging unit 190b as shown in FIG. A drive signal from the drive circuit 210 is supplied to the switch elements 2 of the three pixels arranged in the second row of the image pickup unit 190a and the switch elements 2 of the three pixels arranged in the second row of the image pickup unit 190b in the row drive line 4. Supply through. In response to the drive signal input to the switch elements, the switch elements 2 arranged in the second row of each image pickup unit are driven on or off together. The column signal line 6 is a signal line for reading the signal from the photoelectric conversion element 1 for each column. The column signal line 6 of each column is connected to the read circuit 220 mounted on the FPC 222.

In this embodiment, the photoelectric conversion element 1 is described as a photodiode for convenience. A reverse bias is applied to the photodiode, and the cathode electrode side of the photodiode is biased to + (plus). The voltage for biasing the photodiode can be supplied from the power supply Vs via the bias line 7. In this example, the bias line 7 is commonly connected to the cathode electrode of the photodiode. A reset line 8 that gives a reset voltage to the photodiode is commonly connected to the photodiode. A reset voltage can be applied to the photodiode from the power supply Vr via the reset line 8. As the photoelectric conversion element 1, for example, a MIS type or PIN type thin film photoelectric conversion element using a hydrogenated amorphous silicon film, a PN photodiode using single crystal silicon, or the like can be used. When these photoelectric conversion elements are used, the scintillator layer 9 converts radiation such as X-rays into visible light, the visible light is incident on the photoelectric conversion element, and an electric signal corresponding to the intensity of the visible light is photoelectrically converted. It can be output from the conversion element.

Further, amorphous selenium, gallium arsenide, mercury iodide, lead iodide, and cadmium telluride, which are direct conversion elements for directly converting X-rays into electric signals, can be used as photoelectric conversion elements. When using the direct conversion element, the scintillator layer 9 may be omitted. Further, as the switch elements 2 and 3, a thin film transistor (TFT) using amorphous silicon, polycrystalline silicon, single crystal silicon, or the like, or a known MOS transistor can be used. The switch element 2 is a transfer switch element (hereinafter referred to as a transfer TFT) for transferring an electric signal based on charges photoelectrically converted by the photoelectric conversion element. The switch element 3 functions as a reset switch element (hereinafter referred to as a reset TFT) for resetting the photoelectric conversion element 1.

The drive circuit 210 can apply a drive signal to the row drive line 4 of a predetermined row to selectively control the switch elements 2 of a predetermined row arranged in the imaging units 190a and 190b. The drive circuit 210 may include a timing circuit for performing control for selectively supplying a drive signal to a predetermined row. As described above, the drive signal from the drive circuit 210 can select pixels in a predetermined row in the first imaging unit 190a and the second imaging unit 190b as described above. The plurality of transfer TFTs in the row selected by receiving the drive signal can connect the anode electrodes of the photoelectric conversion elements 1 of the plurality of pixels in the row to the column signal line 6 in each column.

The readout circuit 220 may include the first-stage integration amplifier 11 to read out the charges generated in the photoelectric conversion element 1. An integration capacitor 12 is connected to the first-stage integration amplifier 11. Power is supplied to the first-stage integration amplifier 11 from the power supply Vref. The signals from the photoelectric conversion elements 1 of the plurality of pixels in the row selected by the drive signal from the drive circuit 210 are input to the first stage integration amplifier 11 of the readout circuit 220 outside the radiation detector via the column signal line 6. To be done.

The output signal of the photoelectric conversion element output from the column signal line 6 is amplified by the first-stage integration amplifier 11 and sampled and held in the capacitor 13. The multiplexer 14 sequentially switches the output signal sampled and held in the capacitor 13 and outputs the output signal to the A/D (analog/digital) converter 15. The A/D converter 15 converts the signal output from the multiplexer 14 into a digital signal. The signal converted into a digital signal can be stored in the frame memory 16. The signal stored in the frame memory is read out to the outside through the interface 18 serially or in parallel. The configuration of the read circuit 220 of the present embodiment is an example, and the AD converter may be provided for each column.

Next, the operation of the radiation imaging apparatus of this embodiment will be described based on the flow of signals. The radiation detector 100 is irradiated with radiation such as X-rays. The irradiated X-rays enter the scintillator layer 9 after passing through the subject. The scintillator layer 9 converts the wavelength of the X-ray into visible light. The light converted into visible light is incident on the photoelectric conversion element 1 included in a plurality of pixels, converted into electric charges, and accumulated. Next, a driving signal for driving a predetermined row is supplied from the driving circuit 210 to the common wiring 500 of the predetermined row through the connection portion 160. The row drive lines 4 of the predetermined rows of the first image pickup section 190a and the second image pickup section 190b are connected by a common wiring 500, respectively. The drive signal is input to the gate electrode of the transfer TFT 2 in a predetermined row of the image pickup unit 190a and the image pickup unit 190b via the row drive line 4 of each of the first image pickup unit 190a and the second image pickup unit 190b, and is transferred. The TFT2 is controlled to be turned on. As a result of the transfer TFT 2 being turned on, an electric signal based on the charges accumulated in the photoelectric conversion elements 1 included in the plurality of pixels in a predetermined row is supplied to the integration capacitance of the first-stage integration amplifier 11 via the plurality of column signal lines 6. 12 is transferred, and the transferred electric signal is converted into a voltage signal. As described above, in the present embodiment, signals are read out together from the photoelectric conversion elements 1 of a plurality of pixels in a predetermined row in the first image pickup unit 190a and the second image pickup unit 190b.

The voltage signal output from the first-stage integration amplifier 11 is sampled and held in the capacitor 13. The analog signal, which is the voltage signal sampled and held in the capacitor 13, is sequentially selected and read by the multiplexer 14. The read voltage signal is converted into a digital signal by the A/D converter 15 and stored in the frame memory 16. By repeating such a read operation by sequentially driving the plurality of row drive lines 4 for each row, a two-dimensional image can be obtained from the pixels arranged in a matrix. When all the image signals of the image pickup unit are read out, the reset TFT 3 connected to the gate line 5 of the first image pickup unit 190a and the second image pickup unit 190b by the reset signal from the drive circuit 210 before the acquisition of the next image. Is turned on. As a result, the reset potential is supplied from the power supply Vr to the photoelectric conversion element 1 via the reset TFT 3, and the photoelectric conversion element 1 is reset. Here, for the sake of explanation, it is assumed that each image pickup unit is composed of 3×3 pixels, but in reality, an area sensor having a large area of several thousand×several thousands pixels or more is controlled to perform image pickup.

As described above, the common wiring 500 wired in the wiring section 200 connects the row drive line 4 of each imaging section. The common wiring 500 is connected to the connecting portion 160 provided in the wiring portion 200. By supplying the drive signal from the drive circuit 210 to the connection unit 160, the single drive circuit 210 can control the first imaging unit 190a and the second imaging unit 190b. Since it is not necessary to separately provide a connecting portion for the drive signal to each image pickup portion, the number of parts and the manufacturing cost can be reduced. By supplying a signal from the connection unit 160 of the wiring unit 200 between the image pickup units, the pixel farthest from the connection unit 160 among the pixels of the first image pickup unit 190a and the second image pickup unit 190b. The same wiring length can be used. Therefore, the wiring resistance (wiring length) that affects the drive signal can be made the same in both imaging units.

That is, the drive circuit 210 that drives the image capturing unit is shared by the first image capturing unit 190a and the second image capturing unit 190b, and the output from the drive circuit 210 causes the first image capturing unit 190a and the second image capturing unit 190b to operate. Can be controlled simultaneously. In addition, the wiring length from the position of the connection unit 160 to the pixel with the longest distance among the pixels in each row of each imaging unit can be shortened. Specifically, the wiring length of the row drive line 4 can be halved with respect to the total length of the first imaging unit 190a and the second imaging unit 190b in the direction along the gate line. In spite of the long imaging section, it is possible to reduce the influence of signal delay due to the increase in wiring resistance. Since the wiring length is halved, it is possible to suppress the waveform of the drive signal transmitted on the gate line from being rounded, and thus it is possible to reduce variations and delays in the operation of the switch element. Further, it is possible to reduce the difference in drive timing between the side closer to the drive circuit and the side farther from the drive circuit. Therefore, it is possible to suppress variations in the quality of image signals obtained from the first image pickup unit 190a and the second image pickup unit 190b, and it is possible to provide a high-performance and low-cost radioactive image pickup apparatus.

(Second embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG. The configuration, material, etc. of the radiation imaging apparatus are the same as those in the first embodiment, and the description thereof will be omitted. The detector substrate 101 has flexibility as a whole. In this example, the radiation detector 100 according to the present embodiment is woven in an inverted S-shape when viewed in FIG.

In the present embodiment, the first imaging unit 190a and the second imaging unit 190b are continuous when the detector substrate 101 is viewed from the direction perpendicular to the plane in which the pixels of the detector substrate 101 are arranged. Hold both imaging parts so that they look like. Then, the alignment is performed so that the images obtained by the first image pickup unit 190a and the second image pickup unit 190b are bent by being bent at the wiring portion 200 at the center of the radiation detector. As shown by the dotted line, the first image pickup unit 190a and the second image pickup unit 190b are held so that they are exactly overlapped when viewed from the direction perpendicular to the pixel, thereby preventing loss of images in the wiring unit 200. You can It is also possible to prevent the dropout by holding the portions so that they partially overlap each other. When the portions overlap, the images obtained in the overlapping portions can be processed so as to appear continuous. Further, even when the first image capturing unit 190a and the second image capturing unit 190b do not overlap with each other, it is possible to reduce the influence of the missing image. In this case, the first image pickup unit 190a and the second image pickup unit 190b are held parallel to a predetermined plane, and the first image pickup unit and the second image pickup unit are orthographically projected onto the predetermined plane. If the distance between the orthographically projected first imaging unit and the second imaging unit is narrow, the effect of image loss is small. For example, if the distance between the center of the photoelectric conversion element included in the pixel and the center of the photoelectric conversion element included in the pixel adjacent to the pixel is 0.5 times or more and 3 times or less, The effect on the captured image is small. In this case, the influence can be further reduced if the distance between the first and second image pickup units is about the center of the photoelectric conversion element, so that the distance between the orthogonally projected image pickup units can be reduced between the centers of the photoelectric conversion elements. It is preferable to set the distance to 0.7 to 1.3 times. When the first image pickup section 190a and the second image pickup section 190b are spread two-dimensionally and used for image pickup, an image is missing in the wiring section 200 in which pixels are not formed. By bending and holding the radiation detector 100 as in this embodiment, a large area and a long image can be captured. Further, by holding the image pickup units so that the image pickup units partially overlap each other or the interval between the image pickup units becomes small, it is possible to reduce the influence of image loss in the wiring unit 200 in which pixels are not formed.

In FIG. 4, the radiation source that emits X-rays is located above the detector substrate side of the radiation imaging apparatus (opposite to the side where the drive circuit 210 is arranged), and the X-rays are emitted from top to bottom. .. Also in the present embodiment, the drive signal from the drive circuit 210 is commonly supplied to the row drive line 4 wired in each imaging unit. Since the drive signal can be input together from the drive circuit 210 to the switch elements arranged in the same row of the first image pickup unit 190a and the second image pickup unit 190b, the first image pickup unit 190a and the second image pickup unit 190b can receive the drive signals. The switch elements can be driven simultaneously. That is, it is possible to simultaneously input a drive signal for controlling on or off to the switch elements 2 arranged in the same row of the left and right imaging units as viewed in FIG.

When the radiation detector 100 is used as it is without being bent, the radiation detector 100 has the wiring portion 200 in the central portion thereof, and thus the image may be missing in the central portion. By bending like the present embodiment, it is possible to eliminate a portion that cannot be imaged when an image of a large screen using the entire detection substrate is imaged. Here, in order to form an inverted S shape, a step is formed between the image pickup unit on the side closer to the radiation source and the image pickup unit on the far side when viewed in the vertical direction. However, the step is a few millimeters, and has little effect on the intensity of radiation. If necessary, the influence can be removed by image processing.

(Third Embodiment)
Next, an example used in the energy subtraction method will be described with reference to FIG. In the present embodiment, the radiation detector 100 is bent 180 degrees at the portion of the wiring unit 200 between the imaging units 190a and 190b, so that the first imaging unit 190a and the second imaging unit 190b are parallel to each other and overlap each other. Is held as. The filter 600 for absorbing radiation is held between the first imaging unit 190a and the second imaging unit 190b that are held in parallel so as to be parallel to and overlap with the imaging unit. The filter 600 absorbs low energy components (low frequency components; soft radiation) from the radiation. For the filter 600, for example, a thin plate of metal such as aluminum, copper, molybdenum, or tungsten is applied. With such a configuration, imaging using the energy subtraction method can be performed.

In the present embodiment, the two imaging units are bent and held in parallel, and the filter 600 is sandwiched between them, so that imaging by the one-shot energy subtraction method can be realized. When the scintillator layer 9 and the pixel region 150 including the photoelectric conversion element are arranged in this order from one surface of the detector substrate 101, by bending the wiring portion 200, the order of the scintillator layer and the pixel region with respect to the radiation source is changed. , The upper surface and the lower surface of the detector substrate 101. For this reason, the detector substrate 101 is made of a material that transmits the radiation from the back side of the scintillator layer 9 so that the radiation from any surface can be detected. In addition, there may be a difference in the intensity of signals obtained on the upper surface and the lower surface, but this problem can be solved by processing the signals by image processing. Also in the present embodiment, the drive signal can be supplied together from the drive circuit 210 to the switch elements 2 arranged in the same row of the first image pickup unit 190a and the second image pickup unit 190b. The switch elements of the two image pickup units 190b can be simultaneously driven.

As described above, by using the radiation detector 100 of the present embodiment, general imaging, long-length imaging, and further imaging using the energy subtraction method can be realized using the common radiation detector 100. You can

(Fourth Embodiment)
FIG. 6 is a diagram showing an application example of the X-ray imaging apparatus according to the present invention to an X-ray diagnostic system (radiation imaging system). X-rays 6060 generated by the X-ray tube 6050 (radiation source) pass through the chest 6062 of the patient or subject 6061 and enter the photoelectric conversion device 6040 equipped with a scintillator. This incident X-ray contains information on the inside of the body of the patient 6061. The scintillator emits light in response to the incidence of X-rays, and this is converted into an electric signal by a photoelectric conversion element to obtain electric information. This information is converted into a digital signal and image-processed by an image processor 6070 which serves as a signal processing means and can be observed on a display 6080 which serves as a display means of a control room. The radiation imaging system includes at least a radiation imaging device and a signal processing circuit that processes a signal from the radiation imaging device. Further, this information can be transferred to a remote place by a transmission processing means such as a communication line 6090, can be displayed on a display 6081 which is a display means such as a doctor room at another place, or can be stored in a recording means such as an optical disk. It is also possible for the doctor to diagnose. It is also possible to record on the film 6110 which is a recording medium by the film processor 6100 which is a recording means.

4: row drive line, 9: scintillator layer, 100: radiation detector, 101: detector substrate, 200: wiring part, 190a: first imaging unit, 190b: second imaging unit, 210: drive circuit, 215 : FPC, 220: readout circuit, 221: readout circuit board, 222: FPC

Claims (10)

A radiation imaging apparatus comprising a radiation detector and a drive circuit,
The radiation detector includes a first imaging unit, a second imaging unit, and a wiring unit arranged between the first imaging unit and the second imaging unit,
The first imaging unit and the second imaging unit include a plurality of pixels arranged so as to form a plurality of rows and a plurality of columns, and a plurality of row drive lines respectively corresponding to the plurality of rows. Have,
The drive circuit generates a plurality of drive signals respectively supplied to the plurality of row drive lines,
The plurality of row drive lines of the first image pickup unit and the plurality of row drive lines of the second image pickup unit are respectively connected by a plurality of common wirings arranged in the wiring unit,
The radiation imaging apparatus, wherein the wiring section is provided with a connecting section that connects the plurality of common wirings to the drive circuit, and the wiring section has flexibility. The radiation detector comprises a flexible detector substrate,
The first imaging unit and the second imaging unit are arranged on the detector substrate,
The radiation imaging apparatus according to claim 1, wherein the wiring portion is a portion sandwiched between the first imaging unit and the second imaging unit of the detector substrate. The radiation detector is bent by the wiring portion, and the first imaging unit and the second imaging unit are held so as to be parallel to and overlap with each other. Radiation imaging device. A filter that absorbs radiation is held in a position parallel to the first imaging unit between the first imaging unit and the second imaging unit held in parallel. The radiation imaging apparatus according to claim 3. The radiation detector is bent by the wiring part, and the first imaging part and the second imaging part are held in parallel with each other and partially overlapped with each other. Radiation imaging device. Each of the plurality of pixels includes a photoelectric conversion element and a switch element,
The radiation detector is bent at the wiring part, the first imaging part and the second imaging part are parallel to each other with respect to a predetermined plane, and the first imaging part and the second imaging part are parallel to each other. When the image pickup unit is orthographically projected onto the predetermined plane, the distance .0 between the centers of the photoelectric conversion elements between the orthogonal projection of the first image pickup unit and the orthogonal projection of the second image pickup unit is 0. The radiation imaging apparatus according to claim 1, wherein the radiation imaging apparatus is held so as to have an interval of 5 times or more and 3 times or less. The radiation imaging apparatus according to claim 1, wherein the radiation detector includes a scintillator layer. The radiation imaging apparatus according to claim 1, wherein the drive circuit controls the plurality of drive signals to select pixels in a predetermined row. 8. The read circuit for reading out signals from the plurality of pixels is provided in correspondence with each of the first image pickup unit and the second image pickup unit. The radiation imaging apparatus according to. A radiation imaging apparatus according to any one of claims 1 to 9,
A signal processing circuit for processing a signal read from the radiation imaging apparatus;
A radiation imaging system comprising:

Images