CN112297258A - Processing method - Google Patents

Processing method Download PDF

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Publication number
CN112297258A
CN112297258A CN202010716022.3A CN202010716022A CN112297258A CN 112297258 A CN112297258 A CN 112297258A CN 202010716022 A CN202010716022 A CN 202010716022A CN 112297258 A CN112297258 A CN 112297258A
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CN
China
Prior art keywords
cutting
unit
test piece
workpiece
axis direction
Prior art date
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Pending
Application number
CN202010716022.3A
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Chinese (zh)
Inventor
山本直子
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Disco Corp
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Disco Corp
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Publication date
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Publication of CN112297258A publication Critical patent/CN112297258A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rotating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10004—Still image; Photographic image
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30164—Workpiece; Machine component

Abstract

Provided is a processing method capable of more easily determining the replacement timing of a cutting tool and suppressing the continuous manufacture of defective chips. The processing method is a processing method of a processed object, wherein the processing method comprises the following steps: a cutting step of cutting the workpiece with a cutting tool; a cutting groove forming step of forming a cutting groove by cutting the test piece from one end to the other end with a cutting tool; an imaging step of imaging a side surface of one end side or the other end side of the test piece after the cutting groove forming step is performed to form an image including the cutting groove; and a determination step of determining whether or not the cutting tool needs to be replaced, based on the inclination of the inner surface of the cutting flute detected from the captured image.

Description

Processing method
Technical Field
The present invention relates to a method for processing a workpiece.
Background
As a cutting apparatus for cutting a workpiece such as a semiconductor wafer, there is used a cutting apparatus which performs a notch inspection during cutting and detects a size of a chipping generated in the wafer (for example, see patent document 1).
Patent document 1: japanese patent laid-open publication No. 2001-129822
However, in the cutting device disclosed in patent document 1, when so-called beveling occurs during cutting, the side surfaces of the singulated chips are inclined, and when the inclined angle exceeds a standard value, the chips become defective, and therefore, the cutting tool needs to be replaced.
Conventionally, in the beveling, a worker extracts a chip from a wafer having been cut, and measures the size of the chip using a microscope to check whether or not the side surface of the chip is inclined. And, the cutting tool is replaced in the case where the side surface of the chip is inclined. However, according to this method, although the wafer is in a state where the bevel is generated, there is a concern that the wafer is not noticed for a while and processing is continued, and a large number of defective chips are produced. In addition, there is a problem that it takes time to extract the chip and measure the size.
Disclosure of Invention
Accordingly, an object of the present invention is to provide a machining method capable of more easily determining the timing of replacement of a cutting tool and suppressing continuous production of defective chips.
According to the present invention, there is provided a machining method for a workpiece, comprising the steps of: a cutting step of cutting the workpiece with a cutting tool; a cutting groove forming step of forming a cutting groove by cutting the test piece from one end to the other end with the cutting tool; an imaging step of imaging a side surface of the test piece on the one end side or the other end side after the cutting groove forming step is performed to form an image including the cutting groove; and a determination step of determining whether or not the cutting tool needs to be replaced, based on the inclination of the side wall of the cutting flute detected from the captured image.
The invention has the following effects: the timing of replacement of the cutting tool can be determined more easily, and defective chips can be prevented from being continuously manufactured.
Drawings
Fig. 1 is a perspective view showing a configuration example of a processing apparatus for carrying out a processing method according to an embodiment.
Fig. 2 is a perspective view of a table unit of the processing apparatus shown in fig. 1.
Fig. 3 is a diagram showing an example of a normal image stored in the normal image storage unit of the control unit of the processing apparatus shown in fig. 2.
Fig. 4 is a flowchart illustrating a flow of the processing method according to the embodiment.
Fig. 5 is a sectional view schematically showing a cutting step of the machining method shown in fig. 4.
Fig. 6 is a cross-sectional view schematically showing a cutting groove forming step of the machining method shown in fig. 4.
Fig. 7 is a plan view of the test piece after the cutting groove forming step in the machining method shown in fig. 4.
Fig. 8 is a sectional view schematically showing an imaging step of the processing method shown in fig. 4.
Fig. 9 is a diagram showing an example of a captured image obtained in the capturing step of the processing method shown in fig. 4.
Fig. 10 is a diagram illustrating an example of a determination procedure of the machining method illustrated in fig. 4.
Fig. 11 is a cross-sectional view schematically showing an imaging step of a processing method according to a modification of the embodiment.
Description of the reference symbols
21: a cutting tool; 70: a test piece; 71: one end; 72: the other end; 80. 80-1: cutting a groove; 81. 81-1: an inner surface (sidewall); 400: shooting an image; 711. 721: a side surface; 200: a workpiece; ST 1: cutting; ST 4: a cutting groove forming step; ST 5: shooting; ST 6: and a judging step.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. The components described below include those that can be easily conceived by those skilled in the art, and substantially the same ones. The following structures may be combined as appropriate. Various omissions, substitutions, and changes in the structure may be made without departing from the spirit of the invention.
A processing method according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a perspective view showing a configuration example of a processing apparatus for carrying out a processing method according to an embodiment. Fig. 2 is a perspective view of a table unit of the processing apparatus shown in fig. 1. Fig. 3 is a diagram showing an example of a normal image stored in the normal image storage unit of the control unit of the processing apparatus shown in fig. 2. Fig. 4 is a flowchart illustrating a flow of the processing method according to the embodiment.
(processing apparatus)
The machining method according to the embodiment is a method of cutting a workpiece 200 by the machining apparatus (cutting apparatus) 1 shown in fig. 1. In the embodiment, the workpiece 200 is a wafer such as a disc-shaped semiconductor wafer or an optical device wafer having a substrate 204 made of silicon, sapphire, gallium, or the like. In the object 200, devices 203 are formed in regions defined in a lattice pattern by a plurality of lines to divide 202 formed in a lattice pattern on the front surface 201 of the substrate 204.
The workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer having a thinned central portion and a thick portion formed on an outer peripheral portion, and the workpiece 200 may be a rectangular package substrate having a plurality of resin-sealed devices, a ceramic substrate, a ferrite substrate, a substrate including at least one of nickel and iron, or the like, in addition to the wafer. In the embodiment, the object 200 is attached with a disc-shaped adhesive tape 210 having a larger diameter than the object 200 on the back surface 205 of the substrate 204, and an annular frame 211 is attached to the outer periphery of the adhesive tape 210 and supported by the annular frame 211.
The machining apparatus 1 shown in fig. 1 is a cutting apparatus that holds a workpiece 200 on a chuck table 10, performs cutting (corresponding to machining) along a line to divide 202 by a cutting tool 21, and divides the workpiece into chips 206. Wherein chip 206 has a portion of substrate 204 and device 203. As shown in fig. 1, a processing apparatus 1 includes: a table unit 2 having a chuck table 10 for sucking and holding the workpiece 200 by a holding surface 11; a cutting unit 20 for cutting the workpiece 200 held by the chuck table 10 by a cutting tool 21; an imaging unit 30 that images the workpiece 200 held by the chuck table 10; and a control unit 100 as a control means.
As shown in fig. 1, the processing apparatus 1 includes at least: an X-axis moving unit 31 that performs machining feed in an X-axis direction parallel to the horizontal direction of the table unit 2 including the chuck table 10; a Y-axis moving unit 32 that index-feeds the cutting unit 20 in a Y-axis direction parallel to the horizontal direction and perpendicular to the X-axis direction; a Z-axis moving unit 33 that performs a cutting-in feed of the cutting unit 20 in a Z-axis direction parallel to a vertical direction perpendicular to both the X-axis direction and the Y-axis direction; and a rotation moving unit 34 that rotates the chuck table 10 about an axis parallel to the Z-axis direction. As shown in fig. 1, the machining apparatus 1 is a dicing machine having two cutting units 20, that is, two spindles, a so-called facing biaxial type cutting apparatus.
The chuck table 10 has a disk shape, and the holding surface 11 for holding the workpiece 200 is formed of porous ceramics or the like. The chuck table 10 is provided so as to be movable in the X-axis direction in a machining region below the cutting unit 20 by the X-axis moving unit 31 and in and out of a carrying-in and carrying-out region separated from the lower side of the cutting unit 20 and carrying in and carrying out the object 200, and is provided so as to be rotatable about an axis parallel to the Z-axis direction by the rotating and moving unit 34. The holding surface 11 of the chuck table 10 is connected to a vacuum suction source, not shown, and the workpiece 200 placed on the holding surface 11 is sucked and held by suction from the vacuum suction source. In the embodiment, the chuck table 10 sucks and holds the back surface 205 side of the workpiece 200 through the adhesive tape 210.
In the embodiment, the chuck table 10 is provided on the table cover 3 that is moved in the X-axis direction by the X-axis moving unit 31 of the table unit 2, and is supported to be rotatable about the axial center by the rotating unit 34, and the rotating unit 34 is provided to be movable in the X-axis direction by the X-axis moving unit 31. Further, the upper surface of the table cover 3 is formed flat along the horizontal direction.
The cutting unit 20 is a cutting member to which a cutting tool 21 for cutting the workpiece 200 held by the chuck table 10 is detachably attached. The cutting units 20 are provided to be movable in the Y-axis direction by the Y-axis moving unit 32 and movable in the Z-axis direction by the Z-axis moving unit 33 with respect to the workpiece 200 held by the chuck table 10.
As shown in fig. 1, the one cutting unit 20 is provided on one pillar portion of the gate-shaped support frame 5 erected from the apparatus main body 4 via the Y-axis moving unit 32, the Z-axis moving unit 33, and the like. As shown in fig. 1, the other cutting unit 20 is provided on the other column portion of the support frame 5 via a Y-axis moving unit 32, a Z-axis moving unit 33, and the like. The support frame 5 connects the upper ends of the column portions to each other via a horizontal beam.
The cutting unit 20 can position the cutting tool 21 at an arbitrary position on the holding surface 11 of the chuck table 10 by the Y-axis moving unit 32 and the Z-axis moving unit 33.
The cutting unit 20 has: a spindle housing 22 provided to be movable in the Y-axis direction and the Z-axis direction by a Y-axis moving unit 32 and a Z-axis moving unit 33; a spindle 23 provided in the spindle housing 22 to be rotatable about an axis; and a cutting tool 21 attached to the spindle 23.
The cutting tool 21 is an extremely thin cutting abrasive having a substantially ring shape. In the embodiment, the cutting tool 21 is a so-called hub tool having an annular circular base made of a conductive metal and an annular cutting edge disposed on an outer peripheral edge of the circular base and cutting the workpiece 200. The cutting edge is formed with a predetermined thickness by abrasive grains such as diamond and CBN (Cubic Boron Nitride) and a bonding material such as metal or resin. The spindle 23 is rotated by a spindle motor, not shown, and has a cutting tool 21 attached to a distal end portion thereof. The axial centers of the spindle 23 and the cutting tool 21 of the cutting unit 20 are set parallel to the Y-axis direction.
The imaging unit 30 is fixed to one of the cutting units 20 so as to move integrally with the one of the cutting units 20. The imaging unit 30 includes an imaging element for imaging a region to be divided of the workpiece 200 before cutting held by the chuck table 10. The imaging Device is, for example, a CCD (Charge-Coupled Device) imaging Device or a CMOS (Complementary metal oxide semiconductor) imaging Device. The imaging unit 30 images the workpiece 200 held by the chuck table 10 to obtain an image for performing alignment, that is, positioning of the workpiece 200 and the cutting tool 21, and outputs the obtained image to the control unit 100.
The X-axis moving unit 31 moves the chuck table 10 of the table unit 2 in the X-axis direction, which is a machining feed direction, and relatively feeds the chuck table 10 and the cutting unit 20 in the X-axis direction. The Y-axis moving unit 32 moves the cutting unit 20 in the Y-axis direction, which is an index feeding direction, and relatively indexes the chuck table 10 and the cutting unit 20 along the Y-axis direction. The Z-axis moving unit 33 moves the cutting unit 20 in the Z-axis direction, which is a cutting feed direction, and causes the chuck table 10 and the cutting unit 20 to perform cutting feed relatively in the Z-axis direction.
The X-axis moving unit 31, the Y-axis moving unit 32, and the Z-axis moving unit 33 have: a known ball screw provided to be rotatable about an axis; a well-known motor that rotates a ball screw about an axis; and a known guide rail that supports the chuck table 10 or the cutting unit 20 to be movable in the X-axis direction, the Y-axis direction, or the Z-axis direction.
The machining apparatus 1 further includes: an X-axis direction position detection unit, not shown, for detecting the position of the chuck table 10 in the X-axis direction; a Y-axis direction position detection unit, not shown, for detecting the position of the cutting unit 20 in the Y-axis direction; and a Z-axis direction position detection unit for detecting a Z-axis direction position of the cutting unit 20. The X-axis direction position detecting unit and the Y-axis direction position detecting unit may be constituted by a linear scale parallel to the X-axis direction or the Y-axis direction and a readhead. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction using the pulse of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the X-axis direction of the chuck table 10, and the Y-axis direction or Z-axis direction position of the cutting unit 20 to the control unit 100. In the embodiment, the positions of the components of the processing apparatus 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are set using reference positions that are set in advance and are not shown as reference positions.
The machining apparatus 1 further includes: a cassette lifter 40 for placing a cassette (not shown) for storing the workpiece 200 before and after cutting and moving the cassette in the Z-axis direction; a cleaning unit 50 for cleaning the cut workpiece 200; and a conveying unit, not shown, for conveying the workpiece 200 between the cassette, the chuck table 10, and the cleaning unit 50 while moving the workpiece 200 in and out of the cassette.
The processing apparatus 1 further includes a test piece chuck table 60. The test piece chuck table 60 is provided in the table cover 3 of the table unit 2, and as shown in fig. 2, the test piece chuck table 60 is formed in a rectangular shape, and an upper surface 61 is made of a flat metal material. In the embodiment, the longitudinal direction of the test piece chuck table 60 is parallel to the Y-axis direction. The test piece chuck table 60 mounts a test piece 70 shown in fig. 2 on the upper surface 61. The test piece 70 is made of the same material as the substrate 204 of the workpiece 200, and has a flat planar shape of the same rectangular shape as the upper surface 61.
The test piece chuck table 60 has a suction groove 62 formed in the upper surface 61 and connected to a vacuum suction source, not shown. The suction groove 62 is concavely formed from the upper surface 61. The test piece chuck table 60 sucks the test piece 70 placed on the upper surface 61 by a vacuum suction source and holds the test piece. In the embodiment, the test piece chuck table 60 is supported by a rotary drive mechanism 63 attached to the table cover 3 so as to be rotatable about an axis parallel to the Y-axis direction. In the embodiment, the rotation drive mechanism 63 rotates the test piece chuck table 60 to a position shown by a solid line in fig. 2 where the upper surface 61 faces upward and a position shown by a broken line in fig. 2 where the upper surface 61 faces the carrying-in/out area.
The control unit 100 controls each component of the machining apparatus 1 to cause the machining apparatus 1 to perform a machining operation on the workpiece 200. Further, the control unit 100 is a computer, and the control unit 100 includes: an arithmetic processing device having a microprocessor such as a Central Processing Unit (CPU); a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory); and an input/output interface device. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs a control signal for controlling the machining device 1 to each component of the machining device 1 via the input/output interface device.
The control unit 100 is connected to a display unit, not shown, including a liquid crystal display device or the like for displaying a state of a machining operation, an image, or the like, an input unit used by an operator to register machining content information or the like, and a notification unit 101. The input unit is configured by at least one of an external input device such as a touch panel and a keyboard provided in the display unit. The notification unit 101 notifies the operator by emitting at least one of sound and light.
As shown in fig. 1, the control unit 100 includes a normal image storage unit 102 and a comparison determination unit 103. The normal image storage unit 102 stores a normal image 300 shown in fig. 3, in which the normal image 300 is obtained by imaging the cut groove 80 formed in the test piece 70 by cutting the test piece 70 from one end 71 to the other end 72 in the X-axis direction with the normal cutting tool 21 from the side surface 711 on the side of one end 71 of the both ends 71, 72 with the imaging unit 30. In the normal image 300, the inner surface 81 as the side wall of the cut groove 80 is perpendicular to the front surface 73 of the test piece 70. The normal image storage unit 102 stores a predetermined distance 301 from the front surface 73 to the bottom of the test piece 70 of the cut groove 80 of the normal image 300. The predetermined distance 301 is a distance that defines a determination position 302, and when the test piece 70 is cut by the cutting tool 21, the determination position 302 is used to determine whether or not the cutting tool 21 needs to be replaced. The mechanism of the normal image storage unit 102 is realized by a storage device.
The comparison determination unit 103 determines whether or not the cutting tool 21 needs to be replaced, based on the cutting groove 80 (an example is shown in fig. 9 and the like, and hereinafter, reference numeral 80-1) formed by cutting the test piece 70 with the cutting tool 21. The comparison determination unit 103 determines whether or not the cutting tool 21 needs to be replaced based on the inclination of the inner surface 81-1 of the cutting groove 80-1 in the captured image 400 (an example is shown in fig. 9) obtained by capturing the cutting groove 80-1 formed by cutting the test piece 70 with the cutting tool 21 from the side surface 711 on the one end 71 side by the capturing unit 30. The function of the comparison determination unit 103 is realized by the arithmetic processing unit executing a computer program stored in the storage unit.
(processing method)
The machining method of the embodiment is a machining operation in which the machining device 1 performs a cutting process on the workpiece 200. The operator registers the processing content information in the control unit 100, places a cassette containing a plurality of workpieces 200 to be processed before cutting on the upper surface of the cassette lifter 40, places a test piece 70 on the upward upper surface 61 of the test piece chuck table 60, and when receiving an instruction from the operator to start a processing operation, the processing apparatus 1 performs a processing method. When the machining operation is started, the machining apparatus 1 sucks and holds the test piece 70 on the upper surface 61 of the test piece chuck table 60.
The machining method is a machining method of the workpiece 200, and as shown in fig. 4, the machining method includes a cutting step ST1, a cutting groove forming step ST4, an imaging step ST5, and a determination step ST 6.
(cutting step)
Fig. 5 is a sectional view schematically showing a cutting step of the machining method shown in fig. 4. The cutting step ST1 is a step of cutting the workpiece 200 with the cutting tool 21. In the cutting step ST1, the processing apparatus 1 transports the workpiece 200 from the cassette to the chuck table 10 in the carrying-in/out area by the transport means, and suction-holds the back surface 205 side on the holding surface 11 of the chuck table 10 via the adhesive tape 210.
In the cutting step ST1, the machining apparatus 1 moves the chuck table 10 toward the machining area by the X-axis moving means, images the workpiece 200 by the imaging means 30, and performs alignment based on the image captured by the imaging means 30. As shown in fig. 5, the machining apparatus 1 cuts the workpiece 200 into the respective lines to divide the workpiece 200 into the respective chips 206 by cutting the cutting tool 21 into the respective lines to divide 202 while relatively moving the workpiece 200 and the cutting unit 20 along the lines to divide 202. The processing apparatus 1 conveys the workpiece 200 divided into the chips 206 from the chuck table 10 to the cleaning unit 50 by the conveying unit, and cleans the workpiece 200 by the cleaning unit 50. In the cutting step ST1, the processing apparatus 1 transports the workpiece 200 after cutting and cleaning by the transport unit from the cleaning unit 50 to the cassette and stores the workpiece in the cassette.
The control unit 100 of the machining apparatus 1 determines whether or not to end the machining operation (step ST 2). Specifically, the control unit 100 of the machining device 1 determines that the machining operation is ended when the cutting of all the workpieces 200 in the cassette is completed, and determines that the machining operation is continued when the workpieces 200 that have not been cut remain in the cassette.
When the control unit 100 of the machining apparatus 1 determines that the machining operation is to be ended (step ST 2: yes), the machining operation, that is, the machining method is ended. When the control unit 100 of the machining apparatus 1 determines that the machining operation is to be continued (step ST 2: no), it determines whether or not the timing to determine whether or not the cutting tool 21 needs to be replaced is reached (step ST 3).
The timing of determining whether or not the cutting tool 21 needs to be replaced is determined by the material of the workpiece 200 to be cut, the material of the cutting edge of the cutting tool 21, and the like. The timing of determining whether or not the cutting tool 21 needs to be replaced is, for example, every time one workpiece 200 is cut or every time a predetermined number of workpieces 200 are cut, stored in the storage device of the control unit 100 as part of the processing content information. In the present invention, the timing of determining whether or not the cutting tool 21 needs to be replaced may be every time a predetermined number of lines to divide 202 are cut, that is, the timing of the determination may be during the cutting of the workpiece 200 held by the chuck table 10. In this case, the timing of determining whether or not the cutting tool 21 needs to be replaced may be every time all of one of the lines to divide 202 parallel to each other are cut.
When the control unit 100 of the machining apparatus 1 determines that the timing to determine whether or not the cutting tool 21 needs to be replaced is not present (step ST 3: no), the process returns to the cutting step ST 1. When the control unit 100 of the machining apparatus 1 determines that the timing to determine whether or not the cutting tool 21 needs to be replaced is reached (step ST 3: yes), the process proceeds to a cutting groove forming step ST 4.
(cutting groove formation step)
Fig. 6 is a cross-sectional view schematically showing a cutting groove forming step of the machining method shown in fig. 4. Fig. 7 is a plan view of the test piece after the cutting groove forming step in the machining method shown in fig. 4. The cutting groove forming step ST4 is a step of cutting the test piece 70 from one end 71 to the other end 72 in the X-axis direction by the cutting tool 21 to form a cutting groove 80-1.
In the embodiment, in the cutting groove forming step ST4, the control unit 100 of the processing apparatus 1 images the test piece 70 sucked and held by the test piece chuck table 60 by the imaging unit 30, and aligns the test piece 70 with the cutting edge of the cutting tool 21. The machining apparatus 1 cuts the test piece 70 into the workpiece 200 from one end 71 to the other end 72 as shown in fig. 6 while relatively moving the test piece 70 and the cutting unit 20 in the X-axis direction as shown in fig. 5, thereby forming the cut groove 80-1 shown in fig. 7 in the workpiece 200, and proceeds to the imaging step ST 5. In the embodiment, the cutting groove 80-1 is formed from the one end 71 to the other end 72 in the X-axis direction of the test piece 70, but in the present invention, the cutting tool 21 may be raised by cutting from the one end 71 toward the other end 72 side to the middle without completely cutting from the one end 71 to the other end 72.
(shooting step)
Fig. 8 is a sectional view schematically showing an imaging step of the processing method shown in fig. 4. Fig. 9 is a diagram showing an example of a captured image obtained in the capturing step of the processing method shown in fig. 4. The imaging step ST5 is a step of imaging the side surfaces 711 and 721 on the one end 71 side or the other end 72 side of the test piece 70 after the cut groove forming step ST4 is performed, and forming the captured image 400 including the cut groove 80-1.
In the embodiment, in the imaging step ST5, the processing apparatus 1 rotates the test piece chuck table 60 by 90 degrees around the axis by the rotation driving mechanism 63 so that the upper surface 61 faces the carrying-in/out area. In the embodiment, in the photographing step ST5, the processing apparatus 1 photographs the side surface 711 on the side of the one end 71 of the test piece 70 with the photographing unit 30 as shown in fig. 8, obtains a photographed image 400 shown in fig. 9 as an example, and proceeds to the determination step ST 6.
(determination step)
Fig. 10 is a diagram illustrating an example of a determination procedure of the machining method illustrated in fig. 4. The determination step ST6 is a step of determining whether or not the cutting tool 21 needs to be replaced, based on the inclination of the inner surface 81-1 of the cutting flute 80-1 detected from the captured image 400.
In the embodiment, in the determination step ST6, the cut groove 80 (indicated by a broken line in fig. 10) of the normal image 300 is superimposed on the captured image 400. In the embodiment, the upper end of the cut groove 80 in the normal image 300 is overlapped with the upper end of the cut groove 80 in the captured image 400. In the embodiment, in the determination step ST6, the control unit 100 detects the distance 401 between the inner surface 81-1 of the cut groove 80-1 in the photographed image 400 at the determination position 302 and the inner surface 81 of the cut groove 80 in the normal image 300, determines that the replacement of the cutting tool 21 is not necessary when the detected distance 401 is determined to be equal to or less than a preset allowable value (determination step ST 6: no), and returns to the cutting step ST 1. In this manner, in the embodiment, in the determination step ST6, the control unit 100 determines whether or not the cutting tool 21 needs to be replaced, based on the inclination of the inner surface 81-1 of the cutting flute 80-1 detected from the captured image 400.
In the embodiment, when the control unit 100 determines in the determination step ST6 that the detected distance 401 exceeds the preset allowable value, it determines that the cutting tool 21 needs to be replaced (determination step ST 6: yes), and operates the notification unit 101 to notify (step ST7), thereby ending the machining operation, that is, the machining method of the embodiment. In the present invention, the method of determining whether or not the cutting tool 21 needs to be replaced in step ST6 is not limited to the method described in the embodiment, and the contour of the cut groove 80 in the normal image 300 may be compared with the contour of the cut groove 80 in the captured image 400, or the imaginary line of the inner surface 81-1 of the cut groove 80-1 in the captured image 400 may be compared with the ideal inner surface of the cut groove 80.
As described above, the machining method and the machining apparatus 1 according to the embodiment form the cut groove 80-1 in the test piece 70 and photograph the side surface 711 of the test piece 70. Whether or not the cutting tool 21 needs to be replaced is determined based on the inclination of the inner surface 81-1 of the cutting flute 80-1 detected from the photographed image 400 formed by photographing. As a result, the machining method and the machining apparatus 1 have the following effects: the timing of replacement of the cutting tool 21 can be determined more easily than in the conventional art, and chips 206 that are not continuously manufactured can be suppressed.
[ modified examples ]
A machining method according to a modification of the embodiment of the present invention will be described with reference to the drawings. Fig. 11 is a cross-sectional view schematically showing an imaging step of a processing method according to a modification of the embodiment. In fig. 11, the same portions as those in the embodiment are denoted by the same reference numerals, and the description thereof is omitted.
The processing apparatus 1 according to the processing method according to the modification of the embodiment includes the 2 nd imaging unit 90 for acquiring the captured image 400 separately from the imaging unit 30, and the 2 nd imaging unit 90 is disposed on the lateral side of the test piece chuck table 60 in the X axis direction. In the modification, in the imaging step ST5, the processing apparatus 1 captures an image of the side surface 721 on the other end 72 side of the test piece 70 sucked and held by the chuck table 60 for test pieces with the upper surface 61 facing upward, as shown in fig. 11, and acquires the captured image 400.
The 2 nd imaging unit 90 has an imaging element for imaging the side surface 721 on the other end 72 side of the test piece 70, similarly to the imaging unit 30. The imaging Device is, for example, a CCD (Charge-Coupled Device) imaging Device or a CMOS (Complementary metal oxide semiconductor) imaging Device.
In the machining method and the machining apparatus 1 according to the modified example, the cut groove 80-1 is formed in the test piece 70 in the cut groove forming step ST4, and the side surface 721 of the test piece 70 is photographed by the 2 nd photographing unit 90 in the photographing step ST 5. In the machining method and the machining apparatus 1, in the same manner as in the embodiment, in the determination step ST6, it is determined whether or not the cutting tool 21 needs to be replaced, based on the inclination of the inner surface 81-1 of the cutting flute 80-1 detected from the photographed image 400 formed by photographing. As a result, the machining method and the machining apparatus 1 of the modification have the following effects, as in the embodiment: the timing of replacement of the cutting tool 21 can be determined more easily than in the conventional art, and the chips 206 that are continuously manufactured are suppressed from being defective.
The present invention is not limited to the above embodiments. That is, various modifications can be made and implemented without departing from the scope of the present invention. In the embodiment, the cutting process is stopped and the photographing step ST5 and the determination step ST6 are performed, but the present invention is not limited to this, and the photographing step ST5 and the determination step ST6 may be performed during the cutting process.
In the present invention, when the machining device 1 as a cutting device includes a pair of cutting units 20, a pair of test piece chuck tables 60 having a rotation drive mechanism 63 may be provided corresponding to the respective cutting units 20. In this case, it is desirable that the processing apparatus 1 dispose the test piece chuck table 60 on the side of each cutting unit 20 with the chuck table 10 interposed therebetween.

Claims (1)

1. A processing method of a processed object, wherein,
the processing method comprises the following steps:
a cutting step of cutting the workpiece with a cutting tool;
a cutting groove forming step of forming a cutting groove by cutting the test piece from one end to the other end with the cutting tool;
an imaging step of imaging a side surface of the test piece on the one end side or the other end side after the cutting groove forming step is performed to form an image including the cutting groove; and
and a determination step of determining whether or not the cutting tool needs to be replaced, based on the inclination of the side wall of the cutting flute detected from the captured image.
CN202010716022.3A 2019-07-26 2020-07-23 Processing method Pending CN112297258A (en)

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JP3646781B2 (en) 1999-11-08 2005-05-11 株式会社東京精密 Dicing method, kerf check method of dicing apparatus, and kerf check system
JP2006108219A (en) 2004-10-01 2006-04-20 Disco Abrasive Syst Ltd Method of adjusting inclined angle of cutting blade of cutting device and method for cutting using the same
JP5384174B2 (en) * 2009-04-06 2014-01-08 株式会社ディスコ Cutting blade tip shape detection method
JP5757831B2 (en) * 2011-09-14 2015-08-05 株式会社ディスコ Cutting blade tip shape detection method
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JP2002176012A (en) * 2000-12-05 2002-06-21 Sharp Corp Apparatus and method for dicing
JP2007196326A (en) * 2006-01-26 2007-08-09 Disco Abrasive Syst Ltd Slitting confirmation method of cutting blade
JP2007296604A (en) * 2006-04-28 2007-11-15 Disco Abrasive Syst Ltd Wafer cutting device

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KR20210012906A (en) 2021-02-03

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