CN112337899B - Nondestructive laser cleaning method - Google Patents
Nondestructive laser cleaning method Download PDFInfo
- Publication number
- CN112337899B CN112337899B CN202011194626.2A CN202011194626A CN112337899B CN 112337899 B CN112337899 B CN 112337899B CN 202011194626 A CN202011194626 A CN 202011194626A CN 112337899 B CN112337899 B CN 112337899B
- Authority
- CN
- China
- Prior art keywords
- workpiece
- cleaning
- laser
- closed
- sealing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Optics & Photonics (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Laser Beam Processing (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses a nondestructive laser cleaning method, which relates to the technical field of laser cleaning and has the technical scheme that: the method comprises the following steps: s1, preparing a closed cleaning chamber, and sealing the sealing plates at the inner side and the outer side; s2, filling protective gas and discharging air; s3, opening the sealing plate on the outer side, and placing the workpiece on a workpiece table; s4, sealing the outer side sealing plate, and vacuumizing the inlet and outlet channels by using a vacuum device; s5, opening the sealing plate on the inner side, and starting the mechanical arm to clamp the workpiece; s6, starting a laser cleaning gun to perform laser cleaning on the workpiece, and monitoring the cleaning quality of the workpiece by using a monitoring device; and S7, moving the workpiece into the access passage after cleaning, sealing the inner side sealing plate, opening the outer side sealing plate, moving the workpiece out, and replacing the next workpiece for cleaning. The invention can utilize protective gas to carry out closed cleaning, avoid oxygen permeation to carry out oxidation, monitor the cleaning process in real time, avoid excessive cleaning, realize nondestructive cleaning and improve the cleaning effect.
Description
Technical Field
The invention relates to the technical field of laser cleaning, in particular to a nondestructive laser cleaning method.
Background
The laser cleaning method is a green cleaning method, can clear pollutants on the surfaces of various materials and various types, achieves the cleanliness which cannot be achieved by conventional cleaning, does not need any chemical agent or cleaning solution, basically cleans the waste materials which are solid powder, has small volume, is easy to store and recycle, and can easily solve the problem of environmental pollution caused by chemical cleaning.
For example, chinese patent publication No. CN108405486A, publication No. 2018.08.17 discloses a laser cleaning device and a laser cleaning method, where the laser cleaning device includes a moving platform, a laser, a beam splitter, a reflecting mirror, a vibrating mirror, a driving member, and a protection mechanism. The movable platform is used for placing a workpiece and driving the workpiece to move along a first direction; the laser is used for generating laser light. The spectroscope is arranged corresponding to the laser, the spectroscope divides the laser into a first cleaning laser and a second cleaning laser, and the light quantity of the first cleaning laser is greater than that of the second cleaning laser; the reflector is used for reflecting the second cleaning laser. The vibrating mirror is arranged on the light path of the first cleaning laser and the second cleaning laser, the first cleaning laser can be incident on the workpiece after being reflected by the vibrating mirror, and the second cleaning laser reflected by the reflecting mirror can be incident on the workpiece after being reflected by the vibrating mirror; the driving piece is connected with the galvanometer and used for driving the galvanometer to swing so as to enable the first cleaning laser and the second cleaning laser to scan in a reciprocating mode along a second direction; the shielding mechanism is used for applying shielding gas to the workpiece. The laser cleaning method comprises the following steps: placing a workpiece on a moving platform; starting the laser cleaning device, enabling the first cleaning laser and the second cleaning laser to scan in a reciprocating mode along a second direction, and enabling a protection mechanism to apply protection gas to the workpiece; the moving platform drives the workpiece to move along a first direction, the first cleaning laser cleans an oxide layer on the surface of the workpiece to form a first cleaning area, and the second cleaning laser cleans oxides regenerated by the first cleaning area.
And cleaning an oxide layer on the surface of the workpiece by using the first cleaning laser, cleaning regenerated oxides on the surface of the workpiece by using the second cleaning laser, and matching protective gas to prevent the regenerated oxides on the workpiece from being cleaned for the second time. However, the workpiece is cleaned on a platform exposed on the surface, protective gas is easy to diffuse, oxygen in the air is easy to mix with the protective gas, the protective effect is affected, and the workpiece is cleaned and damaged.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a nondestructive laser cleaning method, which can utilize protective gas to carry out closed cleaning, avoid oxygen permeation for oxidation, monitor the cleaning process in real time, avoid excessive cleaning, realize nondestructive cleaning and have the advantage of improving the cleaning effect.
In order to achieve the purpose, the invention provides the following technical scheme:
a nondestructive laser cleaning method comprises the following steps:
s1, preparing a closed cleaning chamber, and starting a door locking mechanism to close the sealing plates on the inner side and the outer side of a workpiece inlet and outlet channel on the side wall of the closed cleaning chamber;
s2, filling protective gas into the closed cleaning chamber, exhausting air in the closed cleaning chamber, and measuring the oxygen content in the closed cleaning chamber;
s3, opening the sealing plate outside the access passage, and moving the workpiece table out of the access passage by the moving mechanism, so as to place the workpiece on the workpiece table;
s4, moving the workpiece table into the access passage by the moving mechanism, sealing the outer side sealing plate, and vacuumizing the access passage by using a vacuum device;
s5, opening the sealing plate on the inner side, moving the workpiece platform into the closed cleaning chamber by the moving mechanism, starting a manipulator in the closed cleaning chamber to clamp the workpiece, and aligning the surface to be cleaned of the workpiece with the laser cleaning gun;
s6, starting a laser cleaning gun to perform laser cleaning on the workpiece, and monitoring the cleaning quality of the workpiece by using a monitoring device;
and S7, judging the cleaning condition of the workpiece according to the cleaning quality monitoring, moving the workpiece into the access passage after cleaning, sealing the inner side sealing plate, and opening the outer side sealing plate, so that the workpiece can be moved out and replaced by the next workpiece to be cleaned to perform cleaning operation.
Further setting: and in the step S2, after the oxygen content in the closed cleaning chamber is lower than three percent, the protective gas forms a circulating circulation state in the closed cleaning chamber by utilizing the circulating pipe and a circulating air pump.
Further setting: when the workpiece table is moved out in the step S3, a liquid film is added to the workpiece placing position of the workpiece table, and then the workpiece to be cleaned is placed, and the surface of the workpiece to be cleaned is soaked in the liquid film.
Further setting: and the circulating air pressure of the circulating air pump is adjusted according to the cleaning operation process, is gradually increased from the front to the middle to the back of the laser cleaning operation and is stopped after the cleaning operation is finished, so that the workpiece is taken out.
Further setting: the in-process of circulating pipe circulation protective gas, the dust piece that the gas that gets into in the circulating pipe produced laser cleaning through the filtration module of moving filters the back, and clean gas recirculation is discharged back to in the airtight washing chamber.
Further setting: and S6, controlling the laser power during laser cleaning until the pollutants on the surface of the workpiece are loosened and crushed and are peeled off from the workpiece, blowing the crushed and peeled pollutants off from the workpiece by the air pressure of the protective gas in the circulating pipe, and sending the pollutants into the filtering module to filter and collect impurities.
Further setting: in the step S6, the monitoring device measures the resistance change of the surface of the workpiece to be cleaned by using a resistance meter and acquires the image of the surface of the workpiece in real time in cooperation with the image acquisition module to determine the cleaning effect of the workpiece.
Further setting: in step S6, after the monitoring device detects that the contamination on the surface of the workpiece is blown, the laser power is controlled to be adjusted downward, and the thin layer of impurities left on the surface of the workpiece is cleaned at low power until the workpiece is cleaned.
Further setting: in the step S7, after the workpiece is moved into the access passage and the inner sealing plate is sealed, the vacuum delivers air pressure into the access passage to blow off part of the impurities remaining on the surface of the workpiece, and the impurities on the surface of the workpiece are further cleaned by the dust removing roller brush in the access passage.
Further setting: the inlet and outlet channel is formed with an impurity deposition groove at the position below the moving mechanism, a drawer is arranged in the impurity deposition groove, and the drawer is taken out after being used periodically to clean impurities.
Compared with the prior art, the invention has the following advantages by adopting the technical scheme:
1. the laser cleaning is carried out in the closed cleaning chamber, the workpiece matrix is protected by the protective gas, the protective gas can be used for closed cleaning, and the oxidation caused by oxygen permeation is avoided, so that the nondestructive cleaning is realized, and the advantage of improving the cleaning effect is achieved;
2. the inlet and outlet channels are matched with the two closed plates, so that the workpieces can be conveniently replaced under a closed condition, and the workpieces are subjected to vacuum operation in and out, and the oxygen content in the closed cleaning chamber is ensured to be unchanged after adjustment, so that when the next workpiece is cleaned, the protective gas quantity does not need to be adjusted, the operation procedure is saved, and the use convenience is improved;
3. by circularly flowing the protective gas, impurities falling during cleaning can be taken away while workpiece protection is provided, the impurities falling during cleaning are prevented from influencing laser cleaning, and the laser cleaning effect is improved;
4. the pollutants are firstly cut and crushed, so that the pollutants can be blown off by circularly flowing protective gas, and then the surface residues are subjected to laser cleaning, so that the workpiece base materials can be prevented from being damaged by continuous laser, the cleaning efficiency and effect can be improved, and the nondestructive cleaning effect can be realized;
5. through the cooperation of measuring the surface resistance change of the workpiece and the image change, the cleaning degree of the workpiece can be more accurately judged so as to detect the cleaning condition of the workpiece in real time, avoid excessive cleaning, realize nondestructive cleaning and have the advantage of improving the cleaning effect.
Drawings
FIG. 1 is a schematic structural view of a closed cleaning apparatus;
FIG. 2 is a schematic view of a part of the structure of the inside of a closed cleaning chamber.
In the figure: 1. sealing the cleaning chamber; 11. a shielding gas charging tube; 12. an air outlet duct; 13. a circulation pipe; 14. a circulating air pump; 15. a filtering module; 2. cleaning a gun by laser; 3. an image acquisition module; 4. a resistance meter; 5. an access passage; 51. a vacuum; 6. sealing plates; 7. a door locking mechanism; 71. linearly moving the machine table; 72. an electrically controlled lock; 8. a moving mechanism; 9. a workpiece stage; 10. and a manipulator.
Detailed Description
The nondestructive laser cleaning method is further explained with reference to fig. 1 to 2.
A nondestructive laser cleaning method is characterized in that cleaning is carried out through a closed cleaning device as shown in figures 1 and 2, specifically, the closed cleaning device comprises a closed cleaning chamber 1 and a laser cleaning gun 2 arranged in the closed cleaning chamber 1, an image acquisition module 3 used for acquiring an image of a surface to be cleaned of a workpiece is arranged at a gun head of the laser cleaning gun 2, and a display used for displaying the image acquired by the image acquisition module 3 is arranged on the outer wall of the closed cleaning chamber 1, so that the image condition of the surface of the workpiece can be observed through the display in real time during cleaning.
As shown in fig. 1 and 2, an access passage 5 for allowing a workpiece to enter and exit is formed in a side wall of the closed cleaning chamber 1, sealing plates 6 are mounted on both the inside and outside of the access passage 5, the sealing plates 6 are used for sealing openings on both the inside and outside of the access passage 5, wherein the sealing plates 6 are controlled by a door locking mechanism 7 to seal the access passage 5 or open the access passage 5, the door locking mechanism 7 comprises a linear moving machine 71 and an electric control lock 72, and the sealing plates 6 are conveniently and automatically controlled to open or close by matching of the linear moving machine 71 and the electric control lock 72. A workpiece table 9 for placing workpieces is arranged in the access channel 5 in a sliding mode, the workpiece table 9 is driven to move through a moving mechanism 8, and the moving mechanism 8 can be a screw rod moving mechanism 8, so that the workpiece table 9 can be conveniently and automatically controlled to enter and exit.
As shown in fig. 1 and fig. 2, a resistance meter 4 is arranged on a workpiece table 9, a resistance contact head on the resistance meter 4 corresponds to a workpiece clamping piece on the workpiece table 9, so that when a workpiece is placed on the workpiece table 9 and clamped and positioned by the workpiece clamping piece, the resistance contact head of the resistance meter 4 contacts the surface of the workpiece, the cleaning condition of the workpiece is fed back by detecting the resistance change of the workpiece, usually along with continuous laser cleaning, the resistance is gradually reduced due to the reduction of impurities on the surface of the workpiece, and the situation is limited to different conditions according to different materials of the workpiece. Although the measurement of the resistance meter 4 can measure a certain laser cleaning effect, there are some errors, so that the accuracy of judging the laser cleaning effect can be improved in cooperation with the further comparison of the image acquisition module 3, and the end of the laser cleaning operation can be conveniently controlled.
As shown in fig. 1 and 2, a vacuum 51 for vacuumizing the inside of the access passage 5 is connected to the access passage 5, a protective gas charging pipe and an air discharging pipe 12 are connected to the closed cleaning chamber 1, and an oxygen meter is installed on the closed cleaning chamber 1 for measuring the oxygen content in the closed cleaning chamber 1, so that the charging amount of the protective gas can be conveniently controlled, and the protective gas in the closed cleaning chamber 1 can be circulated to form a circular flow operation when the oxygen content is lower than a certain value.
The nondestructive laser cleaning method uses a closed cleaning device to carry out closed cleaning, and comprises the following steps:
s1, preparing a sealed cleaning chamber 1, starting the door locking mechanism 7 to seal the sealing plates 6 on the inner side and the outer side of the workpiece access passage 5 on the side wall of the sealed cleaning chamber 1. The door locking mechanism 7 controls the opening and closing of the sealing plate 6 by adopting an electric control lock 72 and a linear sliding table, the linear sliding table drives the sealing plate 6 to slide in or out of an opening at the end part of the access passage 5, and the electric control lock 72 is used for controlling the locking and unlocking states of the sealing plate 6, so that the automatic control is facilitated, and the convenience in operation is improved;
s2, filling protective gas into the closed cleaning chamber 1, exhausting the air in the closed cleaning chamber 1, and measuring the oxygen content in the closed cleaning chamber 1. The closed cleaning chamber 1 is provided with a protective gas charging port and an air outlet, when the protective gas is charged, the two ports are opened simultaneously so as to discharge the air, the closed cleaning chamber 1 is filled with the protective gas, so that the oxygen content in the closed cleaning chamber 1 is less than three percent, the protective gas charging port and the air outlet can be closed, and the circulating pipe 13 is started to cooperate with the circulating air pump 14 to form a circulating circulation state of the protective gas in the closed cleaning chamber 1;
s3, opening the sealing plate 6 outside the access passage 5, and moving the workpiece table 9 out of the access passage 5 by the moving mechanism 8, so as to place the workpiece on the workpiece table 9; placing the workpiece, namely adding a liquid film at a workpiece placing position of the workpiece table 9, then placing the workpiece to be cleaned, and soaking the surface to be cleaned of the workpiece to be cleaned in the liquid film, so that protection can be formed during laser cleaning, and a substrate of the workpiece is prevented from being damaged;
s4, moving the workpiece table 9 into the access passage 5 by the moving mechanism 8, sealing the outer sealing plate 6, and vacuumizing the access passage 5 by using the vacuum device 51 to ensure that the surface of the workpiece does not contain air and oxygen and protected by protective gas when the workpiece is in the closed cleaning chamber 1;
s5, opening the sealing plate 6 on the inner side, moving the workpiece platform 9 into the closed cleaning chamber 1 by the moving mechanism 8, starting the manipulator 10 in the closed cleaning chamber 1 to clamp the workpiece, and aligning the surface to be cleaned of the workpiece with the laser cleaning gun 2;
s6, starting the laser cleaning gun 2 to perform laser cleaning on the workpiece, and monitoring the workpiece cleaning quality by using a monitoring device; in the laser cleaning process, the circulating air pressure of the circulating air pump 14 is adjusted according to the cleaning operation process, the circulating air pressure is gradually increased from the front to the middle to the back of the laser cleaning operation and is stopped after the cleaning is finished, so that the workpiece is taken out after the cleaning is stopped, the laser cleaning is continuously carried out, the chips are gradually increased, the laser cleaning is closer to the substrate of the workpiece, the increased protective air pressure can quickly blow away the chips, the chips are prevented from influencing the laser cleaning, the substrate is more strongly protected, and the substrate is prevented from being cleaned and damaged; before laser cleaning, the laser power is controlled to loosen and crush pollutants on the surface of a workpiece and peel the pollutants from the workpiece, then the crushed and peeled pollutants are blown off from the workpiece by the air pressure of protective gas in the circulating pipe 13 and are sent into the filtering module 15 to be filtered and collected with impurities, so that preliminary fragmented cleaning is formed, the fragile pollutants are convenient to clean and collect, finally stubborn stains are cleaned completely and accurately by laser, and compared with an operation mode of directly cleaning by using the laser continuously, the mode can prevent the laser from directly acting on the fragile pollutants to enable the laser to directly operate on a substrate to damage the substrate of the workpiece after the pollutants are crushed, is quicker in whole, is softer in laser operation, avoids damaging the substrate of the workpiece, and improves the lossless cleaning effect; furthermore, in the step S6, the monitoring device measures the resistance change of the surface of the workpiece to be cleaned by using the resistance meter 4, and acquires the image of the surface of the workpiece in real time in cooperation with the image acquisition module 3 to determine the cleaning effect of the workpiece, and the accuracy of determining the cleaning effect of the workpiece is improved by performing determination in combination with the resistance change and the image change; in the judging process, after the monitoring device detects that the pollutants on the surface of the workpiece are blown, controlling the laser power to be reduced, and cleaning the residual thin-layer impurities on the surface of the workpiece at low power until the impurities are cleaned, so as to avoid the overlarge laser power from damaging the surface of the substrate and realize nondestructive cleaning;
s7, judging the cleaning condition of the workpiece according to the cleaning quality monitoring, moving the workpiece into the access passage 5 after cleaning, sealing the inner side sealing plate 6, opening the outer side sealing plate 6, and moving the workpiece out to replace the next workpiece to be cleaned for cleaning operation; wherein, after the work piece moves into the access passage 5 and seals the inside sealing plate 6, the vacuum device 51 conveys air pressure to the back in the access passage 5 to blow off the residual partial impurities on the surface of the work piece, and further cleans the impurities on the surface of the work piece by using the dust removing roller brush in the access passage 5, so that the impurities are cleaned comprehensively, the surface of the work piece is guaranteed to be clean, and the laser cleaning and cleaning operation is completed.
Further, access way 5 position shaping has the impurity deposition groove below moving mechanism 8, has the drawer in the impurity deposition groove, takes out the drawer after the periodic use and carries out the clearance of impurity, conveniently collects the processing to the impurity in the access way 5, improves the convenience of using.
Through above-mentioned scheme, during laser cleaning, can carry out laser cleaning in airtight purge chamber 1, and laser cleaning's in-process, the work piece base member is protected by protective gas comprehensively, and protective gas circulation flow in airtight purge chamber 1, in the protection, also can provide circulation flow and take away the impurity that washs the production, avoids wasing the impurity that drops and washs laser and produces the influence. Meanwhile, the laser cleaning operation controls the laser power to be low firstly to cut and fragment pollutants to loosen and fragment the pollutants, so that the pollutants are easy to peel off from a workpiece, the crushed impurities fall off by matching with the protective gas flowing circularly at high pressure, and then the refined laser cleaning operation is carried out, so that the result that the workpiece matrix is damaged due to excessive cleaning caused by continuous laser cleaning can be avoided, and the nondestructive cleaning effect is improved. In addition, after the protective gas is circulated, the protective gas in the protective gas does not need to be adjusted, when the next workpiece is cleaned, the inner sealing plate 6 and the outer sealing plate 6 are controlled to be opened and closed alternately to replace the workpiece, the workpiece can be replaced under the condition that the closed cleaning chamber 1 is closed, the protective gas is prevented from leaking, the oxygen content does not need to be adjusted again, the operation procedures are saved, the convenience in operation and use is improved, and the cleaning efficiency of a plurality of workpieces is improved. To the business turn over of work piece on airtight purge chamber 1, all through vacuum ware 51 to its vacuum operation, conveniently to its edulcoration and avoid remaining oxygen and influence the inside oxygen content of airtight purge chamber 1, guarantee effective the going on of airtight purge chamber 1 cleaning operation time to make the cleaning process in the protection base member work piece, avoid oxygen infiltration to carry out the oxidation, and cleaning process real-time supervision avoids excessively wasing, realizes harmless the washing, has the advantage that improves its cleaning performance.
The above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and all technical solutions that belong to the idea of the present invention belong to the scope of the present invention. It should be noted that modifications and adaptations to those skilled in the art without departing from the principles of the present invention should also be considered as within the scope of the present invention.
Claims (6)
1. A nondestructive laser cleaning method is characterized by comprising the following steps:
s1, preparing a closed cleaning chamber, and starting a door locking mechanism to seal sealing plates on the inner side and the outer side of a workpiece access passage on the side wall of the closed cleaning chamber;
s2, filling protective gas into the closed cleaning chamber, discharging the air in the closed cleaning chamber, and measuring the oxygen content in the closed cleaning chamber; after the oxygen content in the closed cleaning chamber is lower than three percent in the step S2, the protective gas forms a circulating flow state in the closed cleaning chamber by utilizing a circulating pipe and a circulating air pump; in the process of circulating protective gas by the circulating pipe, after dust debris generated by laser cleaning is filtered by the gas entering the circulating pipe through the operating filtering module, the clean gas is recycled and discharged back to the closed cleaning chamber;
s3, opening a sealing plate on the outer side of the access passage, and moving the workpiece table out of the access passage by a moving mechanism, so that the workpiece is placed on the workpiece table;
s4, moving the workpiece platform into the inlet and outlet channel by the moving mechanism, sealing the outer sealing plate, and vacuumizing the inlet and outlet channel by a vacuum device;
s5, opening the sealing plate on the inner side, moving the workpiece platform into the closed cleaning chamber by the moving mechanism, starting a manipulator in the closed cleaning chamber to clamp the workpiece, and aligning the surface to be cleaned of the workpiece with the laser cleaning gun;
s6, starting a laser cleaning gun to perform laser cleaning on the workpiece, and monitoring the cleaning quality of the workpiece by using a monitoring device; during laser cleaning, controlling laser power until pollutants on the surface of a workpiece are loosened and crushed, peeling the pollutants from the workpiece, blowing the pollutants peeled by crushing off from the workpiece by the air pressure of protective gas in a circulating pipe, and sending the pollutants into a filtering module to filter and collect impurities; meanwhile, the circulating air pressure of the circulating air pump is adjusted according to the cleaning operation process, is gradually increased from the front to the middle to the back of the laser cleaning operation, and is stopped after the cleaning operation is finished;
and S7, judging the cleaning condition of the workpiece according to the cleaning quality monitoring, moving the workpiece into the access passage after cleaning, sealing the inner side sealing plate, and opening the outer side sealing plate, so that the workpiece can be moved out and replaced by the next workpiece to be cleaned to carry out cleaning operation.
2. The nondestructive laser cleaning method according to claim 1, wherein in the step S3, when the workpiece stage is moved out, a liquid film is added to a workpiece placement position of the workpiece stage, and then the workpiece to be cleaned is placed, and the surface to be cleaned of the workpiece to be cleaned is immersed in the liquid film.
3. The nondestructive laser cleaning method of claim 1, wherein the monitoring device in step S6 uses a resistance meter to measure the resistance change of the surface of the workpiece to be cleaned and cooperates with the image acquisition module to acquire the image of the surface of the workpiece in real time to determine the cleaning effect of the workpiece.
4. A nondestructive laser cleaning method according to claim 3, wherein in step S6, after the monitoring device detects that the contamination on the surface of the workpiece is blown, the laser power is controlled to be adjusted downward, so as to perform the cleaning operation on the thin layer of impurities left on the surface of the workpiece at low power until the workpiece is cleaned.
5. The method of claim 1, wherein in step S7, after the workpiece is moved into the access duct and the inner sealing plate is sealed, the vacuum sends air pressure into the access duct to blow off part of the impurities on the surface of the workpiece and further clean the impurities with the dust-removing roller brush in the access duct.
6. A nondestructive laser cleaning method according to claim 5, wherein said access passage is formed with a foreign substance deposition groove at a position below said moving mechanism, said foreign substance deposition groove having a drawer therein, said drawer being taken out for cleaning of foreign substances after periodic use.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011194626.2A CN112337899B (en) | 2020-10-30 | 2020-10-30 | Nondestructive laser cleaning method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011194626.2A CN112337899B (en) | 2020-10-30 | 2020-10-30 | Nondestructive laser cleaning method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112337899A CN112337899A (en) | 2021-02-09 |
CN112337899B true CN112337899B (en) | 2022-07-26 |
Family
ID=74356818
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202011194626.2A Active CN112337899B (en) | 2020-10-30 | 2020-10-30 | Nondestructive laser cleaning method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112337899B (en) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5643476A (en) * | 1994-09-21 | 1997-07-01 | University Of Southern California | Laser system for removal of graffiti |
US6635844B2 (en) * | 2002-01-03 | 2003-10-21 | United Microelectronics Corp. | Apparatus for on-line cleaning a wafer chuck with laser |
CN209109750U (en) * | 2018-09-18 | 2019-07-16 | 中车青岛四方机车车辆股份有限公司 | Wet type laser cleaning system |
CN209222786U (en) * | 2018-12-12 | 2019-08-09 | 苏州市康普来表面处理科技有限公司 | Using the non-oxidation laser cleaning equipment of protective gas atmosphere |
CN110836896B (en) * | 2019-10-14 | 2020-12-18 | 深圳信息职业技术学院 | Laser cleaning detection equipment and laser cleaning detection method |
CN110773518B (en) * | 2019-11-06 | 2021-01-22 | 哈尔滨工业大学 | Laser cleaning real-time monitoring device and method |
-
2020
- 2020-10-30 CN CN202011194626.2A patent/CN112337899B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN112337899A (en) | 2021-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110514741B (en) | Automatic flaw detection device and method based on ultrasonic technology | |
US20090158537A1 (en) | Static electricity and dust removing apparatus | |
US7880138B2 (en) | Apparatus and method for analyzing contaminants on wafer | |
US20150211976A1 (en) | Methods and apparatus to determine workpiece contamination | |
CN114188243A (en) | Substrate processing system and management method of substrate processing apparatus | |
CN112044874B (en) | Real-time monitoring system and monitoring method for laser cleaning | |
CN112337899B (en) | Nondestructive laser cleaning method | |
CN115973772A (en) | Glass defect detection device based on advanced generation information display | |
CN104359628A (en) | Device and method for testing airtightness of test piece | |
CN112067760B (en) | Detection apparatus for chemical waste gas for environmental protection | |
CN116967235B (en) | Wafer box automatic cleaning and detecting integrated equipment and method | |
CN108787553B (en) | Doctor blade cleaning device, pushing piece device and smear preparation equipment | |
KR20050003641A (en) | Index table test equipment of battery | |
CN213670900U (en) | Full-automatic plasma cleaning mechanism | |
US12072318B2 (en) | Chamber component cleanliness measurement system | |
CN110416129A (en) | A kind of wafer defect labelling apparatus and wafer defect labeling method | |
CN211402181U (en) | DPF pore passage detection equipment | |
CN221063671U (en) | Master disk cleaning device | |
CN221445885U (en) | Glass defect illumination detection device | |
US20220143707A1 (en) | Additive manufacturing | |
CN216326891U (en) | Vertical multi-axis numerical control machining tool | |
CN221038993U (en) | Online COD analyzer | |
CN117245247B (en) | Sealing structure of laser cutting machine | |
CN218694900U (en) | Laser equipment | |
WO2024079554A1 (en) | Device for the optical imaging of filtering septa and filtration apparatus equipped with it |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Qiu Yihui Inventor after: Chen Shuixuan Inventor after: Hong Zhaobin Inventor after: Yuan Heping Inventor after: Ma Lin Inventor before: Chen Shuixuan Inventor before: Hong Zhaobin Inventor before: Yuan Heping Inventor before: Ma Lin |
|
GR01 | Patent grant | ||
GR01 | Patent grant |