CN112191570A - Degumming and paint removing process for fingerprint module - Google Patents
Degumming and paint removing process for fingerprint module Download PDFInfo
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- CN112191570A CN112191570A CN202011094696.0A CN202011094696A CN112191570A CN 112191570 A CN112191570 A CN 112191570A CN 202011094696 A CN202011094696 A CN 202011094696A CN 112191570 A CN112191570 A CN 112191570A
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- chip
- fingerprint module
- putting
- degumming
- paint removal
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- 239000003973 paint Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000005498 polishing Methods 0.000 claims abstract description 20
- 239000003292 glue Substances 0.000 claims abstract description 19
- 238000004506 ultrasonic cleaning Methods 0.000 claims abstract description 19
- 238000005406 washing Methods 0.000 claims abstract description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000004809 Teflon Substances 0.000 claims abstract description 7
- 229920006362 Teflon® Polymers 0.000 claims abstract description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002390 adhesive tape Substances 0.000 claims abstract description 7
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 4
- 238000012790 confirmation Methods 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 238000009826 distribution Methods 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 239000010959 steel Substances 0.000 claims abstract description 4
- 238000004140 cleaning Methods 0.000 claims description 15
- 238000001035 drying Methods 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 238000002372 labelling Methods 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 238000007790 scraping Methods 0.000 claims description 3
- 238000009461 vacuum packaging Methods 0.000 claims description 3
- 210000002268 wool Anatomy 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/16—Rigid blades, e.g. scrapers; Flexible blades, e.g. wipers
- B08B1/165—Scrapers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a degumming and paint removal process for a fingerprint module, which comprises the following steps: the method comprises the following steps: material confirmation: receiving materials according to a customer distribution list; step two: the fingerprint module is baked: putting the material into an oven for baking; step three: the fingerprint module is disassembled: starting up the heating platform fully adhered with the Teflon adhesive tape, taking out the fingerprint module from the Tray disc, putting the chip face upwards on the heating platform for heating, cutting in from the middle of the FPC and the steel sheet by using a pen knife after the tin is melted, and taking out the chip; the invention has the beneficial effects that: the mixed liquid consisting of 75% alcohol is put into the ultrasonic cleaning machine, so that the labor intensity of paint removal is reduced, and the paint removal efficiency is further improved; the chip surface is placed on a heating platform to be heated for 5S at the temperature of 200 ℃, after heating is OK, a large area of residual glue on the PAD surface is scraped by a scalpel, and the efficiency of degumming and paint removal is improved by washing and polishing.
Description
Technical Field
The invention belongs to the technical field of chips, and particularly relates to a degumming and paint removing process for a fingerprint module.
Background
In the field of electronics, a chip refers to a way of miniaturizing a circuit, and specifically, a semiconductor manufacturing process is adopted to manufacture devices such as transistors, resistors, capacitors, inductors and the like required by the circuit on a smaller semiconductor wafer or a medium substrate, the devices are combined into a complete electronic circuit by a multilayer wiring or tunnel wiring method, and then the electronic circuit is packaged in a tube shell to form an independent entity, which is called as a "chip", wherein the electronic circuit is called as an integrated circuit. It can be said that a chip is both a carrier of an integrated circuit and a result of the integrated circuit after design, manufacture, packaging and testing, and is usually a plug-and-play independent whole.
In order to improve the efficiency of fingerprint module degumming and paint removal, we provide a degumming and paint removal process for a fingerprint module.
Disclosure of Invention
The invention aims to provide a degumming and paint removal process for a fingerprint module, which improves the degumming and paint removal efficiency of the fingerprint module.
In order to achieve the purpose, the invention provides the following technical scheme: a degumming and paint removal process for a fingerprint module comprises the following steps:
the method comprises the following steps: material confirmation: receiving materials according to a customer distribution list;
step two: the fingerprint module is baked: putting the material into an oven for baking;
step three: the fingerprint module is disassembled: starting up the heating platform fully adhered with the Teflon adhesive tape, taking out the fingerprint module from the Tray disc, putting the chip face upwards on the heating platform for heating, cutting in from the middle of the FPC and the steel sheet by using a pen knife after the tin is melted, and taking out the chip;
step four: removing glue on the PAD surface: starting up the heating platform fully adhered with the Teflon adhesive tape, taking out the chip which is disassembled OK, putting the chip on the heating platform with the surface facing upwards for heating, and scraping large-area residual adhesive on the PAD surface by using a scalpel after heating OK;
step five: coating layer laser: placing the chip into a jig to be subjected to laser, placing the Coating surface upwards into a laser working area, and performing laser operation;
step six: removing edge glue: removing residual glue around the chip by using an art designing knife;
step seven: cleaning and paint removing: cleaning the product in an ultrasonic cleaning machine, taking the product out of the ultrasonic cleaning machine after cleaning, putting the product into a jig to be cleaned, and wiping the surface with wool felt until the cleaning is finished;
step eight: washing: putting the chip subjected to glue removal into an ultrasonic cleaning machine by using a net blue for washing, and removing the foreign matters remained on the surface;
step nine: polishing: polishing a PAD surface and an EMC surface;
step ten: and (3) washing again: putting the chip subjected to glue removal into an ultrasonic cleaning machine by using a net blue for washing, and removing the foreign matters remained on the surface;
step eleven: and (3) drying: drying the washed product;
step twelve: cleaning: putting the product on superfine dust-free cloth, wiping the surface of the chip by using alcohol, and removing water stains and dirt;
step thirteen: and (4) checking: performing appearance full inspection;
fourteen steps: baking: putting the Tray disc material into an oven for baking;
step fifteen: packaging: vacuum packaging with nylon flat bag, and labeling.
In the second step, the material is put into an oven and baked for 2 hours at the temperature of 80 ℃.
In the third step, the chip is placed on the heating platform with the surface facing upwards and heated at the temperature of 215-225 ℃.
In the fourth step, the chip is placed on the heating platform with the surface facing upwards and heated for 5S at the temperature of 200 ℃.
In the eighth step, the chip after removing the glue is washed in an ultrasonic cleaning machine for 3min by using a net blue, wherein the liquid used for the ultrasonic cleaning machine is 75% alcohol.
As a preferred embodiment of the present invention, in the ninth step, PAD surface polishing: putting the chip into a grinder to be ground with the PAD facing upwards, starting the grinder with the replaced polishing disc and setting the speed; EMC surface polishing: the chip was placed in the machine to be ground with PAD side up, the machine with the replaced polishing disc was started and the speed was set.
In a preferred embodiment of the present invention, in the eleventh step, the moisture content after drying is less than 8%.
As a preferable aspect of the present invention, in the thirteenth step, the appearance complete inspection includes: whether the tin quantity on the PAD is smooth or not; whether the PAD surface is damaged or not is judged; whether the Coating surface is subjected to film removal OK or not, and whether scratches, edge collapse or edge collapse exists or not.
In the fourteenth step, the Tray material is placed in an oven and baked for 2 hours at 80 ℃.
Compared with the prior art, the invention has the beneficial effects that:
(1) the mixed liquid consisting of 75% alcohol is put into the ultrasonic cleaning machine, so that the labor intensity of paint removal is reduced, and the paint removal efficiency is further improved;
(2) the chip surface is placed on a heating platform to be heated for 5S at the temperature of 200 ℃, after heating is OK, a large area of residual glue on the PAD surface is scraped by a scalpel, and the efficiency of degumming and paint removal is improved by washing and polishing.
Drawings
FIG. 1 is a process flow diagram of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a degumming and paint removal process of a fingerprint module comprises the following steps:
the method comprises the following steps: material confirmation: receiving materials according to a client distribution list, comparing the types and the quantity of the received materials with real objects, and reporting to the client under the condition of difference;
step two: the fingerprint module is baked: putting the material into an oven, and baking for 2 hours at the temperature of 80 ℃;
step three: the fingerprint module is disassembled: starting up the heating platform fully adhered with the Teflon adhesive tape, taking out the fingerprint module from the Tray disc, putting the chip on the heating platform with the upward surface, heating at the temperature of 215-225 ℃, cutting in from the middle of the FPC and the steel sheet by using a pen knife after the tin is melted, and taking out the chip;
step four: removing glue on the PAD surface: starting up the heating platform fully adhered with the Teflon adhesive tape, taking out the chip which is disassembled OK, putting the chip on the heating platform with the surface facing upwards, heating for 5 seconds at the temperature of 200 ℃, and scraping large-area residual adhesive on the PAD surface by using a scalpel after heating OK;
step five: coating layer laser: placing the chip into a jig to be subjected to laser, placing the Coating surface upwards into a laser working area, and performing laser operation;
step six: removing edge glue: removing residual glue around the chip by using an art designing knife;
step seven: cleaning and paint removing: cleaning the product in an ultrasonic cleaning machine, taking the product out of the ultrasonic cleaning machine after cleaning, putting the product into a jig to be cleaned, and wiping the surface with wool felt until the cleaning is finished; the mixed solution consisting of 75% alcohol is put into the ultrasonic cleaning machine, so that the labor intensity of paint removal is reduced, and the paint removal efficiency is further improved;
step eight: washing: washing the chip with the removed glue in an ultrasonic cleaning machine with 75% alcohol for 3min to remove the foreign matter on the surface;
step nine: polishing: polishing a PAD surface and an EMC surface; wherein, PAD surface polishing: putting the chip into a grinder to be ground with the PAD facing upwards, starting the grinder with the replaced polishing disc and setting the speed; EMC surface polishing: putting the chip into a grinder to be ground with the PAD facing upwards, starting the grinder with the replaced polishing disc and setting the speed;
step ten: and (3) washing again: putting the chip subjected to glue removal into an ultrasonic cleaning machine by using a net blue for washing, and removing the foreign matters remained on the surface;
step eleven: and (3) drying: drying the washed product, wherein the water content of the dried product is less than 8%;
step twelve: cleaning: putting the product on superfine dust-free cloth, wiping the surface of the chip by using alcohol, and removing water stains and dirt;
step thirteen: and (4) checking: performing appearance full inspection; the appearance is examined entirely and is included: whether the tin quantity on the PAD is smooth or not; whether the PAD surface is damaged or not is judged; whether the Coating surface is subjected to film removal OK or not, whether scratches, edge collapse or edge collapse exists or not;
fourteen steps: baking: putting the Tray disc material into an oven to bake for 2h at 80 ℃;
step fifteen: packaging: vacuum packaging with nylon flat bag, and labeling.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a fingerprint module's deguming depainting technology which characterized in that: the process comprises the following steps:
the method comprises the following steps: material confirmation: receiving materials according to a customer distribution list;
step two: the fingerprint module is baked: putting the material into an oven for baking;
step three: the fingerprint module is disassembled: starting up the heating platform fully adhered with the Teflon adhesive tape, taking out the fingerprint module from the Tray disc, putting the chip face upwards on the heating platform for heating, cutting in from the middle of the FPC and the steel sheet by using a pen knife after the tin is melted, and taking out the chip;
step four: removing glue on the PAD surface: starting up the heating platform fully adhered with the Teflon adhesive tape, taking out the chip which is disassembled OK, putting the chip on the heating platform with the surface facing upwards for heating, and scraping large-area residual adhesive on the PAD surface by using a scalpel after heating OK;
step five: coating layer laser: placing the chip into a jig to be subjected to laser, placing the Coating surface upwards into a laser working area, and performing laser operation;
step six: removing edge glue: removing residual glue around the chip by using an art designing knife;
step seven: cleaning and paint removing: cleaning the product in an ultrasonic cleaning machine, taking the product out of the ultrasonic cleaning machine after cleaning, putting the product into a jig to be cleaned, and wiping the surface with wool felt until the cleaning is finished;
step eight: washing: putting the chip subjected to glue removal into an ultrasonic cleaning machine by using a net blue for washing, and removing the foreign matters remained on the surface;
step nine: polishing: polishing a PAD surface and an EMC surface;
step ten: and (3) washing again: putting the chip subjected to glue removal into an ultrasonic cleaning machine by using a net blue for washing, and removing the foreign matters remained on the surface;
step eleven: and (3) drying: drying the washed product;
step twelve: cleaning: putting the product on superfine dust-free cloth, wiping the surface of the chip by using alcohol, and removing water stains and dirt;
step thirteen: and (4) checking: performing appearance full inspection;
fourteen steps: baking: putting the Tray disc material into an oven for baking;
step fifteen: packaging: vacuum packaging with nylon flat bag, and labeling.
2. The degumming and paint removal process for the fingerprint module according to claim 1, characterized in that: in the second step, the material is put into an oven and baked for 2 hours at the temperature of 80 ℃.
3. The degumming and paint removal process for the fingerprint module according to claim 1, characterized in that: in the third step, the chip is placed on the heating platform with the surface facing upwards and heated at the temperature of 215-225 ℃.
4. The degumming and paint removal process for the fingerprint module according to claim 1, characterized in that: in the fourth step, the chip is placed face up on a heating platform and heated at a temperature of 200 ℃ for 5S.
5. The degumming and paint removal process for the fingerprint module according to claim 1, characterized in that: and step eight, putting the chip subjected to glue removal into an ultrasonic cleaning machine by using a net blue to wash for 3min, wherein the liquid for the ultrasonic cleaning machine is 75% alcohol.
6. The degumming and paint removal process for the fingerprint module according to claim 1, characterized in that: in the ninth step, polishing the PAD surface: putting the chip into a grinder to be ground with the PAD facing upwards, starting the grinder with the replaced polishing disc and setting the speed; EMC surface polishing: the chip was placed in the machine to be ground with PAD side up, the machine with the replaced polishing disc was started and the speed was set.
7. The degumming and paint removal process for the fingerprint module according to claim 1, characterized in that: in the eleventh step, the water content after drying is less than 8%.
8. The degumming and paint removal process for the fingerprint module according to claim 1, characterized in that: in the thirteenth step, the appearance complete inspection includes: whether the tin quantity on the PAD is smooth or not; whether the PAD surface is damaged or not is judged; whether the Coating surface is subjected to film removal OK or not, and whether scratches, edge collapse or edge collapse exists or not.
9. The degumming and paint removal process for the fingerprint module according to claim 1, characterized in that: in the fourteenth step, the Tray disc material is put into an oven to be baked for 2 hours at 80 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011094696.0A CN112191570B (en) | 2020-10-14 | 2020-10-14 | Degumming and paint removing process for fingerprint module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011094696.0A CN112191570B (en) | 2020-10-14 | 2020-10-14 | Degumming and paint removing process for fingerprint module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112191570A true CN112191570A (en) | 2021-01-08 |
| CN112191570B CN112191570B (en) | 2022-04-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011094696.0A Active CN112191570B (en) | 2020-10-14 | 2020-10-14 | Degumming and paint removing process for fingerprint module |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115815206A (en) * | 2022-12-01 | 2023-03-21 | 苏州欧梦达电子有限公司 | CSP module disassembling method |
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2020
- 2020-10-14 CN CN202011094696.0A patent/CN112191570B/en active Active
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| CN112191570B (en) | 2022-04-22 |
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