CN112195476A - Aqueous cleaning agent containing copper ions - Google Patents
Aqueous cleaning agent containing copper ions Download PDFInfo
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- CN112195476A CN112195476A CN202010737272.5A CN202010737272A CN112195476A CN 112195476 A CN112195476 A CN 112195476A CN 202010737272 A CN202010737272 A CN 202010737272A CN 112195476 A CN112195476 A CN 112195476A
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- parts
- cleaning agent
- water
- copper ions
- agent containing
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 41
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 title claims abstract description 23
- 229910001431 copper ion Inorganic materials 0.000 title claims abstract description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000203 mixture Substances 0.000 claims abstract description 22
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 17
- 150000001879 copper Chemical class 0.000 claims abstract description 14
- 239000008367 deionised water Substances 0.000 claims abstract description 11
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 11
- 239000013538 functional additive Substances 0.000 claims abstract description 10
- 150000007529 inorganic bases Chemical class 0.000 claims abstract description 10
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 15
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 15
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 claims description 10
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 7
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 7
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 7
- 239000004115 Sodium Silicate Substances 0.000 claims description 5
- 229910000160 potassium phosphate Inorganic materials 0.000 claims description 5
- 235000011009 potassium phosphates Nutrition 0.000 claims description 5
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 5
- 239000002280 amphoteric surfactant Substances 0.000 claims description 2
- 125000000129 anionic group Chemical group 0.000 claims description 2
- 239000003945 anionic surfactant Substances 0.000 claims description 2
- 239000002518 antifoaming agent Substances 0.000 claims description 2
- 125000002091 cationic group Chemical group 0.000 claims description 2
- 239000003093 cationic surfactant Substances 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000008233 hard water Substances 0.000 claims description 2
- 239000002736 nonionic surfactant Substances 0.000 claims description 2
- 239000003513 alkali Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract description 13
- 230000000844 anti-bacterial effect Effects 0.000 abstract description 9
- 238000004140 cleaning Methods 0.000 abstract description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000003899 bactericide agent Substances 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 238000005536 corrosion prevention Methods 0.000 abstract description 2
- 238000005202 decontamination Methods 0.000 abstract description 2
- 230000003588 decontaminative effect Effects 0.000 abstract description 2
- 239000002085 irritant Substances 0.000 abstract description 2
- 231100000021 irritant Toxicity 0.000 abstract description 2
- 230000009972 noncorrosive effect Effects 0.000 abstract description 2
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 230000003000 nontoxic effect Effects 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 230000001954 sterilising effect Effects 0.000 abstract description 2
- 238000004659 sterilization and disinfection Methods 0.000 abstract description 2
- 239000012224 working solution Substances 0.000 abstract description 2
- 239000000839 emulsion Substances 0.000 description 7
- 229920002545 silicone oil Polymers 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- -1 alcohol ether carboxylic acid Chemical class 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 3
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 2
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 description 2
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Chemical compound C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 2
- ONJQDTZCDSESIW-UHFFFAOYSA-N polidocanol Chemical compound CCCCCCCCCCCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO ONJQDTZCDSESIW-UHFFFAOYSA-N 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 201000004624 Dermatitis Diseases 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000003337 fertilizer Substances 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 210000004916 vomit Anatomy 0.000 description 1
- 230000008673 vomiting Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/14—Cleaning or pickling metallic material with solutions or molten salts with alkaline solutions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/06—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using emulsions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Detergent Compositions (AREA)
Abstract
The invention relates to the technical field of industrial aqueous cleaning, in particular to an aqueous cleaning agent containing copper ions, and provides an aqueous cleaning agent containing copper ions, wherein the aqueous metal cleaning agent comprises the following raw materials in parts by weight: 0.5-10 parts of water-soluble copper salt, 1-30 parts of inorganic base mixture, 1-30 parts of emulsifier mixture, 0-20 parts of other functional additives and the balance of deionized water to 100 parts. The aqueous industrial cleaning agent disclosed by the invention is strong in decontamination capability, long in service life, free of formaldehyde release type bactericide, friendly to human body, non-toxic, non-irritant and non-corrosive, and can effectively guarantee the health and safety of operators without polluting the surrounding environment; meanwhile, due to the existence of copper ions, the copper-based composite material has a good sterilization and corrosion prevention effect, the working solution cannot be rancid and go bad, can be circularly added and used, and cannot pollute the environment.
Description
Technical Field
The invention relates to the technical field of industrial aqueous cleaning, in particular to an aqueous cleaning agent containing copper ions.
Background
At present, the metal cleaning agent is widely applied in industrial production and is commonly used for surface degreasing and descaling before and after metal processing and cleaning processes before finished product assembly or packaging. At present, the commonly used metal cleaning agents are divided into solvent type, semi-solvent type and water-based type. In the solvent type metal cleaning agent, the petroleum solvent is inflammable and explosive and wastes resources. Chlorofluorocarbons are commonly used solvent-based metal cleaners, but are banned due to their destruction of the atmospheric ozone layer. Thus, solvent-based metal cleaners are being gradually replaced by semi-solvent and water-based metal cleaners. With the advent of the chlorofluorocarbon (CFC) replacement date, water-based cleaning agents have received various attention for their research and use.
The water-soluble industrial cleaning agent has good cleaning performance and water dilution ratio, is easy to separate and recycle for treatment, and has long service life. In order to reduce the cost and prolong the service life of the aqueous metal cleaner, it is necessary to prevent the aqueous metal cleaner from being deteriorated and to add a bactericide component thereto, and currently, organic bactericides such as morpholine and triazine are generally used as the bactericide. The organic bactericide substances are generally strongly corrosive and pungent in smell, and inevitably volatilize into the air in the use process and contact with the skin of an operator, so that the vomit, the skin allergy and even the faint of the operator can be caused; has an adverse effect on the surrounding environment.
Therefore, a low-toxicity water-based metal cleaning agent is needed, which has excellent antibacterial performance and cleaning performance, no peculiar smell, no harm or stimulation to human bodies, can ensure the health and safety of operators, and does not cause pollution to the surrounding environment; meanwhile, the compound fertilizer can not be rancid and go bad in a long period, can be circularly added and used in a long period, and has low use cost.
The present invention is based on the object of solving the above-mentioned drawbacks of the prior art and proposes a specific solution.
Disclosure of Invention
The technical scheme adopted by the invention is as follows:
the aqueous industrial cleaning agent containing copper ions comprises the following raw materials in parts by weight: 0.5-10 parts of water-soluble copper salt, 1-30 parts of inorganic base mixture, 1-30 parts of emulsifier mixture, 0-20 parts of other functional additives and the balance of deionized water to 100 parts.
In a specific embodiment, the water-soluble copper salt is at least one of copper chloride, copper sulfate or other water-soluble copper salts, and it should be understood that other water-soluble copper salts capable of ionizing copper ions in water may be used instead of copper chloride or copper sulfate;
in a specific embodiment, the inorganic base is potassium hydroxide or at least one of sodium hydroxide, sodium silicate, potassium phosphate.
In a specific embodiment, the emulsifier is one or a mixture of more of commercially available anionic, nonionic, cationic or amphoteric surfactants such as AEO-9, AEO-3, TX-10, 6501, L62, etc.;
in a preferred embodiment, the other functional additive is one or a mixture of two or more of a functional additive including an antifoaming agent, a hard water resistant agent, and other additives.
In a specific embodiment, the water-soluble copper salt is 0.5 parts, the inorganic base mixture is 1 part, and the emulsifier mixture is 1 part;
in a specific embodiment, the water-soluble copper salt is 5 parts, the inorganic base mixture is 15 parts, the emulsifier mixture is 15 parts, and the other functional additives are 10 parts;
in a specific embodiment, the water-soluble copper salt is 10 parts, the inorganic base mixture is 30 parts, the emulsifier mixture is 30 parts, and the other functional additives are 20 parts.
In addition, the invention also provides a use method of the copper ion-containing aqueous industrial cleaning agent, wherein the copper ion-containing aqueous cleaning agent and water are diluted by 1:20-50 times according to the weight ratio.
The invention has the beneficial technical effects that:
the aqueous industrial cleaning agent disclosed by the invention is strong in decontamination capability, long in service life, free of formaldehyde release type bactericide, friendly to human body, non-toxic, non-irritant and non-corrosive, and can effectively guarantee the health and safety of operators without polluting the surrounding environment; meanwhile, due to the existence of copper ions, the copper-based composite material has a good sterilization and corrosion prevention effect, the working solution cannot be rancid and go bad, can be circularly added and used, and cannot pollute the environment.
Detailed Description
Embodiment 1:
the water-based industrial cleaning agent comprises the following components in parts by weight: 0.5 part of copper chloride, 1 part of potassium hydroxide, 1 part of AEO9 emulsifier, 1 part of disodium ethylenediaminetetraacetate (EDTA2Na), and the balance of deionized water to 100 parts.
Embodiment 2:
the water-based industrial cleaning agent comprises the following components in parts by weight: 5 parts of copper sulfate, 15 parts of sodium hydroxide, 15 parts of AEO-3 emulsifier, 10 parts of silicone oil emulsion and disodium ethylene diamine tetraacetate, and the balance of deionized water to 100 parts.
Embodiment 3:
the water-based industrial cleaning agent comprises the following components in parts by weight: 10 parts of copper sulfate, 30 parts of sodium silicate, 30 parts of TX-10 emulsifier, 20 parts of silicone oil emulsion and tetrasodium ethylene diamine tetraacetate, and the balance of deionized water to 100 parts.
Embodiment 4:
the water-based industrial cleaning agent comprises the following components in parts by weight: 8 parts of copper chloride, 25 parts of potassium phosphate, 25 parts of 6501 emulsifier, 15 parts of silicone oil emulsion and tetrasodium ethylene diamine tetraacetate, and the balance of deionized water to 100 parts.
Embodiment 5:
the water-based industrial cleaning agent comprises the following components in parts by weight: 8 parts of copper chloride, 10 parts of potassium hydroxide, 15 parts of sodium hydroxide, 25 parts of L62 emulsifier, 15 parts of silicone oil emulsion and tetrasodium ethylene diamine tetraacetate, and the balance of deionized water to 100 parts.
Embodiment 6:
the water-based industrial cleaning agent comprises the following components in parts by weight: 8 parts of copper chloride, 10 parts of potassium hydroxide, 15 parts of sodium silicate, 10 parts of AEO-9, 10 parts of AEO-3, 18 parts of silicone oil emulsion and alcohol ether carboxylic acid, and the balance of deionized water is added to 100 parts.
Embodiment 7:
the water-based industrial cleaning agent comprises the following components in parts by weight: 10 parts of copper sulfate, 10 parts of sodium silicate, 15 parts of potassium phosphate, 15 parts of L62, 10 parts of TX-10, 16 parts of silicone oil emulsion and alcohol ether carboxylic acid, and the balance of deionized water is added to 100 parts.
Embodiment 8:
the water-based industrial cleaning agent comprises the following components in parts by weight: 3 parts of copper sulfate, 10 parts of sodium hydroxide, 12 parts of potassium phosphate, 12 parts of AEO-3, 10 parts of 6501 emulsifier, 16 parts of silicone oil emulsion and alcohol ether carboxylic acid, and the balance of deionized water to 100 parts.
When the industrial cleaning agent is used, the industrial cleaning agent is directly diluted with water according to the weight ratio of 1:50, and is used for ultrasonic and manual cleaning of heavy oil stains on various metal pieces.
The copper ion cleaner of the present invention was compared to a commercially available brand of ion cleaner according to the test method of JB/T4323.2-1999 Metal cleaner. The test results are shown in the following table.
In the present test method, a more than 20% reduction in cleaning power is considered to be the end of the cleaning agent life.
As can be seen from the table above, the difference of the bactericidal capacity of the copper ion cleaning agent provided by the invention and the commercial cleaning agent is not great, but the service life of the copper ion cleaning agent is 2-3 times of that of the commercial cleaning agent, and the copper ion cleaning agent has good bactericidal effect.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. The aqueous industrial cleaning agent containing copper ions comprises the following components in parts by weight: 0.5-10 parts of water-soluble copper salt, 1-30 parts of inorganic base mixture, 1-30 parts of emulsifier mixture, 0-20 parts of other functional additives and the balance of deionized water to 100 parts.
2. The aqueous industrial cleaning agent containing copper ions according to claim 1, characterized in that: the water-soluble copper salt is at least one of copper chloride, copper sulfate or other water-soluble copper salts.
3. The aqueous industrial cleaning agent containing copper ions according to claim 1, characterized in that: the inorganic alkali is at least one of potassium hydroxide or sodium hydroxide, sodium silicate and potassium phosphate.
4. The aqueous industrial cleaning agent containing copper ions according to claim 1, characterized in that: the emulsifier is one or a mixture of more of anionic, nonionic, cationic or amphoteric surfactants.
5. The aqueous industrial cleaning agent containing copper ions according to claim 1, characterized in that: the other functional additives are one or a mixture of more than two of a defoaming agent and a hard water resisting agent.
6. The aqueous industrial cleaning agent containing copper ions according to claim 1, characterized in that: the water-soluble copper salt is 0.5 part, the inorganic base mixture is 1 part, and the emulsifier mixture is 1 part.
7. The aqueous industrial cleaning agent containing copper ions according to claim 1, characterized in that: the water-soluble copper salt is 5 parts, the inorganic base mixture is 15 parts, the emulsifier mixture is 15 parts, and other functional additives are 10 parts.
8. The aqueous industrial cleaning agent containing copper ions according to claim 1, characterized in that the water-soluble copper salt is 10 parts, the inorganic base mixture is 30 parts, the emulsifier mixture is 30 parts, and the other functional additives are 20 parts.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010737272.5A CN112195476A (en) | 2020-07-28 | 2020-07-28 | Aqueous cleaning agent containing copper ions |
| PCT/CN2021/084417 WO2022021920A1 (en) | 2020-07-28 | 2021-03-31 | Water-based cleaning agent containing copper ions |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010737272.5A CN112195476A (en) | 2020-07-28 | 2020-07-28 | Aqueous cleaning agent containing copper ions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112195476A true CN112195476A (en) | 2021-01-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010737272.5A Pending CN112195476A (en) | 2020-07-28 | 2020-07-28 | Aqueous cleaning agent containing copper ions |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112195476A (en) |
| WO (1) | WO2022021920A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022021920A1 (en) * | 2020-07-28 | 2022-02-03 | 安美科技股份有限公司 | Water-based cleaning agent containing copper ions |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105369283A (en) * | 2015-11-17 | 2016-03-02 | 东莞市安美润滑科技有限公司 | Aqueous metal cleaner containing nano-silver and preparation and use methods thereof |
| CN105483724A (en) * | 2015-11-25 | 2016-04-13 | 安徽天思朴超精密模具股份有限公司 | Metal degreasant material combination as well as preparing method and application of metal degreasant |
| WO2022021920A1 (en) * | 2020-07-28 | 2022-02-03 | 安美科技股份有限公司 | Water-based cleaning agent containing copper ions |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014218704A (en) * | 2013-05-09 | 2014-11-20 | 日本特殊陶業株式会社 | Method for manufacturing main metallic body for spark plug and method for manufacturing spark plug |
| CN109468618A (en) * | 2018-11-14 | 2019-03-15 | 广东顺德三阳化学有限公司 | In a kind of drinking-water pipe in coating liquid and metal drinking-water pipe plated film method |
-
2020
- 2020-07-28 CN CN202010737272.5A patent/CN112195476A/en active Pending
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2021
- 2021-03-31 WO PCT/CN2021/084417 patent/WO2022021920A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105369283A (en) * | 2015-11-17 | 2016-03-02 | 东莞市安美润滑科技有限公司 | Aqueous metal cleaner containing nano-silver and preparation and use methods thereof |
| CN105483724A (en) * | 2015-11-25 | 2016-04-13 | 安徽天思朴超精密模具股份有限公司 | Metal degreasant material combination as well as preparing method and application of metal degreasant |
| WO2022021920A1 (en) * | 2020-07-28 | 2022-02-03 | 安美科技股份有限公司 | Water-based cleaning agent containing copper ions |
Non-Patent Citations (1)
| Title |
|---|
| 中国材料研究学会, 中国铁道出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022021920A1 (en) * | 2020-07-28 | 2022-02-03 | 安美科技股份有限公司 | Water-based cleaning agent containing copper ions |
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| Publication number | Publication date |
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| WO2022021920A1 (en) | 2022-02-03 |
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Effective date of registration: 20210914 Address after: 523000 No. 6, Gongye West Road, Songshanhu science and Technology Industrial Park, Dongguan City, Guangdong Province Applicant after: AMER TECHNOLOGY Co.,Ltd. Address before: 402100 Building 1, No.399 Gangqiao Road, Zhutuo Town, Yongchuan District, Chongqing (in Gangqiao Industrial Park) Applicant before: Chongqing Anmei New Material Co.,Ltd. |
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Application publication date: 20210108 |