CN112344843B - High and low temperature resistant polyimide strain gauge and manufacturing method thereof - Google Patents
High and low temperature resistant polyimide strain gauge and manufacturing method thereof Download PDFInfo
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- CN112344843B CN112344843B CN202011213937.9A CN202011213937A CN112344843B CN 112344843 B CN112344843 B CN 112344843B CN 202011213937 A CN202011213937 A CN 202011213937A CN 112344843 B CN112344843 B CN 112344843B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
- G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/24—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
- B29C41/30—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length incorporating preformed parts or layers, e.g. moulding around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/34—Component parts, details or accessories; Auxiliary operations
- B29C41/46—Heating or cooling
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
- B29K2079/08—PI, i.e. polyimides or derivatives thereof
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention relates to a method for manufacturing a high and low temperature resistant polyimide strain gauge, which comprises the following steps: s1, preparing a composite layer, fixing a metal foil, and coating polyimide slurry on the upper surface of the metal foil; s2, first-time thermosetting, namely heating the metal foil coated with the polyimide slurry, and curing the polyimide slurry to obtain a composite layer consisting of the metal foil and the polyimide substrate; s3, manufacturing a sensitive grid, and photoetching the metal foil of the composite layer by using a photoetching process to obtain the sensitive grid; and S4, performing second-time thermosetting, coating polyimide slurry on one surface, corresponding to the metal foil, of the composite layer, heating, and curing the polyimide slurry to obtain the high-temperature and low-temperature resistant polyimide strain gauge.
Description
Technical Field
The invention relates to the field of strain gauges, in particular to a high and low temperature resistant polyimide strain gauge and a manufacturing method thereof.
Background
The strain gauge is a sensor with resistance changing along with acting force; it converts physical quantities such as force, pressure, tension, weight, etc. into changes in resistance, thereby measuring the physical quantities. When an external force is applied to the fixed object, stress and strain are generated. The reaction force (to the external force) generated inside the object is the stress, and the displacement and deformation generated is the strain. Strain gauges are one of the most important sensors in electrical measurement technology, and are used for measuring mechanical quantities. As its name implies, strain gauges are used primarily for strain measurement. As a generic term, "strain" includes both tensile and compressive strain, distinguished by a positive or negative sign. Thus, the strain gauge can measure both expansion and contraction.
The use temperature range of the high-temperature resistance strain gauge is generally-30-250 ℃, but in actual use, when the temperature exceeds 150 ℃, the measurement performance is difficult to ensure, phenomena of unstable creep, large resistance change, irregular resistance change, unstable zero point and the like occur, and the measurement error is increased. The base and cover layer materials of the high-temperature strain gauge are usually made of polyimide, polyether-ether-ketone, organic silicon resin and other heat-resistant materials, the materials belong to special high polymer materials, and when the heat-resistant temperature is more than 200 ℃, the polyimide, polyether-ether-ketone, organic silicon resin and other materials can generate the change of elastic modulus, the change of size and the change of creep property, so that the strain gauge generates the change of performance.
The invention aims to design a high and low temperature resistant polyimide strain gauge aiming at the problems in the prior art.
Disclosure of Invention
In view of the problems in the prior art, the present invention provides a polyimide strain gauge with high and low temperature resistance, which can effectively solve the problems in the prior art.
The technical scheme of the invention is as follows:
a manufacturing method of a high and low temperature resistant polyimide strain gauge comprises the following steps:
s1, preparing a composite layer, fixing a metal foil, and coating polyimide slurry on the upper surface of the metal foil;
s2, first-time thermosetting, namely heating the metal foil coated with the polyimide slurry, and curing the polyimide slurry to obtain a composite layer consisting of the metal foil and the polyimide substrate;
s3, manufacturing a sensitive grid, and photoetching the metal foil of the composite layer by using a photoetching process to obtain the sensitive grid;
s4, performing thermal curing for the second time, coating polyimide slurry on one surface of the composite layer, which corresponds to the metal foil, heating, and curing the polyimide slurry to obtain the high and low temperature resistant polyimide strain gauge.
Further, in the first thermal curing of step S2, the metal foil coated with the polyimide paste is heated at a temperature of 250 to 380 ℃ for a duration of 1 to 5 hours.
Further, in step S2, after the metal foil coated with the polyimide paste is heated, an inert gas is filled around the metal foil coated with the polyimide paste, and the metal foil is naturally cooled to 20 to 30 ℃ and left for 1 to 4 hours.
Further, in step S4, the heating temperature is 250-380 ℃ and the heat curing time is 1-5 hours.
Further, in step S4, after the polyimide slurry is coated on the surface of the composite layer corresponding to the metal foil and heated, inert gas is filled, and the composite layer is naturally cooled to 20 to 30 ℃ and stands for 1 to 4 hours.
Further, in step S3, the sensitive gate includes a gate and an electrode, and in step S4, before applying the polyimide paste on the side of the composite layer corresponding to the metal foil, the method further includes: and covering the electrodes with polyimide pressure sensitive adhesive tapes.
The high and low temperature resistant polyimide strain gauge comprises a substrate, a cover layer and a sensitive grid, wherein the surface of the sensitive grid is in hot melting joint with the cover layer, the lower surface of the sensitive grid is in hot melting joint with the substrate, and the cover layer and the substrate are made of polyimide.
Further, the thickness of the substrate is 10-30 microns, and the thickness of the cover layer is 10-30 microns.
Further, the thickness of the substrate is 20-25 microns, and the thickness of the cover layer is 12-16 microns
Further, the thickness of the sensitive grid is 2-5 microns.
Accordingly, the present invention provides the following effects and/or advantages:
according to the method provided by the invention, the metal foil is hot-melted and attached to the surface of the polyimide slurry through first thermosetting, the sensitive grid is obtained by photoetching the metal foil, and then the sensitive grid is completely hot-melted and attached to the polyimide slurry through second thermosetting, so that the high-temperature-resistant strain gauge is prepared. The method changes the traditional preparation method, does not need to use bonding glue to bond the substrate, the sensitive grid and the cover layer, directly utilizes the polyimide slurry to coat the two surfaces of the sensitive grid, and leads the polyimide to coat the two surfaces of the sensitive grid through twice thermocuring to form the substrate and the cover layer. The method ensures that the polyimide substrate and the cover layer are firmly coated on two sides of the sensitive grid through specific temperature and heating time, ensures stable performance at high temperature and low temperature, and completely avoids the defect that the performance of the strain gauge is influenced by the performance change of the adhesive at low temperature and high temperature because the adhesive is not used.
The polyimide slurry is used as the cover layer and the substrate of the strain gauge after being thermally cured, has the advantages of high bonding reliability, low water absorption rate, low thermal shrinkage rate, high thermal dimensional stability and the like, and provides high reliability for the stable work of the strain gauge.
The strain gauge prepared by the method can continuously and normally work for more than 240min at the ambient temperature of-50-350 ℃, and the resistance deviation is within 0.5%; the normal work can be continued for more than 120min at the ambient temperature of-100 to-50 ℃ or 350 to 420 ℃, and the resistance deviation is within 0.8 percent. The high-temperature-resistant and low-temperature-resistant electric heating wire has the characteristics of high temperature resistance and low temperature resistance, and has small resistance deviation and long endurable working time in high-temperature and low-temperature environments.
The difference value of the thermal expansion coefficient of the high and low temperature resistant polyimide strain gauge is within 3 ppm/k; the adhesive has high bonding reliability and the peel strength is more than 10N/cm; the heat-shrinkable film has high heat dimensional stability, and the heat shrinkage is lower than 0.5%; high glass transition temperature, above 380 ℃; the high thermal decomposition temperature is above 580 percent, so that the use in a high-temperature environment is ensured; low water absorption rate, the water absorption rate is lower than 2 percent; high water vapor barrier rate lower than 1 mg/(m) 2 Day), ensuring the service performance in high humidity environment; high surface energy, dyne value above 42; the tensile strength is 200-250Mpa, the tensile modulus is 4-5Gpa, and the breaking elongation is 10-20%. The performance of the strain gage is improved relative to the traditional strain gage.
It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
Drawings
FIG. 1 is a schematic flow diagram of the process.
Fig. 2 is a schematic structural diagram of the fifth embodiment.
Detailed Description
To facilitate understanding of those skilled in the art, the structure of the present invention will now be described in further detail by way of examples in conjunction with the accompanying drawings:
referring to fig. 1, a method for manufacturing a high and low temperature resistant polyimide strain gauge includes the following steps:
s1, preparing a composite layer, fixing a metal foil, and coating polyimide slurry on the upper surface of the metal foil;
s2, performing first-time thermal curing, namely putting the metal foil coated with the polyimide slurry into an oven to be heated, wherein the heating temperature is 250-380 ℃, the heating duration is 1-5 hours, then filling inert gas around the metal foil coated with the polyimide slurry, naturally cooling to 20-30 ℃, standing for 1-4 hours, and curing the polyimide slurry to obtain a composite layer consisting of the metal foil and the polyimide substrate;
s3, manufacturing a sensitive grid, and photoetching the metal foil of the composite layer by using a photoetching process to obtain the sensitive grid, wherein the sensitive grid comprises a grid electrode and an electrode;
s4, performing second-time thermosetting, namely covering the electrode with a polyimide pressure sensitive adhesive tape, coating polyimide slurry on one surface of the composite layer corresponding to the metal foil, heating the composite layer in an oven at the temperature of 250-380 ℃ for 1-5 hours, filling inert gas, naturally cooling to 20-30 ℃, standing for 1-4 hours, and curing the polyimide slurry to obtain the high-temperature and low-temperature resistant polyimide strain gauge.
Example one
A manufacturing method of a high and low temperature resistant polyimide strain gauge comprises the following steps:
s1, preparing a composite layer, fixing a metal foil, and coating polyimide slurry on the upper surface of the metal foil;
s2, first-time thermosetting, namely heating the metal foil coated with the polyimide slurry at 250 ℃ for 5 hours, filling nitrogen or argon around the metal foil coated with the polyimide slurry, naturally cooling to 20 ℃, standing for 1 hour, and curing the polyimide slurry to obtain a composite layer consisting of the metal foil and the polyimide substrate;
s3, manufacturing a sensitive grid, and photoetching the metal foil of the composite layer by using a photoetching process to obtain the sensitive grid, wherein the sensitive grid comprises a grid electrode and an electrode;
and S4, performing second thermosetting, namely covering the electrode with a polyimide pressure sensitive adhesive tape, coating polyimide slurry on one surface of the composite layer corresponding to the metal foil, heating at 250 ℃ for 5 hours, filling nitrogen or argon, naturally cooling to 20 ℃, standing for 1 hour, and curing the polyimide slurry to obtain the high-low temperature resistant polyimide strain gauge.
Example two
A manufacturing method of a high and low temperature resistant polyimide strain gauge comprises the following steps:
s1, preparing a composite layer, fixing a metal foil, and coating polyimide slurry on the upper surface of the metal foil;
s2, first thermosetting, namely heating the metal foil coated with the polyimide slurry at 330 ℃ for 4 hours, filling nitrogen or argon around the metal foil coated with the polyimide slurry, naturally cooling to 25 ℃, standing for 2 hours, and curing the polyimide slurry to obtain a composite layer consisting of the metal foil and the polyimide substrate;
s3, manufacturing a sensitive grid, and photoetching the metal foil of the composite layer by using a photoetching process to obtain the sensitive grid, wherein the sensitive grid comprises a grid electrode and an electrode;
s4, performing thermal curing for the second time, covering the electrode with a polyimide pressure sensitive adhesive tape, coating polyimide slurry on one surface of the composite layer corresponding to the metal foil, heating at 280 ℃ for 4 hours, filling nitrogen or argon, naturally cooling to 25 ℃, standing for 2 hours, and curing the polyimide slurry to obtain the high and low temperature resistant polyimide strain gauge.
EXAMPLE III
A manufacturing method of a high and low temperature resistant polyimide strain gauge comprises the following steps:
s1, preparing a composite layer, fixing a metal foil, and coating polyimide slurry on the upper surface of the metal foil;
s2, first-time thermosetting, namely heating the metal foil coated with the polyimide slurry at 360 ℃ for 3 hours, filling nitrogen or argon around the metal foil coated with the polyimide slurry, naturally cooling to 25 ℃ and standing for 3 hours, and curing the polyimide slurry to obtain a composite layer consisting of the metal foil and the polyimide substrate;
s3, manufacturing a sensitive grid, and photoetching the metal foil of the composite layer by a photoetching process to obtain the sensitive grid, wherein the sensitive grid comprises a grid electrode and an electrode;
s4, performing thermal curing for the second time, covering the electrode with a polyimide pressure sensitive adhesive tape, coating polyimide slurry on one surface of the composite layer corresponding to the metal foil, heating at 320 ℃, performing thermal curing for 3 hours, filling nitrogen or argon, naturally cooling to 25 ℃, standing for 3 hours, and curing the polyimide slurry to obtain the high and low temperature resistant polyimide strain gauge.
Example four
A manufacturing method of a high and low temperature resistant polyimide strain gauge comprises the following steps:
s1, preparing a composite layer, fixing a metal foil, and coating polyimide slurry on the upper surface of the metal foil;
s2, first thermosetting, namely heating the metal foil coated with the polyimide slurry at the temperature of 380 ℃ for 1 hour, filling nitrogen or argon around the metal foil coated with the polyimide slurry, naturally cooling to 30 ℃, standing for 4 hours, and curing the polyimide slurry to obtain a composite layer consisting of the metal foil and the polyimide substrate;
s3, manufacturing a sensitive grid, and photoetching the metal foil of the composite layer by a photoetching process to obtain the sensitive grid, wherein the sensitive grid comprises a grid electrode and an electrode;
s4, performing second-time thermosetting, namely covering the electrode with a polyimide pressure sensitive adhesive tape, coating polyimide slurry on one surface of the composite layer corresponding to the metal foil, heating at the temperature of 380 ℃ for 1 hour, filling nitrogen or argon, naturally cooling to 30 ℃, standing for 4 hours, and curing the polyimide slurry to obtain the high-low temperature resistant polyimide strain gauge.
EXAMPLE five
Referring to fig. 2, a high and low temperature resistant polyimide strain gauge manufactured according to the above method comprises a substrate 1, a cover layer 2 and a sensitive grid 3, wherein the sensitive grid 3 is hot-melt bonded to the cover layer 2 on the surface thereof, the sensitive grid 3 is hot-melt bonded to the substrate 1 on the lower surface thereof, and the cover layer 2 and the substrate 1 are made of polyimide.
Further, the thickness of the substrate 1 is 10-30 microns, and the thickness of the cover layer 2 is 10-30 microns.
Further, the thickness of the substrate 1 is 20-25 microns, and the thickness of the cover layer 2 is 12-16 microns.
The thickness of the sensitive grid 3 is 2-5 microns.
Specifically, in the present embodiment, the thickness of the substrate is 10 microns, the thickness of the cap layer is 10 microns, and the thickness of the sensitive gate is 5 microns. In other embodiments, the thickness of the substrate may be 20 micrometers, the thickness of the cover layer is 12 micrometers, and the thickness of the sensitive gate is 5 micrometers, or the thickness of the substrate is 25 micrometers, the thickness of the cover layer is 16 micrometers, and the thickness of the sensitive gate is 5 micrometers, or the thickness of the substrate is 30 micrometers, the thickness of the cover layer is 30 micrometers, and the thickness of the sensitive gate is 5 micrometers. And may be 2 microns or 3 microns in other embodiments.
Experimental data
The high and low temperature resistant polyimide strain gauges arbitrarily prepared by examples one to four were tested:
the resistance value of the high and low temperature resistant polyimide strain gauge obtained by testing at normal temperature is taken as a reference;
when the test is carried out at the ambient temperature of-50 to 350 ℃, the high and low temperature resistant polyimide strain gauge can continuously and normally work for more than 240min, and the resistance deviation is within 0.5 percent;
the high and low temperature resistant polyimide strain gauge can work normally for more than 120min and has a resistance deviation within 0.8 percent when tested at the ambient temperature of-100 to-50 ℃ or 350 to 420 ℃.
The difference value of the thermal expansion coefficient of the high and low temperature resistant polyimide strain gauge is within 3 ppm/k; the adhesive has high bonding reliability and the peel strength is more than 10N/cm; the heat-shrinkable film has high heat dimensional stability, and the heat shrinkage is lower than 0.5%; high glass transition temperature, 380 deg.CThe above; the high thermal decomposition temperature is above 580 percent, so that the use in a high-temperature environment is ensured; low water absorption rate, the water absorption rate is lower than 2 percent; high water vapor barrier rate lower than 1 mg/(m) 2 Day), ensuring the service performance in high humidity environment; high surface energy, dyne value above 42; the tensile strength is 200-250Mpa, the tensile modulus is 4-5Gpa, and the breaking elongation is 10-20%.
The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the claims of the present invention should be covered by the present invention.
Claims (6)
1. A manufacturing method of a high and low temperature resistant polyimide strain gauge is characterized by comprising the following steps: comprises the following steps:
s1, preparing a composite layer, fixing a metal foil, and coating polyimide slurry on the upper surface of the metal foil;
s2, first-time thermosetting, namely heating the metal foil coated with the polyimide slurry at 250-330 ℃ for 1-5 hours, filling inert gas around the metal foil coated with the polyimide slurry, curing the polyimide slurry, naturally cooling to 20-30 ℃ and standing for 1-4 hours to obtain a composite layer consisting of the metal foil and the polyimide substrate;
s3, manufacturing a sensitive grid, and photoetching the metal foil of the composite layer by using a photoetching process to obtain the sensitive grid;
s4, performing second-time thermal curing, namely coating polyimide slurry on one surface, corresponding to the metal foil, of the composite layer, heating at the temperature of 250-330 ℃, filling inert gas, curing the polyimide slurry, performing thermal curing for 1-5 hours, naturally cooling to 20-30 ℃, standing for 1-4 hours, and thus obtaining the high-temperature and low-temperature resistant polyimide strain gauge.
2. The manufacturing method of the high and low temperature resistant polyimide strain gauge according to claim 1, characterized in that: in step S3, the sensitive gate includes a gate and an electrode, and in step S4, before coating the polyimide slurry on the surface of the composite layer corresponding to the metal foil, the method further includes: and covering the electrode with polyimide pressure sensitive adhesive tape.
3. A high and low temperature resistant polyimide strain gauge manufactured according to the method of claim 1, wherein: the sensor comprises a substrate, a cover layer and a sensitive grid, wherein the cover layer is attached to the sensitive grid in a hot melting mode on the surface of the sensitive grid, the substrate is attached to the lower surface of the sensitive grid in a hot melting mode, and the cover layer and the substrate are made of polyimide.
4. The high and low temperature resistant polyimide strain gauge according to claim 3, wherein: the thickness of the substrate is 10-30 microns, and the thickness of the cover layer is 10-30 microns.
5. The high and low temperature resistant polyimide strain gauge according to claim 4, wherein: the thickness of the substrate is 20-25 microns, and the thickness of the cover layer is 12-16 microns.
6. The high and low temperature resistant polyimide strain gauge according to claim 4, wherein: the thickness of the sensitive grid is 2-5 microns.
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| DE102010036586A1 (en) * | 2010-07-23 | 2012-01-26 | Sartorius Weighing Technology Gmbh | Strain gauges |
| CN103604363B (en) * | 2013-11-30 | 2017-08-29 | 中航电测仪器股份有限公司 | One kind plastic deformation test strain gauge and its manufacture and scaling method |
| CN106461365A (en) * | 2015-03-17 | 2017-02-22 | 贝果实验室有限公司 | Length measuring device and length measuring system |
| JP2017067764A (en) * | 2015-09-29 | 2017-04-06 | ミネベアミツミ株式会社 | Strain gauge, load sensor, and manufacturing method for strain gauge |
| CN206818337U (en) * | 2017-04-12 | 2017-12-29 | 厦门市诺盛测控技术有限公司 | Miniature three axle is not superimposed strain gauge |
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