CN112291394A

CN112291394A - Electronic device

Info

Publication number: CN112291394A
Application number: CN202011185568.7A
Authority: CN
Inventors: 周华昭; 伍伟竞
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-10-29
Filing date: 2020-10-29
Publication date: 2021-01-29

Abstract

The application discloses electronic equipment, which belongs to the technical field of communication equipment and comprises a screen support, a first circuit board, a frame plate assembly, a loudspeaker and a loudspeaker shielding case; the first circuit board and the loudspeaker are arranged on the screen support at intervals, the loudspeaker is positioned in the loudspeaker shielding cover, and the loudspeaker shielding cover is provided with a first through hole; the frame plate assembly is located the first circuit board deviates from one side of screen support, the second through-hole has been seted up to the frame plate assembly, the second through-hole with first through-hole is relative, first circuit board the frame plate assembly with between the speaker shield, form sealed back tone chamber. The scheme can solve the problem that the thickness of the electronic equipment is large.

Description

Electronic device

Technical Field

The application belongs to the technical field of communication equipment, and particularly relates to electronic equipment.

Background

With the rapid development of electronic devices, the electronic devices are more and more widely used, and for example, electronic devices such as mobile phones and tablet computers play more and more roles in the work, life, entertainment and the like of people.

In the related art, an electronic device is provided with a speaker, and the speaker is used for realizing a sound emission function of the electronic device. In order to make the speaker have a relatively prominent bass sound, the speaker needs to have a relatively large back sound cavity, so that the bass sound of the speaker can be prominent, and the sound emitted by the speaker is more pleasant.

In the process of implementing the invention, the inventor finds that in the related art, the rear sound cavity of the speaker is larger, so that the overall volume of the speaker is increased, and at this time, the speaker occupies a larger internal space of the electronic device, so that the thickness of the electronic device is larger, and therefore, the development of thinning and lightening of the electronic device is not facilitated.

Disclosure of Invention

An object of the embodiments of the present application is to provide an electronic device, which can solve the problem of a large thickness of the electronic device.

In order to solve the technical problem, the present application is implemented as follows:

the embodiment of the application provides electronic equipment, which comprises a screen bracket, a first circuit board, a frame plate assembly, a loudspeaker and a loudspeaker shielding cover, wherein the screen bracket is arranged on the first circuit board;

the first circuit board and the loudspeaker are arranged on the screen support at intervals, the loudspeaker is positioned in the loudspeaker shielding cover, and the loudspeaker shielding cover is provided with a first through hole;

the frame plate assembly is located the first circuit board deviates from one side of screen support, the second through-hole has been seted up to the frame plate assembly, the second through-hole with first through-hole is relative, first circuit board the frame plate assembly with between the speaker shield, form sealed back tone chamber.

In an embodiment of the present application, a sealed back sound cavity is formed between the first circuit board, the chassis assembly and the speaker shield. This scheme utilizes the cavity that first circuit board and frame plate subassembly formed to act as the partial back sound chamber of speaker to enlarged the back sound chamber of speaker, thereby make the less that the volume of speaker self can set up, and then make the speaker occupy electronic equipment's inner space less, make electronic equipment's thickness less, more be favorable to electronic equipment's frivolous development.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present application;

FIG. 2 is an exploded view of an electronic device according to an embodiment of the present disclosure;

FIG. 3 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of a speaker in an electronic device according to an embodiment of the disclosure;

FIG. 5 is a front view of a speaker in an electronic device according to an embodiment of the present disclosure;

fig. 6 and 7 are side views of a speaker in an electronic device according to an embodiment of the present application.

Description of reference numerals:

100-screen support, 110-groove, 120-holding groove, 121-fourth through hole,

200-a first circuit board,

300-shelf assembly, 301-second through hole, 310-second circuit board, 320-support member,

400-a loudspeaker,

500-speaker shield, 510-first through hole, 520-fifth through hole, 530-main body part, 540-extending convex part, 550-connecting convex part,

600-sealing element, 610-third through hole,

700-screw thread connecting piece,

810-rear sound cavity, 811-first cavity, 812-second cavity, 820-front sound cavity.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

Referring to fig. 1 to 7, an embodiment of the present application discloses an electronic device, which includes a screen bracket 100, a first circuit board 200, a chassis assembly 300, a speaker 400, and a speaker shield 500.

The screen holder 100 is a main body part of the electronic device, which provides a mounting base for other components of the electronic device, for example, the screen holder 100 may be used for mounting components such as a display screen and a main board of the electronic device.

The first circuit board 200 and the speaker 400 are spaced apart from each other on the screen holder 100, that is, the speaker 400 is not stacked on the first circuit board 200 but is disposed side by side with the first circuit board 200. The speaker 400 is located in the speaker shield 500, and the speaker shield 500 is opened with a first through hole 510. Speaker shield 500 may be capable of shielding speaker 400 from electromagnetic fields or from interference with other components of an electronic device caused by electromagnetic fields generated by speaker 400.

The chassis assembly 300 is located on a side of the first circuit board 200 facing away from the screen support 100. The frame plate assembly 300 defines a second through hole 301, and the second through hole 301 is opposite to the first through hole 510, that is, the first through hole 510 is communicated with the second through hole 301. A sealed back acoustic chamber 810 is formed between the first circuit board 200, the chassis assembly 300 and the speaker shield 500. The back sound chamber 810 is to highlight the bass sound of the speaker 400 to improve the sound quality of the speaker 400.

Alternatively, a second cavity 812 may be formed between the speaker 400 and the speaker shield 500, and the first through hole 510 may communicate with the second cavity 812. The first circuit board 200 and the chassis assembly 300 may enclose a first cavity 811, the second through hole 301 may communicate with the first cavity 811, at this time, the first cavity 811 and the second cavity 812 may communicate with each other through the first through hole 510 and the second through hole 301, and the first cavity 811 and the second cavity 812 together form a rear sound cavity 810.

In the embodiment of the present application, a sealed rear sound cavity 810 is formed between the first circuit board 200, the chassis assembly 300 and the speaker shield 500. This scheme utilizes the cavity that first circuit board 200 and frame plate subassembly 300 formed to act as the partial back sound chamber of speaker 400 to enlarged back sound chamber 810 of speaker 400, thereby what make speaker 400 self volume can set up is less, and then makes speaker 400 occupy electronic equipment's inner space less, makes electronic equipment's thickness less, more is favorable to electronic equipment's frivolous development.

In addition, the first circuit board 200 and the speaker 400 are disposed on the screen bracket 100 at an interval, and at this time, the speaker 400 is not directly attached to the first circuit board 200, so that the area occupied by the speaker 400 on the first circuit board 200 is small, thereby saving a large device mounting area for the first circuit board 200, and optimizing the layout of the electronic device.

In addition, the volume of the rear sound cavity 810 is larger, so that the loudspeaker 400 has the larger rear sound cavity 810, the bass of the loudspeaker 400 is more prominent, the acoustic performance of the loudspeaker 400 can be improved, and the sound emitted by the loudspeaker 400 is more pleasant.

Furthermore, the speaker 400 utilizes the first circuit board 200, the frame plate assembly 300 and the speaker shielding case 500 to form the rear sound cavity 810, the volume of the speaker 400 itself can be set small, and then the speaker 400 is not easy to occupy the installation positions of the mainboard, the battery and other electronic components of the electronic device, so that the layout of the electronic components of the electronic device can be optimized, and the structural design of the electronic device is simpler.

Alternatively, the first circuit board 200 and the chassis assembly 300 may be connected by a foam seal, or the joint of the first circuit board 200 and the chassis assembly 300 may be soldered by a full solder. Of course, other connection methods may be used, and are not limited herein.

In another alternative embodiment, the shelf assembly 300 may include a second circuit board 310 and a support member 320, the first circuit board 200 may be stacked with the second circuit board 310, and the support member 320 is supportively disposed between the first circuit board 200 and the second circuit board 310. The supporter 320 is hermetically connected to the first circuit board 200 and the second circuit board 310, respectively.

In this embodiment, the first circuit board 200 and the second circuit board 310 may both provide a receiving space for electronic components. At the moment, the two layers of circuit boards can fully utilize the space of the electronic equipment in the thickness direction, and the purpose of providing more electronic component mounting positions is achieved.

Alternatively, the first circuit board 200 and the second circuit board 310 may be a main board of the electronic device, or a sub-board of the electronic device, and of course, the first circuit board 200 and the second circuit board 310 may also be other circuit structures, which is not limited herein.

In another alternative embodiment, the first circuit board 200 and the second circuit board 310 may be electrically connected through the supporter 320. In this embodiment, no other component is required to be disposed in the electronic device to electrically connect the first circuit board 200 and the second circuit board 310, so that the structure of the electronic device is simpler and more compact. Alternatively, the supporting member 320 may be a conductive adhesive layer, or the supporting member 320 may be a conductive metal member, and of course, the supporting member 320 may also be other conductive structures, which is not limited herein.

In another embodiment, the first circuit board 200 or the second circuit board 310 is electrically connected to the speaker 400. The first circuit board 200 or the second circuit board 310 can supply power to the speaker 400 and control the speaker 400. In this scheme, the distance between the speaker 400 and the first circuit board 200 or the second circuit board 310 is short, so that no additional electrical connector needs to be arranged in the electronic device to supply power and control the speaker 400, and the speaker 400 is conveniently electrically connected with the first circuit board 200 and the second circuit board 310, so that the electronic device is simple and compact in structure.

In the above embodiment, the second through hole 301 may be opened on the supporting member 320. However, since the supporting member 320 is disposed between the first circuit board 200 and the second circuit board 310, in order to reduce the thickness of the electronic device, the thickness of the supporting member 320 needs to be reduced, and thus the difficulty of forming the second through hole 301 on the supporting member 320 is high. Based on this, in another alternative embodiment, the second circuit board 310 may have the second through hole 301 thereon, the speaker shield 500 may be in contact with the second circuit board 310, and the first through hole 510 is opposite to the second through hole 301. In this embodiment, the second circuit board 310 has a larger volume, so that the second circuit board 310 is easier to form the second through hole 301, and the manufacturing difficulty of the electronic device is smaller.

In another alternative embodiment, in the axial projection direction of the first through hole 510, the projection profile of the first through hole 510 coincides with the projection profile of the second through hole 301. In this solution, the external dimensions of the first through hole 510 and the second through hole 301 are the same, so that the communication performance between the first cavity 811 and the second cavity 812 is better, and the speaker 400 has better acoustic performance.

In the above embodiment, the sound leakage phenomenon is likely to occur at the junction of the first through hole 510 and the second through hole 301, thereby degrading the acoustic performance of the speaker 400. Based on this, in another alternative embodiment, the electronic device disclosed in the embodiment of the present application may further include a sealing member 600, the sealing member 600 may be disposed between the speaker shield 500 and the second circuit board 310, and the sealing member 600 may be provided with a third through hole 610. The first through hole 510, the second through hole 301 and the third through hole 610 are all communicated. In this scheme, the sealing member 600 can seal the gap between the first through hole 510 and the second through hole 301, so that the sound leakage phenomenon at the joint of the first through hole 510 and the second through hole 301 can be avoided, and the acoustic performance of the speaker 400 is further improved.

Further, the seal 600 may be an elastic structure. In this embodiment, the sealing member 600 has elasticity, and thus does not rigidly contact the second circuit board 310, so that the second circuit board 310 is not easily crushed. In addition, the sealing member 600 has elasticity, and when the sealing member 600 is assembled, a pre-pressure can be applied to the sealing member 600, so that the sealing member 600 is deformed, and the resilience of the sealing member 600 can press the second circuit board 310 and the speaker shield 500, thereby further improving the sealing performance of the second circuit board 310 and the speaker shield 500.

Optionally, the sealing member 600 is made of a material such as sealing foam or sealing silicone, and of course, other sealing materials may also be used, which is not limited herein.

In another alternative embodiment, the electronic device disclosed in the embodiment of the present application may further include a screw connector 700, and the chassis assembly 300 and the speaker shield 500 may be screw-coupled by the screw connector 700. In this scheme, frame plate subassembly 300 and speaker shield cover 500 can realize dismantling the connection through threaded connection spare 700, when frame plate subassembly 300, speaker 400 or other electronic components damaged, through dismantling threaded connection spare 700 to realize the separation of frame plate subassembly 300 and speaker 400, and then make things convenient for electronic equipment's maintenance, with the maintenance performance who improves electronic equipment.

Of course, the frame plate assembly 300 and the speaker shield 500 may be connected by other means, such as clamping, bonding, riveting, or magnetic attraction. The specific connection between the frame plate assembly 300 and the speaker shield 500 is not limited herein.

In another alternative embodiment, the screen bracket 100 may have a fourth through hole 121, and the sound outlet hole of the speaker 400 may communicate with the fourth through hole 121. In this scheme, the screen bracket 100 may be provided with a through hole for communicating the outside of the electronic device with the speaker 400, so that the electronic device has a simple structure, is convenient to manufacture, and has a low cost.

Alternatively, the screen support 100, the speaker shield 500 and the speaker 400 may together form a front sound cavity 820, in which case the screen support 100 not only serves to support the speaker shield 500 and the speaker 400, but also serves to enclose the front sound cavity 820. Structurally, the speaker shield 500 covers only a side of the speaker 400 facing away from the sound outlet, and a side of the speaker 400 where the sound outlet is located is exposed. At this time, the sound generated by the speaker 400 is transmitted to the front sound cavity 820 through the sound output hole, transmitted to the fourth through hole 121 through the front sound cavity 820, and transmitted to the outside of the electronic device through the fourth through hole 121.

Or, in another alternative, the speaker shield 500 encloses the entire speaker 400, the speaker shield 500 and the speaker 400 forming a front acoustic cavity 820. At this time, the screen support 100 is used only to support the speaker 400 and the speaker shield 500, and is not used to enclose the front sound cavity 820. The speaker shielding case 500 is provided with a fifth through hole 520, and the front sound cavity 820 is communicated with the fourth through hole through the fifth through hole 520.

In order to reduce the thickness of the electronic device, in another alternative embodiment, the screen holder 100 has a receiving groove 120, and the fourth through hole 121 may be disposed at the bottom of the receiving groove 120. The speaker 400 may be at least partially disposed in the accommodating groove 120. In this scheme, at least part of speaker 400 can be hidden in holding tank 120 to reduced the stack height of speaker 400 and screen support 100, further reduced the thickness of electronic equipment, and then improved user experience.

Further, the screen support 100 may be provided with a recess 110, and the first circuit board 200, at least part of the shelf assembly 300 and at least part of the speaker 400 are all located in the recess 110. In this scheme, at least part of first circuit board 200, frame plate assembly 300 and at least part of speaker 400 all can hide in recess 110 to reduce the groove and first circuit board 200, the stack height of frame plate assembly 300 and speaker 400, further reduced electronic equipment's thickness, and then improved user experience. The receiving groove 120 may be opened on the bottom of the groove 110.

In another alternative embodiment, the speaker shield 500 may include a main body portion 530 and an extended protrusion 540, the main body portion 530 may be connected with the extended protrusion 540, and the speaker 400 may be located in the main body portion 530. The first through-hole 510 may open at the extended convex part 540. The thickness of the extended protrusion 540 is less than that of the body part 530. At this time, the thickness direction of the extended convex part 540 and the thickness direction of the main body part 530 are the same as the thickness direction of the electronic device.

In this embodiment, the speaker shield 500 is divided into two parts, the thickness of the extension protrusion 540 is smaller than that of the main body 530, and the extension protrusion 540 can be overlapped on the shelf board assembly 300, so that the stacking thickness of the shelf board assembly 300 and the speaker shield 500 is further reduced, and the thickness of the electronic device is further reduced. In addition, the extension protrusion 540 is pressed on the chassis assembly 300, and the extension protrusion 540 can limit the first circuit board 200 and the chassis assembly 300 in the thickness direction of the electronic device, so that the first circuit board 200 and the chassis assembly 300 are more stably mounted.

In another alternative embodiment, a connection protrusion 550 may be disposed in the main body part 530, and the speaker 400 may be connected to the main body part 530 through the connection protrusion 550. In this scheme, speaker 400 is not directly connected with main part 530 to make speaker 400 be at the in-process of vibration sound production, the production vibration of speaker 400 is difficult to transmit to main part 530, and then is difficult to cause the vibration of other parts of the inside of electronic equipment, thereby improves electronic equipment's security and reliability.

Further, the connecting protrusion 550 may be made of an elastic material, such as rubber, silicon rubber, and elastic metal. At this time, the coupling projection 550 has elasticity, so that vibration generated from the speaker 400 can be absorbed, thereby further improving safety and reliability of the electronic device.

The electronic device disclosed in the embodiment of the application can be a smart phone, a tablet computer, an electronic book reader or a wearable device. Of course, the electronic device may also be other devices, and the embodiment of the present invention is not limited thereto.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. An electronic device comprising a screen support, a first circuit board, a frame plate assembly, a speaker and a speaker shield;

2. The electronic device of claim 1, wherein the chassis assembly includes a second circuit board and a support member, the first circuit board and the second circuit board being stacked, the support member being disposed between the first circuit board and the second circuit board, the support member being sealingly connected to the first circuit board and the second circuit board, respectively.

3. The electronic device of claim 2, wherein the second circuit board has a second through hole thereon, the speaker shield contacts the second circuit board, and the first through hole is opposite the second through hole.

4. The electronic device of claim 3, further comprising a seal disposed between the speaker shield and the second circuit board, the seal being provided with a third through hole; the first through hole, the second through hole and the third through hole are all communicated.

5. The electronic device of claim 4, wherein the seal is an elastomeric structure.

6. The electronic device of claim 1, further comprising a threaded connector by which the frame plate assembly and the speaker shield are threadably connected.

7. The electronic device according to claim 1, wherein the screen holder has a fourth through hole, and the sound outlet hole of the speaker is communicated with the fourth through hole.

8. The electronic device of claim 7, wherein the screen holder has a receiving slot, the fourth through hole is disposed at a bottom of the receiving slot, and the speaker is at least partially disposed in the receiving slot.

9. The electronic device according to claim 1, wherein the speaker shield includes a main body portion and an extending protrusion, the main body portion is connected to the extending protrusion, the speaker is located in the main body portion, and the first through hole is opened in the extending protrusion;

the thickness of the extending convex part is smaller than that of the main body part.

10. The electronic device according to claim 9, wherein a connecting protrusion is provided in the main body portion, and the speaker is connected to the main body portion through the connecting protrusion.