CN112188760A - Local mixed-compression method for high-speed printed circuit board - Google Patents
Local mixed-compression method for high-speed printed circuit board Download PDFInfo
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- CN112188760A CN112188760A CN202011012738.1A CN202011012738A CN112188760A CN 112188760 A CN112188760 A CN 112188760A CN 202011012738 A CN202011012738 A CN 202011012738A CN 112188760 A CN112188760 A CN 112188760A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
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Abstract
The invention belongs to the technical field of circuit board processing, and provides a local mixed pressing method of a high-speed printed circuit board, which comprises a plane local mixed pressing process and a three-dimensional local mixed pressing process; preparing a plane local mixed-compression structure by the plane local mixed-compression process; and the three-dimensional local mixed compression structure is prepared by the three-dimensional local mixed compression process. The local mixed-compression process of two structures is provided, a large amount of creative labor of an inventor is utilized, the defect generation mechanism is actually analyzed, the local mixed-compression technology of the printed circuit board is mastered through data analysis, large-scale mass production is realized, and reliability tests such as 288 ℃ of stress test x10s x 5 times, 5 times of lead-free reflow soldering without layering and the like show that the reliability of the local mixed-compression technology is qualified.
Description
Technical Field
The invention belongs to the technical field of circuit board processing, and particularly relates to a local mixed-compression method for a high-speed printed circuit board.
Background
With the rapid development of electronic circuits, higher requirements are put forward on high-frequency and high-speed transmission of signals, the base material of the printed circuit board is required to have low dielectric constant Dk, low dielectric loss Df, matching of coefficient of thermal expansion CTE and to meet the requirements of reliability tests, and in the traditional printed circuit board design process, high-frequency materials are usually selected on the whole high-frequency signal layer and are mixed and pressed with common FR-4 materials of other layers. The mixed pressing structure is batched at present by reasonably controlling the laminated structure and the pressing parameters. If only the high-frequency material is used in the high-frequency signal area (local) and the common FR-4 material is used in other areas, the manufacturing method of locally embedding the high-frequency material can reduce the use cost of the high-frequency material, simultaneously meets the use requirement, and greatly reduces the cost in the PCB processing and assembling process. If the PCB structure has the requirement of local high density, the high-frequency sub-board can be locally embedded, the level of the whole PCB is reduced, meanwhile, the processing cost of the printed circuit board is reduced, and the local mixed compression technology is adopted along with the gradual development of the PCB to the high-frequency and high-speed directions, so that the cost is saved.
In the prior art, the following problems still exist: 1. malposition of the daughter board after mixed pressing; 2. the insufficient glue filling and the board surface glue flowing at the mixed pressing part are controlled; 3. the warping degree of the plate is not controlled; 4. and the reliability test is unqualified.
Disclosure of Invention
In view of the above, the present invention provides a local mixing and pressing method for a high-speed printed circuit board, and the method of the present invention provides local mixing and pressing processes with two structures.
The technical scheme of the invention is as follows:
a local mixed compression method of a high-speed printed circuit board is characterized by comprising a plane local mixed compression process and a three-dimensional local mixed compression process;
preparing a plane local mixed-compression structure by the plane local mixed-compression process; and the three-dimensional local mixed compression structure is prepared by the three-dimensional local mixed compression process.
Further, the planar local mixed compression process comprises the following steps: daughter board/mother board: cutting → inner layer pattern → inner layer etching → outer layer pattern → inner layer punching groove → inner layer AOI → brown mother-son board mixed pressing, laminating → edge milling, drilling target → drilling → removing drilling stain → copper deposition → electroplating → outer layer pattern → outer layer etching → outer layer inspection → resistance welding/character → surface treatment → milling appearance → electrical property test → finished product inspection → final trial → packaging.
Further, in the shape milling process, the milling shape of the daughter board is to mill the whole PCB into independent small boards; the milling shape of the mother plate is to slot the L1-L2 layer core plate.
Further, only the browning of the L2 layer was performed after the milling of the daughter board.
Further, the three-dimensional local mixed pressing plate process comprises the following steps: sub-board blanking → inner layer pattern → inner layer etching → inner layer notching → inner layer inspection → laminating → edge milling/target drilling → horizontal desmearing → copper deposition → electroplating → resin plugging → mechanical glue removal → ceramic brush plate → outer layer pattern → outer layer acid etching → outer layer inspection → shape → brown oxidized mother board blanking → inner pattern → inner layer notching → inner layer inspection → shape → brown oxidized mother board mixed pressing: laminating → edge milling → drilling → desmearing → hole forming → thickening electroplating → outer drawing → pattern electroplating → outer layer alkaline etching → outer layer inspection → solder resist/character → surface processing → outer shape milling → final trial → packaging.
Furthermore, the daughter board is manufactured into a PCB with complete performance, and the metalized through holes of the daughter board are plugged.
Furthermore, the outer layer graph of the daughter board is only made into an L6 layer graph, and after the daughter board and the mother board are mixed and pressed, the surface circuit graph of the whole board is made into the outer layer graph.
Furthermore, in the planar local mixed-compression structure, on the same planar layer, except for the high-frequency signal area which adopts the high-frequency microwave material, the other areas still use the common FR-4 material.
Further, the planar local mixed-compression structure is a 6-layer planar local mixed-compression structure, the high-frequency material is any one of PTFE, Megtron series or Rogers series materials, and the mother board is made of common FR-4 materials.
Further, slotting an L1-L2 layer core plate of the mother plate, embedding the high-frequency daughter board into the mother plate, and then carrying out mixed pressing, wherein the mixed pressing area is combined by the prepregs between the core plates; when the plate is processed, firstly, a daughter board in a high-frequency region is processed, then, a L1-L2 layer core board of a mother board is grooved, and the daughter board and the mother board are combined through a middle prepreg after lamination and pressing, so that an integral plate is formed.
Furthermore, in the L1-L2 layer core board slot of the mother board, the tolerance requirement is set between the slot size and the daughter board size, and the thickness of the core board of the L1-L2 layer of the mother board is equal to that of the daughter board.
Furthermore, a plurality of high-frequency daughter boards are embedded on one mother board simultaneously, so that high density of a plurality of areas is realized. Three high-frequency daughter boards are embedded on one mother board, and a plurality of high-frequency high-speed areas can be realized on one mother board.
Furthermore, in the three-dimensional local mixed-compression structure, only a local area needs high density, a high-density small-size daughter board can be pressed into a large-size mother board with a lower layer number according to the requirement, and a local high-density multilayer board is formed in the superposed area of the daughter board and the mother board to realize high-density signal transmission.
Furthermore, the three-dimensional local mixed-compression structure adopts a daughter board with 12 layers, a mother board with an 8-layer structure, and the mother board is made of common FR-4 material.
Furthermore, the three-dimensional local mixed-compression structure adopts a structural design of 6 layers of sub-boards and 12 layers of mother boards, the 6 layers of sub-boards are made of high-frequency Megtron6 (R5775) materials, and the 12 layers of mother boards are made of common FR-4 materials.
Furthermore, the core plates of the layers of the mother plates L1-L2 and L3-L4 are grooved, and the plates are buried in the grooved mother plates, so that three-dimensional local mixed compression is realized.
Particularly, the materials of the daughter board and the mother board are selected, and the thickness of the daughter board is required to be the same as that of the mother board L1-L4 layer core board after lamination.
According to the invention, the local embedded daughter board has the requirement of interlayer alignment, the mother board is manufactured in a pin positioning mode, pin positioning holes are required to be designed on the mother board and the daughter board, and the dislocation of the mother board and the daughter board is improved in a mode that positioning pins are required to be milled after pressing. In addition, in order to prevent errors in the stacking of the mother and daughter boards, an error-proof design is required on the mother and daughter boards, so that the mother and daughter boards cannot be identified in the stacking process;
meanwhile, the mixed-pressing joint is filled by the inner-layer prepreg gummosis at the pressing process. The glue flow of the board surface is controlled to be too fast, so that the glue is prevented from overflowing to the board surface. When the glue filling at the mixed pressing position is insufficient, the prepreg with high glue content is used, the glue flow is insufficient during the lamination, and the gap of the mixed pressing area cannot be fully filled; resin flow and filling are improved by adjusting lamination parameters in a kraft paper padding mode; by optimizing the dimensional tolerance of the slotting of the mother plate, the problems that the gap of a mixed pressure area is small and resin flow is not facilitated are solved. In order to improve the warpage of the plate, the equation al-b1= a2-b2 is required to be established, and the material and pressing parameters are optimized.
The invention provides a local mixed-compression process with two structures, which is characterized in that a large amount of creative labor of an inventor is utilized, a defect generation mechanism is actually analyzed, a local mixed-compression technology of a printed circuit board is mastered through data analysis, large-scale mass production is realized, and reliability tests such as stress test at 288 ℃ for x10s x 5 times, lead-free reflow soldering for 5 times, no delamination and the like show that the reliability of the local mixed-compression technology is qualified.
Drawings
FIG. 1 is a schematic structural diagram of planar local mixing and pressing according to the present invention;
FIG. 2 is a schematic view of a method for embedding a mother board into a plurality of daughter boards according to the present invention;
fig. 3 is a schematic structural view of three-dimensional partial mixing and pressing according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Example 1
The local mixed-compression method for the high-speed printed circuit board is characterized by comprising a plane local mixed-compression process, wherein a plane local mixed-compression structure is prepared by the plane local mixed-compression process.
Further, the planar local mixed compression process comprises the following steps: daughter board/mother board: cutting → inner layer pattern → inner layer etching → outer layer pattern → inner layer punching groove → inner layer AOI → brown mother-son board mixed pressing, laminating → edge milling, drilling target → drilling → removing drilling stain → copper deposition → electroplating → outer layer pattern → outer layer etching → outer layer inspection → resistance welding/character → surface treatment → milling appearance → electrical property test → finished product inspection → final trial → packaging.
Further, in the shape milling process, the milling shape of the daughter board is to mill the whole PCB into independent small boards; the milling shape of the mother plate is to slot the L1-L2 layer core plate.
Further, only the browning of the L2 layer was performed after the milling of the daughter board.
Furthermore, in the planar local mixed-compression structure, on the same planar layer, except for the high-frequency signal area which adopts the high-frequency microwave material, the other areas still use the common FR-4 material.
Further, the planar local mixed-compression structure is a 6-layer planar local mixed-compression structure, the high-frequency material is any one of PTFE, Megtron series or Rogers series materials, and the mother board is made of common FR-4 materials.
Further, slotting an L1-L2 layer core plate of the mother plate, embedding the high-frequency daughter board into the mother plate, and then carrying out mixed pressing, wherein the mixed pressing area is combined by the prepregs between the core plates; when the plate is processed, firstly, a daughter board in a high-frequency region is processed, then, a L1-L2 layer core board of a mother board is grooved, and the daughter board and the mother board are combined through a middle prepreg after lamination and pressing, so that an integral plate is formed.
Furthermore, in the L1-L2 layer core board slot of the mother board, the tolerance requirement is set between the slot size and the daughter board size, and the thickness of the core board of the L1-L2 layer of the mother board is equal to that of the daughter board.
According to the invention, the local embedded daughter board has the requirement of interlayer alignment, the mother board is manufactured in a pin positioning mode, pin positioning holes are required to be designed on the mother board and the daughter board, and the dislocation of the mother board and the daughter board is improved in a mode that positioning pins are required to be milled after pressing. In addition, in order to prevent errors in the stacking of the mother and daughter boards, an error-proof design is required on the mother and daughter boards, so that the mother and daughter boards cannot be identified in the stacking process;
meanwhile, the mixed-pressing joint is filled by the inner-layer prepreg gummosis at the pressing process. The glue flow of the board surface is controlled to be too fast, so that the glue is prevented from overflowing to the board surface. When the glue filling at the mixed pressing position is insufficient, the prepreg with high glue content is used, the glue flow is insufficient during the lamination, and the gap of the mixed pressing area cannot be fully filled; resin flow and filling are improved by adjusting lamination parameters in a kraft paper padding mode; by optimizing the dimensional tolerance of the slotting of the mother plate, the problems that the gap of a mixed pressure area is small and resin flow is not facilitated are solved. In order to improve the warpage of the plate, the equation al-b1= a2-b2 is required to be established, and the material and pressing parameters are optimized.
Through a large amount of creative labor of the inventor, the defect generation mechanism is actually analyzed, the local mixed compression technology of the printed circuit board is mastered through data analysis, large-scale mass production is realized, and reliability tests such as 288 ℃ of stress test x10s x 5 times, 5 times of lead-free reflow soldering without delamination and the like show that the reliability of the local mixed compression technology is qualified.
Example 2
The local mixed-compression method for the high-speed printed circuit board is characterized by comprising a plane local mixed-compression process, wherein a plane local mixed-compression structure is prepared by the plane local mixed-compression process.
Further, the planar local mixed compression process comprises the following steps: daughter board/mother board: cutting → inner layer pattern → inner layer etching → outer layer pattern → inner layer punching groove → inner layer AOI → brown mother-son board mixed pressing, laminating → edge milling, drilling target → drilling → removing drilling stain → copper deposition → electroplating → outer layer pattern → outer layer etching → outer layer inspection → resistance welding/character → surface treatment → milling appearance → electrical property test → finished product inspection → final trial → packaging.
Further, in the shape milling process, the milling shape of the daughter board is to mill the whole PCB into independent small boards; the milling shape of the mother plate is to slot the L1-L2 layer core plate.
Further, only the browning of the L2 layer was performed after the milling of the daughter board.
Furthermore, in the planar local mixed-compression structure, on the same planar layer, except for the high-frequency signal area which adopts the high-frequency microwave material, the other areas still use the common FR-4 material.
Further, the planar local mixed-compression structure is a 6-layer planar local mixed-compression structure, the high-frequency material is any one of PTFE, Megtron series or Rogers series materials, and the mother board is made of common FR-4 materials.
Further, slotting an L1-L2 layer core plate of the mother plate, embedding the high-frequency daughter board into the mother plate, and then carrying out mixed pressing, wherein the mixed pressing area is combined by the prepregs between the core plates; when the plate is processed, firstly, a daughter board in a high-frequency region is processed, then, a L1-L2 layer core board of a mother board is grooved, and the daughter board and the mother board are combined through a middle prepreg after lamination and pressing, so that an integral plate is formed.
Furthermore, in the L1-L2 layer core board slot of the mother board, the tolerance requirement is set between the slot size and the daughter board size, and the thickness of the core board of the L1-L2 layer of the mother board is equal to that of the daughter board.
Furthermore, a plurality of high-frequency daughter boards are embedded on one mother board simultaneously, so that high density of a plurality of areas is realized. Three high-frequency daughter boards are embedded on one mother board, and a plurality of high-frequency high-speed areas can be realized on one mother board.
According to the invention, the local embedded daughter board has the requirement of interlayer alignment, the mother board is manufactured in a pin positioning mode, pin positioning holes are required to be designed on the mother board and the daughter board, and the dislocation of the mother board and the daughter board is improved in a mode that positioning pins are required to be milled after pressing. In addition, in order to prevent errors in the stacking of the mother and daughter boards, an error-proof design is required on the mother and daughter boards, so that the mother and daughter boards cannot be identified in the stacking process;
meanwhile, the mixed-pressing joint is filled by the inner-layer prepreg gummosis at the pressing process. The glue flow of the board surface is controlled to be too fast, so that the glue is prevented from overflowing to the board surface. When the glue filling at the mixed pressing position is insufficient, the prepreg with high glue content is used, the glue flow is insufficient during the lamination, and the gap of the mixed pressing area cannot be fully filled; resin flow and filling are improved by adjusting lamination parameters in a kraft paper padding mode; by optimizing the dimensional tolerance of the slotting of the mother plate, the problems that the gap of a mixed pressure area is small and resin flow is not facilitated are solved. In order to improve the warpage of the plate, the equation al-b1= a2-b2 is required to be established, and the material and pressing parameters are optimized.
Through a large amount of creative labor of the inventor, the defect generation mechanism is actually analyzed, the local mixed compression technology of the printed circuit board is mastered through data analysis, large-scale mass production is realized, and reliability tests such as 288 ℃ of stress test x10s x 5 times, 5 times of lead-free reflow soldering without delamination and the like show that the reliability of the local mixed compression technology is qualified.
According to the invention, the local embedded daughter board has the requirement of interlayer alignment, the mother board is manufactured in a pin positioning mode, pin positioning holes are required to be designed on the mother board and the daughter board, and the dislocation of the mother board and the daughter board is improved in a mode that positioning pins are required to be milled after pressing. In addition, in order to prevent errors in the stacking of the mother and daughter boards, an error-proof design is required on the mother and daughter boards, so that the mother and daughter boards cannot be identified in the stacking process;
meanwhile, the mixed-pressing joint is filled by the inner-layer prepreg gummosis at the pressing process. The glue flow of the board surface is controlled to be too fast, so that the glue is prevented from overflowing to the board surface. When the glue filling at the mixed pressing position is insufficient, the prepreg with high glue content is used, the glue flow is insufficient during the lamination, and the gap of the mixed pressing area cannot be fully filled; resin flow and filling are improved by adjusting lamination parameters in a kraft paper padding mode; by optimizing the dimensional tolerance of the slotting of the mother plate, the problems that the gap of a mixed pressure area is small and resin flow is not facilitated are solved. In order to improve the warpage of the plate, the equation al-b1= a2-b2 is required to be established, and the material and pressing parameters are optimized.
The invention provides a local mixed-compression process with two structures, which is characterized in that a large amount of creative labor of an inventor is utilized, a defect generation mechanism is actually analyzed, a local mixed-compression technology of a printed circuit board is mastered through data analysis, large-scale mass production is realized, and reliability tests such as stress test at 288 ℃ for x10s x 5 times, lead-free reflow soldering for 5 times, no delamination and the like show that the reliability of the local mixed-compression technology is qualified.
Example 3
The local mixed-compression method for the high-speed printed circuit board is characterized by comprising a three-dimensional local mixed-compression process, wherein a three-dimensional local mixed-compression structure is prepared by the three-dimensional local mixed-compression process.
Furthermore, in the three-dimensional local mixed-compression structure, only a local area needs high density, a high-density small-size daughter board can be pressed into a large-size mother board with a lower layer number according to the requirement, and a local high-density multilayer board is formed in the superposed area of the daughter board and the mother board to realize high-density signal transmission.
Furthermore, the three-dimensional local mixed-compression structure adopts a daughter board with 12 layers, a mother board with an 8-layer structure, and the mother board is made of common FR-4 material.
Furthermore, the core plates of the layers of the mother plates L1-L2 and L3-L4 are grooved, and the plates are buried in the grooved mother plates, so that three-dimensional local mixed compression is realized.
Particularly, the materials of the daughter board and the mother board are selected, and the thickness of the daughter board is required to be the same as that of the mother board L1-L4 layer core board after lamination.
According to the invention, the local embedded daughter board has the requirement of interlayer alignment, the mother board is manufactured in a pin positioning mode, pin positioning holes are required to be designed on the mother board and the daughter board, and the dislocation of the mother board and the daughter board is improved in a mode that positioning pins are required to be milled after pressing. In addition, in order to prevent errors in the stacking of the mother and daughter boards, an error-proof design is required on the mother and daughter boards, so that the mother and daughter boards cannot be identified in the stacking process;
meanwhile, the mixed-pressing joint is filled by the inner-layer prepreg gummosis at the pressing process. The glue flow of the board surface is controlled to be too fast, so that the glue is prevented from overflowing to the board surface. When the glue filling at the mixed pressing position is insufficient, the prepreg with high glue content is used, the glue flow is insufficient during the lamination, and the gap of the mixed pressing area cannot be fully filled; resin flow and filling are improved by adjusting lamination parameters in a kraft paper padding mode; by optimizing the dimensional tolerance of the slotting of the mother plate, the problems that the gap of a mixed pressure area is small and resin flow is not facilitated are solved. In order to improve the warpage of the plate, the equation al-b1= a2-b2 is required to be established, and the material and pressing parameters are optimized.
Through a large amount of creative labor of the inventor, the defect generation mechanism is actually analyzed, the local mixed compression technology of the printed circuit board is mastered through data analysis, large-scale mass production is realized, and reliability tests such as 288 ℃ of stress test x10s x 5 times, 5 times of lead-free reflow soldering without delamination and the like show that the reliability of the local mixed compression technology is qualified.
Example 4
The local mixed-compression method for the high-speed printed circuit board is characterized by comprising a three-dimensional local mixed-compression process, wherein a three-dimensional local mixed-compression structure is prepared by the three-dimensional local mixed-compression process.
Furthermore, in the three-dimensional local mixed-compression structure, only a local area needs high density, a high-density small-size daughter board can be pressed into a large-size mother board with a lower layer number according to the requirement, and a local high-density multilayer board is formed in the superposed area of the daughter board and the mother board to realize high-density signal transmission.
Furthermore, the three-dimensional local mixed-compression structure adopts a structural design of 6 layers of sub-boards and 12 layers of mother boards, the 6 layers of sub-boards are made of high-frequency Megtron6 (R5775) materials, and the 12 layers of mother boards are made of common FR-4 materials.
Furthermore, the core plates of the layers of the mother plates L1-L2 and L3-L4 are grooved, and the plates are buried in the grooved mother plates, so that three-dimensional local mixed compression is realized.
Particularly, the materials of the daughter board and the mother board are selected, and the thickness of the daughter board is required to be the same as that of the mother board L1-L4 layer core board after lamination.
According to the invention, the local embedded daughter board has the requirement of interlayer alignment, the mother board is manufactured in a pin positioning mode, pin positioning holes are required to be designed on the mother board and the daughter board, and the dislocation of the mother board and the daughter board is improved in a mode that positioning pins are required to be milled after pressing. In addition, in order to prevent errors in the stacking of the mother and daughter boards, an error-proof design is required on the mother and daughter boards, so that the mother and daughter boards cannot be identified in the stacking process;
meanwhile, the mixed-pressing joint is filled by the inner-layer prepreg gummosis at the pressing process. The glue flow of the board surface is controlled to be too fast, so that the glue is prevented from overflowing to the board surface. When the glue filling at the mixed pressing position is insufficient, the prepreg with high glue content is used, the glue flow is insufficient during the lamination, and the gap of the mixed pressing area cannot be fully filled; resin flow and filling are improved by adjusting lamination parameters in a kraft paper padding mode; by optimizing the dimensional tolerance of the slotting of the mother plate, the problems that the gap of a mixed pressure area is small and resin flow is not facilitated are solved. In order to improve the warpage of the plate, the equation al-b1= a2-b2 is required to be established, and the material and pressing parameters are optimized.
Through a large amount of creative labor of the inventor, the defect generation mechanism is actually analyzed, the local mixed compression technology of the printed circuit board is mastered through data analysis, large-scale mass production is realized, and reliability tests such as 288 ℃ of stress test x10s x 5 times, 5 times of lead-free reflow soldering without delamination and the like show that the reliability of the local mixed compression technology is qualified.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art in the field.
Claims (10)
1. A local mixed compression method of a high-speed printed circuit board is characterized by comprising a plane local mixed compression process and a three-dimensional local mixed compression process;
preparing a plane local mixed-compression structure by the plane local mixed-compression process; and the three-dimensional local mixed compression structure is prepared by the three-dimensional local mixed compression process.
2. The local mixing and pressing method for the high-speed printed circuit board according to claim 1, wherein the planar local mixing and pressing process comprises the following steps: daughter board/mother board: cutting → inner layer pattern → inner layer etching → outer layer pattern → inner layer punching groove → inner layer AOI → brown mother-son board mixed pressing, laminating → edge milling, drilling target → drilling → removing drilling stain → copper deposition → electroplating → outer layer pattern → outer layer etching → outer layer inspection → resistance welding/character → surface treatment → milling appearance → electrical property test → finished product inspection → final trial → packaging.
3. The local mixing and pressing method for the high-speed printed circuit board according to claim 2, wherein in the milling process, the milling shape of the daughter board is to mill the whole PCB into independent small boards; the milling shape of the mother plate is to slot the L1-L2 layer core plate.
4. The high-speed printed circuit board partial pressure mixing method according to claim 1, wherein the three-dimensional partial pressure mixing plate process comprises the following steps: sub-board blanking → inner layer pattern → inner layer etching → inner layer notching → inner layer inspection → laminating → edge milling/target drilling → horizontal desmearing → copper deposition → electroplating → resin plugging → mechanical glue removal → ceramic brush plate → outer layer pattern → outer layer acid etching → outer layer inspection → shape → brown oxidized mother board blanking → inner pattern → inner layer notching → inner layer inspection → shape → brown oxidized mother board mixed pressing: laminating → edge milling → drilling → desmearing → hole forming → thickening electroplating → outer drawing → pattern electroplating → outer layer alkaline etching → outer layer inspection → solder resist/character → surface processing → outer shape milling → final trial → packaging.
5. The method as claimed in claim 4, wherein the outer layer pattern of the daughter board is only L6 layer pattern, and after the daughter board and the mother board are mixed and pressed, the surface circuit pattern of the whole board is made on the outer layer pattern.
6. The local co-compression method for the high-speed printed circuit board according to claim 1, wherein in the planar local co-compression structure, on the same planar layer, except for the high-frequency signal area which is made of high-frequency material, the common FR-4 material is still used in other areas; the high-frequency material is made of any one of PTFE, Megtron series or Rogers series materials, and the motherboard is made of common FR-4 materials.
7. The local mixed compression method for the high-speed printed circuit board according to claim 6, wherein the planar local mixed compression structure is a 6-layer planar local mixed compression structure, the L1-L2 core plates of the mother board are grooved, the high-frequency daughter board is buried in the mother board and then mixed compressed, and the mixed compression area is combined by the prepregs between the core plates; when the plate is processed, firstly, a daughter board in a high-frequency region is processed, then, a L1-L2 layer core board of a mother board is grooved, and the daughter board and the mother board are combined through a middle prepreg after lamination and pressing, so that an integral plate is formed.
8. The method of claim 6, wherein a plurality of high frequency daughter boards are embedded simultaneously on a mother board to achieve high density of multiple areas.
9. The local mixed compression method for the high-speed printed circuit board according to claim 1, wherein when the three-dimensional local mixed compression structure adopts a daughter board with 12 layers, a mother board with an 8-layer structure, and the mother board is made of a common FR-4 material; when the three-dimensional local mixed-compression structure adopts a structural design of 6 layers of daughter boards and 12 layers of mother boards, the 6 layers of daughter boards adopt high-frequency Megtron6 materials, and the 12 layers of mother boards adopt common FR-4 materials.
10. The local mixed compression method for the high-speed printed circuit board as claimed in claim 9, wherein the three-dimensional local mixed compression is realized by slotting the core plates of the layers L1-L2 and L3-L4 of the mother board and embedding the plates into the slotted mother board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011012738.1A CN112188760A (en) | 2020-09-23 | 2020-09-23 | Local mixed-compression method for high-speed printed circuit board |
Applications Claiming Priority (1)
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| WO2024131221A1 (en) * | 2022-12-22 | 2024-06-27 | 胜宏科技（惠州）股份有限公司 | Method for manufacturing high-layer-count multilayer circuit board with local multi-frequency compatibility |
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Application publication date: 20210105 |