CN112304978A - Multilayer flexible circuit board defect detection method - Google Patents
Multilayer flexible circuit board defect detection method Download PDFInfo
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- CN112304978A CN112304978A CN202011123172.XA CN202011123172A CN112304978A CN 112304978 A CN112304978 A CN 112304978A CN 202011123172 A CN202011123172 A CN 202011123172A CN 112304978 A CN112304978 A CN 112304978A
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- circuit board
- pattern
- circuit
- copper plate
- detecting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
Abstract
The invention discloses a method for detecting defects of a flexible circuit board, which comprises the following steps: opening a cover on the first circuit board to obtain a first pattern; shielding the first circuit area exposed in the first pattern to obtain a second pattern; detecting the first circuit board; wherein, the first circuit area is on the second circuit board; the first wiring board is laminated over the second wiring board. After the multilayer flexible circuit board laminating and cover opening process, the circuit of the cover opening area is shielded, and meanwhile, the waste material tearing condition of the cover opening part and the circuit area of the outer layer circuit board after cover opening are detected, so that two times of circuit process detection in the prior art are combined, and the detection efficiency is improved.
Description
Technical Field
The invention relates to the technical field of flexible circuit board manufacturing, in particular to a method for detecting defects of a multilayer flexible circuit board.
Background
With the development of Flexible Printed Circuit (FPC) technology, high-density/high-difficulty Circuit design of electronic products puts higher requirements on Automatic Optical Inspection (AOI) systems; on the other hand, with the increase of labor cost and equipment cost, the improvement of automatic optical inspection efficiency, the improvement of yield and quality is a trend to improve core competitiveness of companies.
The AOI detection process of the existing FPC circuit manufacturing process in the industry at present generally comprises the following steps: developing, Etching, and removing the film (DES); an AOI inspection procedure of an outer layer circuit of the FPC multilayer board; a laser/punch/decap (laser/punch/decap) process; and (5) performing AOI inspection after tearing off the waste in the cover opening area. And performing AOI detection on the FPC after DES for detecting the printing quality of the outer layer circuit, wherein the AOI detection after the uncapping process is used for detecting the waste tearing condition of the uncapping area and confirming that no waste residue exists in the uncapping area.
Therefore, how to research a faster and more efficient line detection method on the conventional detection process becomes an urgent problem to be solved.
Disclosure of Invention
In view of this, the embodiment of the invention provides a method for detecting defects of a multilayer flexible circuit board, so as to solve the problem that the efficiency of two-time AOI detection in the conventional detection process is not high enough.
The embodiment of the invention provides a method for detecting defects of a flexible circuit board, which comprises the following steps:
opening a cover on the first circuit board to obtain a first pattern;
shielding the first circuit area exposed in the first pattern to obtain a second pattern;
detecting the first circuit board;
wherein, the first circuit area is on the second circuit board; the first wiring board is laminated over the second wiring board.
Optionally, after the first pattern is obtained by opening the cover on the first circuit board, the method further includes:
laminating flash glue at the joint between the first circuit board and the second circuit board;
and covering the overflowing glue.
Optionally, the step of shielding the first circuit region exposed in the first pattern to obtain a second pattern includes:
and shielding all copper plate areas in the second circuit board.
Optionally, the detecting the first circuit board further includes:
and detecting the second circuit area on the first circuit board.
Optionally, the detecting the first circuit board includes:
setting a difference region of the first pattern and the second pattern as a third pattern;
the copper plate and/or the thin film in the third pattern are inspected.
Optionally, the detecting the copper plate and/or the thin film in the third pattern comprises:
if only the thin film material exists in the third pattern on the second circuit board, and the detection image shows that the copper plate exists in the third pattern, outputting the detection result as unqualified;
if only the copper plate material exists in the third pattern on the second circuit board, and the detection image shows that the thin film exists in the third pattern, the output detection result is unqualified.
Optionally, the inspecting the copper plate and/or the thin film in the third pattern further comprises:
and if the third pattern on the second circuit board contains the thin film material and the copper plate, comparing the detection image with the reference image, and if the comparison result is inconsistent, outputting the detection result as unqualified.
Optionally, the detecting the first circuit board includes:
acquiring pixel information in an optical detection image;
if the hue of the pixel information is less than 46, the saturation is more than 57 and the brightness is more than 98, assigning 255 to the corresponding pixel block;
if the hue of the pixel information is more than 245, the saturation is less than 30 and the brightness is less than 29, assigning 0 to the corresponding pixel block;
if the hue range of the pixel information is 100-140, the saturation range is 30-40, and the brightness range is 80-95, the corresponding pixel block is assigned with a value 122.
Optionally, the first circuit board is subjected to automatic optical detection to obtain yield information of the second circuit area on the first circuit board and a waste tearing yield of the uncovered area on the first circuit board.
Optionally, the opening the cover on the first circuit board to obtain the first pattern includes:
the edge of the first pattern is dropped over the copper plate in the second wiring board.
The embodiment of the invention has the following beneficial effects: after the multilayer flexible circuit board laminating and cover opening process, the circuit of the cover opening area is shielded, and meanwhile, the waste material tearing condition of the cover opening part and the circuit area of the outer layer circuit board after cover opening are detected, so that two times of circuit process detection in the prior art are combined, and the detection efficiency is improved.
Drawings
The features and advantages of the present invention will be more clearly understood by reference to the accompanying drawings, which are illustrative and not to be construed as limiting the invention in any way, and in which:
FIG. 1 is a flow chart of a method for detecting defects of a flexible printed circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an embodiment of the present invention showing a multi-layer flexible circuit board waste material before being torn away;
FIG. 3 is a schematic diagram showing the multi-layer flexible circuit board waste material after being torn away in the embodiment of the invention;
FIG. 4 is a schematic diagram showing another embodiment of the present invention after the waste material of the multi-layer flexible circuit board has been torn off.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
For a multilayer flexible circuit board, an embodiment of the present invention provides a method for detecting defects of a flexible circuit board, as shown in fig. 1 to 3, including:
in step S10, a first pattern is obtained by opening the cover on the first wiring board.
As shown in fig. 2, the first wiring board includes a polyimide film (PI) 101 and a wiring 102 before the cover opening, and as shown in fig. 3, a cover opening frame line 201 is a minimum cover opening range, and a first pattern is a pattern circled by the cover opening frame line 201.
In step S20, the first circuit area exposed in the first pattern is blocked to obtain a second pattern.
In the present embodiment, as shown in fig. 3, in the uncapped region 202, the first circuit area 203 is a circuit on the second circuit board, and in the process of preparing the second circuit board, quality detection is already performed on the second circuit board to ensure production yield, so that after the laminating process, the circuit detection is not required to be performed on the first circuit area exposed by the uncapping, and the detection of the area is skipped by shielding the first circuit area.
In step S30, the first wiring board is detected.
In the present embodiment, step S30 includes:
step S301 detects a second circuit area on the first circuit board.
In this step, the detection of the first circuit board includes two parts: firstly, detecting the manufacturing condition of a second circuit area 102 of a first circuit board; and secondly, detecting the waste tearing condition of the uncovering area of the first circuit board.
Step S302, automatic optical detection is carried out on the first circuit board. So as to obtain the yield information of the second circuit area on the first circuit board and the waste tearing yield of the cover opening area on the first circuit board.
In a specific embodiment, the circuit board detection method can be selected according to actual needs, for example, an image of the circuit board is obtained, and since the flexible circuit board area to be detected only contains PI and copper, the image of the area to be detected can be subjected to binarization or critical value calculation processing to obtain a black-and-white image, and the black-and-white image is compared with a reference standard image to realize the detection process.
Wherein, the first circuit area is on the second circuit board; the first wiring board is laminated over the second wiring board.
The production process of the multilayer flexible circuit board comprises the following steps: exposing, developing and etching each layer of flexible circuit board to obtain an intermediate circuit board; laminating the multilayer flexible circuit board; a window (decap) is opened on the outer layer circuit board to expose part of the circuit pattern of the inner layer circuit board.
After the cover opening process, 1, detecting the cover opening part to confirm that the waste tearing condition meets the production standard; 2. and detecting the circuit area of the outer layer circuit board after the cover is opened to confirm that the circuit production meets the standard.
In this embodiment, after the lamination and cover opening process of the multilayer flexible circuit board, the circuit of the cover opening area is shielded, and meanwhile, the waste material tearing condition of the cover opening part and the circuit area of the outer layer circuit board after cover opening are detected, so that two times of circuit process detection in the prior art are combined, and the detection efficiency is improved.
As an optional implementation manner, after step S10, the method further includes:
step S11, adhesive overflow is laminated at the joint between the first circuit board and the second circuit board.
And step S12, covering the overflowed glue.
In this embodiment, after the decap is torn off, the glue overflow caused by lamination remains on the edge of the exposed second circuit, the first circuit board and the second circuit board have a height difference, and since the black-and-white image generated by the glue overflow is different from the design data, the glue overflow part is covered to avoid the occurrence of false detection due to excessive defect confirmation points or detection interference.
As an alternative embodiment, step S20 includes:
step S201, shielding all copper plate areas in the second circuit board.
In this embodiment, the occlusion part does not participate in the detection. In a specific embodiment, when the AOI software is used for detection, the detection file can be set in advance: and selecting all copper plate areas of the second circuit board in the cover opening area, shielding the part of the pattern, and not detecting the shielding area. Because the purpose to the regional detection of uncapping lies in, whether detecting tearing of uncapping edge waste material PI accords with production standard, has under the condition that waste material copper exists on the waste material PI that is torn away on first circuit board, if the residual part has waste material copper, at this moment, the copper in second circuit district participates in the detection and can causes the interference, consequently sets up in advance in AOI software and detects the shielding region, shelters from all copper regions in the second circuit board promptly to reduce and detect the interference.
As an alternative embodiment, step S30 includes:
in step S303, the difference region between the first pattern and the second pattern is set as a third pattern.
Step S304, the copper plate and/or the thin film in the third pattern are detected.
In the present embodiment, as shown in fig. 3 and 4, the difference set region between the first pattern and the second pattern 202 is the third pattern 103, and whether the scrap tearing result meets the production standard can be obtained by detecting the copper plate and/or the thin film in the third pattern 103.
As an alternative embodiment, step S304 includes:
if only the thin film material exists in the third pattern on the second circuit board, and the detection image shows that the copper plate exists in the third pattern, outputting the detection result as unqualified;
if only the copper plate material exists in the third pattern on the second circuit board, and the detection image shows that the thin film exists in the third pattern, the output detection result is unqualified.
In this embodiment, as shown in fig. 4, AOI detection may detect the third pattern 103 through a black-and-white image in the image, assuming that the second circuit board has only a thin film in the third pattern 103, if the detection result is that a copper plate exists in the third pattern 103, it indicates that the scrap is torn off and remains, and the production standard is not met; if the second circuit board only has a copper plate in the third pattern 103, if the detection result is that a thin film exists in the third pattern 103, it indicates that the scrap is torn off and remains, and the production standard is not met. Whether the product is qualified or not is judged by detecting the existence of the copper plate/PI, the detection process is rapid, and the efficiency is high.
As an optional implementation manner, step S304 further includes:
and if the third pattern on the second circuit board contains the thin film material and the copper plate, comparing the detection image with the reference image, and if the comparison result is inconsistent, outputting the detection result as unqualified.
In this embodiment, since the third pattern 103 also includes a boundary portion between the first circuit region 203 and the edge of the cover, it is necessary to compare the first circuit region with the cover edge by image comparisonAnd (3) detection:suppose inIf the border part of the first line area 203 and the edge of the cover is detected to be PI, the PI is remained and the tearing is incomplete. By comparing with the reference image, the detection speed is slow, the calculation process is long, but the detection precision is high.
As an alternative embodiment, step S30 includes:
acquiring pixel information in an optical detection image;
if the hue of the pixel information is less than 46, the saturation is more than 57 and the brightness is more than 98, assigning 255 to the corresponding pixel block;
if the hue of the pixel information is more than 245, the saturation is less than 30 and the brightness is less than 29, assigning 0 to the corresponding pixel block;
if the hue range of the pixel information is 100-140, the saturation range is 30-40, and the brightness range is 80-95, the corresponding pixel block is assigned with a value 122.
In this embodiment, the colors of copper, PI and the shielding material are different, usually, the hue of copper is less than 46, the saturation is greater than 57, the brightness is greater than 98, the hue of PI is greater than 245, the saturation is less than 30, and the brightness is less than 29, the shielding material is selected from materials having a hue range of 100 to 140, a saturation range of 30 to 40, and a brightness range of 80 to 95 if the pixel information, so that the copper part in the optical detection image is assigned to 255, the PI part is assigned to 0, and the shielding material part is assigned to 122, thereby obtaining a detection image of black, white and gray.
In a specific embodiment, shielding the shielding part to obtain a black-and-white detection image, and overlapping and comparing the black-and-white detection image with the reference image, so that the circuit detection in the first circuit board and the uncovering area waste tearing detection can be simultaneously realized.
As an alternative embodiment, step S10 includes:
the edge of the first pattern is dropped over the copper plate in the second wiring board.
In the present embodiment, the boundary line of the open-cover region is disposed above the copper plate in the second wiring board, and by detecting the vicinity of the boundary line of the open-cover region: if the third pattern edge has the PI material, the product is unqualified; otherwise, the product is qualified. The detection process is further simplified.
Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations fall within the scope defined by the appended claims.
Claims (10)
1. A method for detecting defects of a flexible circuit board is characterized by comprising the following steps:
opening a cover on the first circuit board to obtain a first pattern;
shielding the first circuit area exposed in the first pattern to obtain a second pattern;
detecting the first circuit board;
wherein the first circuit area is on a second circuit board; the first wiring board is laminated over the second wiring board.
2. The method for detecting defects of a flexible circuit board according to claim 1, further comprising, after the first pattern is obtained by uncapping the first circuit board:
laminating flash at a joint between the first circuit board and the second circuit board;
and covering the overflowing glue.
3. The method of claim 1, wherein the step of shielding the first circuit region exposed in the first pattern to obtain a second pattern comprises:
and shielding all copper plate areas in the second circuit board.
4. The method of claim 1, wherein the inspecting the first circuit board further comprises:
and detecting a second circuit area on the first circuit board.
5. The method of claim 1, wherein the inspecting the first circuit board comprises:
making a difference set region of the first pattern and the second pattern a third pattern;
and detecting the copper plate and/or the thin film in the third pattern.
6. The method of claim 5, wherein the detecting the copper plate and/or the thin film in the third pattern comprises:
if only a thin film material exists in the third pattern on the second circuit board, and the detection image indicates that a copper plate exists in the third pattern, outputting a detection result as unqualified;
and if only the copper plate material exists in the third pattern on the second circuit board, and the detection image shows that the thin film exists in the third pattern, outputting the detection result as unqualified.
7. The method of claim 5, wherein the detecting the copper plate and/or the thin film in the third pattern further comprises:
and if the third pattern on the second circuit board contains a thin film material and a copper plate, comparing the detection image with the reference image, and if the comparison result is inconsistent, outputting the detection result as unqualified.
8. The method of claim 1, wherein the inspecting the first circuit board comprises:
acquiring pixel information in an optical detection image;
if the hue of the pixel information is less than 46, the saturation is more than 57 and the brightness is more than 98, assigning 255 to the corresponding pixel block;
if the hue of the pixel information is more than 245, the saturation is less than 30 and the brightness is less than 29, assigning 0 to the corresponding pixel block;
and if the hue range of the pixel information is 100-140, the saturation range is 30-40 and the brightness range is 80-95, assigning 122 to the corresponding pixel block.
9. The method according to claim 4, wherein the first circuit board is automatically optically inspected to obtain yield information of the second circuit area on the first circuit board and a waste tearing yield of the first circuit board in the cap area.
10. The method of detecting defects in a flexible wiring board according to claim 1, wherein the step of uncapping the first wiring board to obtain the first pattern comprises:
the edge of the first pattern is dropped over the copper plate in the second wiring board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011123172.XA CN112304978A (en) | 2020-10-20 | 2020-10-20 | Multilayer flexible circuit board defect detection method |
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| CN202011123172.XA CN112304978A (en) | 2020-10-20 | 2020-10-20 | Multilayer flexible circuit board defect detection method |
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| CN108848620A (en) * | 2018-06-13 | 2018-11-20 | 深圳市百柔新材料技术有限公司 | The circuit mending method of printed wiring board |
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| CN111307834A (en) * | 2018-12-11 | 2020-06-19 | 柯尼卡美能达株式会社 | Foil-pressing printing inspection device, inspection system, inspection method, and recording medium |
| CN111551565A (en) * | 2020-06-19 | 2020-08-18 | 湖南恒岳重钢钢结构工程有限公司 | Wind power tower cylinder weld defect detection device and method based on machine vision |
| CN111650813A (en) * | 2019-03-04 | 2020-09-11 | 东京毅力科创株式会社 | Substrate processing apparatus, substrate inspection apparatus and method, and recording medium |
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2020
- 2020-10-20 CN CN202011123172.XA patent/CN112304978A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102539443A (en) * | 2011-12-29 | 2012-07-04 | 天津普达软件技术有限公司 | Bottle body defect automatic detection device based on machine vision and method thereof |
| CN108848620A (en) * | 2018-06-13 | 2018-11-20 | 深圳市百柔新材料技术有限公司 | The circuit mending method of printed wiring board |
| CN111307834A (en) * | 2018-12-11 | 2020-06-19 | 柯尼卡美能达株式会社 | Foil-pressing printing inspection device, inspection system, inspection method, and recording medium |
| CN111650813A (en) * | 2019-03-04 | 2020-09-11 | 东京毅力科创株式会社 | Substrate processing apparatus, substrate inspection apparatus and method, and recording medium |
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