CN112276481B - Gyro cavity hole path processing method based on passive laser gyroscope - Google Patents
Gyro cavity hole path processing method based on passive laser gyroscope Download PDFInfo
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- CN112276481B CN112276481B CN202011002206.XA CN202011002206A CN112276481B CN 112276481 B CN112276481 B CN 112276481B CN 202011002206 A CN202011002206 A CN 202011002206A CN 112276481 B CN112276481 B CN 112276481B
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Abstract
The invention provides a gyro cavity hole path processing method based on a passive laser gyro, which is used for solving the problem that no available processing method exists for a large-size gyro cavity. The gyro cavity hole path processing method comprises the steps of firstly grinding and polishing any large end face of a cavity to be a reference surface, and drilling and milling eight light path holes on a square reference surface with concave-square four sides in a cavity vertical state; cutting the allowance of the surface angle of the patch by using a diamond saw blade under the state that the cavity is horizontally placed, and reaching the preset thickness; and drilling and milling four functional holes along the diagonal line of the square of the large end face, then drilling and milling a central hole communicated with the functional holes, finally drilling and milling an installation hole and chamfering. The invention is used for processing the precise dimension of the cavity structure of the large-size laser gyroscope, ensures the external dimension of the cavity of the gyroscope, the angular precision of various apertures, the position precision of coplane precision and the like by adopting the applicable tools such as the diamond-fixed abrasive hollow drill bit, the grinding wheel and the like, has stable processing quality, improves the processing efficiency and reduces the processing cost at the same time.
Description
Technical Field
The invention belongs to the field of manufacturing of precision optical parts, and particularly relates to a gyro cavity hole path machining method based on a passive laser gyro.
Background
The laser gyroscope is a precision shifter for measuring physical angular displacement, and has been widely used to replace a mechanical gyroscope. According to the position relation between a gain medium and a geometric cavity in the gyroscope, the laser gyroscope is divided into an active type and a passive type. The active gain medium is positioned in the geometric cavity and is suitable for the laser gyroscope with the geometric cavity with the maximum size within 100mm and the optical path hole smaller than 80 mm. Due to measurement requirements, after the length of the geometric cavity reaches a meter level, the frequency interval of the over-narrow free spectral range is far smaller than the gain bandwidth of the gain medium, and therefore laser mode competition occurs. In order to avoid mode competition from influencing the measurement precision of the gyroscope, the gain medium is arranged outside the geometric cavity, namely the passive laser gyroscope. In order to enable laser beams emitted from a gain medium of the passive laser gyroscope to smoothly enter the geometric cavity, precise drilling on the geometric cavity of a meter level is required.
In the prior art, after the grinding and polishing of six (or more) surfaces of a cavity are usually completed, a central hole is firstly processed, the central hole is installed on a workpiece shaft of a processing device, and then the processing of a light path hole is respectively performed according to a program by using the central hole as a positioning reference. Unlike the active cavity, the passive laser gyroscope is not applicable to the method using the center hole positioning as the reference, and the processing method is different. At present, no method for precisely forming and punching a large-size (for example, 360mm × 360mm × 50mm) passive laser gyroscope cavity larger than 100mm exists.
Disclosure of Invention
In view of the above defects or shortcomings in the prior art, the present invention aims to provide a gyro cavity hole path processing method based on a passive laser gyro, which determines a processing reference suitable for a passive laser gyro cavity, ensures consistency and reliability of porous drilling and milling through corresponding drilling and milling, and realizes precise shaping of the passive large-size gyro cavity and precise manufacturing of a light path hole.
In order to achieve the above purpose, the embodiment of the invention adopts the following technical scheme:
the embodiment of the invention provides a gyro cavity hole path processing method based on a passive laser gyro, which comprises the following steps:
step S1, any large end face of the grinding and polishing cavity is a reference face, the reference face is a square with four sides in a concave shape, and the precision requirement is met;
step S2, vertically placing the cavity on a workbench, fixing the cavity to measure and adjust the cavity reference surface and angle, drilling and milling eight light path holes on a square reference surface with four sides in a concave shape by using a diamond drill with a first preset diameter, wherein the eight light path holes penetrate through eight protruding parts in the shape of the four concave shapes and are intersected vertically in pairs at the four corners of the square;
step S3, horizontally placing the cavity on a workbench, fixing the cavity in a non-working area, measuring and adjusting the angle of the cavity, cutting the allowance of the surface angle of the patch by using a diamond saw blade, and milling the surface of the patch by using a diamond grinding wheel until the distance between the surface of the patch and the intersection point of two light path holes at a right angle reaches a preset thickness;
step S4, fixing an abrasive hollow drill bit by using a diamond with a first preset diameter, and drilling and milling four functional holes along a square diagonal line of a large end surface to the circumference of a preset central hole by taking the intersection point of two light path holes at a right angle as a starting point;
step S5, flatly placing the cavity on a workbench, padding a circular glass cushion plate between the cavity and the workbench, fixing the glass cushion plate and the cavity on the workbench in a non-working area, and measuring and adjusting the coordinates and the angle of the cavity to ensure that the center of the glass cushion plate coincides with the center of the large end face;
step S6, uniformly and distributively drilling and milling a plurality of process holes by using a diamond drill in a circular area which takes the center of the large end face as the circle center and is preset with the radius of a central hole, then milling and milling the process holes layer by using an electroplated diamond grinding wheel until the plurality of process holes form the central hole with the preset radius, and chamfering, wherein the central hole is communicated with the functional hole;
and step S7, drilling and milling the mounting hole and chamfering the mounting hole.
In a preferred embodiment of the present invention, the diamond bit with the preset diameter is selected according to the size of the reference surface, and the diamond bit is a diamond fixed abrasive hollow bit.
In a preferred embodiment of the present invention, the accuracy in step S1 is required to be 3 or more in the accuracy of the inner surface shape of the end face with an arbitrary diameter Φ 100 mm.
As a preferred embodiment of the present invention, the accuracy requirement further includes that the surface defect grade is B ═ IV.
As a preferred embodiment of the invention, the measuring tool is a dial indicator.
As a preferred embodiment of the present invention, the predetermined thickness of step S3 is 0.2 mm.
As a preferred embodiment of the present invention, in step S6, a plurality of process holes are uniformly and distributively drilled and milled by using a diamond bit with a second preset diameter and a diamond bit with a first preset diameter, respectively.
In a preferred embodiment of the present invention, the drilling and milling of the mounting hole uses a diamond drill with a third preset diameter, and a through hole is drilled and milled in the center of four regular triangles of the square large end surface, and is chamfered.
As a preferred embodiment of the present invention, after step S7, the method for machining a hole path further includes:
and step S8, measuring indexes of the cavity by using a universal tool microscope.
As a preferred embodiment of the invention, the external dimension of the gyroscope cavity is 360mm multiplied by 50mm, the lengths of the light path hole and the functional hole are respectively 300mm and 424.2mm, and the diameters are phi 12 mm; the coplanarity degree of the axes of the light path holes is less than or equal to 0.1 mm; the perpendicularity between the four patch surfaces and the reference surface is not more than 3 arc seconds.
The invention has the following beneficial effects:
the gyro cavity hole path processing method based on the passive laser gyro is used for precisely processing the structural dimension of a large-size laser gyro cavity, ensures the precision of the external dimension of the gyro cavity, the angular precision, the coplanar precision and other position precision of various apertures by adopting tools such as a diamond fixed abrasive hollow drill bit, a grinding wheel and the like which are suitable for precisely forming the external dimension of the large-size laser gyro cavity and processing a light path hole, completes the precise forming of the external dimension of the gyro cavity and the precise processing of the light path hole, has stable processing quality, improves the processing efficiency and reduces the processing cost at the same time.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments made with reference to the following drawings:
fig. 1 is a flowchart of a method for processing a cavity hole of a gyroscope based on a passive laser gyroscope according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a reference plane of a gyroscope cavity in an embodiment of the invention;
FIG. 3 is a schematic diagram of a gyroscope cavity light path hole drilling and milling in the first embodiment of the present invention;
FIG. 4 is a top view of the positioning of the facing surface of the gyroscope cavity according to the first embodiment of the present invention;
FIG. 5 is a front view of a top cavity patch plane cut in the first embodiment of the present invention;
FIG. 6 is a schematic diagram illustrating milling allowance of a slice surface of a gyroscope cavity according to a first embodiment of the present invention;
FIG. 7 is a schematic diagram of a drilling and milling of a functional hole of a gyroscope cavity according to a first embodiment of the present invention;
FIG. 8 is a top view of a top cavity center hole drilling and milling in a first embodiment of the present invention;
fig. 9 is a front view of a top cavity center hole drilling and milling in the first embodiment of the invention.
Description of reference numerals:
1-a cavity; 2-a glass gasket; 3, pressing a plate; 4-diamond cutters; 5-positioning a block; 6-a workbench; 7-saw handle; 8-a saw blade; 9-sticking the surface; 10-glass backing plate.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
The invention provides a method for processing a large-size gyroscope cavity light path hole, aiming at manufacturing of a passive laser gyroscope. The invention is in the processing process of the laser gyroscope, has no special requirement on the selection of materials, and the material of the cavity can be microcrystalline glass or transparent ceramic for laser. In the present embodiment, a microcrystalline glass is described as an example, but the present invention is not limited thereto. The large-size laser gyroscope has a gyroscope cavity usually larger than 100mm, such as 300mm or 360mm, and is used in the fields of navigation, earth operation parameter monitoring and the like.
Fig. 1 shows a flow of a gyro cavity hole path processing method based on a passive laser gyro in an embodiment of the invention. As shown in fig. 1, the method for processing the cavity hole of the gyroscope includes the following steps:
and step S1, taking any large end face of the grinding and polishing cavity as a reference surface, wherein the reference surface is a square with four concave sides and meets the precision requirement.
In this step, the accuracy requirement is determined according to the use condition or requirement of the gyroscope. Preferably, the accuracy requirement is: the precision of the inner surface shape of the aperture with the arbitrary diameter phi of 100mm of the end face reaches N to 3.
Fig. 2 is a schematic diagram of a reference surface of the gyroscope cavity in this step. As shown in fig. 2, the big end surface of the gyroscope cavity is square, the four sides are concave, and eight protruding parts of the four concave shapes are punching holes of the light path hole. The side length of a large-end-face square of a passive laser gyroscope is typically on the order of meters greater than 100mm, for example, 300mm on a side and 38mm in thickness, or 360mm on a side and 50mm in thickness.
Preferably, the step may also add requirements on the accuracy of the reference plane, for example, the surface defect grade is B ═ IV.
Step S2, vertically placing the cavity on a workbench, fixing the cavity to measure and adjust the cavity reference surface and angle, drilling and milling eight light path holes on the square reference surface with four sides in a concave shape by using a diamond drill with a first preset diameter, wherein the eight light path holes penetrate through the eight protruding parts in the shape of the concave shape, and are intersected every two perpendicularly at the four corners of the square.
In order to realize the precise processing of a precise instrument, high-precision measuring tools such as a lever dial indicator and a screw micrometer are adopted for the measurement in the embodiment; preferably a dial gauge.
In this step, the diamond bit with the first preset diameter is selected according to the size of the large end face, and the diamond bit is a diamond fixed abrasive hollow bit. The diamond-fixed abrasive hollow drill bit is adopted, so that the precise processing of the cavity can be realized, the material can not be damaged, and microcracks generated in the material due to drilling vibration are reduced. The diamond drill bits used subsequently are preferably diamond-bonded abrasive hollow drill bits.
Step S3, the cavity is horizontally placed on the workbench, the cavity is fixed in a non-working area, the angle of the cavity is measured and adjusted, the margin of the surface angle of the patch is cut by a diamond saw blade, and the distance from the surface of the patch to the intersection point of the two light path holes at the right angle reaches the preset thickness d by a diamond grinding wheel.
And step S4, fixing the abrasive hollow drill bit by using the diamond with the first preset diameter, and drilling and milling four functional holes along the circumference of the preset central hole along the diagonal line of the square of the large end face by taking the intersection point of the two light path holes at the right angle as a starting point.
Step S5, the cavity is flatly placed on the workbench, a round glass pad is arranged between the cavity and the workbench, the glass pad and the cavity are fixed on the workbench in a non-working area, and the coordinate and the angle of the cavity are measured and adjusted, so that the center of the glass pad coincides with the center of the large end face.
Step S6, uniformly and distributively drilling and milling a plurality of process holes by using a diamond drill bit with a second preset diameter and a diamond drill bit with a first preset diameter in a circular area with the center of the large end face as the circle center and the radius of a preset central hole, and then milling and grinding the process holes layer by using an electroplated diamond grinding wheel until the plurality of process holes form the central hole with the preset radius, and chamfering, wherein the central hole is communicated with the functional hole.
And step S7, drilling and milling the mounting hole and chamfering the mounting hole.
In this step, the drilling and milling of the mounting hole is performed by using a diamond drill with a third preset diameter, and drilling and milling a through hole and chamfering are performed at four regular three-shaped centers of the square large end face.
After step S7, the method for machining a hole path may further include:
and step S8, checking. And measuring each index of the cavity by using a universal tool microscope to determine whether the index meets the requirement.
The invention will now be described in more detail by means of two specific embodiments, with reference to the accompanying drawings.
First embodiment
The embodiment provides a gyro cavity hole path processing method based on a passive laser gyro. The gyroscope cavity processed by the embodiment is a square cavity with an end face of 360mm multiplied by 360mm and a thickness of 50mm, and four sides of the square control body are in a concave shape. In the embodiment, a large passive laser gyroscope for measuring earth rotation is taken as an example, the overall dimension of a cavity is 360mm × 360mm × 50mm, the lengths of a light path hole and a functional hole are respectively 300mm and 424.2mm, and the large length-diameter ratio of the diameter phi 12mm is obtained; the coplanarity degree of the axes of the light path holes is less than or equal to 0.1 mm; the perpendicularity between the four patch surfaces and the reference surface is not more than 3 arc seconds.
In the embodiment, four 300mm light path holes are respectively decomposed into two parts of 100 mm; a center hole with the diameter phi of 100mm is processed in the center of the cavity, so that a 424.2mm functional hole is divided into two parts of 162.1mm, the punching difficulty is reduced, and the index requirements of the whole angle, coplanarity and the like of the cavity are met. After the cavity is finished, the diameter is 360mm multiplied by 360mm2On the basis of the precise grinding and polishing of the reference surface, a numerical control machining center is adopted as a machining main body device, a rigid fixture is used for precise positioning and clamping, and a diamond fixed abrasive hollow drill bit tool is used for finally finishing precise punching and forming of the cavity.
The hole path processing method comprises the following steps:
step S101, grinding and polishing the large end face of 360 multiplied by 360 as a reference surface. One of two 360 multiplied by 360 large end faces of a grinding cavity is used as a reference plane U, a ring polishing machine is used for polishing the reference plane, the surface shape precision is that N is 3 in a caliber with any diameter phi of 100mm, and the surface defect grade is B is IV.
Step S102, vertically placing the cavity on a workbench, fixing the cavity in a non-working area by using a fixture, measuring and adjusting a cavity reference surface and an angle by using a lever dial indicator, fixing an abrasive hollow drill by using a phi 10mm diamond, drilling and milling four phi 10mm through holes penetrating through the protruding parts in sequence at eight protruding parts in a shape like a Chinese character 'ao', wherein the total length is 50mm, and milling and grinding 4-5 mm chamfers by using a 45-degree electroplated diamond grinding wheel.
As shown in fig. 3, since the cavity 1 is vertically placed on the table 6, the pressing plate 3 of the jig clamps the concave lower protruding portion of the cavity 1 from the left and right sides, and the drill is caused to drill a through hole from the upper protruding portion to the concave upper protruding portion from the top. The reference surface and the angle of the measuring cavity are adjusted by a lever dial indicator (the A axis direction cannot be adjusted by rotating the turntable, and equal-thickness capacitance paper needs to be padded below the cavity for adjustment). And (3) sticking a round glass gasket 2 with the diameter of 30mm to the outlet of the through hole to be processed by paraffin to prevent the edge from being broken at the outlet. And (3) drilling and milling a bottom hole to the length of 44mm by using the phi 12mm short diamond fixed abrasive hollow drill bit 4, replacing a phi 12mm long drill, and continuously drilling and milling the hole to reach the through hole with the total length of 136 mm. And unloading the workpiece and cleaning. The step is repeated for seven times to finish the drilling and milling of the other seven light path holes.
And step S103, precisely milling four patch surfaces. The cavity 1 is flatly placed on a workbench 6, as shown in fig. 4, the cavity is fixed at three points a, B and c by a pressing plate 3 of a clamp, three supported and positioned polytetrafluoroethylene material cylinder positioning blocks 5 are fixed at three points d, e and f, and the directions of an axis A and an axis B of the angle of the cavity are adjusted and measured by a lever dial indicator. As shown in fig. 5, the B axis of the worktable is rotated by 90 degrees, the coordinates (marked in the figures of C, X, Y, and Z) of the measurement cavity are adjusted by a dial indicator, the margin of the surface angle of the patch is cut by a diamond saw blade 8 with phi 125mm installed on the saw handle 7, and the surface of the patch is milled by a diamond grinding wheel with phi 100mm to the position with the distance of 10mm from the intersection point of the two light path holes shown in fig. 4. As shown in fig. 6, the actual distance d from the intersection point of the light path hole to the milling surface is measured by a universal tool microscope, the depth of the milling surface is adjusted by the detected actual data, and the patch surface is milled until the distance d from the intersection point of the capillary hole is 0.2 mm.
And step S104, drilling and milling four 45-degree inclined long functional holes.
As shown in fig. 7, after finishing milling the patch surface 9, four 45-degree oblique long functional holes are drilled and milled by a diamond fixed abrasive hollow drill with the diameter of 12mm, the drilling and milling depth of the short positioning hollow drill is firstly 20mm, and then the drilling and milling depth of the long drill is changed to 165 mm. And milling and grinding a 0.5-1 mm chamfer angle by using a 45-degree electroplated diamond grinding wheel. Repeating the step three times to finish the drilling and milling of the other three inclined long functional holes.
And S105, positioning before drilling and milling the central hole. As shown in fig. 8, the cavity is flatly placed on the workbench, a round glass pad plate with the diameter of 250mm is arranged between the cavity and the workbench, the glass pad plate 10 and the cavity 1 are fixed on the workbench 6 by pressing plates 3 of clamps at four large edges a, b, c and d of the cavity, and the coordinates and angles of the cavity are adjusted and measured by a dial indicator.
And step S106, drilling and milling a central hole with the diameter of phi 100 mm. As shown in fig. 8 and fig. 9, twelve fabrication holes are drilled and milled by using diamond fixed abrasive hollow drill bits with the diameter of 50mm and 12mm respectively, and then a central hole is milled and milled layer by using an electroplated diamond grinding wheel with the diameter of 37mm to the diameter of 100mm and chamfered.
And step S107, drilling and milling four phi 10mm mounting holes and chamfering.
Four phi 10mm through holes are drilled and milled by a phi 10mm diamond fixed abrasive hollow drill bit to serve as mounting holes, the total length is 50mm, and a 4-5 mm chamfer is milled and milled by a 45-degree electroplated diamond grinding wheel. And (5) repeating the step five, clamping and adjusting the part, and processing four chamfers with phi 10mm through holes with the depth of 5 mm.
After step S107, the method for machining a via may further include:
and step S108, checking. And measuring various indexes of the cavity by using a universal tool microscope.
Step S109, the process is switched. And (5) packaging the qualified cavity, then putting the cavity into a packaging box, and rotating the surface of the patch to grind and polish.
Second embodiment
The embodiment provides a gyro cavity hole path processing method based on a passive laser gyro. The method for processing the hole path in this embodiment is basically the same as that in the first embodiment, except that the sizes of the gyroscope cavities processed by the hole path and the gyroscope cavities processed by the hole path are different from each other in the selected parameters. The external dimension of the gyroscope cavity processed in the first embodiment is 360mm multiplied by 50mm, the external dimension of the gyroscope cavity processed in the embodiment is 300mm multiplied by 40mm, the lengths of the light path hole and the functional hole are 240mm and 336mm respectively, and the large length-diameter ratio of the diameter phi 11mm is obtained; the coplanarity degree of the axes of the light path holes is less than or equal to 0.1 mm; the perpendicularity between the four patch surfaces and the reference surface is not more than 3 arc seconds.
The foregoing description is only exemplary of the preferred embodiments of the invention and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the invention herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of the above features or their equivalents without departing from the spirit of the invention. For example, the above features and (but not limited to) features having similar functions disclosed in the present invention are mutually replaced to form the technical solution.
Claims (10)
1. A gyro cavity hole path processing method based on a passive laser gyro is characterized by comprising the following steps:
step S1, any large end face of the grinding and polishing cavity is a reference face, the reference face is a square with four sides in a concave shape, and the precision requirement is met;
step S2, vertically placing the cavity on a workbench, fixing the cavity to measure and adjust the cavity reference surface and angle, drilling and milling eight light path holes on a square reference surface with four sides in a concave shape by using a diamond drill with a first preset diameter, wherein the eight light path holes penetrate through eight protruding parts in the shape of the four concave shapes and are intersected vertically in pairs at the four corners of the square;
step S3, horizontally placing the cavity on a workbench, fixing the cavity in a non-working area, measuring and adjusting the angle of the cavity, cutting the allowance of the surface angle of the patch by using a diamond saw blade, and milling the surface of the patch by using a diamond grinding wheel until the distance between the surface of the patch and the intersection point of two light path holes at a right angle reaches a preset thickness;
step S4, fixing an abrasive hollow drill bit by using a diamond with a first preset diameter, and drilling and milling four functional holes along a square diagonal line of a large end surface to the circumference of a preset central hole by taking the intersection point of two light path holes at a right angle as a starting point;
step S5, flatly placing the cavity on a workbench, padding a circular glass cushion plate between the cavity and the workbench, fixing the glass cushion plate and the cavity on the workbench in a non-working area, and measuring and adjusting the coordinates and the angle of the cavity to ensure that the center of the glass cushion plate coincides with the center of the large end face;
step S6, uniformly and distributively drilling and milling a plurality of process holes by using a diamond drill in a circular area which takes the center of the large end face as the circle center and is preset with the radius of a central hole, then milling and milling the process holes layer by using an electroplated diamond grinding wheel until the plurality of process holes form the central hole with the preset radius, and chamfering, wherein the central hole is communicated with the functional hole;
and step S7, drilling and milling the mounting hole and chamfering the mounting hole.
2. The method for machining the hole of the gyroscope cavity according to claim 1, wherein the diamond drill bit with the preset diameter is selected according to the size of the reference surface, and is a diamond fixed abrasive hollow drill bit.
3. The method for processing the hole of the gyroscope cavity according to claim 1, wherein the precision requirement in step S1 is that the precision of the inner surface shape of the end face with the diameter of 100mm is N-3.
4. The method according to claim 3, wherein the accuracy requirement further comprises that the surface defect grade reaches B-IV.
5. The method for machining the hole path of the gyroscope cavity according to claim 1, wherein a measuring tool adopts a dial indicator.
6. The method for processing the hole of the gyroscope cavity according to claim 1, wherein the predetermined thickness of the step S3 is 0.2 mm.
7. The method for processing the hole path of the gyroscope cavity according to claim 1, wherein in the step S6, a plurality of process holes are uniformly and distributively drilled and milled by using a diamond drill bit with a second preset diameter and a diamond drill bit with a first preset diameter respectively.
8. The method for machining the hole of the gyroscope cavity according to claim 1, wherein a diamond drill with a third preset diameter is used for drilling and milling a through hole in the centers of four isosceles right triangles with a square large end face and chamfering the through hole.
9. The gyro cavity hole path processing method according to any one of claims 1 to 8, wherein after step S7, the hole path processing method further includes:
and step S8, measuring indexes of the cavity by using a universal tool microscope.
10. The method for processing the hole of the gyroscope cavity according to claim 8, wherein the external dimension of the gyroscope cavity is 360mm x 50mm, the lengths of the light path hole and the functional hole are respectively 300mm and 424.2mm, and the diameters of the light path hole and the functional hole are phi 12 mm; the coplanarity degree of the axes of the light path holes is less than or equal to 0.1 mm; the perpendicularity between the four patch surfaces and the reference surface is not more than 3 arc seconds.
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| US6704111B2 (en) * | 2001-09-11 | 2004-03-09 | Honeywell International Inc. | High temperature electrode seal in a ring laser gyro |
| JP4502931B2 (en) * | 2005-10-24 | 2010-07-14 | 日本航空電子工業株式会社 | Ring laser gyro |
| CN202053155U (en) * | 2011-03-08 | 2011-11-30 | 中国航天科工集团第三研究院第八三五八研究所 | Tool used for laser gyro cavity optical processing |
| CN104708524B (en) * | 2013-12-11 | 2017-10-31 | 中国航空工业第六一八研究所 | A kind of laser gyro cavity aperture polishing method |
| CN106624644B (en) * | 2016-12-21 | 2018-08-03 | 北京航天新风机械设备有限责任公司 | Ferrite-plate class structural features processing method and its tooling containing elongated inclined hole feature |
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