CN112171074A - Cutting equipment for solar cell - Google Patents
Cutting equipment for solar cell Download PDFInfo
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- CN112171074A CN112171074A CN201910586809.XA CN201910586809A CN112171074A CN 112171074 A CN112171074 A CN 112171074A CN 201910586809 A CN201910586809 A CN 201910586809A CN 112171074 A CN112171074 A CN 112171074A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 85
- 230000007246 mechanism Effects 0.000 claims abstract description 105
- 238000001179 sorption measurement Methods 0.000 claims description 17
- 238000006073 displacement reaction Methods 0.000 claims description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 238000002834 transmittance Methods 0.000 description 8
- 238000009434 installation Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000010248 power generation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- CPBQJMYROZQQJC-UHFFFAOYSA-N helium neon Chemical compound [He].[Ne] CPBQJMYROZQQJC-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of photovoltaic product processing equipment, in particular to solar cell cutting equipment. The laser spectrometer comprises a shifting mechanism, a laser emitter, a supporting mechanism and a light splitting mechanism, wherein the shifting mechanism comprises a driving part and a mounting plate, and the driving part is movably connected with the mounting plate along a first direction; the laser emitter is connected to the mounting plate; the supporting mechanism is positioned on one side of the mounting plate and used for supporting the solar cell to be cut; the light splitting mechanism comprises a base, a refractor and a reflector, the base is connected to one side, close to the supporting mechanism, of the mounting plate, the refractor and the reflector are connected with the mounting plate through the base, the refractor is located between the laser emitter and the reflector, laser is divided into a reflected light beam and a refracted light beam through the refractor, and the reflected light beam and the refracted light beam are used for cutting the solar cell. The cutting equipment is used for cutting the solar cell, the cutting loss and the cutting seam are small, the cutting quality and efficiency are high, and the production cost can be reduced.
Description
Technical Field
The invention relates to the technical field of photovoltaic product processing equipment, in particular to solar cell cutting equipment.
Background
With the enhancement of energy-saving and environment-friendly consciousness, the photovoltaic industry is rapidly developed. In the field of photovoltaic power generation, a slicing process and a tiling process are combined to improve the photoelectric conversion efficiency. However, the slicing quality of the solar cell directly affects the conversion efficiency. At present, the solar cell is generally cut by adopting laser output by a galvanometer, but because the quality of laser beams generated by the galvanometer is poor, the cutting loss and the cutting seam of the formed slice are large, the effective power generation area of the slice is small, the quality of the slice is relatively low, and the production cost is high.
Disclosure of Invention
The technical problem to be solved by the invention is as follows: the current solar cell slice has large cutting loss and cutting seam, small effective power generation area, relatively low quality and high production cost.
(II) technical scheme
In order to achieve the above technical problem, the present invention provides a solar cell cutting apparatus, which includes:
the displacement mechanism comprises a driving part and a mounting plate, and the driving part is movably connected with the mounting plate along a first direction;
the laser emitter is connected to the mounting plate and used for emitting laser;
the supporting mechanism is positioned on one side of the mounting plate and used for supporting the solar cell to be cut;
light splitting mechanism, light splitting mechanism includes base, refractor and speculum, the pedestal connection in the mounting panel is close to one side of supporting mechanism, the refractor with the speculum all passes through the base with the mounting panel is connected, just the refractor is located laser emitter with between the speculum, laser passes through the refractor falls into reflected beam and refraction light beam, the reflected beam with the refraction light beam all is used for the cutting solar wafer.
Optionally, the refractor is provided with a plurality of refractors, and the plurality of refractors are arranged between the laser emitter and the reflector at intervals.
Optionally, the energy of the reflected beam is the same as the energy of the refracted beam.
Optionally, the base is provided with a plurality of, along the second direction perpendicular to the first direction, the refractor passes through the base with the mounting panel is adjustable to be connected.
Optionally, the refractor is detachably connected with the mounting plate.
Optionally, the cutting equipment provided by the invention further comprises a negative pressure adsorption mechanism, the support mechanism is provided with a support surface, the support surface is used for supporting the solar cell to be cut, the support surface is provided with an adsorption fixing hole, and the adsorption fixing hole is connected with the negative pressure adsorption mechanism.
Optionally, an avoiding conduction groove is formed in one side of the supporting surface of the supporting mechanism, the avoiding conduction groove extends along the first direction, and the avoiding conduction groove is communicated with spaces on two opposite sides of the supporting mechanism along the first direction.
Optionally, the wavelength of the laser is 1064 nm.
Optionally, the cutting device provided by the invention further comprises a feeding mechanism, wherein the feeding mechanism comprises a mechanical arm and a suction cup, and the suction cup is connected with the end part of the mechanical arm and is used for sucking the solar cell to be cut and transferring the solar cell to the supporting mechanism.
Optionally, the cutting device provided by the invention further comprises a CCD positioning mechanism, the CCD positioning mechanism is connected with the feeding mechanism, and the CCD positioning mechanism is used for determining the position of the supporting mechanism and controlling the feeding mechanism to act.
(III) advantageous effects
The invention provides a cutting device of a solar cell, which generates laser by means of a laser transmitter, and further the quality of the generated laser is higher, so that the cutting loss and the joint cutting uniformity are smaller in the process of cutting the solar cell, the quality of a slice is higher, and the slice has a larger power generation area; meanwhile, the cutting equipment provided by the invention comprises the light splitting mechanism, and the laser emitted by the laser emitter can be divided into the reflected light beam and the refracted light beam by virtue of the refractor in the light splitting mechanism, so that the solar cell is cut by virtue of the reflected light beam and the refracted light beam in the process of cutting the solar cell, the cutting efficiency can be improved, the production efficiency is further improved, and the production cost is reduced.
Drawings
The advantages of the above and/or additional aspects of the present invention will become apparent and readily appreciated from the following description of the embodiments taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic diagram of a solar cell cutting device provided by the invention in cooperation with a solar cell;
fig. 2 is a working state diagram of the solar cell cutting equipment provided by the invention.
Reference numerals
1-a drive section; 2-a laser emitter; 3-a mirror; 4-a refractor; 5, mounting a plate; 6-solar cell slice; 7-a scaffold; 8-a support mechanism; 9-avoiding a conduction groove; 10-base.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.
As shown in fig. 1, an embodiment of the present invention provides a cutting apparatus for a solar cell 6, which includes a displacement mechanism, a laser emitter 2, a light splitting mechanism, and a support mechanism 8, wherein the laser emitter 2 is configured to generate laser light to cut the solar cell 6 by energy of the laser light, so that one solar cell 6 is cut into a plurality of slices; before and during the cutting work, the solar cell sheet 6 to be cut can be supported on the supporting mechanism 8, the shifting mechanism comprises a driving part 1 and a mounting plate 5, the driving part 1 is movably connected with the mounting plate 5 along a first direction, and the laser emitter 2 is mounted on the mounting plate 5, so that the position of the laser emitter 2 is changed by means of the driving part 1 during the cutting process, a set track is formed on the solar cell sheet 6, and the cutting work is completed; in order to improve the cutting efficiency, the laser emitter 2 is also matched with a light splitting mechanism, the light splitting mechanism comprises a base 10, a refractor 4 and a reflector 3, the base 10 is connected with one side, close to the supporting mechanism 8, of the mounting plate 5, the refractor 4 and the reflector 3 are both connected with the mounting plate 5 through the base 10, the refractor 4 is located between the laser emitter 2 and the reflector 3, then after laser passes through the refractor 4, a reflected light beam and a refracted light beam are formed, the reflected light beam irradiates the supporting mechanism 8 arranged opposite to the light splitting mechanism to cut the solar cell piece 6, and the refracted light beam irradiates the reflector 3 to change the propagation direction under the action of the reflector 3 to finally act on the solar cell piece 6 to cut the solar cell piece 6.
Specifically, the laser emitter 2 may be a free electron laser emitter, a helium neon laser emitter, or a laser diode, and the wavelength of the emitted laser may be determined according to actual requirements, for example, the laser may be ultraviolet light, infrared light, or green light. Alternatively, the laser emitter 2 may be a water-cooled fiber laser emitter with a power of 100W-500W, and the wavelength of the emitted laser may be 1064nm, which is relatively high in energy, and relatively low in equipment cost, electricity cost, and the like for forming the laser. As shown in fig. 1, the laser emitter 2 may be fixedly connected to the mounting plate through a bracket 7, the bracket 7 and the mounting plate 5 may be formed in an integrally formed manner, or the bracket 7 may be fixedly connected to the mounting plate 5 through a threaded connection member or the like; and the specific structure of the support 7 can be determined according to the actual structure of the laser emitter 2, and is not limited herein.
The mounting plate 5 can be made of hard materials such as metal, the specific structure of the mounting plate can be flexibly determined according to the actual structure of the part to be mounted, the driving part 1 can be a cylinder, a hydraulic cylinder or an electric cylinder, and optionally, the driving part 1 can be an electric cylinder, so that the variety of power sources required by the whole cutting equipment can be reduced, and on the other hand, the control precision of each parameter of the electric cylinder is relatively high, and the cutting work requirement can be better met; the mounting plate 5 can be installed on the driving shaft of the driving part 1, and the seat body of the driving part 1 can be installed on a wall body or other positions of a processing workshop, so that in the process of the action of the driving part 1, the relative position of the mounting plate 5 can be changed, and finally, the cutting work of the solar cell 6 is completed. Before the cutting process begins, the solar cell sheet 6 to be cut can be placed on the supporting mechanism 8 in a manual taking mode, or the solar cell sheet 6 can be transferred to the supporting mechanism 8 by means of a mechanical arm and other equipment. The first direction may be determined according to the placing position of the solar cell 6, the cutting manner, and other practical situations, for example, the first direction may be a direction a in fig. 1.
Optionally, the cutting device provided in the embodiment of the present invention may further include a feeding mechanism (not shown in the drawings), which may specifically be a combination mechanism of a mechanical arm and a suction cup, where the mechanical arm may be a multi-link structure. In the cutting process, the supporting mechanism 8 can be supplied with materials by the feeding mechanism, so that the automation degree of the whole cutting work can be further improved, and the processing efficiency and the safety performance can be improved to a certain degree. In detail, the sucker is a negative pressure sucker, the mechanical arm can be a three-axis mechanical arm or a free mechanical arm, the sucker is mounted at the end of the mechanical arm and can be communicated with negative pressure equipment, so that the connection reliability between the sucker and the solar cell 6 is further improved, the sucker is matched with the solar cell 6, and an operator can move the solar cell 6 to a set position, namely the position of the supporting mechanism 8, by operating the mechanical arm, so that the feeding work of the solar cell 6 is completed; accordingly, after the solar cell sheet 6 is cut, the cut sheet can be taken out by a mechanism similar to the feeding mechanism, and will not be described in detail here.
Optionally, the cutting apparatus provided in the embodiment of the present invention may further include a CCD (Charge-coupled Device) CCD positioning mechanism (not shown in the figure), the CCD positioning mechanism is matched with the feeding mechanism, and during the cutting process, the CCD positioning mechanism may determine the position of the supporting mechanism 8 by using the acquired real-time image, and control the movement of the feeding mechanism according to the information, that is, control how the feeding mechanism moves, so as to ensure that the feeding mechanism can accurately place the solar cell 6 on the supporting mechanism 8, which may further improve the automation degree of the entire cutting apparatus, thereby reducing the labor cost. Specifically, CCD positioning mechanism can include a plurality of modules of making a video recording to obtain supporting mechanism 8's position from a plurality of angles, then through the mode of comprehensive judgement, can confirm supporting mechanism 8's actual position comparatively accurately, in order to further guarantee that solar wafer 6 can form comparatively reliable relation of connection with supporting mechanism 8.
The supporting mechanism 8 can be a workbench, and can be fixed on a table surface such as the ground, or can form a relatively fixed relationship with the mounting plate 5, the size of the size can be determined according to the actual size of the solar cell 6 to be supported, and the solar cell 6 can be fixed on the supporting mechanism 8 under the action of the self gravity, or can be fixed on the supporting mechanism 8 by means of other components such as a buckle. More specifically, the support mechanism 8 has a support surface on which the solar cell sheet 6 is supported.
Optionally, as shown in fig. 1, an avoiding conduction groove 9 may be provided on the supporting surface, and the avoiding conduction groove 9 extends along the first direction, thereby in the process of cutting the solar cell piece 6 by means of laser, the supporting mechanism 8 may be prevented from being damaged by the laser through the avoiding conduction groove 9, and simultaneously, because the energy of the laser is relatively high, in the process of cutting the solar cell piece 6, certain heat may be inevitably generated, the avoiding conduction groove 9 is provided on the supporting mechanism 8, and the two sides of the supporting mechanism 8 may also be subjected to gas exchange through the avoiding conduction groove 9, in the process of gas exchange, the energy on the solar cell piece 6 may be taken away, and further, the solar cell piece 6 may be prevented from being damaged by too high temperature. Specifically, the avoiding conduction groove 9 may be a rectangular groove, and the specific size thereof may be flexibly determined according to the actual situation. In addition, a plurality of avoidance guiding grooves 9 may be provided, and in the case where a plurality of refractors 4 are provided, the plurality of avoidance guiding grooves 9 may correspond to the plurality of light beams one by one, respectively.
Optionally, the cutting apparatus provided in the embodiment of the present invention may further include a negative pressure adsorption mechanism (not shown in the figure), and the support surface may further be provided with an adsorption fixing hole, so that the adsorption fixing hole is communicated with the negative pressure adsorption mechanism, so as to further improve the connection reliability between the support mechanism 8 and the solar cell 6, so as to further ensure that the position of the solar cell 6 is not changed during the cutting process; meanwhile, the solar cell 6 is fixed through the negative pressure adsorption mechanism, the orientation of the supporting surface of the supporting mechanism 8 can be unlimited, if the supporting surface can be parallel to the gravity direction, and the solar cell 6 is fixed only through the negative pressure adsorption mechanism and the adsorption fixing hole, so that the installation range of the whole cutting equipment is expanded under certain conditions. Specifically, adsorb the fixed orifices and can be provided with a plurality ofly, a plurality ofly adsorb fixed orifices evenly distributed on the holding surface, and adsorb the fixed orifices and can pass through pipeline and negative pressure adsorption apparatus to solar wafer 6 on the fixed holding surface.
The base 10 and the mounting plate 5 in the light splitting mechanism can form a reliable connection relationship through a connecting piece, so that the whole light splitting mechanism cannot generate relative motion with the mounting plate 5 (or the laser emitter 2) in the cutting process, the stability of a reflected light beam and a refracted light beam formed by the light splitting mechanism is further ensured, and the slicing has high quality; the specific size of the refractor 4 and the reflector 3 can be determined according to actual requirements, and the refractive index and the transmittance of the refractor 4 can be determined according to actual factors such as the wavelength of the laser and the number of the refractors 4. In addition, both the refractor 4 and the reflector 3 can be made of quartz materials, and coating films can be formed on both the refractor 4 and the reflector 3 to ensure that both the refractor 4 and the reflector have high wear resistance and high temperature resistance; in the process of assembling the cutting device, as shown in fig. 2, a person skilled in the art can determine the incident angle of the laser according to the refractive index of the selected refractor 4 to ensure that the reflected light beam reflected by the refractor 4 can be emitted to the solar cell 6 opposite to the light splitting mechanism, and ensure that the refracted light beam passing through the refractor 4 can also be emitted to the solar cell 6 under the action of the reflector 3. It should be noted that, the installation angle of the refractor can be determined according to the actual conditions such as the refractive index of the refractor 4, so as to prevent the problem that the solar cell cannot be cut due to the condition of excessive angle deviation of the formed refracted light and reflected light after the laser is refracted and reflected by the refractor.
In order to further improve the cutting efficiency, optionally, as shown in fig. 1, a plurality of refractors 4 may be disposed in the cutting apparatus provided in the embodiment of the present invention, and the plurality of refractors 4 are disposed at intervals and are located between the laser emitter 2 and the reflector 3, so that when the laser emitted from the laser emitter 2 passes through each refractor 4, a reflected light and a refracted light may be formed, the reflected light is emitted to the solar cell 6, the refracted light propagates to the next refractor 4, and then another reflected light and another refracted light are generated, the another reflected light acts on the solar cell 6, the refracted light continues to propagate, and emits to the refractors 4 or reflectors 3, and when acting on the reflector 3, the reflected light may act on the solar cell 6, so as to form a plurality of light beams that can be used for cutting the solar cell 6, this can further improve the cutting efficiency of the solar cell sheet 6.
Specifically, the structures, refractive indexes and transmittances of the refractors 4 can be the same, and under the condition that the refractive indexes of the refractors 4 are the same, the installation positions, the inclination angles and the like of the refractors 4 are basically consistent, so that the assembly difficulty and the debugging difficulty of the whole cutting equipment can be reduced; optionally, the transmittances of the plurality of refractors 4 may be different from each other, so as to ensure that the energy of the light beam reflected by the reflector 3 is not greatly different from the energy of the light beam reflected by the upstream refractor 4, that is, the transmittances of the refractors 4 sequentially distributed along the emission direction of the laser may be gradually reduced, and further, the energy difference of the plurality of light beams formed by the laser through the light splitting mechanism is not large, which may ensure that different light beams may generate substantially the same cutting effect on the solar cell sheet 6, so as to further improve the quality of each cut sheet.
Optionally, the energy of the reflected light beam and the energy of the refracted light beam can be the same, under the condition, the cutting loss and the quality of the two opposite edges of the slice formed by cutting the reflected light beam and the refracted light beam can be basically the same, the quality consistency of each slice can be further ensured to be relatively high, and the overall quality of the slice is improved; meanwhile, under the condition that the energy of the reflected light beam and the energy of the refracted light beam are the same, the depths of the cutting slits formed by the reflected light beam and the refracted light beam are basically the same, so that the solar cell sheet 6 can be cut once to form a complete slice by adjusting the actual energy of the reflected light beam and the refracted light beam, and the situation that the whole cutting work can be completed only by cutting for many times at certain positions due to the fact that the energy of the reflected light beam and the energy of the refracted light beam are different can be effectively prevented; of course, in some cases, the energy of the reflected light beam and the refracted light beam can be reduced, so that the solar cell sheet 6 needs to be cut twice or more at the same position to form a complete slice, which can also reduce the cutting loss to some extent. In addition, the energy of the laser can be reduced, the solar cell sheet 6 can be subjected to an incomplete cutting process, and a subsequent splitting process is performed to form a complete slice.
Specifically, the energy of the reflected beam and the refracted beam formed by the laser through the refractor 4 can be equalized by changing the transmittance of the refractor 4; further, in the case where the refractor 4 is provided in plural, the energy of the plural beams formed by the laser light passing through the plural refractors 4 can be equalized by changing the transmittance of the refractor 4 at different positions. In the process of actually building the cutting equipment, a person skilled in the art can flexibly determine the transmittance of each refractor 4 according to the energy of the selected laser, the number of the refractors 4, the loss of the laser in the propagation process and other actual factors. It should be noted that the foregoing equality is not absolutely identical, and there may be a certain range of differences in energy between the reflected beam and the refracted beam, or between multiple beams, depending on the processing conditions, the precision of the laser emitter 2 and the refractor 4, and so on, and this is within the scope of the present invention.
Optionally, the base 10 can be movably connected to the mounting plate 5 along a second direction perpendicular to the first direction, so that in the cutting process of the solar cell 6, the purpose of slicing in different sizes can be achieved by adjusting the distance between the refractor 4 and the reflector 3 according to different requirements, and the applicability of the whole device can be wider; accordingly, in the case where the cutting apparatus is provided with a plurality of refractors 4, the interval between the adjacent refractors 4 may also be implemented by adjusting the distance between the plurality of susceptors 10. Wherein the second direction may be the direction B in fig. 1.
Specifically, the mounting plate 5 may be provided with a plurality of long holes, an extending direction of the long holes is perpendicular to the first direction, and the base 10 forms a connection relationship with the mounting plate 5 through connection members passing through the long holes, so that in a case where a size of the slice needs to be changed, a distance between the refractor 4 and the reflector 3 may be changed by adjusting a relative position between the connection members and the long holes. Or, the mounting plate 5 and the base 10 can be connected with the mounting plate 5 through an adjustable screw rod and the like, so that the relative position between the base 10 and the mounting plate 5 can be changed by screwing the screw rod, and the purpose of adjusting the distance between the refractor 4 and the reflector 3 is achieved.
Optionally, the refractor 4 and the reflector 3 can be detachably connected to the mounting plate 5, so that in the cutting process, in order to ensure that the plurality of light beams formed by the splitting mechanism all meet the cutting requirement, the lenses with different transmittances can be adaptively replaced according to the solar cells 6 with different thicknesses. Specifically, the base 10 and the mounting plate 5 can be connected through a detachable connecting piece, so that when the refractor 4 needs to be replaced, the base 10 with the refractor 4 can be integrally detached, other refractors 4 and the base 10 can be replaced, and the base 10 is connected to the mounting plate 5; or, a detachable connection relationship may be formed between the refractor 4 and the base 10, for example, an installation slot may be formed on the inner wall of the base 10, the refractor 4 may be placed in the installation slot, and is clamped with the inner wall of the base 10 through a clamping member, so as to ensure that a relatively fixed relationship is formed between the refractor 4 and the base 10.
In summary, as shown in fig. 2, the working process of the cutting apparatus provided by the embodiment of the present invention is as follows: firstly, a sucker in a feeding device sucks a solar cell 6 to be cut from the front end or the upstream, the position of a supporting mechanism 8 can be determined through a CCD (charge coupled device) positioning mechanism, a mechanical arm is controlled to act, the solar cell 6 is placed on the supporting mechanism 8, a negative pressure adsorption mechanism works and acts on the solar cell 6 through an adsorption fixing hole, and the solar cell 6 is ensured not to move in the cutting process; laser emitter 2 starts, under beam splitting mechanism's effect, form a plurality of light beams, then mounting panel 5 removes from one end under the effect of electric jar, and drive laser emitter 2 and beam splitting mechanism and remove together, thereby carry out the cutting operation to placing solar wafer 6 on supporting mechanism 8, when mounting panel 5 removes the end, accomplish the cutting work to solar wafer 6, form a plurality of sections, it is all relatively less to cut the loss and the grooving, and the section quality is relatively higher with cutting efficiency homogeneous phase.
In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the communication may be direct, indirect via an intermediate medium, or internal to both elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A solar cell cutting apparatus, comprising:
the displacement mechanism comprises a driving part and a mounting plate, and the driving part is movably connected with the mounting plate along a first direction;
the laser emitter is connected to the mounting plate and used for emitting laser;
the supporting mechanism is positioned on one side of the mounting plate and used for supporting the solar cell to be cut;
light splitting mechanism, light splitting mechanism includes base, refractor and speculum, the pedestal connection in the mounting panel is close to one side of supporting mechanism, the refractor with the speculum all passes through the base with the mounting panel is connected, just the refractor is located laser emitter with between the speculum, laser passes through the refractor falls into reflected beam and refraction light beam, the reflected beam with the refraction light beam all is used for the cutting solar wafer.
2. The cutting apparatus of claim 1, wherein the refractor is provided in plurality, and a plurality of refractors are provided at intervals between the laser emitter and the reflector.
3. The cutting apparatus of claim 1, wherein the energy of the reflected beam is the same as the energy of the refracted beam.
4. The cutting apparatus of claim 1, wherein the base is provided in plurality, the refractor being adjustably coupled to the mounting plate through the base in a second direction perpendicular to the first direction.
5. The cutting apparatus of claim 1, wherein the refractor is removably coupled to the mounting plate.
6. The cutting device according to claim 1, further comprising a negative pressure adsorption mechanism, wherein the support mechanism is provided with a support surface for supporting the solar cell to be cut, and the support surface is provided with an adsorption fixing hole connected with the negative pressure adsorption mechanism.
7. The cutting apparatus as claimed in claim 1, wherein an avoiding guide groove is provided at a side of the support surface of the support mechanism, the avoiding guide groove extends along the first direction, and the avoiding guide groove communicates with spaces at opposite sides of the support mechanism along the first direction.
8. The cutting apparatus according to claim 1, wherein the laser has a wavelength of 1064 nm.
9. The cutting apparatus according to claim 1, further comprising a feeding mechanism comprising a robotic arm and a suction cup connected with an end of the robotic arm for sucking the solar cell sheet to be cut and transferring onto the support mechanism.
10. The cutting device according to claim 9, further comprising a CCD positioning mechanism, wherein the CCD positioning mechanism is connected to the feeding mechanism, and the CCD positioning mechanism is used for determining the position of the supporting mechanism and controlling the feeding mechanism to operate.
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| CN201910586809.XA CN112171074A (en) | 2019-07-01 | 2019-07-01 | Cutting equipment for solar cell |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910586809.XA CN112171074A (en) | 2019-07-01 | 2019-07-01 | Cutting equipment for solar cell |
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| CN112171074A true CN112171074A (en) | 2021-01-05 |
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