CN112259481B - COB die bonder and COB die bonding method - Google Patents
COB die bonder and COB die bonding method Download PDFInfo
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- CN112259481B CN112259481B CN202011267115.9A CN202011267115A CN112259481B CN 112259481 B CN112259481 B CN 112259481B CN 202011267115 A CN202011267115 A CN 202011267115A CN 112259481 B CN112259481 B CN 112259481B
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- die bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
Abstract
The invention provides a COB die bonder which comprises a machine base, a die bonder workbench movement mechanism, an X-axis linear movement mechanism, a die bonder head capable of realizing linear movement and rotary movement, a die disc and a die disc movement mechanism, wherein the die bonder workbench is arranged on the die bonder workbench movement mechanism, the die bonder workbench movement mechanism is arranged on the machine base, the die bonder head is arranged on the X-axis linear movement mechanism, the X-axis linear movement mechanism is arranged on the machine base, the die disc is arranged on the die disc movement mechanism, the die disc movement mechanism is arranged on the machine base, a die picking image detection mechanism for detecting the position of a wafer is arranged on the X-axis linear movement mechanism, and a thimble mechanism for ejecting the wafer on the die disc is arranged on the machine base. The invention also provides a COB die bonding method. The invention has the beneficial effects that: the production efficiency of die bonding is improved.
Description
Technical Field
The invention relates to a die bonder, in particular to a COB die bonder and a COB die bonding method.
Background
The LED die bonder is a special die bonder for LED products, is controlled by a computer and is provided with an image sensing system, an image sensor scans to determine a correct path, a set programming program is input, and a button is pressed easily, so that the whole working process can be realized: fixing a product needing die bonding on a jig, dispensing red glue, sucking the LED wafer through a suction nozzle, and fixing the LED wafer on the product. It should be noted that the product after solidification is preferably solidified within 1 to 2 hours.
The COB technology is an emerging LED packaging technology, and is different from the traditional SMD positive packaging technology, and is a flip-chip technology, which directly welds the light emitting chip to the PCB. As the size of the LED wafer is reduced, the number of the lamp beads in the same PCB area is increased, and the die bonding is completed as soon as possible after the solder paste is brushed. The COB technique improves screen resolution, reliability, and high color rendition.
The conventional COB die bonder is low in production efficiency and not high in placement precision.
Disclosure of Invention
In order to solve the problems in the prior art, the invention provides a COB die bonder with high production efficiency and a COB die bonding method.
The invention provides a COB die bonder which comprises a machine base, a die bonder workbench movement mechanism, an X-axis linear movement mechanism, a die bonder head capable of realizing linear movement and rotary movement, a wafer disc and a wafer disc movement mechanism, wherein the die bonder workbench movement mechanism is installed on the die bonder workbench movement mechanism, the die bonder workbench movement mechanism is installed on the machine base, the die bonder head is installed on the X-axis linear movement mechanism, the X-axis linear movement mechanism is installed on the machine base, the wafer disc is installed on the wafer disc movement mechanism, the wafer disc movement mechanism is installed on the machine base, a wafer taking image detection mechanism for detecting the position of a wafer is arranged on the X-axis linear movement mechanism, an ejector pin mechanism for ejecting the wafer on the wafer disc is arranged on the machine base, a wafer correction image detection mechanism for detecting the position deviation of the wafer sucked by the die bonder head is arranged on the machine base, and a die bonder image detection mechanism for detecting the die bonder position is arranged on the X-axis linear movement mechanism.
As a further improvement of the invention, the adjustable die bonding table clamps are arranged on the left side and the right side of the die bonding worktable.
As a further improvement of the invention, the adjustable die bonding table clamp comprises a left clamp baffle and a right clamp baffle, wherein the left clamp baffle and the right clamp baffle are respectively arranged on an adjusting slide block which can move left and right along an X axis.
As a further improvement of the invention, the movement mechanism of the die bonding worktable is an X-axis and Y-axis linear movement mechanism.
As a further improvement of the invention, the wafer disc motion mechanism is an X-axis and Y-axis linear motion mechanism.
As a further improvement of the invention, at least two wafer disks form a wafer disk group, the wafer disks are distributed on the left side and the right side of the die bonding workbench, and at least two die bonding heads are distributed on the left side and the right side of the die bonding workbench.
As a further improvement of the invention, the die bonding head comprises a linear lifting motion mechanism and a rotating mechanism for angle correction.
As a further improvement of the present invention, a wafer ring is disposed on the wafer disk motion mechanism, and the wafer disk is mounted on the wafer ring.
The invention also provides a COB die bonding method, which adopts the COB die bonding machine to bond the substrate.
As a further improvement of the invention, the die bonding process comprises the following steps: the wafer position is determined through the wafer taking image detection mechanism, the die bonding head moves to the wafer position provided by the wafer taking image detection mechanism through the X-axis linear motion mechanism, the thimble mechanism punctures the blue film to eject the wafer out, the die bonding head absorbs the wafer, the position deviation of the wafer absorbed by the die bonding head is obtained through the wafer correction image detection mechanism, the die bonding head carries out angle correction according to the position deviation, the die bonding worktable motion mechanism drives the die bonding worktable to carry out position correction in the XY direction according to the position deviation, the die bonding position on the substrate is detected through the die bonding image detection mechanism, and the die bonding head carries out die bonding according to the die bonding position.
As a further improvement of the invention, in the process of die bonding of the die bonding head, the die bonding head adopts torque control to realize die bonding, and whether die bonding is finished is judged by monitoring the change of the torque of the die bonding head in real time.
The invention has the beneficial effects that: by the scheme, the production efficiency of die bonding is improved.
Drawings
Fig. 1 is a schematic view of a COB die bonder of the present invention.
Fig. 2 is a layout diagram of a COB die bonder according to the present invention.
Fig. 3 is a schematic view of an adjustable die bonder clamp of a COB die bonder according to the present invention.
Fig. 4 is a schematic view of a die bonding head of a COB die bonder according to the present invention.
Fig. 5 is a schematic diagram of an ejector pin mechanism of a COB die bonder according to the present invention.
Detailed Description
The invention is further described with reference to the following description and embodiments in conjunction with the accompanying drawings.
As shown in fig. 1 to 5, a COB die bonder includes a machine base 1, a die bonder table 2, a die bonder table motion mechanism 3, an X-axis linear motion mechanism 4, a die bonder head 5 capable of performing linear motion and rotational motion, a wafer tray 8 and a wafer tray motion mechanism 6, wherein the die bonder table 2 is installed on the die bonder table motion mechanism 3, the die bonder table motion mechanism 3 is installed on the machine base 1, the die bonder head 5 is installed on the X-axis linear motion mechanism 4, the X-axis linear motion mechanism 4 is installed on the machine base 1, the wafer disc 8 is installed on the wafer disc movement mechanism 6, the wafer disc movement mechanism 6 is installed on the machine base 1, a wafer taking image detection mechanism 10 for detecting the position of a wafer to be taken is arranged on the X-axis linear movement mechanism 4, an ejector pin mechanism 9 for ejecting the wafer on the wafer disc 8 is arranged on the machine base 1, a wafer correction image detection mechanism 11 for detecting the position deviation of the wafer sucked by the wafer fixing head 5 is arranged on the machine base 1, and a wafer fixing image detection mechanism 12 for detecting the position of the wafer fixing is arranged on the X-axis linear movement mechanism 4.
And adjustable die bonding table clamps are arranged on the left side and the right side of the die bonding workbench 2.
The adjustable die bonding table clamp comprises a left clamp baffle 13 and a right clamp baffle 14, the left clamp baffle 13 and the right clamp baffle 14 are respectively installed on an adjusting slide block capable of moving left and right along an X axis, the left clamp baffle 13 and the right clamp baffle 14 can be ensured to move left and right stably, the adaptable product width of the die bonding table 2 can be adjusted, a product with the width of 600mm is supported to the maximum extent, the length can be manufactured according to the specific size of the product, and the adjustable die bonding table clamp has the length of 1200mm.
The movement mechanism 3 of the die bonding worktable is an X-axis linear movement mechanism and a Y-axis linear movement mechanism.
The wafer disc motion mechanism 6 is an X-axis linear motion mechanism and a Y-axis linear motion mechanism.
The wafer disks 8 are at least two and are distributed on the left side and the right side of the die bonding workbench 2, and the die bonding heads 5 are at least two and are distributed on the left side and the right side of the die bonding workbench 2.
The die bonding head 5 includes a linear elevating movement mechanism and a rotation mechanism for performing angle correction.
The wafer disc movement mechanism 6 is provided with a wafer ring 7, and the wafer disc 8 is installed on the wafer ring 7.
The solid crystal head 5 is matched with the linear motion mechanism 4, so that 3-axis motion can be realized: the wafer protection device can be used for controlling the pressure through sensing the change of the driving current during the up-and-down motion, and can better protect the wafer. The rotation motion can realize the correction of the wafer angle and ensure the accuracy of the die bonding position.
A COB die bonding method adopts the COB die bonding machine to bond the die on a substrate.
The die bonding process comprises the following steps: the wafer position is determined through the wafer taking image detection mechanism 10, the die bonding head 5 moves to the wafer position provided by the wafer taking image detection mechanism 10 through the X-axis linear motion mechanism 4, the thimble mechanism 9 pierces a blue film to eject the wafer, the die bonding head 5 absorbs the wafer, the position deviation of the wafer absorbed by the die bonding head 5 is obtained through the wafer correction image detection mechanism 11, the die bonding head 5 rotates to perform angle correction according to the position deviation, the die bonding table motion mechanism 3 drives the die bonding table 2 to perform XY direction position correction according to the position deviation, the die bonding position on the substrate is detected through the die bonding image detection mechanism 12, the die bonding head 5 performs die bonding according to the die bonding position, and in the process, the die position on the die bonding head 5 and the die bonding table 2 position are tracked and adjusted in real time. The die bonding position precision and the die bonding yield are ensured.
In the process of die bonding of the die bonding head, the die bonding head adopts torque control to realize die bonding, whether die bonding is finished or not is judged by monitoring the change of the torque of the die bonding head in real time, the traditional die bonding machine adopts distance control, namely, the die bonding is finished by walking a fixed distance, if a panel is slightly deformed, insufficient stroke or stroke overshoot is caused, and the die bonding is unstable or a wafer is crushed. The invention adopts torque control to realize die bonding, judges whether die bonding is finished or not by monitoring the change of the torque in real time, can finely adjust the die bonding distance in real time and reduces the probability of the phenomenon of unstable die bonding or wafer crushing.
The die bonder is composed of a die bonding workbench 2,2 or 4 die bonding heads 5 and one or more wafer disks 8, wherein 2 or 4 die bonding heads 5 are used for bonding wafers in the wafer disks 8 to a substrate (PCB) according to a certain mixed-striking method, the size of the substrate can reach 1200mmX600mm at most, and the die bonding yield can be greatly improved by adjusting the positions of crystal grains on suction nozzles and controlling the die bonding force, so that the die bonder effectively promotes the mass production of the products and is characterized in that:
1. a plurality of wafer disks 8 are distributed on two sides of the die bonding worktable 2; the wafer rings 7 are symmetrically distributed, a single wafer ring 7 can be provided with one or more wafer disks 8, and at most 3 wafer disks 8 can be simultaneously placed on the single wafer ring 7.
2. The single wafer ring 7 is driven by the same group of precise linear motors, and different wafer disks can be switched.
3. Support a plurality of solid brilliant first 5 (1, 2, 3, 4) solid brilliant simultaneously, install as required and select for use the solid brilliant first of different quantity, can effectively raise the efficiency.
4. Each die bonding head 5 adopts a unique structural design, so that the control of angles and moments can be realized, the accuracy of die bonding positions is ensured, and the die bonding yield is effectively improved.
5. The linear motor is adopted to control the die bonding head 5, which is different from swing arm die bonding, so that the linear motion of the die bonding head is realized, the position deviation of crystal grains caused by swing is avoided, and the die bonding yield can be effectively improved.
6. After the die bonder head 5 absorbs the die from the wafer disc 8, the deflection position of the die bonder head 5 for absorbing the wafer is calculated through images, so that the real-time die angle and die bonder position correction is realized, and the die bonder yield can be effectively improved.
7. The fixed crystal taking and fixing images realize the fixed crystal taking and fixing distance, and effectively ensure the repeated precision of the crystal taking and fixing. The die bonding yield is improved.
8. The brand-new die bonding worktable clamp is designed, the clamping size is adjustable, the die bonding worktable clamp can adapt to products with different sizes, and the die bonding worktable clamp can support products with adjustable sizes within 1200mmX600 MM.
9. The die bonding workbench 2 can be arranged, two groups of die bonding heads 5 and wafer disks 8 are symmetrically arranged on the front side and the back side of the die bonding workbench, the work flows of the die bonding heads 5 on the left side and the right side are consistent, the die bonding heads are independently driven and controlled, the fact that the left die bonding head and the right die bonding head work simultaneously and do not interfere with each other is guaranteed, die bonding position accuracy and yield are guaranteed, and meanwhile efficiency is improved to the maximum extent.
The foregoing is a more detailed description of the invention in connection with specific preferred embodiments and it is not intended that the invention be limited to these specific details. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (7)
1. The utility model provides a solid brilliant machine of COB which characterized in that: the wafer fixing device comprises a machine base, a wafer fixing workbench movement mechanism, an X-axis linear movement mechanism, a wafer fixing head capable of achieving linear movement and rotary movement, a wafer disc and a wafer disc movement mechanism, wherein the wafer fixing workbench is installed on the wafer fixing workbench movement mechanism;
the COB die bonder is used for die bonding of the substrate, and the die bonding process comprises the following steps: determining the position of a wafer through a wafer taking image detection mechanism, moving a die bonding head to the position of the wafer provided by the wafer taking image detection mechanism through an X-axis linear motion mechanism, puncturing a blue film by a thimble mechanism, ejecting the wafer, sucking the wafer by the die bonding head, obtaining the position deviation of the wafer sucked by the die bonding head through a wafer correction image detection mechanism, carrying out angle correction on the die bonding head according to the position deviation, driving a die bonding worktable by a die bonding worktable motion mechanism according to the position deviation to carry out position correction in the XY direction, detecting the die bonding position on a substrate through the die bonding image detection mechanism, and carrying out die bonding by the die bonding head according to the die bonding position;
in the process of die bonding of the die bonding head, the die bonding head realizes die bonding by adopting torque control, and whether die bonding is finished is judged by monitoring the change of the torque of the die bonding head in real time.
2. The COB die bonder of claim 1, wherein: and adjustable die bonding table clamps are arranged on the left side and the right side of the die bonding workbench.
3. The COB die bonder of claim 2, wherein: the adjustable die bonder clamp comprises a left clamp baffle and a right clamp baffle, and the left clamp baffle and the right clamp baffle are respectively installed on an adjusting slide block which can move left and right along an X axis.
4. The COB die bonder of claim 1, wherein: the movement mechanism of the die bonding worktable is an X-axis linear movement mechanism and a Y-axis linear movement mechanism, and the movement mechanism of the wafer disc is an X-axis linear movement mechanism and a Y-axis linear movement mechanism.
5. The COB die bonder of claim 1, wherein: the wafer disks are at least two and are distributed on the left side and the right side of the die bonding workbench, and the die bonding heads are at least two and are distributed on the left side and the right side of the die bonding workbench.
6. The COB die bonder of claim 1, wherein: the die bonding head comprises a linear lifting motion mechanism and a rotating mechanism for angle correction.
7. The COB die bonder as claimed in claim 1, wherein: the wafer disc movement mechanism is provided with a wafer ring, and the wafer disc is installed on the wafer ring.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011267115.9A CN112259481B (en) | 2020-11-13 | 2020-11-13 | COB die bonder and COB die bonding method |
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| CN202011267115.9A CN112259481B (en) | 2020-11-13 | 2020-11-13 | COB die bonder and COB die bonding method |
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| CN112259481A CN112259481A (en) | 2021-01-22 |
| CN112259481B true CN112259481B (en) | 2023-03-21 |
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| CN114650666A (en) * | 2022-05-18 | 2022-06-21 | 武汉昱升光电股份有限公司 | Full-automatic die bonding device and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211350607U (en) * | 2020-04-02 | 2020-08-25 | 先进光电器材（深圳）有限公司 | MiniLED double-head die bonder |
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| JP2012069742A (en) * | 2010-09-24 | 2012-04-05 | Nec Corp | Mounting method and mounting apparatus for electronic component |
| JP5638978B2 (en) * | 2011-02-18 | 2014-12-10 | Juki株式会社 | Pressure control head of mounter |
| TW201320254A (en) * | 2011-11-15 | 2013-05-16 | Walsin Lihwa Corp | Apparatus and method for die bonding |
| CN211088302U (en) * | 2019-12-17 | 2020-07-24 | 重庆慧库科技有限公司 | COB lamp strip die bonder |
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| CN211350607U (en) * | 2020-04-02 | 2020-08-25 | 先进光电器材（深圳）有限公司 | MiniLED double-head die bonder |
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Address after: 518000 1st floor, workshop beside Yousheng paper, Wenchuan Road, yingrenshi community, Shiyan street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Zhuoxing Semiconductor Technology Co.,Ltd. Address before: 518000 1st floor, workshop beside Yousheng paper, Wenchuan Road, yingrenshi community, Shiyan street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: SHEN ZHEN TALUER TECHNOLOGY Co.,Ltd. |
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