CN112341814A - 一种高韧性导热绝缘材料 - Google Patents
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- 239000011810 insulating material Substances 0.000 title claims abstract description 47
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 59
- 239000000835 fiber Substances 0.000 claims abstract description 30
- 239000011247 coating layer Substances 0.000 claims abstract description 25
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 22
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 22
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 22
- 230000003712 anti-aging effect Effects 0.000 claims abstract description 15
- 239000000919 ceramic Substances 0.000 claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 15
- 229920006241 epoxy vinyl ester resin Polymers 0.000 claims abstract description 15
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 15
- 239000010439 graphite Substances 0.000 claims abstract description 15
- 229920003986 novolac Polymers 0.000 claims abstract description 15
- 229920000515 polycarbonate Polymers 0.000 claims abstract description 15
- 239000004417 polycarbonate Substances 0.000 claims abstract description 15
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 15
- 239000002994 raw material Substances 0.000 claims abstract description 15
- 229920001721 polyimide Polymers 0.000 claims abstract description 14
- 239000009719 polyimide resin Substances 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000005543 nano-size silicon particle Substances 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- 230000032683 aging Effects 0.000 abstract description 4
- 239000000377 silicon dioxide Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 3
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08L2205/00—Polymer mixtures characterised by other features
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
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Abstract
本发明公开了一种高韧性导热绝缘材料,其原料按重量份包括:聚酞亚胺树脂30‑60份、环氧树脂20‑40份、酚醛环氧乙烯基酯树脂20‑40份、聚碳酸酯12‑28份、膨胀石墨10‑20份、碳纳米管10‑20份、石墨烯10‑20份、聚芳酰胺纤维10‑18份、无机陶瓷纤维10‑18份、防老剂1‑5份,所述的碳纳米管和石墨烯的外侧均包覆有绝缘包覆层。本发明提高了绝缘材料抗冲击强度及其柔韧性,从而防止绝缘材料受外界影响撕裂,提高了绝缘材料抗老性,从而提高了绝缘材料的使用年限、提高了绝缘材料导热性,从而防止绝缘材料因温度导致电气元件过高损坏,并能够提高绝缘材料的品质。
Description
技术领域
本发明属于绝缘材料技术领域,具体涉及一种高韧性导热绝缘材料。
背景技术
根据常用的绝缘材料按其化学性质不同,可分为无机绝缘材料、有机绝缘材料和混合绝缘材料。绝缘材料对直流电流有非常大的阻力,在直流电压作用下,除了有极微小的表面泄漏电流外,实际上几乎是不导电的,而对于交流电流则有电容电流通过,但也认为是不导电的。绝缘材料的电阻率越大,绝缘性能越好。电机、电器设备都是由导体材料、磁性材料、绝缘材料和结构材料构成的。绝缘材料是决定电器元件的关键材料,所以,绝缘材料的抗冲击强度、抗老性、导热性及其柔韧性都较为重要,如果绝缘材料的质量不好,不仅会影响使用寿命,还会影响使用安全性。
发明内容
本发明的目的在于提供一种高韧性导热绝缘材料,以解决上述背景技术中所提出的问题。
为实现上述目的,本发明提供以下技术方案:一种高韧性导热绝缘材料,其技术要点在于:其原料按重量份包括:聚酞亚胺树脂30-60份、环氧树脂20-40份、酚醛环氧乙烯基酯树脂20-40份、聚碳酸酯12-28份、膨胀石墨10-20份、碳纳米管10-20份、石墨烯10-20份、聚芳酰胺纤维10-18份、无机陶瓷纤维10-18份、防老剂1-5份,所述的碳纳米管和石墨烯的外侧均包覆有绝缘包覆层。
作为优选的,其原料按重量份包括:聚酞亚胺树脂42份、环氧树脂28份、酚醛环氧乙烯基酯树脂32份、聚碳酸酯23份、膨胀石墨14份、碳纳米管15份、石墨烯18份、聚芳酰胺纤维16份、无机陶瓷纤维14份、防老剂3份。
作为优选的,其原料按重量份包括:聚酞亚胺树脂51份、环氧树脂32份、酚醛环氧乙烯基酯树脂33份、聚碳酸酯02份、膨胀石墨17份、碳纳米管18份、石墨烯16份、聚芳酰胺纤维14份、无机陶瓷纤维16份、防老剂4份。
作为优选的,绝缘包覆层为纳米二氧化硅包覆层,且纳米二氧化硅包覆层的厚度为10-50nm。
与现有技术相比,本发明提高了绝缘材料抗冲击强度及其柔韧性,从而防止绝缘材料受外界影响撕裂,提高了绝缘材料抗老性,从而提高了绝缘材料的使用年限、提高了绝缘材料导热性,从而防止绝缘材料因温度导致电气元件过高损坏,并能够提高绝缘材料的品质。
具体实施方式
下面结合实施例对本发明做进一步的解释说明,但不限制本发明的保护范围。
实施例一
本发明提供一种技术方案,一种高韧性导热绝缘材料,其原料按重量份包括:聚酞亚胺树脂30-60份、环氧树脂20-40份、酚醛环氧乙烯基酯树脂20-40份、聚碳酸酯12-28份、膨胀石墨10-20份、碳纳米管10-20份、石墨烯10-20份、聚芳酰胺纤维10-18份、无机陶瓷纤维10-18份、防老剂1-5份,所述的碳纳米管和石墨烯的外侧均包覆有绝缘包覆层。
其中,在本实施例中,其原料按重量份包括:聚酞亚胺树脂42份、环氧树脂28份、酚醛环氧乙烯基酯树脂32份、聚碳酸酯23份、膨胀石墨14份、碳纳米管15份、石墨烯18份、聚芳酰胺纤维16份、无机陶瓷纤维14份、防老剂3份。
其中,在本实施例中,所述的绝缘包覆层为纳米二氧化硅包覆层,且纳米二氧化硅包覆层的厚度为30nm。
实施例二
本发明提供一种技术方案,一种高韧性导热绝缘材料,其原料按重量份包括:聚酞亚胺树脂30-60份、环氧树脂20-40份、酚醛环氧乙烯基酯树脂20-40份、聚碳酸酯12-28份、膨胀石墨10-20份、碳纳米管10-20份、石墨烯10-20份、聚芳酰胺纤维10-18份、无机陶瓷纤维10-18份、防老剂1-5份,所述的碳纳米管和石墨烯的外侧均包覆有绝缘包覆层。
其中,在本实施例中,其原料按重量份包括:聚酞亚胺树脂51份、环氧树脂32份、酚醛环氧乙烯基酯树脂33份、聚碳酸酯02份、膨胀石墨17份、碳纳米管18份、石墨烯16份、聚芳酰胺纤维14份、无机陶瓷纤维16份、防老剂4份。
其中,在本实施例中,所述的绝缘包覆层为纳米二氧化硅包覆层,且纳米二氧化硅包覆层的厚度为20nm。
实施例三
本发明提供一种技术方案,一种高韧性导热绝缘材料,其原料按重量份包括:聚酞亚胺树脂30-60份、环氧树脂20-40份、酚醛环氧乙烯基酯树脂20-40份、聚碳酸酯12-28份、膨胀石墨10-20份、碳纳米管10-20份、石墨烯10-20份、聚芳酰胺纤维10-18份、无机陶瓷纤维10-18份、防老剂1-5份,所述的碳纳米管和石墨烯的外侧均包覆有绝缘包覆层。
其中,在本实施例中,其原料按重量份包括:聚酞亚胺树脂30份、环氧树脂20份、酚醛环氧乙烯基酯树脂20份、聚碳酸酯12份、膨胀石墨10份、碳纳米管10份、石墨烯10份、聚芳酰胺纤维10份、无机陶瓷纤维10份、防老剂1份。
其中,在本实施例中,所述的绝缘包覆层为纳米二氧化硅包覆层,且纳米二氧化硅包覆层的厚度为10nm。
实施例四
本发明提供一种技术方案,一种高韧性导热绝缘材料,其原料按重量份包括:聚酞亚胺树脂30-60份、环氧树脂20-40份、酚醛环氧乙烯基酯树脂20-40份、聚碳酸酯12-28份、膨胀石墨10-20份、碳纳米管10-20份、石墨烯10-20份、聚芳酰胺纤维10-18份、无机陶瓷纤维10-18份、防老剂1-5份,所述的碳纳米管和石墨烯的外侧均包覆有绝缘包覆层。
其中,在本实施例中,其原料按重量份包括:聚酞亚胺树脂60份、环氧树脂40份、酚醛环氧乙烯基酯树脂40份、聚碳酸酯28份、膨胀石墨20份、碳纳米管20份、石墨烯20份、聚芳酰胺纤维18份、无机陶瓷纤维18份、防老剂5份。
其中,在本实施例中,所述的绝缘包覆层为纳米二氧化硅包覆层,且纳米二氧化硅包覆层的厚度为50nm。
通过以上四个实施例均可提升高韧性导热绝缘材料的性能,其中实施例二提升的效果最好,本发明提高了绝缘材料抗冲击强度及其柔韧性,从而防止绝缘材料受外界影响撕裂,提高了绝缘材料抗老性,从而提高了绝缘材料的使用年限、提高了绝缘材料导热性,从而防止绝缘材料因温度导致电气元件过高损坏,并能够提高绝缘材料的品质。
对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内,不应将权利要求中的任何标记视为限制所涉及的权利要求。
此外,应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。
Claims (4)
1.一种高韧性导热绝缘材料,其特征在于:其原料按重量份包括:聚酞亚胺树脂30-60份、环氧树脂20-40份、酚醛环氧乙烯基酯树脂20-40份、聚碳酸酯12-28份、膨胀石墨10-20份、碳纳米管10-20份、石墨烯10-20份、聚芳酰胺纤维10-18份、无机陶瓷纤维10-18份、防老剂1-5份,所述的碳纳米管和石墨烯的外侧均包覆有绝缘包覆层。
2.根据权利要求1所述的一种高韧性导热绝缘材料,其特征在于:其原料按重量份包括:聚酞亚胺树脂42份、环氧树脂28份、酚醛环氧乙烯基酯树脂32份、聚碳酸酯23份、膨胀石墨14份、碳纳米管15份、石墨烯18份、聚芳酰胺纤维16份、无机陶瓷纤维14份、防老剂3份。
3.根据权利要求1所述的一种高韧性导热绝缘材料,其特征在于:其原料按重量份包括:聚酞亚胺树脂51份、环氧树脂32份、酚醛环氧乙烯基酯树脂33份、聚碳酸酯02份、膨胀石墨17份、碳纳米管18份、石墨烯16份、聚芳酰胺纤维14份、无机陶瓷纤维16份、防老剂4份。
4.根据权利要求1所述的一种高韧性导热绝缘材料,其特征在于:所述的绝缘包覆层为纳米二氧化硅包覆层,且纳米二氧化硅包覆层的厚度为10-50nm。
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