CN112289693A - Small-hole gravity type tin ball array method and technology - Google Patents
Small-hole gravity type tin ball array method and technology Download PDFInfo
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- CN112289693A CN112289693A CN202011116781.2A CN202011116781A CN112289693A CN 112289693 A CN112289693 A CN 112289693A CN 202011116781 A CN202011116781 A CN 202011116781A CN 112289693 A CN112289693 A CN 112289693A
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- ball
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- tin
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- tin ball
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/119—Methods of manufacturing bump connectors involving a specific sequence of method steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a method and a process for a small-hole gravity type tin ball array, which comprises the following steps: the method comprises the steps that a tin ball lower ball plate is arranged on an operation platform capable of being controlled in an inclined and overturning mode, a ball taking upper ball plate capable of moving left and right and moving up and down is arranged above the tin ball lower ball plate, array type cup-shaped micro holes are machined in the ball taking upper ball plate and the tin ball lower ball plate, the cup-shaped micro holes of the ball taking upper ball plate correspond to the cup-shaped micro holes of the tin ball lower ball plate, vacuum cavity supporting plates are arranged at the bottom of the tin ball lower ball plate and the top of the tin ball taking upper ball plate, and a vacuum cavity in each vacuum cavity supporting plate is communicated with the corresponding cup-shaped micro holes in the tin ball lower ball plate and the tin ball taking upper ball. The invention controls the tin ball bin to enable the tin balls to fall onto the lower ball plate under the action of gravity and negative pressure, controls the tin ball bin to reset and close the negative pressure of the lower ball plate, takes away redundant tin balls under the double action of gravity and a scraper, and controls the ball taking upper ball plate to transfer and plant the tin balls, thereby improving the productivity of full-automatic production BGA packaging, and increasing the implantation precision and the ball planting efficiency of the tin balls.
Description
Technical Field
The invention relates to the technical field of chip manufacturing and packaging, in particular to a method and a process for a small-hole gravity type tin ball array.
Background
With the rise of the semiconductor industry, the demand of chips is increasing, the method and the process for manufacturing the chips cannot keep up with the productivity, solder balls can be used for implantation in a large amount in the packaging of the chip manufacturing, and because the solder balls are smaller and need to be distributed according to high-precision arrays, the solder balls are implanted more complexly and are troublesome to arrange.
Disclosure of Invention
The invention aims to provide a method and a process for arranging small-hole gravity type solder balls, which are used for batch ball arrangement in a process before full-automatic BGA packaging production and solve the problems of low productivity and poor precision.
In order to achieve the above purpose, the invention provides the following technical scheme: a method and a process for preparing an array of small-hole gravity solder balls comprise the following steps:
step one, arranging a lower tin ball plate on an operation platform capable of being controlled in an inclined and overturning manner, arranging an upper tin ball taking plate capable of moving left and right and moving up and down above the lower tin ball plate, processing array-type cup-shaped micro holes in the upper tin ball taking plate and the lower tin ball plate, and enabling the cup-shaped micro holes of the upper tin ball taking plate to correspond to the cup-shaped micro holes of the lower tin ball plate;
step two, mounting vacuum cavity supporting plates at the bottom of the ball dropping plate and at the top of the ball taking upper plate, and enabling a vacuum cavity in the vacuum cavity supporting plate to be communicated with the cup-shaped micro holes in the ball dropping plate and the ball taking upper plate;
step three, arranging a tin ball bin capable of sliding left and right on the top of the tin ball lower plate, wherein the tin ball bin is provided with no bottom bin, storing the tin balls in the tin ball bin, and arranging scrapers on four walls of the bottom of the tin ball bin;
controlling the operation platform to incline to one side and controlling the tin ball bin to move towards the top of the tin ball lower ball plate, so that the tin balls enter the cup-shaped micro pores of the lower ball plate under the action of gravity and the ball hole negative pressure of the lower ball plate in an inclined state;
and step five, after the solder balls fall into the cup-shaped micro holes in the solder ball dropping plate, the vacuum cavity supporting plate at the bottom of the solder ball dropping plate is continuously subjected to vacuum operation, negative pressure is generated in the cup-shaped micro holes to suck the solder balls, the solder balls are prevented from being thrown out, and the heights of all the solder balls are consistent.
Step six, controlling the operation platform to return to the horizontal position, enabling the tin ball bin and a scraper in the tin ball bin to return to the original point, taking away redundant tin balls and completing the ball distributing action;
step seven, controlling the ball taking upper ball plate to move to the ball taking lower ball plate, enabling the cup-shaped micro holes of the ball taking upper ball plate and the ball taking lower ball plate to correspond to each other, then controlling a vacuum cavity supporting plate at the bottom of the ball taking lower ball plate to blow air, driving the ball taking lower ball plate to vibrate at high frequency by using a vibrating device, then starting a vacuum cavity supporting plate at the top of the ball taking upper ball plate to perform vacuum air suction, forming negative pressure in the cup-shaped micro holes of the ball taking upper ball plate, sucking all the solder balls into the cup-shaped micro holes of the ball taking upper ball plate, and finishing ball taking action;
and step eight, controlling the ball taking upper ball plate to move to the BGA substrate needing ball planting, and controlling a vacuum cavity supporting plate at the top of the ball taking upper ball plate to stop working, so that the ball planting process can be completed.
Preferably, the lower tin ball plate is a copper plate, the upper tin ball plate is a copper plate or a graphite plate, the cup-shaped micro holes in the lower tin ball plate and the upper tin ball plate are finish machined, and the depths of all the cup-shaped micro holes are consistent.
Preferably, the lower ball-placing plate of the solder ball and the vacuum cavity support plate and the upper ball-taking plate of the solder ball and the vacuum cavity support plate are positioned by positioning pins and are fixedly connected by bolt components.
Preferably, a large hole is formed above the cup-shaped micro small hole, a funnel-type small hole is formed below the large hole, and the funnel-type small hole is communicated with the vacuum cavity of the vacuum cavity supporting plate.
Preferably, the vibration range of the vibrating device to the movable tin ball lower ball plate in the step eight is set to be 0.05mm-0.20 mm.
Preferably, a tin ball box is arranged at the top of the tin ball bin, and the volume of the tin ball box is larger than that of the tin ball bin.
In the technical scheme, the invention provides the following technical effects and advantages:
the operation platform is controlled to incline to one side, the tin ball bin is enabled to move towards the top of the tin ball lower ball plate, the tin balls are scraped onto the tin ball lower ball plate, the gravity of the tin balls naturally falls into the cup-shaped micro-pores of the tin ball lower ball plate, the operation platform and the tin ball bin are controlled to reset, redundant tin balls are taken away, automatic arrangement of the tin balls can be achieved, the tin ball taking upper ball plate is controlled to move onto the tin ball lower ball plate, the tin balls are completely transferred into the tin ball taking upper ball plate by the vacuum cavity supporting plate, and finally the tin ball taking upper ball plate is controlled to move onto the BGA substrate needing ball planting, so that the automatic ball planting process is achieved, the automatic arrangement and planting of the tin balls are achieved, the processing efficiency of the pre-process of full-automatic production packaging is greatly improved, the productivity of full-automatic production BGA packaging is improved, and the tin ball planting accuracy is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present invention, and other drawings can be obtained by those skilled in the art according to the drawings.
FIG. 1 is a schematic view of a device required for use in the present invention
FIG. 2 is a schematic view of a structure of an under-bump-ball board according to the present invention.
FIG. 3 is an enlarged view of the cup-shaped micro-holes of the under-bump-ball board of the present invention.
Fig. 4 is a schematic structural view of the cavity supporting plate of the present invention.
Description of reference numerals:
1. a base; 2. an operating platform; 3. a solder ball dropping plate; 4. taking a ball and putting the ball on a board; 5. a vacuum cavity support plate; 6. a tin ball bin; 7. a scraper; 8. a vibrating device; 9. a BGA substrate; 10. a tin ball box.
Detailed Description
In order to make the technical solutions of the present invention better understood, those skilled in the art will now describe the present invention in further detail with reference to the accompanying drawings.
The invention provides a method and a process for preparing a small-hole gravity type tin ball array as shown in figures 1-4, which comprises the following steps:
firstly, arranging a lower tin ball plate 3 on an operation platform 2 capable of being controlled by tilting and turning, arranging an upper tin ball taking plate 4 capable of moving left and right and moving up and down above the lower tin ball plate 3, processing array-type cup-shaped micro holes in the upper tin ball taking plate 4 and the lower tin ball plate 3, and enabling the cup-shaped micro holes of the upper tin ball taking plate 4 to correspond to the cup-shaped micro holes of the lower tin ball plate 3;
step two, mounting vacuum cavity supporting plates 5 at the bottom of the lower ball plate 3 of the solder ball and at the top of the upper ball taking plate 4 of the solder ball, and enabling vacuum cavities in the vacuum cavity supporting plates 5 to be communicated with cup-shaped micro holes in the lower ball plate 3 of the solder ball and the upper ball taking plate 4 of the solder ball;
step three, arranging a solder ball bin 6 capable of sliding left and right on the top of the solder ball lower ball plate 3, arranging the solder ball bin 6 without a bottom bin, storing the solder balls in the solder ball bin 6, and arranging scrapers 7 on four walls of the bottom of the solder ball bin 6;
fourthly, controlling the operation platform 2 to incline towards one side and controlling the tin ball bin 6 to move towards the top of the tin ball lower ball plate 3, so that the tin balls enter the cup-shaped micro pores of the lower ball plate under the action of gravity and the ball hole negative pressure of the lower ball plate in an inclined state;
and step five, after the solder balls fall into the cup-shaped micro holes in the solder ball dropping plate 3, opening the vacuum cavity supporting plate 5 at the bottom of the solder ball dropping plate 3 to perform vacuum operation, generating negative pressure in the cup-shaped micro holes to suck the solder balls, preventing the solder balls from being thrown out, and enabling the heights of all the solder balls to be consistent.
Step six, controlling the operation platform 2 to return to the horizontal position, so that the tin ball bin 6 and the scraper 7 inside the tin ball bin return to the original point, and taking away redundant tin balls to finish the ball distributing action;
step seven, controlling the ball taking upper ball plate 4 to move to the ball dropping plate 3, enabling the cup-shaped micro holes of the ball taking upper ball plate 4 and the ball dropping plate 3 to correspond to each other, then controlling a vacuum cavity supporting plate 5 at the bottom of the ball dropping plate 3 to blow air, driving the ball dropping plate 3 to vibrate at high frequency by using a vibrating device 8, then starting the vacuum cavity supporting plate 5 at the top of the ball taking upper ball plate 4 to perform vacuum air extraction, forming negative pressure in the cup-shaped micro holes of the ball taking upper ball plate 4, and sucking all the solder balls into the cup-shaped micro holes of the ball taking upper ball plate 4 to finish ball taking action;
step eight, controlling the ball taking upper ball plate 4 to move to the BGA substrate 9 needing ball planting, and controlling the vacuum cavity support plate 5 at the top of the ball taking upper ball plate 4 to stop working, so that the ball planting process can be completed;
furthermore, in the above technical scheme, the solder ball lower ball plate 3 and the ball taking upper ball plate 4 are both set as copper plates, the cup-shaped micro holes in the solder ball lower ball plate 3 and the ball taking upper ball plate 4 are both finely processed, and the depths of all the cup-shaped micro holes are consistent, so that the ball distributing accuracy is ensured;
furthermore, in the above technical solution, the positions between the under-ball plate 3 and the vacuum chamber support plate 5 and between the upper ball-taking plate 4 and the vacuum chamber support plate 5 are all located by locating pins and are fixedly connected by bolt assemblies, so as to facilitate replacement of different batches of ball plates;
furthermore, in the above technical solution, a large hole is arranged above the cup-shaped micro small hole, a funnel-shaped small hole is arranged below the large hole, and the funnel-shaped small hole is communicated with the vacuum cavity of the vacuum cavity support plate 5, so that the funnel-shaped small hole can temporarily store the solder ball conveniently;
further, in the above technical solution, the vibration range of the vibrating device 8 to the dynamic solder ball lower ball plate 3 in the eighth step is set to be 0.05mm-0.20mm, so that the solder ball can be conveniently taken out;
further, in the above technical solution, the tin ball box 10 is arranged at the top of the tin ball bin 6, and the volume of the tin ball box 10 is larger than that of the tin ball bin 6, so that a large number of tin balls can be stored at one time, thereby facilitating continuous processing;
the implementation mode is specifically as follows: the operation platform 2 capable of being controlled by tilting and overturning is provided with a lower ball plate 3 of a tin ball, the operation platform 2 is controlled to tilt towards one side, a tin ball bin 6 is enabled to move towards the top of the lower ball plate 3 of the tin ball, the tin ball enters into a cup-shaped micro pore of the lower ball plate under the action of gravity and the negative pressure of a ball hole of the lower ball plate, the gravity of the tin ball naturally falls into the cup-shaped micro pore of the lower ball plate 3 of the tin ball, the operation platform 2 and the tin ball bin 6 are controlled to reset, the redundant tin ball is taken away, the automatic arrangement of the tin ball can be realized, the upper ball plate 4 of the tin ball is controlled to move to the lower ball plate 3 of the tin ball, a supporting plate 5 at the bottom of the lower ball plate 3 of the tin ball is controlled to blow air, a vibrating device 8 is utilized to drive the lower ball plate 3 of the tin ball to vibrate at high frequency, the supporting plate 5 at the top of, and finally, the ball taking upper ball plate 4 is controlled to move to the BGA substrate 9 needing ball planting, the vacuum cavity supporting plate 5 at the top of the ball taking upper ball plate 4 is controlled to stop working, the ball planting process can be completed, and then the automatic process is realized for arrangement and implantation of the solder balls, the processing efficiency of the full-automatic production BGA packaging pre-process is greatly improved, the productivity of full-automatic production BGA packaging is improved, and the implantation precision of the solder balls is increased.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that the described embodiments may be modified in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are illustrative in nature and should not be construed as limiting the scope of the invention.
Claims (6)
1. A method and a process for preparing an array of small-hole gravity type solder balls are characterized by comprising the following steps:
step one, arranging a lower tin ball plate (3) on an operation platform (2) capable of being controlled in an inclined and overturning manner, arranging an upper tin ball taking plate (4) capable of moving left and right and moving up and down above the lower tin ball plate (3), processing array type cup-shaped micro holes in the upper tin ball taking plate (4) and the lower tin ball plate (3), and enabling the cup-shaped micro holes of the upper tin ball taking plate (4) to correspond to the cup-shaped micro holes of the lower tin ball plate (3);
step two, mounting vacuum cavity supporting plates (5) at the bottom of the ball dropping plate (3) and the top of the ball taking upper plate (4) respectively, and enabling vacuum cavities in the vacuum cavity supporting plates (5) to be communicated with cup-shaped micro holes in the ball dropping plate (3) and the ball taking upper plate (4);
thirdly, arranging a tin ball bin (6) capable of sliding left and right on the top of the tin ball lower ball plate (3), arranging the tin ball bin (6) into a bottomless bin, storing the tin balls in the tin ball bin (6), and arranging scrapers (7) on four walls of the bottom of the tin ball bin (6);
fourthly, controlling the operation platform (2) to incline to one side, and controlling the tin ball bin (6) to move towards the top of the tin ball lower ball plate (3), so that the tin balls enter the cup-shaped micro pores of the lower ball plate (3) under the action of gravity and the ball hole negative pressure of the lower ball plate in an inclined state;
and step five, after the solder balls fall into the cup-shaped micro holes in the solder ball dropping plate (3), the vacuum cavity supporting plate (5) at the bottom of the solder ball dropping plate (3) is continuously operated in vacuum, negative pressure is generated in the cup-shaped micro holes to suck the solder balls, the solder balls are prevented from being thrown out, and the heights of all the solder balls are consistent.
Sixthly, controlling the operation platform (2) to return to the horizontal position, so that the tin ball bin (6) and a scraper (7) inside the tin ball bin return to the original point, and taking away redundant tin balls to finish the ball distributing action;
step seven, controlling the ball taking upper ball plate (4) to move to the ball dropping plate (3) and enabling the cup-shaped micro holes of the ball taking upper ball plate and the ball dropping plate to correspond to each other, then controlling a vacuum cavity supporting plate (5) at the bottom of the ball dropping plate (3) to blow air, driving the ball dropping plate (3) to vibrate at high frequency by using a vibrating device (8), then starting the vacuum cavity supporting plate (5) at the top of the ball taking upper ball plate (4) to perform vacuum air suction, forming negative pressure in the cup-shaped micro holes of the ball taking upper ball plate (4), and sucking all the ball into the cup-shaped micro holes of the ball taking upper ball plate (4) to finish ball taking action;
and step eight, controlling the ball taking and feeding plate (4) to move to the BGA substrate (9) needing ball planting, and controlling the vacuum cavity support plate (5) at the top of the ball taking and feeding plate (4) to stop working, so that the ball planting process can be completed.
2. The method and process of claim 1 for the formation of an array of small gravity solder balls, wherein: the lower tin ball plate (3) is set to be a copper plate, the upper tin ball plate (4) is set to be a copper plate or a graphite plate, the lower tin ball plate (3) and the upper tin ball plate (4) are both finely machined, and the depth of all the small cup-shaped holes is consistent.
3. The method and process of claim 1 for the formation of an array of small gravity solder balls, wherein: the lower ball-placing plate (3) of the solder ball and the vacuum cavity supporting plate (5) and the upper ball-taking plate (4) of the solder ball and the vacuum cavity supporting plate (5) are positioned by positioning pins and fixedly connected by bolt components.
4. The method and process of claim 1 for the formation of an array of small gravity solder balls, wherein: the upper part of the cup-shaped micro small hole is provided with a large hole, the lower part of the large hole is provided with a funnel-shaped small hole, and the funnel-shaped small hole is communicated with the vacuum cavity of the vacuum cavity supporting plate (5).
5. The method and process of claim 1 for the formation of an array of small gravity solder balls, wherein: and in the step eight, the vibration range of the vibrating device (8) to the ball moving ball lower plate (3) is set to be 0.05mm-0.20 mm.
6. The method and process of claim 1 for the formation of an array of small gravity solder balls, wherein: the tin ball bin is characterized in that a tin ball box (10) is arranged at the top of the tin ball bin (6), and the volume of the tin ball box (10) is larger than that of the tin ball bin (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011116781.2A CN112289693A (en) | 2020-10-19 | 2020-10-19 | Small-hole gravity type tin ball array method and technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011116781.2A CN112289693A (en) | 2020-10-19 | 2020-10-19 | Small-hole gravity type tin ball array method and technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112289693A true CN112289693A (en) | 2021-01-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011116781.2A Withdrawn CN112289693A (en) | 2020-10-19 | 2020-10-19 | Small-hole gravity type tin ball array method and technology |
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| Country | Link |
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| CN (1) | CN112289693A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114597146A (en) * | 2022-05-07 | 2022-06-07 | 深圳市立可自动化设备有限公司 | BGA ball mounting machine |
-
2020
- 2020-10-19 CN CN202011116781.2A patent/CN112289693A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114597146A (en) * | 2022-05-07 | 2022-06-07 | 深圳市立可自动化设备有限公司 | BGA ball mounting machine |
| CN114597146B (en) * | 2022-05-07 | 2022-07-22 | 深圳市立可自动化设备有限公司 | BGA ball mounting machine |
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Application publication date: 20210129 |