CN112271214A - 带有屏蔽栅结构的igbt器件及制造方法 - Google Patents
带有屏蔽栅结构的igbt器件及制造方法 Download PDFInfo
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- CN112271214A CN112271214A CN202011297128.0A CN202011297128A CN112271214A CN 112271214 A CN112271214 A CN 112271214A CN 202011297128 A CN202011297128 A CN 202011297128A CN 112271214 A CN112271214 A CN 112271214A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 210000000746 body region Anatomy 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229920005591 polysilicon Polymers 0.000 claims description 24
- 238000000151 deposition Methods 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 15
- 239000012535 impurity Substances 0.000 claims description 12
- 150000002500 ions Chemical class 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000005286 illumination Methods 0.000 claims description 3
- 238000001259 photo etching Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 238000010992 reflux Methods 0.000 claims description 3
- 238000009826 distribution Methods 0.000 abstract description 2
- 230000005684 electric field Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42356—Disposition, e.g. buried gate electrode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202011297128.0A CN112271214A (zh) | 2020-11-19 | 2020-11-19 | 带有屏蔽栅结构的igbt器件及制造方法 |
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CN202011297128.0A CN112271214A (zh) | 2020-11-19 | 2020-11-19 | 带有屏蔽栅结构的igbt器件及制造方法 |
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CN112271214A true CN112271214A (zh) | 2021-01-26 |
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CN202011297128.0A Pending CN112271214A (zh) | 2020-11-19 | 2020-11-19 | 带有屏蔽栅结构的igbt器件及制造方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113097297A (zh) * | 2021-03-26 | 2021-07-09 | 上海埃积半导体有限公司 | 功率器件结构及制作方法 |
CN113838915A (zh) * | 2021-09-23 | 2021-12-24 | 电子科技大学 | 一种沟槽栅电荷存储型igbt及其制作方法 |
CN113838917A (zh) * | 2021-09-23 | 2021-12-24 | 电子科技大学 | 一种三维分离栅沟槽电荷存储型igbt及其制作方法 |
-
2020
- 2020-11-19 CN CN202011297128.0A patent/CN112271214A/zh active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113097297A (zh) * | 2021-03-26 | 2021-07-09 | 上海埃积半导体有限公司 | 功率器件结构及制作方法 |
CN113838915A (zh) * | 2021-09-23 | 2021-12-24 | 电子科技大学 | 一种沟槽栅电荷存储型igbt及其制作方法 |
CN113838917A (zh) * | 2021-09-23 | 2021-12-24 | 电子科技大学 | 一种三维分离栅沟槽电荷存储型igbt及其制作方法 |
CN113838915B (zh) * | 2021-09-23 | 2023-03-28 | 电子科技大学 | 一种沟槽栅电荷存储型igbt及其制作方法 |
CN113838917B (zh) * | 2021-09-23 | 2023-03-28 | 电子科技大学 | 一种三维分离栅沟槽电荷存储型igbt及其制作方法 |
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Effective date of registration: 20240613 Address after: 100000 106A, Floor 1, B-1, Zhongguancun Dongsheng Science Park, 66 Xixiaokou Road, Haidian District, Northern Territory, Beijing Applicant after: ZIGUANG TONGXIN MICROELECTRONICS CO.,LTD. Country or region after: China Address before: 214135 Jiangsu Wuxi New District, 200, Linghu Road, China, four floor, D2 International Innovation Park, China sensor network. Applicant before: WUXI UNIGROUP MICROELECTRONICS CO.,LTD. Country or region before: China |