CN114290538A - Method for processing diaphragm hole of cavity of laser gyroscope - Google Patents
Method for processing diaphragm hole of cavity of laser gyroscope Download PDFInfo
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- CN114290538A CN114290538A CN202111436395.6A CN202111436395A CN114290538A CN 114290538 A CN114290538 A CN 114290538A CN 202111436395 A CN202111436395 A CN 202111436395A CN 114290538 A CN114290538 A CN 114290538A
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Abstract
The invention relates to a processing method of a diaphragm hole of a cavity of a laser gyroscope, which comprises the following steps: s1, oppositely machining the capillary holes M1 and the capillary holes M2 on two opposite surfaces of the material to be machined along the same axis; the length and the pore diameter of the capillary hole M1 and the capillary hole M2 are equal, and the capillary hole M1 and the capillary hole M2 are blind holes; s2, drilling round holes at the bottoms of the capillary hole M1 and the capillary hole M2 respectively to penetrate through the capillary hole M1 and the capillary hole M2; the pore diameter of the round hole is smaller than that of the capillary hole M1 or the capillary hole M2; and S3, respectively milling round holes at the bottoms of the capillary holes M1 and the capillary holes M2 into elliptical holes meeting the requirements, namely diaphragm holes. The method of drilling capillary holes, flattening the bottom, pre-drilling round holes and milling holes is adopted, so that the errors of the shape and the position of the diaphragm hole can be effectively avoided.
Description
Technical Field
The invention relates to the technical field of optical device processing, in particular to a processing method of a diaphragm hole of a cavity of a laser gyroscope.
Background
The laser gyroscope cavity generally adopts hard and brittle optical materials with extremely low expansion coefficient, such as microcrystalline glass and quartz glass, the diaphragm hole is required to be an elliptical small hole and is positioned in the center of the cavity, and the shape and position precision requirements are high, so that the diaphragm hole is the core for processing the laser gyroscope cavity.
Because the diaphragm hole is an elliptical small hole, the processing difficulty is higher, and the size precision and the position precision are difficult to guarantee. In order to reduce the processing difficulty of the diaphragm hole, the diaphragm hole is usually processed into a circular shape or a kidney shape, but the design requirement of the laser gyro is deviated, and the precision of the laser gyro is reduced. Therefore, the key point of ensuring the precision of the laser gyroscope is realized by processing the diaphragm hole of the cavity of the high-precision elliptical laser gyroscope.
Disclosure of Invention
Aiming at the technical problems in the prior art, the invention provides a processing method of a diaphragm hole of a cavity of a laser gyroscope, which comprises the following steps:
s1, oppositely machining the capillary holes M1 and the capillary holes M2 on two opposite surfaces of the material to be machined along the same axis; the length and the pore diameter of the capillary hole M1 and the capillary hole M2 are equal, and the capillary hole M1 and the capillary hole M2 are blind holes;
s2, drilling round holes at the bottoms of the capillary hole M1 and the capillary hole M2 respectively to penetrate through the capillary hole M1 and the capillary hole M2; the pore diameter of the round hole is smaller than that of the capillary hole M1 or the capillary hole M2;
and S3, respectively milling round holes at the bottoms of the capillary holes M1 and the capillary holes M2 into elliptical holes meeting the requirements, namely diaphragm holes.
Further, the processing method of the capillary M1 or the capillary M2 comprises:
drilling an annular groove on a processing surface of a material to be processed by using a diamond drill bit; breaking off and removing the cylinder in the annular groove to form capillary pores; and then the bottom bulge of the capillary hole is ground flat by using a diamond grinding head.
Further, the round holes at the bottoms of the capillary holes M1 and the capillary holes M2 are milled into elliptical holes meeting the requirements, respectively, and the method includes:
firstly, roughly milling the round hole into an elliptical hole by using a small-caliber diamond grinding rod, and then finely milling the elliptical hole obtained by rough milling by using a large-caliber diamond grinding rod to obtain the elliptical hole meeting the requirements.
Further, the material to be processed is a hard and brittle material, and comprises microcrystalline glass, quartz glass, sapphire crystals and ceramics.
The invention has the beneficial effects that: the laser gyroscope cavity generally adopts hard and brittle optical materials with extremely low expansion coefficient, such as microcrystalline glass and quartz glass, the diaphragm hole is generally an elliptical small hole and is positioned in the center of the cavity, and the requirements on shape and position accuracy are high, so that the diaphragm hole is the core for processing the laser gyroscope cavity.
The invention successfully solves the technical problem of processing the diaphragm hole of the cavity of the laser gyroscope and realizes the processing of the diaphragm hole with the depth, the small size and the ellipse inside the microcrystalline glass.
The method of drilling the capillary hole, flattening the bottom, pre-drilling the round hole, roughly milling the diaphragm hole and finely milling the diaphragm hole is adopted, so that the problem of errors of the shape and the position of the diaphragm hole can be effectively avoided.
Drawings
FIG. 1 is a schematic flow chart of a processing method according to an embodiment of the present invention;
fig. 2 to 11 are schematic views of processing corresponding to each processing step in sequence.
In the drawings, the components represented by the respective reference numerals are listed below:
1. the laser gyroscope comprises a laser gyroscope cavity, 2 capillary holes M1, 3, a glass column, 4 protrusions, 5 circular holes, 6 capillary holes M2, 7, a glass column, 8 protrusions, 9 circular holes, 10 elliptical holes.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1, an embodiment of the present invention provides a method for processing a diaphragm hole of a cavity of a laser gyroscope, including the following steps:
firstly, oppositely processing a capillary hole M1 and a capillary hole M2 on two opposite surfaces of a material to be processed along the same axis; the length and the pore diameter of the capillary hole M1 and the pore diameter M2 are equal, and the capillary hole M1 and the pore diameter M2 are blind holes.
Secondly, drilling round holes at the bottoms of the capillary hole M1 and the capillary hole M2 to penetrate through the capillary hole M1 and the capillary hole M2; the pore diameter of the round hole is smaller than that of the capillary hole M1 or the capillary hole M2.
When the round hole is pre-drilled, a through round hole can be directly drilled from the bottom of the capillary hole M1 or the bottom of the capillary hole M2 by the conventional method, however, the taper of the edge of the round hole does not meet the precision requirement, and the problem of edge breakage can be caused by drilling the through round hole at one time. The above problem can be solved by drilling round holes at the bottom of the capillary hole M1 and the capillary hole M2.
Then, round holes at the bottoms of the capillary holes M1 and the capillary holes M2 are milled into elliptical holes, i.e., diaphragm holes, meeting the requirements.
By the method, the processing of the elliptical diaphragm hole with phi 1-phi 10mm and depth of 1-200 mm can be realized. The processing of the cavity diaphragm holes of the laser gyros of different models such as 20 models, 30 models, 50 models, 70 models, 90 models, 120 models, 150 models, 180 models and the like can be realized. The diamond bit and the diamond grinding rod can be a diamond tool, a diamond sand tool and the like. The cavity can be made of hard and brittle materials such as microcrystalline glass, quartz glass, sapphire crystals, ceramics and the like.
Specifically, in the embodiment of the present invention, the processing method is described in detail by taking an example of processing a 90-type diaphragm aperture with a diaphragm aperture size of 1.7 × 2.0 mm. The processing method comprises the following steps:
step S1, machining a capillary hole M1(2) with the diameter of 3.5mm on the cavity (1) of the laser gyro by adopting a diamond drill with the diameter of 3.5mm, wherein the machining depth is 33 mm; as shown in fig. 2.
Step S2, breaking off and removing the glass column (3) in the capillary hole M1 (2); as shown in fig. 3.
Step S3: a diamond grinding head with the phi of 3.4mm is adopted to grind the bottom protrusion (4) of the capillary hole M1(2) flat, and the processing depth is 35 mm; as shown in fig. 4.
Step S4: pre-drilling a phi 1.5mm round hole (5) at the bottom of the capillary hole M1(2) by adopting a phi 1.5mm diamond drill bit, and processing the depth to be 2 mm; as shown in fig. 5.
Step S5: rotating the cavity by 180 degrees, and machining a capillary hole M2(6) with the diameter of 3.5mm in the cavity (1) of the laser gyro by adopting a diamond drill with the diameter of 3.5mm, wherein the machining depth is 33 mm; as shown in fig. 6.
Step S6: breaking off and removing the glass column (7) in the capillary M2 (6); as shown in fig. 7.
Step S7: a diamond grinding head with the phi of 3.4mm is adopted to grind the bottom bulge (8) of the capillary hole M2(6) flat, and the processing depth is 35 mm; as shown in fig. 8.
Step S8: pre-drilling a phi 1.5mm round hole (9) at the bottom of the capillary hole M2(6) by adopting a phi 1.5mm diamond drill bit, and processing the depth to be 2 mm; as shown in fig. 9.
And step 9: roughly milling a round hole (9) with the diameter of 1.5mm into an elliptical hole (10) with the diameter of 1.6 multiplied by 1.9mm by adopting a diamond grinding rod with the diameter of 1.1mm, and processing the elliptical hole with the depth of 4 mm; as shown in fig. 10.
Step 10: adopting a diamond grinding rod with the diameter of 1.2mm to finely mill an elliptical hole with the diameter of 1.6 multiplied by 1.9mm into an elliptical hole with the diameter of 1.7 multiplied by 2.0mm, and processing the elliptical hole with the depth of 4 mm; as shown in fig. 11.
Step 11: the cavity is rotated by 180 degrees, and an elliptical hole with the machining depth of 4mm is milled by adopting a diamond grinding rod with the diameter of 1.2mm, wherein the elliptical hole is 1.7 multiplied by 2.0mm, and the machining depth is shown in figure 11.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (4)
1. A processing method of a diaphragm hole of a cavity of a laser gyroscope is characterized by comprising the following steps:
s1, oppositely machining the capillary holes M1 and the capillary holes M2 on two opposite surfaces of the material to be machined along the same axis; the length and the pore diameter of the capillary hole M1 and the capillary hole M2 are equal, and the capillary hole M1 and the capillary hole M2 are blind holes;
s2, drilling round holes at the bottoms of the capillary hole M1 and the capillary hole M2 respectively to penetrate through the capillary hole M1 and the capillary hole M2; the pore diameter of the round hole is smaller than that of the capillary hole M1 or the capillary hole M2;
and S3, respectively milling round holes at the bottoms of the capillary holes M1 and the capillary holes M2 into elliptical holes meeting the requirements, namely diaphragm holes.
2. The method of claim 1, wherein the processing of the capillary M1 or the capillary M2 comprises:
drilling an annular groove on a processing surface of a material to be processed by using a diamond drill bit; breaking off and removing the cylinder in the annular groove to form capillary pores; and then the bottom bulge of the capillary hole is ground flat by using a diamond grinding head.
3. The method as claimed in claim 1, wherein the milling of the round holes at the bottom of the capillary hole M1 and the capillary hole M2 into elliptical holes according to the requirement comprises:
firstly, roughly milling the round hole into an elliptical hole by using a small-caliber diamond grinding rod, and then finely milling the elliptical hole obtained by rough milling by using a large-caliber diamond grinding rod to obtain the elliptical hole meeting the requirements.
4. The method according to claim 1, wherein the material to be processed is a hard and brittle material, including microcrystalline glass, quartz glass, sapphire crystal, and ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111436395.6A CN114290538A (en) | 2021-11-26 | 2021-11-26 | Method for processing diaphragm hole of cavity of laser gyroscope |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111436395.6A CN114290538A (en) | 2021-11-26 | 2021-11-26 | Method for processing diaphragm hole of cavity of laser gyroscope |
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| Publication Number | Publication Date |
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| CN114290538A true CN114290538A (en) | 2022-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111436395.6A Pending CN114290538A (en) | 2021-11-26 | 2021-11-26 | Method for processing diaphragm hole of cavity of laser gyroscope |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115574800A (en) * | 2022-12-06 | 2023-01-06 | 天津集智航宇科技有限公司 | Laser gyroscope with fitting type diaphragm |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE8632363U1 (en) * | 1986-12-03 | 1988-05-11 | Eischeid, Karl, 5250 Engelskirchen, De | |
| CN101131470A (en) * | 2007-09-21 | 2008-02-27 | 北京工业大学 | Diaphragm ultraviolet laser micromachining system used for scanning electron microscope and method thereof |
| CN104708524A (en) * | 2013-12-11 | 2015-06-17 | 中国航空工业第六一八研究所 | Polishing method of laser gyroscope cavity diaphragm hole |
| CN112276481A (en) * | 2020-09-22 | 2021-01-29 | 天津津航技术物理研究所 | Gyro cavity hole path processing method based on passive laser gyroscope |
| CN112304332A (en) * | 2019-07-24 | 2021-02-02 | 国宏华业投资有限公司 | Method for processing gyroscope cavity |
-
2021
- 2021-11-26 CN CN202111436395.6A patent/CN114290538A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE8632363U1 (en) * | 1986-12-03 | 1988-05-11 | Eischeid, Karl, 5250 Engelskirchen, De | |
| CN101131470A (en) * | 2007-09-21 | 2008-02-27 | 北京工业大学 | Diaphragm ultraviolet laser micromachining system used for scanning electron microscope and method thereof |
| CN104708524A (en) * | 2013-12-11 | 2015-06-17 | 中国航空工业第六一八研究所 | Polishing method of laser gyroscope cavity diaphragm hole |
| CN112304332A (en) * | 2019-07-24 | 2021-02-02 | 国宏华业投资有限公司 | Method for processing gyroscope cavity |
| CN112276481A (en) * | 2020-09-22 | 2021-01-29 | 天津津航技术物理研究所 | Gyro cavity hole path processing method based on passive laser gyroscope |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115574800A (en) * | 2022-12-06 | 2023-01-06 | 天津集智航宇科技有限公司 | Laser gyroscope with fitting type diaphragm |
| CN115574800B (en) * | 2022-12-06 | 2023-03-07 | 天津集智航宇科技有限公司 | Laser gyroscope with fitting type diaphragm |
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