1220420 玖、發明說明 【發明所屬之技術領域】 本發明係關於在半導體製造或液晶製造步驟中，將通 常採用25片裝晶盒或f〇υρ(密閉盒）而所進行的晶圓對製 造裝置之供應回收事宜，藉由潔淨隧道（clean tunnel)而所 構成的連結形態移载設備（即，EFEM(EqUipment Front End Module)、設備前置模組），單片搬送移載晶圓，俾達縮短 製造期間、削減半成品庫存等合理化功效的特殊EFEM、 晶圓搬送移載、晶圓編號讀取方法等。 【先前技術】 習知在半導體製造工廠前處理步驟中的晶圓搬送肩 置’係在將晶圓放入25片裝晶盒或第15圖所示F〇up(^ 閉盒）中之後，在提供給製造裝置，俾執行回收事宜。因也 曰曰I中的2 5片晶圓之最初的第i片，必須直到剩餘存 24片均已處理完成之前，均在F〇up等之内等待著。所琴 晶圓在直_ FOUP内的其他晶圓已處理完成為止之前均a 須等待著’便產生等待| 1〇〇台以上且高達5〇〇步驟以」 之半導體或液晶的所有製造裝置處理的晶圓半成品。在也 方法中’戴至被處理前的等待，與隨此的半成品均將變# 魔大。此外，對製造農置需要從剛…出晶圓… 凌置中進仃處理之後，再度放入晶圓的機構。另外，對也 晶盒、刚P的自動搬送、自動保管方面，需要配合該, 尺寸、重1的較大空間與高價的物流系統，在為求提 1220420 產效率而將晶圓尺寸大口徑化，而且晶盒或FOUP的 與重量亦需要高額投資，而導致潔淨室工廠建設經費 的主因之一。本發明係藉由將晶圓在極小潔淨區域中 單片連續搬送，而將製造裝置間利用晶圓單體予以聯 的系統，乃彌補習知技術缺點，並將單片製造的實現 具體化。 半導體或液晶晶圓係從直徑 2 0 0 m m演變至 300mm，300mm所對應的製造裝置亦從200mm代的批 理方式，大半轉變為單片處理方式，利用製造裝置與 的單片化而提昇生產效率，此乃業界的目標。譬如， IBM在EAST FISHKILL工廠中，便有發表qtaT之利 氣壓力使半導體晶圓浮起並進行搬送的系統，即便使 浮起，但是隨強大氣流的靜電，將使搬送移載存在困難 平均1小時500片至1000片的晶圓搬送並無法滿足實 產線所需的規格’亦無實際的功效。此外，類似的系 有如習知利用輸送帶將晶圓在裝置間進行搬送的設備 如曰本專利jp 3 _丨5 4 7 5 1 A中便有揭示相關利用環狀輸 與機械臂進行移載的方法。但是，此方法則是以晶盒 進行處理，機械臂亦是夾住晶盒的方法，而且在裝置 而要在移載晶盒之際，供使機械臂進行移動的機能。 ，將晶圓以單片為單位而且僅持晶圓端面進行移載的 月方式有所不同，g習知方法並無法避免暫時儲存於 中，故而無法達成縮短製造處理時間的功效。 再者，亦有將晶圓利用習知技術之使用輸送帶進 尺寸 增加 進行 繫著 予以 直徑 次處 搬送 之前 用空 晶圓 點， 際生 統亦 〇譬 送帶 單位 側則 此乃 本發 晶盒 行裝 5 1220420 置間搬送的方法。譬如，美國專利US5820679A與日本專 利JP7-122622A中所示，但是輸送帶與裝置的移載方法並 未明確’而且輸送帶乃由皮帶承受晶圓底面，因此隨晶圓 與皮f間的磨擦便將產生粉塵，因而無法滿足對晶圓製造 要求著極力不接觸晶圓底面的最新規格。此外，在該等之 中亦未揭示將半導體或液晶生產上所需的潔淨區域予以極 小化的想法。亦未存在有將多數個EFFM間利用潔淨區域 進行連接，並藉由將晶圓利用單片進行搬送，俾將製造期 間及平形成連結狀態EFEM的概念。將製造裝置間在最小 潔淨區域中進行搬送之事，在降低潔淨工廠的設備投資額 與運轉成本上乃屬極其重要的因素。 有雲於斯，本發明乃在半導體製造或液晶製造中，藉 由利用連結形態的EFEM而實現單片搬送，藉此將縮短生 產時間（Quick Turn Around Time)、減少半成品與完成品庫 存量予以具體化。 【發明内容】 本發明主要部分的連結形態EFEM係由下述四個構成 要件所構成。即，在半導體與液晶各製造裝置之前，由機 器人（2)、FOUP(12)、及FOUP開口機（14)所構成的特殊 EFEM(Equipment Front End Module)-設備前置模組）（10); 將該等特殊EFEM( 10)與潔淨區域形成共通狀態的潔淨隧道 (clean tunnel)(l);在潔淨隧道内連續搬送晶圓（16)的單片 輸送帶（15);以及將半導體或液晶晶圓裝填於FOUP中的 6 裝填站（3) °藉由（普通的EFEM請參照第14圖所示）此四個 構造而呈連結EFEM組群之形態的連結形態EFEM，係利 用將晶圓（16)裝填於F〇up(12)中的裝填站（3),而連接於連 結形態的EFEM外部。在連結形態的EFEM内將晶圓（16) 依單片進行搬送移載，而在連結形態的EFEM外部則將晶 圓（16)依F0UP(12)單位進行搬送移載。在晶圓（16)單位與 F 0 U P ( 1 2)單位之接點的晶圓裝填站（3 )中，利用機械臂（2 〇 ) 將F0UP(12)内的晶圓（16)形成單片並裝填於f〇1jp(12)中， 然後組合於暫時收容著真正空之F〇UP(12)的緩衝站（4)中， 緩衝站（4)則連繫於執行著連結形態之EFEM間搬送的小批 次搬送機（5)。 特殊EFEM(2)係具備有··晶圓移載用機械臂（2〇);讀取 條碼、英數字的讀取機器（25);自動運轉用緩衝晶盒（13)、 手動運轉用F0UP(12);以及FOUP開口機（14);並利用潔 淨隧道1而連接於潔淨區域（第1圖斜線部分）。 特殊EFEM(2)内的機械臂（2〇)係具備有 丨王吓何有日日圓 (16)外周緣部的保持部（22);並在單片輸送帶（15)、製造裝 置（50〜54)、緩衝晶盒（13)、以及F〇Up(12)之間進行移載。 單片輸送帶（15)係形成環狀形狀，乃利用輪送皮帶（38) 而驅動的連續移動式，在LM導執（36)上的區塊（37)中，安 裝著將晶圓(16)依一定間隔搭載著的鉤指(23)。因為輸送皮 帶（38)若經過一定期間的話，便將產生延伸現象，因此在 導執(36)其中一部份上設置著供拉緊輸送皮帶(38)用的拉緊 機構07)與調整執更換處所（18)。（第16圖、第17圖）當輸 送皮帶（3 8)延伸之際，便將所延伸尺寸份量更換為接著而 至的調整用LM導軌。在單片輸送帶（15)之鉤指（23)上，安 裝著供將對晶圓（16)之接觸形成最小極限的保持部（24)，而 僅保持著晶圓（1 6)的外周緣部。屬於為使隨單片輸送帶（丨5) 之驅動而所產生的粉塵，不致對潔淨隧道1内的潔淨度造 成影響，而採取安裝著供將單片輸送帶（1 5)内部形成負壓 的排氣風扇（3 1)，並連繫於排氣集塵器（32)，俾經由空氣過 渡器將空氣予以排放出的潔淨對策的輸送帶。 屬於主掌半導體成液晶工廒之生產管理的電腦的 MES(Manufacturing Engineering System)，因為頗難將全部 晶圓毫無錯誤的進行循轨，因此最好在將晶圓（丨6)裝入製 造裝置（50〜54)之前（即，特殊EFEM(2)内之機械臂（20)，從 單片輸送帶（15)操取晶圓（16)之時點），便讀取晶圓編號， 然後將應處理晶圓之事宜報告給MES，之後在經製造裝置 (50〜54)而所決定的裝置平台（19)位置處，配合著晶圓 的方向而傳遞。為符合本規格，機器臂（2丨）便具備有：保持 著晶圓（16)外周緣部，並在機器臂（21)移載動作中使晶圓（16) 產生旋轉，當檢測出V缺口或定向緣之時便停止旋轉，而 出現既定位置並讀取晶圓（1 6)之英數字或條碼的讀取機 構。 【實施方式】 為求詳述本發明，便依照所添附圖式進行說明。 第1圖與第2圖所示係連結形態之EFEM與緩衝站（4) 及小批次搬送機（5)間之關係。第3圖與第4圖所示係特殊 Ε_(2)。半導體或液晶製造裝置之前的特殊e_(2)，1220420 发明 Description of the invention [Technical field to which the invention belongs] The present invention relates to a wafer-pair manufacturing apparatus that generally uses a 25-chip crystal box or fOυρ (closed box) in a semiconductor manufacturing or liquid crystal manufacturing process. For supply and recycling matters, the connected form transfer equipment (ie, EFEM (EqUipment Front End Module), equipment front module) formed by clean tunnels, single-chip transfer and transfer wafers, Trent Special EFEM, such as shortening the manufacturing period and reducing the inventory of semi-finished products, wafer transfer, wafer number reading method, etc. [Prior art] It is known that the wafer transfer shoulder in the pre-processing step of a semiconductor manufacturing plant is after placing the wafer in a 25-chip wafer box or F0up (^ closed box) as shown in FIG. 15, After providing to the manufacturing facility, I will carry out recycling matters. Therefore, the first ith wafer of the 25 wafers in I must wait in F0up, etc. until the remaining 24 wafers have been processed. The so-called wafers must wait until all other wafers in the FOUP have been processed, and then wait for 100 times or more and up to 500 steps to process all semiconductor or liquid crystal manufacturing equipment. Wafer semi-finished products. In this method, you can wait until it is processed, and the semi-finished products that follow it will become # 魔 大. In addition, for manufacturing farms, a mechanism is required to load wafers from ... just out of the wafer ... In addition, for the automatic transfer and automatic storage of crystal boxes and rigid Ps, it is necessary to cooperate with the large size and weight of 1 space and the expensive logistics system to increase the size of the wafer in order to improve the productivity of 1220420. In addition, the crystal box or FOUP and the weight also require high investment, which leads to one of the main reasons for the clean room factory construction expenses. The present invention is a system that continuously transfers a single wafer in a very small clean area, and uses a single wafer to connect the manufacturing equipment, which compensates the shortcomings of the conventional technology and embodies the realization of single wafer manufacturing. The semiconductor or liquid crystal wafer system has evolved from a diameter of 200 mm to 300 mm. The manufacturing equipment corresponding to 300 mm has also changed from a 200 mm generation batch method to a single-chip processing method. The use of manufacturing equipment and singulation has improved production. Efficiency is the goal of the industry. For example, in the EAST FISHKILL factory, IBM has published a system that uses the positive pressure of qtaT to float and transport semiconductor wafers. Even if it floats, the static electricity with strong airflow will make it difficult to transfer. 1 The 500-1000 hour wafer transfer does not meet the specifications required by the actual production line, and it has no practical effect. In addition, a similar system is used to transfer wafers between devices using conventional conveyor belts, such as the Japanese patent jp 3 _ 丨 5 4 7 5 1 A. It is disclosed that related transfer using a circular conveyor and a robot arm Methods. However, in this method, the crystal box is used for processing, and the robot arm is also a method for clamping the crystal box, and when the crystal box is transferred during the device, the robot arm is provided with the function of moving. The method of transferring wafers in a single wafer and carrying only the wafer end faces is different. The conventional method cannot avoid temporary storage in the medium, so it cannot achieve the effect of shortening the manufacturing processing time. In addition, there are also known wafer transfer technologies that use a conveyor belt to increase the size of the wafer. The diameter of the wafer is used to transfer the wafer to an empty spot before the transfer. The interstitial system is also a crystal. Box pack 5 1220420 Intermediate transport method. For example, the US patent US5820679A and Japanese patent JP7-122622A are shown, but the method of transferring the conveyor belt and the device is not clear. And the conveyor belt bears the bottom surface of the wafer by the belt. Dust will be generated, so it cannot meet the latest specifications that require wafer manufacturing to be extremely close to the bottom surface of the wafer. In addition, the idea of minimizing the clean area required for semiconductor or liquid crystal production has not been disclosed among these. There is also no concept of connecting a plurality of EFFMs in a clean area and transferring the wafers in a single piece to form an EFEM in a connected state during manufacturing and flattening. Moving the manufacturing equipment between the smallest clean areas is an extremely important factor in reducing equipment investment and operating costs in clean factories. This is because in the semiconductor manufacturing or liquid crystal manufacturing, the present invention realizes single-chip conveyance by using the connected EFEM, thereby shortening the Quick Turn Around Time and reducing the inventory of semi-finished products and finished products. Materialize. [Summary of the Invention] The connection form EFEM of the main part of the present invention is composed of the following four constituent elements. That is, before the semiconductor and liquid crystal manufacturing devices, a special EFEM (Equipment Front End Module) (equipment front module) composed of a robot (2), a FOUP (12), and a FOUP opening machine (14) (10) A clean tunnel (l) that forms a common state between these special EFEMs (10) and the clean area; a single-chip conveyor belt (15) that continuously transports wafers (16) in the clean tunnel; and semiconductor or 6 loading stations (3) in which the liquid crystal wafers are loaded in the FOUP. (The ordinary EFEM is shown in Figure 14) These four structures form a connection form EFEM that connects the EFEM groups. The circle (16) is loaded in the loading station (3) in F0up (12), and is connected to the outside of the connected EFEM. The wafer (16) is transferred and transferred in a single piece in the EFEM in the connected form, and the wafer (16) is transferred and transferred in units of a FUP (12) outside the EFEM in the connected form. In the wafer loading station (3) at the contact point between the wafer (16) unit and the F 0 UP (1 2) unit, the robot (2) is used to form the wafer (16) in the F0UP (12) into a single unit. The film is packed in f〇1jp (12), and then combined in the buffer station (4) which temporarily holds the real empty F0UP (12), and the buffer station (4) is connected to the EFEM which executes the connection form. Small batch conveyor (5). The special EFEM (2) is equipped with a wafer transfer robot arm (20); a bar code and alphanumeric reading device (25); an automatic operation buffer crystal box (13), and a manual operation F0UP (12); and FOUP opening machine (14); and is connected to the clean area by using the clean tunnel 1 (the oblique part in Fig. 1). The robotic arm (20) in the special EFEM (2) is provided with a holding part (22) of the outer peripheral part of the Japanese yen (16), and it is provided on the single-piece conveyor belt (15) and the manufacturing device (50 ~ 54), buffer cell (13), and F0Up (12). The single-piece conveyor belt (15) is formed in an endless shape, and is a continuous moving type driven by a carousel belt (38). In a block (37) on the LM guide (36), a wafer ( 16) Hook fingers (23) mounted at regular intervals. Because the conveyor belt (38) will stretch after a certain period of time, a tensioning mechanism 07 for adjusting the conveyor belt (38) and an adjusting actuator are provided on a part of the guide (36). Replacement of premises (18). (Figs. 16 and 17) When the conveying belt (38) is extended, replace the extended size with the following LM guide for adjustment. On the hook finger (23) of the single-piece conveyor belt (15), a holding portion (24) is provided for minimizing the contact with the wafer (16), and only the outer periphery of the wafer (16) is held. Edge. It belongs to the dust generated by the driving of the single-piece conveyor belt (丨 5), so as not to affect the cleanliness in the clean tunnel 1, and is installed to form a negative pressure inside the single-piece conveyor belt (1 5). The exhaust fan (31) is connected to the exhaust dust collector (32), and a clean countermeasure conveyor belt that discharges air through an air transition device. MES (Manufacturing Engineering System), a computer that manages the production management of semiconductors and liquid crystals, is difficult to track all wafers without errors. Therefore, it is best to load wafers (6) into manufacturing. Before the device (50 ~ 54) (that is, when the robot arm (20) in the special EFEM (2) handles the wafer (16) from the single-piece conveyor belt (15)), the wafer number is read, and then The MES is reported to the wafer to be processed, and then transferred at the position of the device platform (19) determined by the manufacturing device (50 to 54) in accordance with the direction of the wafer. In order to comply with this specification, the robot arm (2 丨) is provided with: holding the outer periphery of the wafer (16), and rotating the wafer (16) during the robot arm (21) transfer operation, and when V is detected When the notch or orientation edge stops rotating, a predetermined position appears and reads the alphanumeric or barcode reading mechanism of the wafer (16). [Embodiment] In order to describe the present invention in detail, it will be described in accordance with the attached drawings. The relationship between the EFEM connected to the buffer station (4) and the small batch conveyer (5) is shown in Figures 1 and 2. Figures 3 and 4 are special Ε_ (2). Special e_ (2) before semiconductor or liquid crystal manufacturing equipment,
係屬於通常潔淨度級數1之超級满事F I纥敬為淨&域、與級數1〇〇〇程 度的潔淨區域，在級數}的區域中具 八T八爾有.移载機械人（2〇) 與緩衝晶盒（13)。在及數約1〇〇〇 ^ . ^ 霉七 W ^域中設置有 F Ο U P (1 2) ’乃當搬送系統有障礙的 或液晶製造裝置進行特別緊急處理 情況時，供為對半導體 ’俾使操作員依人工搬 送FOUP肖者’在通常的自動運轉時並不使用。此外，通 常的EFEM(第14圖）係、全部依F〇up單位進行處理，而本 發明就特殊EFEM(2)乃對應著緩衝晶盒（13)與F〇up(i2)二 者之點而言，係不同於通常的EFEM。 潔淨隧道⑴係如第α圖與第2圖所示，依沿單片輸送 帶（15)’且覆蓋著其上方之方式而設計著。 在此潔淨隧道⑴上方，如第2圖所示，安裝著ηερα 過濾-器⑷，俾將經潔淨化過的空氣供應給潔淨陡道⑴内。 再者’潔淨随道⑴側邊在除連接於上述特殊efem(2) 之區域外的其餘區域，利用既定構件進行隔間。 再者，潔淨隧道⑴之下方乃利用單片輪送帶(15)而隔 開’如上述’依隨單片輸送帶(15)之驅動而所產生的粉塵， 不致影響到潔淨随道⑴内潔淨度的方式，經由排氣風扇（31) 而連接於排氣集塵器（32)。 特殊EFEM(2)與晶圓裝填站（3)係連接於潔淨隧道， 並構成潔淨度級數丨的區域，包含裝置平台（19)在内，在 此潔淨度級數丨之區域内，晶圓(16)將全部依單片進行移 1220420 載搬送，除緊急處理的人工操作 、W況外 於FOUP(12)中之事，乃僅有透過晶圓裝填 晶圓（16)裝填 站（3)的情況， 因為晶圓（16)的 其中一個處所 FOUP化、單片彳卜兀歷 化乃屬於晶圓裝填站（3)的因此便構成連接荽4主& 释者特殊EFEM(2)的連結 EFEM形態。 依程序管理用電腦的指示，锤 、、乂小批次搬送機（5)所搬送 至的FOUP(12)，在晶圓裝填站（3)中 干將利用機械人（20)而單 片化，並搭載於單片輸送帶（15)上，伯θ a⑻ ’ 但疋當製造裝置（50〜54) 與搬送的時序未吻合的情況_ ’便暫時存放於緩衝站⑷ 中，若依管理用電腦之指#而形成對製造襄置（5〇〜54)屬於 適時機狀態的話，FOUP(12)便從缕你# / /f、 、厂文攸徒衝站（4)移往晶圓裝填站 (3)中，並在單片化之後，爯刹$ 傻丹才』用早片輸送帶（15)搬送至製 造裝置(50〜54)中。單片輸送帶(15)上所搭載的晶圓〇6)， 便利用既定製造裝置(50〜54)前的㈣EFEM⑺内之機械人 (2〇)’而暫時放置於緩衝晶盒(13)中，或者供應給裝置平台 (19)。在製造裝置（50〜54)中經完成加工後的晶圓（16)便利 用機械人（20)，而搭載於單片輸送帶（丨5)上，並搬送往次一 裝·置（50〜54)。 因為連結形態的EFEM係將半導體或液晶製造裝置連 接著10台以上，因此單片輸送帶（15)便需要單位時間5〇〇 至1〇〇〇片程度的搬送能力，但是本發明的單片輸送帶（15) 在當鉤指間距500mm、輸送帶速度1〇m/分的情況下，單位 時間可進行1 200片的搬送，甚至亦可提高此能力。 再者，從特殊EFEM(2)遞送至晶圓裝填站（3)的晶圓 10 U6)，可將在晶圓裝填站（3)中將晶圓（16)裂填於F〇up(l2) 中並進行傳遞的時序’設定為任意小批次。譬如，經過所 決定的時間、或者到達所決定片數的話，便自動關閉 F0UP(12)的蓋子’並利用小批次搬送機（5)自動傳遞給其他 的連結形態EFEM。因為即便將連結形態EFEM内進行單 片搬送，而毫無等待晶圓處理時間，若在連結形態EFEM 間進行批次搬送的話，將削減單片搬送效果，因此便設定 供形成小批次的時間與片數’並執行小格搬送。結果，若 將連結形sl EFEM間依單片輸送帶進行搬送的話，當每分 鐘10m至15m的速度之情況時，於長度i5〇m現場的狀況 下，一圈需要2 0分鐘至3 0分鐘’但是因為小批次搬送機（5) 係每分鐘150m速度，因此一圈的時間僅要2分鐘便可， 不致削減連結形態EFEM内的單片搬送效果。整體的流程 圖如第18圖所示。 第5圖與第6圖所示係經單片輸送帶（15)所搬送至的 晶圓（1 6) ’對製造裝置（50〜54)進行供應、回收的動作關係。 單片輸送帶（15)係利用環狀輸送皮帶（38)而驅動於a方向 的連續移動式輸送帶。在單片輸送帶（15)鉤指（23)的4個保 持部（24)上所搭載的晶圓（16)，在遮蓋到既定製造裝置 (5 0〜5 4)前面的時候，機器臂（2丨）便與朝a方向前進的單片 輸送帶（15)移動速度同步，鑽入鉤指（23)下方，並將機器臂 (21)之B方向速度與鉤指（2 3)之a方向速度設定為等速度， 機械人本體（20)便利用朝c方向上昇，而將晶圓（16)搭載 於機器臂（21)上的4個保持部（22)上。在將晶圓（16)搭載於 i22〇42〇 輸送帶上之時，空的鉤指（23)若來到製造裝置之既定位置 的話，將晶圓（16)搭載於保持部（22)上的機器臂（21)，便將 朝A方向前進的鉤指（23)上，連動於上述鉤指而朝b方向 移動，並將A與B之移動設為等速度，然後利用機器臂（2 1) 朝D方向下降而執行移載。 晶圓（1 6)的V缺口或定向緣之定位、以及刻晝於晶圓（1 6) 上的條碼或英數字之讀取，乃透過習知機器人附近所設置 的旋轉式晶圓定位專用裝置（定位器）與編號讀取裝置而執 行’將旋轉機構組裝於機器臂（2丨）中，便無須移動更換， 可縮短動作時間。此情況下，當從單片輸送帶（15)擷取晶 圓（16)之時，或製造裝置（5〇〜54)的加工結束並搭載於單片 輸送帶（15)上之時，搭載於機械人（2〇)上的讀取機器（25)均 可讀取晶圓（16)上刻晝的英數字或條碼。在進行晶圓（16)的 定位與讀取之際，便利用内建於機器臂（21)内的旋轉機構。 此外，曰曰圓（1 6)的移載係經由接觸晶圓（丨6)面積較少，且對 晶圓（16)損傷最少之方》，乃利用單片鉤指(23)之保持部 (24)與機械臂之保持部（22)，而保持著晶圓（μ)外周緣部。 片第7圖所不係對第4圖、第5圖之連續移動式輸送帶， 在^置平台U9)之前，f時停止輸送帶之鉤指（23)的方法。 鉤扣（23)係女裝於托盤（28)上，並利用驅動輥（^)而移動。 若托盤（28)到逵$ J運既疋位置的話，便利用升起升降式擋止 (3 0) ’ 俾使把盤（2 8L _ i (28)停止。在停止之同時，機器臂（21)將鑽 入晶圓（16)下方， 並利用上昇而擷取晶圓（丨6)。在擷取之 點’因為升降4t 二备止（3 0)將下降，托盤（28)便利用驅動輥（29) 12 1220420 的作用而再度移動。當在鉤指(23)上放置著晶圓(16)之情況 時’托盤（28)的移動亦相同，機械人（2〇)的移動乃如第*圖、 第5圖巾°兒明般。使托盤停止$法係使用具累積機；能的驅 動輥並利用使接觸停止式擋止的作用，亦可達相同的機 能。為使在輥式輸送帶本體（15，）外不致有粉塵，而所安裝 的具過濾器之排氣風扇（31)、或排氣集塵器（32)，係與連續 運轉形式的單片輸送帶（15)共通著。 在製造裝置（5〇,51，52,53,54)之前，便讀取晶圓（16)之 條碼或英數予’且當聯絡於生產管理用.電腦（MES)的系統 之情況時’便在機器臂（21)上安裝著使晶圓（16)進旋轉的機 構。 第8圖所示係單片輸送帶（15)、晶圓號碼讀取裝置、 及機器臂（21)之旋轉機構。機械人（2〇)係持著晶圓，並使臂 前端部的臂旋轉機構（3 3)產生旋轉的形式。第9圖與第10 圖所示係機器臂（2 1)上的晶圓旋轉形式，有二種類，均具 相同機能。 第9圖、第10圖之形式I係與移動的單片輸送帶（15) 之鉤指（23)速度同步的使機器臂（21)進行移動，而依機器臂 (21)由旋轉驅動輥（4〇)與自由輥（4丨，42)之傾斜面承受著晶圓 (1 6)外緣’且使旋轉驅動輥（4〇) 一邊進行旋轉一邊朝e方向 移動’而將晶圓（16)夾置於自由輥（41，42)垂直部與旋轉·驅 動輥（40)垂直部間。 第11圖、第12圖之形式π係利用4個自由輥 (41’，42’，43’，44>)承接晶圓（16)外緣，並使旋轉驅動輥（40’）朝 13 1220420 E方向進行移動而包夾晶圓（1 6)。二種形彳阳也认_ 式因為均屬於利用 使輥（40,41，42、或40，，41，，42，，43，，44，）在旋轉的情況下而乂 置，而使晶圓（1 6)在進行旋轉的情況下^ 且上輮的傾斜部， 因此便可防止晶圓（1 6)的磨擦。此外，鉑扣^ Ί心（23)與機械臂之 輥（40,41，42、或 40，，41，，42，，43，，44’）間的蒋 ]移載尺寸誤差係在 1.3mm以内，旋轉驅動輥（40或40，）朝E方仓沾供救+ 乃同的撞擊亦較小， 晶圓（1 6)之V缺口等的定位與讀取條碼、 央默子的時間亦It belongs to the super clean matter FI, which is usually cleanliness level 1. It is a clean area with a level of 10,000 and a degree of cleanliness. There are eight T eight in the area of the number of stages. Human (20) and buffer crystal box (13). F 〇 UP (1 2) is provided in the field of approximately 100 000 ^. ^ Mold VII W ^ 'This is for semiconductors when the transportation system is obstructed or the liquid crystal manufacturing device is under special emergency treatment' I want the operator to manually transfer the FOUP Shaw's not used in normal automatic operation. In addition, the ordinary EFEM (Figure 14) is processed in units of F0up, and the special EFEM (2) of the present invention corresponds to both the buffer crystal box (13) and F0up (i2). In terms of system, it is different from the usual EFEM. The clean tunnel is designed as shown in Fig. 2 and Fig. 2 along a single piece of conveyor belt (15) 'and covering it. Above this clean tunnel ⑴, as shown in Figure 2, an ηερα filter-⑷ is installed, and 俾 supplies cleaned air into the clean steep track ⑴. In addition, the side of the cleanliness ballast is divided into the remaining areas except for the area connected to the special efem (2) mentioned above, and the compartments are formed using predetermined components. Furthermore, the lower part of the clean tunnel ⑴ is separated by a single piece of conveyor belt (15) to separate the dust generated by the driving of the single piece of conveyor belt (15) as described above, which will not affect the inside of the clean 随The system of cleanliness is connected to an exhaust dust collector (32) via an exhaust fan (31). The special EFEM (2) and the wafer loading station (3) are connected to the clean tunnel and constitute an area of cleanliness level, including the device platform (19). In this area of cleanliness level, the crystal The circle (16) will be moved by a single chip 1220420, except for the manual operation of emergency processing, and the situation in FOUP (12), only the wafer (16) loading station (3) ), Because one of the wafers (16) is FOUPed, and the monolithic wafers belong to the wafer loading station (3), so it constitutes a connection to the 4 main & interpreter special EFEM (2). EFEM pattern. According to the instructions of the computer for program management, the FOUP (12) transferred to the small batch transfer machine (5) by the hammer and cymbal will be singulated in the wafer loading station (3) by the robot (20). It is mounted on a single-chip conveyor belt (15), but when θ a⑻ ', but when the manufacturing equipment (50 ~ 54) does not match the timing of the transfer_', it will be temporarily stored in the buffer station⑷, if it is based on the management computer指指 # and the formation of manufacturing facilities (50 ~ 54) is in a timely state, FOUP (12) will be moved from the wire ## / / f,, the factory Wenyoutuchong station (4) to the wafer loading station (3), and after being singulated, the brakes will be transported to the manufacturing device (50 ~ 54) using the early film conveyor (15). Wafers on the single-chip conveyor belt (15) (6) are conveniently placed in the buffer crystal box (13) by the robot (2) 'in `` EFEM' 'before the predetermined manufacturing equipment (50 ~ 54). , Or supplied to the device platform (19). The finished wafer (16) in the manufacturing device (50 to 54) is conveniently used by a robot (20), and is mounted on a single-chip conveyor (丨 5) and transferred to the next-packing unit (50) ~ 54). The connected EFEM system connects more than 10 semiconductor or liquid crystal manufacturing devices, so the single-chip conveyor belt (15) requires a conveying capacity of about 5,000 to 10,000 pieces per unit time, but the single-chip conveyor of the present invention Conveyor belt (15) In the case of a 500mm hook finger distance and a conveyor belt speed of 10m / min, it can carry 1,200 pieces per unit time, and even improve this capability. Furthermore, wafers (10 U6) delivered from the special EFEM (2) to the wafer loading station (3) can be cracked and filled in the wafer loading station (3) at F0up (l2 ) And the timing of the transfer is set to any small batch. For example, when the determined time elapses, or when the determined number of pieces is reached, the lid of F0UP (12) is automatically closed, and it is automatically transferred to the other connection form EFEM by the small batch transfer machine (5). Even if the single-piece transfer is performed in the connected form EFEM without waiting for the wafer processing time, if the batch transfer is performed between the connected form EFEMs, the single-piece transfer effect will be reduced, so the time for forming a small batch is set. And the number of pieces' and perform small cell transfer. As a result, if the slid-shaped EFEMs are transported on a single piece of conveyor belt, at a speed of 10m to 15m per minute, at a site length of i50m, a lap takes 20 minutes to 30 minutes. 'But because the small batch conveyor (5) has a speed of 150m per minute, the lap time is only 2 minutes, which does not reduce the single-chip transfer effect in the connected EFEM. The overall flow chart is shown in Figure 18. Figures 5 and 6 show the operation relationship between the wafers (16) 'transferred to the manufacturing equipment (50 to 54) via the single-chip conveyor (15). The single-piece conveyor belt (15) is a continuously moving conveyor belt driven in the a direction by an endless conveyor belt (38). When the wafer (16) mounted on the four holding parts (24) of the single-finger conveyor (15) hook fingers (23) is covered in front of a predetermined manufacturing device (50 to 54), the robot arm (2 丨) It is synchronized with the moving speed of the single-piece conveyor belt (15) moving in the direction of a, drills under the hook finger (23), and moves the speed in the B direction of the robot arm (21) to the speed of the hook finger (2 3) The speed in the a direction is set to constant speed, and the robot body (20) is conveniently raised in the c direction, and the wafer (16) is mounted on the four holding portions (22) on the robot arm (21). When the wafer (16) is mounted on the i22040 conveyor belt, if the empty hook finger (23) reaches a predetermined position in the manufacturing apparatus, the wafer (16) is mounted on the holding portion (22). The robot arm (21), the hook finger (23) moving in the direction of A is moved in the direction of b in conjunction with the hook finger, and the movement of A and B is set to the same speed, and then the robot arm (2 1) Perform the transfer by descending in the D direction. The positioning of the V-notch or orientation edge of the wafer (16), and the reading of the barcode or alphanumeric characters engraved on the wafer (16) are exclusively for rotating wafer positioning provided near the conventional robot. The device (positioner) and the number reading device are executed to assemble the rotating mechanism in the robot arm (2 丨), so there is no need to move and replace, which can shorten the operation time. In this case, when the wafer (16) is picked up from the monolithic conveyor belt (15), or when the processing of the manufacturing apparatus (50 to 54) is completed and mounted on the monolithic conveyor belt (15), the mounting The reading machine (25) on the robot (20) can read the alphanumeric or bar code engraved on the wafer (16). When positioning and reading the wafer (16), it is convenient to use a rotating mechanism built into the robot arm (21). In addition, the transfer of the circle (16) is through the contacting wafer (6) with a smaller area and the least damage to the wafer (16) ", which uses the holding part of the single hook (23) (24) and the holding portion (22) of the robot arm to hold the outer peripheral edge portion of the wafer (μ). Figure 7 does not refer to the method of stopping the hook (23) of the conveyor belt at f before the platform U9) is placed on the continuous moving conveyor belt of Figures 4 and 5. The hook buckle (23) is a women's clothing on a tray (28), and is moved by a driving roller (^). If the tray (28) reaches the position of 逵 $ J, it is convenient to use the lifting stop (30) 'to stop the handle plate (28L_i (28). At the same time, the robot arm ( 21) Will be drilled under the wafer (16), and the wafer will be retrieved by raising (丨 6). At the point of retrieval, 'because the lift is 4t, the second standby (30) will be lowered, and the tray (28) is convenient for use. The driving roller (29) 12 1220420 moves again. When the wafer (16) is placed on the hook finger (23), the movement of the tray (28) is the same, and the movement of the robot (2) is As shown in Fig. * And Fig. 5, it is as clear as possible. To stop the tray, the method is to use an accumulator; the function of the driving roller and the use of the contact stop type stop function can also achieve the same function. The roller conveyor belt body (15,) is free from dust, and the exhaust fan (31) or exhaust dust collector (32) with a filter is connected to a continuous single-piece conveyor belt ( 15) Common. Before manufacturing the device (50, 51, 52, 53, 54), read the barcode or alphanumeric value of the wafer (16) to 'and communicate with the production management. Computer (MES) In the case of the system, a mechanism for rotating the wafer (16) is mounted on the robot arm (21). The single-chip conveyor (15), the wafer number reading device, and the robot arm are shown in Fig. 8 (21) Rotation mechanism. The robot (20) holds the wafer and rotates the arm rotation mechanism (33) at the front end of the arm. The robot arms (shown in Figures 9 and 10) 2 There are two types of wafer rotation patterns on 1), both of which have the same function. The form I of Fig. 9 and Fig. 10 are synchronized with the speed of the hook fingers (23) of the moving single-chip conveyor belt (15). The robot arm (21) moves, and according to the robot arm (21), the inclined edges of the rotary driving roller (40) and the free roller (4 丨, 42) bear the outer edge of the wafer (16) and cause the rotary driving The roller (40) moves in the e direction while rotating, and the wafer (16) is sandwiched between the vertical portion of the free roller (41, 42) and the vertical portion of the rotating and driving roller (40). The form of the figure 12 uses four free rollers (41 ', 42', 43 ', 44>) to receive the outer edge of the wafer (16), and the rotary drive roller (40') is moved in the direction of 13 1220420 E. And the wafer is sandwiched (1 6). The two types of Liyang also recognize the _ pattern because both belong to the use of the roller (40, 41, 42, or 40, 41, 42, 42, 43, 44, 44) is rotating The wafer (16) is rotated, and the inclined part of the upper part is rotated, so that the wafer (16) can be prevented from being rubbed. In addition, the platinum buckle ^ Ί 心 ( 23) and the roller of the robot arm (40, 41, 42, or 40, 41, 42, 42, 43, 44, 44 ')] The transfer size error is within 1.3mm, and the rotary drive roller (40 or 40,) The dip in the E side warehouse for rescue + the same impact is also small, the positioning of the V notch of the wafer (1 6) and the time to read the bar code and Yang Mozi are also
在3秒以内。若採用習知定位專用定位器進行晶圓之定位 與讀取的話’因為需要20秒以上’因此便將產生極大的處 理時間縮短效果。 再者，因為屬於將晶圓（16)夾置於自由輥（41，42)垂直 部與旋轉驅動輥（40)垂直部間的卡失機構，因此拾取來自 移動單片輸送帶（15)之鉤指（23)的晶圓（16)，而所需要的旋 轉驅動輥（40)間便形成晶圓（16)+ α的間隔。 再者，藉由此卡夾機構便可使高速的進行晶圓（丨6)之 旋轉。Within 3 seconds. If a conventional positioning device is used for positioning and reading of the wafer, ‘because it takes more than 20 seconds’, it will greatly reduce the processing time. Furthermore, because it is a jam mechanism that sandwiches the wafer (16) between the vertical portion of the free roller (41, 42) and the vertical portion of the rotary drive roller (40), it picks up the material from the moving single-piece conveyor belt (15). The wafers (16) of the hook fingers (23), and the space between the wafers (16) + α are formed between the required rotational driving rollers (40). Moreover, the wafer mechanism (丨 6) can be rotated at a high speed by the clamping mechanism.
再者，藉由此卡夾機構，即便機械臂產生移動，仍可 進行晶圓（1 6)的定位。 第1 3圖所示係當搬送頻率較高，且僅要搬送晶圓的話 便可之情況下的規格，乃當將晶圓（1 6)無法趕上依單片單 位進行搬運之情況時，便可搬送複數個多段式輸送帶鉤指 (3 4)與多段式機器臂（3 5)的狀況。將晶圓（16)利用在縱向具 有多段保持部之多段式輸送帶鉤指（34)上，同時將晶圓（1 6) 搭載於2段、3段上而進行搬送，在移載之際，亦利用將 14 1220420 機器臂（2 1)朝縱向形成多段式淮 ， 八進仃移載，便可增加搬送 力。右將搭載晶圓（16)的吝 V周夕&式輸送帶鉤指（34)與多段式 器臂（3 5)没定為2段式的話，便可 災』形成2倍的搬送及移截 右设疋為3段式的話，便可描且 叹j徒幵至3倍的能力。 【產業上可利用性】 能 機 如上述 搬送的晶圓 晶圓。在使用著 F〇Up 理著· FOUP内之25片中 本毛明係將習知裝入晶盒或密閉盒中而進 改為單片連續搬送者’可連續的供應、回 的處理而並未移送往下一步驟 等的批次處理之方法、中，即便在 的第1片，亦必須等待剩餘24 因此在達500以上之前 理步驟中 丨又取风m要極多等待時間的系 本發明之單片搬i关多客# + π 移载方式係將經處理過的1片晶 馬上送往下-步驟。相關此單片搬送移載效果的具體例 在白决曰曰圓2 5片單位的批次搬送中，於對準步驟便需 25天，但是若改為13片單位批次搬送㈣，便可縮短為 天。甚至有報告指出若利用人工依單片進行搬送晶圓的 寄I為5 8天。晶圓對準步驟的單片搬送化可謂終究的 迗方式，而長久以來並未存在可實現量產工廠的具體系統 藉由本發明’利用將半導體製造袭置或液晶製造裝置的 造程序改變為依序的流線式生產方式（在s〇ny公司的長 工廠中，便實現利用人工流線式生產方式），而在連結形 EFEM内進行晶圓單片搬送，並藉由將緩衝站間執行繼 單片搬迗之概念而進行小批次搬送，藉此便可大幅縮短 至晶圓完成為止前的前處理步驟時間，而降低製造的半 行 收 處 片 處 圓 要 13 話 搬 〇 製 崎 態 續 截 成 15 1220420 品量、與完：品的半成品量’且隨搬送、#管的 而有助益於建設投資額的削減。 〜夕Moreover, with this clamping mechanism, the wafer (16) can be positioned even if the robot arm moves. Figure 13 shows the specifications when the transfer frequency is high and only wafers need to be transferred. When the wafers (16) cannot be transported in a single-chip unit, The condition of a plurality of multi-section belt hook fingers (3 4) and multi-section robot arms (3 5) can be transported. The wafer (16) is transferred to a multi-section conveyor hook (34) with a multi-section holding section in the longitudinal direction, and the wafer (16) is carried on two or three stages for transportation. Also, the 14 1220420 robot arm (21) is used to form a multi-segment Huai in the longitudinal direction, and the occupant can be transferred to increase the conveying force. If the 将 V Zhou Xi & conveyor belt hook (34) and the multi-segment arm (3 5) on which the wafer (16) is mounted on the right are not set to the two-segment type, double the transport and If you move the right section to 3 sections, you can trace and sigh for 3 times the ability. [Industrial availability] Wafers Wafers transported as described above. In the use of F0Up management, the 25 pieces in the FOUP will be used in a crystal box or a closed box to convert the knowledge into a single piece continuous transporter. 'Continuous supply and return processing can be combined. In batch processing methods that are not transferred to the next step, etc., even in the first piece, you must wait for the remaining 24. Therefore, in the processing step before reaching 500 or more, it takes a lot of time to take the wind. The invention of the single-chip moving iguanduoke # + π transfer method is to immediately send the processed 1-chip to the next step. A specific example of the effect of this single-chip transfer is in the batch transfer of 25 pieces of Bai Jue Yuen, which requires 25 days in the alignment step, but if it is changed to 13-unit batch transfer, it can be Shortened to days. It has even been reported that if a wafer is transferred manually by a single wafer, the shipping time is 58 days. The single-chip transfer of the wafer alignment step can be described as the ultimate method, and there has not been a specific system that can achieve a mass production factory for a long time. According to the present invention, the use of the semiconductor manufacturing process or the liquid crystal manufacturing equipment manufacturing process is changed. Sequential streamlined production method (in the long factory of sony company, the manual streamlined production method is implemented), and the wafer is transferred in a single piece of EFEM, and is executed between buffer stations. Carrying out small batches following the concept of single-chip transfer, which can greatly shorten the pre-processing step time until the wafer is completed, and reduce the half-line of the manufacturing process. The state continues to cut into 15 1220420 product quantity, and the finished product quantity: semi-finished product quantity, and it will help to reduce the amount of construction investment with the transfer and # management. ~Xi
半導體之對準步驟的製造天數，在現今需要25 天程度’但是若如上述依單片進行處理的話，僅要5 J 6天以内之製造天數的話便足夠。相較於習知批次方式之 下，因為1/5 # Μ與半成品均較 ' 之 LI此半成σσ的冊彳減 額度，即便日日圓月產5〇〇〇片較 罕乂 J規枳工廠，亦仍可删減 達數十億圓（日圓）。就降低半成品庫存量的效果而言 達⑽億圓（日圓）前後的規模，在提昇資金調度上具極大 的效果。第19圖所示係利用習知批次方式進行生產、與利 用單片進行生產間，就你座吝|l 门就從生產天數的+成品量與隨此所衍 生金額的差異進行試算結果。得知隨工廠的生產片數、晶 片銷售單價、本金比率，在數值上將出現不同的頗大生產 效率差異。此外’就利用習矣口 F_進行搬送方面，有報 告指出當將經熱處理過的晶圓裝填入FOUP中等情況時， 將隨FOUP内的溫度上昇而從F_ 導致產品良率惡化的結$。甚至亦有更進一步朝為供晶圓 加工細微化，而在FOUP中内建有機氣體去除裝置的方向 進行研究。但是，本發明乃屬於在潔淨隧道内的開放氣體 方式’並不需要有機氣體對策。本發明不單僅就機械效率 方面佳’亦可馬上實現促進整體半導體生產前處理步驟的 合理化。 明 圖式簡單說 16 1220420 第1圖係連結形態之EFEM與周邊設備關係的平視圖。 第2圖係連結形態的EFEM剖視圖。 第3圖係特殊EFEM平視圖。 第4圖係特殊EFEM剖視圖。 第5圖係單片輸送帶與機械人之詳細平視圖。 第6圖係單片輸送帶與機械人之詳細剖視圖。 第7圖係輥式單片輸送帶與機械人之詳細剖視圖。 第8圖係機器人之臂部旋轉機構與讀取裝置的側視 圖。 第9圖係晶圓旋轉機構I的平視圖。 第10圖係晶圓旋轉機構I的剖視圖。 第1 1圖係晶圓旋轉機構Π的平視圖。 第1 2圖係晶圓旋轉機構Π的剖視圖。 第1 3圖係執行複數晶圓搬送、移載的多段式輸送帶與 多段式單片機器人的剖視圖。 第14圖係EFEM的平視圖。 第15圖係FOUP。 第1 6圖係單片輸送帶的剖視圖。 第1 7圖係單片輸送帶的拉緊部。 第1 8圖係流程圖。 第1 9圖係庫存金額的計算。 【元件代表符號簡單說明】The number of manufacturing days of the semiconductor alignment step currently requires about 25 days'. However, if it is processed as a single piece as described above, only the manufacturing days within 5 J 6 days are sufficient. Compared with the conventional batch method, because 1/5 # Μ and semi-finished products are less than the semi-finished σσ of the LI, the amount of deduction is even, even if it is 500 yen per month, it is more rare. Factories can still be cut to billions of yen (Japanese yen). In terms of the effect of reducing the inventory of semi-finished products, the scale of around RMB 100 million (Japanese yen) has a great effect on improving capital dispatch. Figure 19 shows the results of the trial batch calculation using the conventional batch method and the single-chip production room. You can calculate the difference between the number of production days + the amount of the finished product and the amount derived from it. It is learned that with the number of wafers produced by the factory, the unit price of wafer sales, and the principal ratio, there will be significant differences in production efficiency. In addition, with regard to the use of Xi'ankou F_ for transportation, there have been reports that when a heat-treated wafer is loaded into a FOUP, etc., it will result in the deterioration of the product yield from F_ as the temperature in the FOUP rises. . There has even been research in the direction of built-in organic gas removal equipment in FOUP for wafer processing miniaturization. However, the present invention belongs to the open gas method in a clean tunnel 'and does not require countermeasures against organic gas. The present invention is not only good in terms of mechanical efficiency, but also can immediately rationalize the overall pre-processing steps for semiconductor production. Schematic Brief Description 16 1220420 Figure 1 is a plan view of the relationship between the EFEM and its peripheral devices in a connected form. Fig. 2 is a sectional view of the EFEM in a connected form. Figure 3 is a special EFEM plan view. Figure 4 is a special EFEM sectional view. Figure 5 is a detailed plan view of the single-piece conveyor belt and the robot. Figure 6 is a detailed cross-sectional view of a single-piece conveyor belt and a robot. Figure 7 is a detailed cross-sectional view of a roller-type single-piece conveyor belt and a robot. Fig. 8 is a side view of a robot arm rotation mechanism and a reading device. FIG. 9 is a plan view of the wafer rotation mechanism 1. FIG. FIG. 10 is a cross-sectional view of the wafer rotation mechanism 1. FIG. Figure 11 is a plan view of the wafer rotation mechanism Π. Fig. 12 is a cross-sectional view of the wafer rotation mechanism Π. Fig. 13 is a cross-sectional view of a multi-segment conveyor belt and a multi-segment single-chip microcomputer that perform multiple wafer transfers and transfers. Figure 14 is a plan view of EFEM. Figure 15 is FOUP. Figure 16 is a sectional view of a single-piece conveyor belt. Figure 17 shows the tightening part of the single-piece conveyor belt. Figure 18 is a flowchart. Figure 19 is the calculation of the inventory amount. [Simple description of component representative symbols]
1潔淨隧道 2特殊EFEM 17 1220420 3 裝填站 4 緩衝站 5 小批次搬送機 6 HEPA 過 11 EFEM 12 FOUP 13 緩衝晶盒 14 FOUP f 15 單片輸送帶 15 ’報式奉 16 晶圓 17 拉緊機 18 調整軌更換處所 20 機械人 21 機器臂 22 機器臂 23 輸送帶之鉤指 2 4 鉤指上 25 .晶圓條碼、英數字讀 取機器 26 讀取裝置之伺服器 27 臂部之 28 托盤 29 驅動輥 30 升降式擋止 3 1 排氣風 32 排氣集塵器 33 臂旋轉 34 多段式輸送帶鉤指 35 多段式 36 LM導軌 37 區塊 38 輸送皮帶 40 ,40'旋 41 ，42,41’，42、43'，44f 自由輥 50 ,5 1,52,5 3,54 製造裝置 濾器 Θ 口機 ^送帶本體 構 本體 之晶圓保持部 的保持部 基座部 扇 機構 機器臂 轉驅動輥 181 clean tunnel 2 special EFEM 17 1220420 3 loading station 4 buffer station 5 small batch conveyor 6 HEPA pass 11 EFEM 12 FOUP 13 buffer crystal box 14 FOUP f 15 single-chip conveyor belt 15 'newspaper style 16 wafer 17 tensioning Machine 18 Adjusting rail replacement space 20 Robot 21 Robot arm 22 Robot arm 23 Hook fingers of the conveyor belt 2 4 Hook fingers 25. Wafer bar code, alphanumeric reading machine 26 Servo for reading device 27 Arm 28 tray 29 Drive roller 30 Lifting stop 3 1 Exhaust wind 32 Exhaust dust collector 33 Arm rotation 34 Multi-segment belt hook finger 35 Multi-segment 36 LM guide 37 Block 38 Conveyor belt 40, 40 'rotation 41, 42, 41 ', 42, 43', 44f Free roller 50,5 1,52,5 3,54 Fabrication device filter Θ mouth machine ^ Send section of wafer holding section with body structure body Base section fan mechanism Robot arm rotation Drive roller 18