CN112349638A - 基板中继承转系统 - Google Patents

基板中继承转系统 Download PDF

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Publication number
CN112349638A
CN112349638A CN201910734309.6A CN201910734309A CN112349638A CN 112349638 A CN112349638 A CN 112349638A CN 201910734309 A CN201910734309 A CN 201910734309A CN 112349638 A CN112349638 A CN 112349638A
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substrate
port
load port
bearing
pivot
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孙建忠
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

Abstract

本发明关于一种基板中继承转系统，包括一机壳，该机壳内部设一承转机体，该承转机体包括一枢轴，该枢轴向外延伸二相隔间距的一第一承载埠以及一第二承载埠，以供得以对该第一承载埠所在位置规律性放置基板式匣。本发明在设计上除了该第一承载埠外，更设有该第二承载埠，该第二承载埠进行晶圆(Wafer)等基板取料的工作，该第一承载埠则是等待外部输送设备(或人工操作)取放料或该第二承载埠空料时进行切换的准备，故可节省外部输送设备取放料的时间。

Description

基板中继承转系统
技术领域
本发明关于一种输送基板系统，尤指一种基板中继承转系统。
背景技术
工业界中有基板制程，例如在半导体晶圆制造以及IC封装设备的操作，基板在制作过程或完成后在IC封装设备操作，在制程中必须有承转机体，等待其他的输送设备而移动至各不同的工序位置。
先前技术的承转机体只有一个承载埠(Load Port)，当基板式匣(Cassette)内已无晶圆(Wafer)等基板时，需等待输送设备，例如OHT(Overhead Hoist Transfer，空中单轨无人搬运车)，即半导体制造工厂所使用的搬送系统将空的基板式匣(Cassette)取走，然后再将满料的基板式匣(Cassette)放置在承载埠(Load Port)上才可以进行作业。
由于单次只有一个作动机构作业，因此造成等待时间的浪费，且降低基板的输送移动效率，进而大幅影响基板生产效率及成本。
发明内容
有鉴于先前技术的问题，本发明者认为应有一种基板中继承转系统，包括一机壳，该机壳内部设一承转机体，该承转机体包括一枢轴，该枢轴向外延伸二相隔间距的一第一承载埠以及一第二承载埠，得以于更设一外部输送设备下，以该外部输送设备得以对该第一承载埠所在位置规律性放置基板式匣，或以人工操作对该第一承载埠所在位置规律性放置基板式匣。
本发明可以解决先前技术承转机体只有一个承载埠(Load Port)，因此等待时间过久的问题，本发明在设计上除了该第一承载埠外，更设有该第二承载埠，该第二承载埠进行晶圆(Wafer)等基板取料的工作，该第一承载埠则是等待外部输送设备取放料(或以人工操作取放料)或该第二承载埠空料时进行切换的准备，故可节省外部输送设备取放料的时间。
附图说明
图1为本发明承转机体立体示意图。
图2为本发明壳体以及内部承转机体的透视图。
图3为本发明配合控制机的立体示意图。
图4为本发明配合外部输送设备的立体示意图。
图5为本发明运作效果示意图。
图号说明：
1 机壳
10盖体
2 承转机体
20枢轴
21第一承载埠
22第二承载埠
3 外部输送设备
4 基板式匣
5 控制介面。
具体实施方式
请参阅图2所示，本发明关于一种基板中继承转系统，包括一机壳1，该机壳1用以保护内部的机构。
配合图1所示，该机壳1内部设一承转机体2，该承转机体2可以用来暂时贮料而等待其他的输送设备而将中间产品移动至各不同的工序位置。
本发明的该承转机体2包括一枢轴20，该枢轴20向外延伸二相隔间距的一第一承载埠21以及一第二承载埠22，甚至可以更多而不限于该第一承载埠21以及该第二承载埠22。
配合图4所示，更设一外部输送设备3，该外部输送设备3得以对该第一承载埠21所在位置规律性放置一基板式匣4；该基板式匣4是作为承接制程设备的成品或半成品的载具，也就是将成品或半成品收纳至该基板式匣4而作为仓储、移动、收纳、运送的基本单元。
该外部输送设备3可以为OHT(Overhead Hoist Transfer，空中单轨无人搬运车，即半导体制造工厂所使用的搬送系统)或是任一机械手臂，可以依据现场或经济成本的考量而选用。
本发明也可以不设该外部输送设备3，而以人工操作进行取放料。人工操作时，可以设置适合人手操作的人孔(Manhole)来进行。
配合图3所示，本发明可以在一控制介面5的操作下，例如依据时间控制、制程控制等进行操作。
如图5所示的步骤显示如下。
首先由该外部输送设备3将该基板式匣4放置于该第一承载埠21，然后该外部输送设备3复位，同时该第一承载埠21上即附载有该基板式匣4。该基板式匣4内的基板可以为晶圆(Wafer，制作硅半导体积体电路所用的硅晶片)、液晶荧幕的玻璃或其他任何薄板状物品等。
然后透过该枢轴20的转动，令该第一承载埠21旋转至下方，而在该第一承载埠21旋转至下方的过程，该第二承载埠22则相对旋转移动至上方。可以令该第二承载埠22得以不同时序沿该枢轴20运转至该第一承载埠21原先所处的位置，即利用时序而不会产生空耗时间来等待。
然后因为时间的设定，当该第二承载埠22沿该枢轴20运转至该第一承载埠21原先所处的位置时，该外部输送设备3再将另一基板式匣4放置于该第二承载埠22，依此利用时序连续以及往复运动。
而原先该第一承载埠21所承载的该基板式匣4移动到下层原先该第二承载埠22所在的位置(即图式下层)，此时该机壳1所设的一盖体10可以依据时间设定而打开，供取出该第一承载埠21所承载的该基板式匣4，然后该盖体10再依据时间设定或手动操作予以关闭。而时序仍然在进行，而产生连续循环的自动化动作。本发明的动作流程可以产生序列图(Sequence Diagram)，亦称为循序图的概念，利用时间差来产生序列、顺序。
本发明可以解决先前技术承转机体只有一个承载埠(Load Port)，因此等待时间过久的问题，本发明在设计上除了该第一承载埠21外，更设有该第二承载埠22，该第二承载埠22进行例如但不限于晶圆(Wafer)等基板取料的工作，该第一承载埠21则是等待该外部输送设备3取放料或该第二承载埠22空料时进行切换的准备，故可节省该外部输送设备3取放料的时间。

Claims (4)

1.一种基板中继承转系统，其特征在于，包括一机壳，该机壳内部设一承转机体，该承转机体包括一枢轴，该枢轴向外延伸二相隔间距的一第一承载埠以及一第二承载埠，以供得以对该第一承载埠所在位置规律性放置一基板式匣。
2.如权利要求1所述的基板中继承转系统，其特征在于，设一外部输送设备，该外部输送设备得以对该第一承载埠所在位置规律性放置一基板式匣。
3.如权利要求2所述的基板中继承转系统，其特征在于，该外部输送设备为一机械手臂。
4.如权利要求2所述的基板中继承转系统，其特征在于，该外部输送设备为一空中单轨无人搬运车。
CN201910734309.6A 2019-08-09 2019-08-09 基板中继承转系统 Pending CN112349638A (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130322990A1 (en) * 2012-06-01 2013-12-05 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport bridge for semiconductor fabrication tools
US20180033663A1 (en) * 2015-02-17 2018-02-01 Tokyo Electron Limited Carrier transport device and carrier transport method
CN108346605A (zh) * 2017-01-23 2018-07-31 孙建忠 基板贮送系统
CN209087799U (zh) * 2018-11-21 2019-07-09 东泰高科装备科技有限公司 载具传输系统

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130322990A1 (en) * 2012-06-01 2013-12-05 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport bridge for semiconductor fabrication tools
TW201351551A (zh) * 2012-06-01 2013-12-16 Taiwan Semiconductor Mfg 用於半導體製程區之晶圓處理系統以及在半導體設備間輸送晶圓之裝置及方法
US20180033663A1 (en) * 2015-02-17 2018-02-01 Tokyo Electron Limited Carrier transport device and carrier transport method
CN108346605A (zh) * 2017-01-23 2018-07-31 孙建忠 基板贮送系统
CN209087799U (zh) * 2018-11-21 2019-07-09 东泰高科装备科技有限公司 载具传输系统

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